CN213638617U

CN213638617U - Circuit board with mounting seat

Info

Publication number: CN213638617U
Application number: CN202022745138.8U
Authority: CN
Inventors: 樊婷; 何勇军; 秦春龙
Original assignee: Shenzhen Ruifengxin Electronic Circuit Co ltd
Current assignee: Shenzhen Ruifengxin Electronic Circuit Co ltd
Priority date: 2020-11-24
Filing date: 2020-11-24
Publication date: 2021-07-06
Anticipated expiration: 2030-11-24

Abstract

The utility model discloses a circuit board with a mounting seat, which comprises a base, wherein mounting grooves are arranged on two opposite sides of the base; the two mounting devices are respectively and movably arranged on the base, and two opposite sides of the circuit board are mounted on the base by the two mounting devices; the heat dissipation device is arranged in the base and below the circuit board; the dustproof net is arranged on the base and below the heat dissipation device; the circuit board is electrically connected with the heat dissipation device; the mounting device comprises two clamping plates, an adjusting structure and two pressing structures; the two clamping plates are symmetrically arranged in parallel; the adjusting structure has elasticity and is arranged between the two clamping plates; the two compression structures are respectively arranged on the corresponding clamping plates. The utility model discloses the problem of circuit board fixing in the mount pad has been solved effectively.

Description

Circuit board with mounting seat

Technical Field

The utility model relates to a circuit board technical field particularly, especially relates to a circuit board with mount pad.

Background

The circuit board is also called a circuit board, a PCB (printed circuit board), an aluminum substrate, a high-frequency board, a printed circuit board and the like, the circuit board mainly comprises a bonding pad, a via hole, a mounting hole, a wire, a component, an inserter, filling, an electrical boundary and the like, and common board layer structures comprise a single-layer board, a double-layer board and a multi-layer board. The circuit board can not be directly installed in some places, and only can be installed by adding a mounting seat, but the circuit board generally does not have the mounting seat in the prior art, so that certain difficulty can be brought to the installation of the circuit board. Therefore, the present invention is modified and improved in view of the defects of the above solutions in actual manufacturing and implementation, and the present invention is created with the help of professional knowledge and experience, and after many kinds of puzzles and experiments.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a circuit board with a mounting base, so as to solve the above problems.

The utility model relates to a circuit board with mount pad can realize through following technical scheme:

the utility model relates to a circuit board with a mounting seat, which comprises a base, wherein mounting grooves are arranged on two opposite sides of the base; the two mounting devices are respectively and movably arranged on the base, and two opposite sides of the circuit board are mounted on the base by the two mounting devices; the heat dissipation device is arranged in the base and below the circuit board; the dustproof net is arranged on the base and below the heat dissipation device; the circuit board is electrically connected with the heat dissipation device; the mounting device comprises two clamping plates, an adjusting structure and two pressing structures; the two clamping plates are symmetrically arranged in parallel; the adjusting structure has elasticity and is arranged between the two clamping plates; the two compression structures are respectively arranged on the corresponding clamping plates.

In one embodiment, two sides in the mounting groove are provided with limiting grooves.

In one embodiment, two sides of the clamping plate are provided with limiting blocks, and the limiting blocks are matched with the limiting grooves.

In one embodiment, the adjusting structure comprises an adjusting cylinder, an adjusting spring, two movable blocks and two connecting rods; the adjusting cylinder is a hollow cavity; the adjusting spring and the two movable blocks are arranged in the adjusting cylinder; the two movable blocks are respectively arranged at two ends of the adjusting spring; two ends of the two connecting rods are respectively connected with the corresponding movable block and the corresponding clamping plate.

In one embodiment, the pressing structure comprises a pressing spring and a buffer cushion, one end of the pressing spring is connected in the clamping plate, the other end of the pressing spring is connected with the buffer cushion, and the buffer cushion is in contact connection with the circuit board.

In one embodiment, the cushion pad is made of silicone or rubber.

In one embodiment, the heat dissipation device comprises at least one fan and a mounting bracket, at least one of the fans being equidistantly disposed on the mounting bracket, the mounting bracket being fixedly mounted within the base.

In one embodiment, the number of the fans is 3.

In one embodiment, a heat conductor is disposed between the circuit board and the heat sink.

In one embodiment, the dust screen is a dust filter screen.

Compared with the prior art, the utility model relates to a beneficial effect of circuit board with mount pad does:

the circuit board with the mounting seat can be matched with circuit boards with different sizes through the adjusting spring, and the circuit board is tightly pressed between the two clamping plates through the pressing structure; the mounting device is fixedly mounted in the mounting groove through the matching of the limiting block and the limiting groove, and the circuit board is fixedly arranged on the base under the interaction of the adjusting spring and the pressing spring, so that the problem that the circuit board is fixed in the mounting seat is effectively solved; the heat dissipation device is arranged below the circuit board, so that heat generated by the circuit board is conveniently conducted out, and the service life of the circuit board is prolonged to a certain extent; meanwhile, the dust screen is arranged below the base, so that dust is prevented from entering the base to influence the functions of the heat dissipation device and the circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a circuit board with a mounting base according to the present invention;

fig. 2 is a schematic cross-sectional view of the circuit board with the mounting base of the present invention shown in fig. 1, including a clamping device;

fig. 3 is a schematic cross-sectional structure diagram of a clamping device in a circuit board with a mounting base according to the present invention shown in fig. 2.

The following are marked in the figure: 11, a base; 111, mounting grooves; 1111, a limiting groove; 12, a circuit board; 13, mounting means; 131, a clamping plate; 1311, a limiting block; 132, an adjustment structure; 1321, a conditioning cylinder; 1322, adjusting springs; 1323, a moving block; 1324, a connecting rod; 133, a compression structure; 1331, a compression spring; 1332, a cushion pad; 14, a heat sink; 141, a fan; 142, a mounting bracket; and 15, a dust screen.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper" and "lower" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention.

Further, in the present disclosure, unless otherwise expressly stated or limited, the first feature may comprise both the first and second features directly contacting each other, and also may comprise the first and second features not being directly contacting each other but being in contact with each other by means of further features between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 and 2, a circuit board with a mounting base according to the present invention may include a base 11, a circuit board 12, two mounting devices 13, a heat dissipation device 14, and a dust screen 15; mounting grooves 111 are formed in two opposite sides of the base 11, and the base 11 is used for arranging the circuit board 12 at a position to be mounted through a screw structure or a buckle structure; the two mounting devices 13 are respectively movably arranged on the base 11 and mount two opposite sides of the circuit board 12 on the base 11; the heat dissipation device 14 is disposed in the base 11 and below the circuit board 12, and is used for dissipating heat generated by the circuit board 12; the dust screen 15 is arranged on the base 11 and below the heat sink 14, and is used for preventing dust from entering the heat sink 14, so as to affect the heat dissipation effect of the heat sink 14; the circuit board 12 is electrically connected to the heat sink 14.

Referring to fig. 2, in the present embodiment, the base 11 is rectangular, the two opposite sides of the base are provided with the mounting grooves 111, and the mounting device 13 is movably disposed in the mounting grooves 111, so as to fix the circuit board 12 on the base 11; in other embodiments, two sides in the mounting groove 111 are further provided with a limiting groove 1111, and the limiting groove 1111 is installed in cooperation with the installation device 131.

Referring to fig. 3, in the present embodiment, the mounting device 13 includes two clamping plates 131, an adjusting structure 132 and two pressing structures 133; the two clamping plates 131 are symmetrically arranged in parallel; the adjusting structure 132 has elasticity, and is disposed between the two clamping plates 131, and the adjusting structure 132 can match the circuit boards 12 with different thicknesses; the two pressing structures 133 are respectively disposed on the two clamping plates 131, and are used for fastening the circuit board 12 and preventing the circuit board 12 from being separated from between the two clamping plates 131. In other embodiments, the two sides of the clamping plate 131 are provided with stop blocks 1311, and the stop blocks 1311 are matched with the stop grooves 1111, so that the mounting device 13 is mounted in the mounting groove 111. In this embodiment, the adjusting structure 132 includes an adjusting cylinder 1321, an adjusting spring 1322, two movable blocks 1323 and two connecting rods 1324, the adjusting cylinder 1321 is a cylindrical hollow cavity, the adjusting spring 1322 and the two movable blocks 1323 are both disposed in the adjusting cylinder 1321, the two movable blocks 1323 are respectively disposed at two ends of the adjusting spring 1322, two ends of the two connecting rods 1324 are respectively connected to the corresponding movable blocks 1323 and the clamping plate 131, and the circuit boards 12 with different sizes can be matched by stretching of the adjusting spring 1322. In this embodiment, the pressing structures 133 include a pressing spring 1331 and a buffer pad 1332, one end of the pressing spring 1331 is connected to the clamping plate 131, the other end of the pressing spring 1331 is connected to the buffer pad 1332, the buffer pad 1332 is connected to the circuit board 12 in a contact manner, and the two pressing structures 133 fix the circuit board 12 in the mounting device 13 under the action of the pressing spring 1331; the material of the cushion 1332 is silica gel or rubber, and in this embodiment, the material of the cushion 1332 is silica gel.

Referring to fig. 2, the heat dissipation device 14 includes at least one fan 141 and a mounting bracket 142, the at least one fan 141 is equidistantly disposed on the mounting bracket 142, and the mounting bracket 142 is fixedly mounted in the base 11, in this embodiment, the number of the fans 141 is 3, and in other embodiments, the number of the fans 141 may be 1, 2, 4, or a plurality of others. In other embodiments, a thermal conductor may be disposed between the circuit board 12 and the heat sink 14 to conduct heat away from the circuit board 12. In this embodiment, the dust screen 15 is a dust filter screen, and its main function is to filter dust.

It should be noted that, the opposite two sides of the circuit board 12 are respectively placed in the two mounting devices 13, the circuit boards 12 with different sizes can be matched through the adjusting spring 1322, the circuit board 12 is pressed between the two clamping plates 131 through the pressing structure 133, the mounting devices 13 are fixedly mounted in the mounting groove 111 through the cooperation of the limiting block 1311 and the limiting groove 1111, and the circuit board 12 is fixedly disposed on the base 11 under the interaction of the adjusting spring 1322 and the tightening spring 1331.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A circuit board with a mounting seat is characterized by comprising a base, wherein mounting grooves are formed in two opposite sides of the base; the two mounting devices are respectively and movably arranged on the base, and two opposite sides of the circuit board are mounted on the base by the two mounting devices; the heat dissipation device is arranged in the base and below the circuit board; the dustproof net is arranged on the base and below the heat dissipation device; the circuit board is electrically connected with the heat dissipation device; the mounting device comprises two clamping plates, an adjusting structure and two pressing structures; the two clamping plates are symmetrically arranged in parallel; the adjusting structure has elasticity and is arranged between the two clamping plates; the two compression structures are respectively arranged on the corresponding clamping plates.

2. The circuit board with the mounting base according to claim 1, wherein two sides in the mounting groove are provided with limiting grooves.

3. The circuit board with the mounting base according to claim 2, wherein two sides of the clamping plate are provided with limiting blocks, and the limiting blocks are matched with the limiting grooves.

4. The circuit board with the mounting seat according to claim 1, wherein the adjusting structure comprises an adjusting cylinder, an adjusting spring, two movable blocks and two connecting rods; the adjusting cylinder is a hollow cavity; the adjusting spring and the two movable blocks are arranged in the adjusting cylinder; the two movable blocks are respectively arranged at two ends of the adjusting spring; two ends of the two connecting rods are respectively connected with the corresponding movable block and the corresponding clamping plate.

5. The circuit board with a mounting base according to claim 1, wherein the compression structure comprises a compression spring and a buffer pad, one end of the compression spring is connected in the clamping plate, the other end of the compression spring is connected with the buffer pad, and the buffer pad is in contact connection with the circuit board.

6. The circuit board with the mounting base according to claim 5, wherein the cushion pad is made of silicone or rubber.

7. The circuit board with a mounting base of claim 1, wherein the heat dissipation device comprises at least one fan and a mounting bracket, at least one fan is equidistantly arranged on the mounting bracket, and the mounting bracket is fixedly mounted in the base.

8. The circuit board with the mounting base according to claim 7, wherein the number of the fans is 3.

9. A circuit board with a mounting base according to any one of claims 1-8, characterised in that a heat conductor is arranged between the circuit board and the heat sink.

10. The circuit board with the mounting base according to any one of claims 1 to 8, wherein the dust screen is a dust filter screen.