CN213633548U - Substrate assembly of probe card - Google Patents

Abstract

The utility model discloses a base plate assembly of probe card, including first probe base plate, first space converter, its upper surface and lower surface respectively take a plurality of terminals, a plurality of terminals on the lower surface with probe electric connection, interval between a plurality of terminals on the upper surface with interval between a plurality of terminals on the lower surface is different, and a plurality of first connectors, installs the peripheral part of first probe base plate and first space converter is inboard, right first probe base plate and first space converter pressurize. According to the utility model discloses, the probe base plate and the whole laminating that closely of space converter of probe are equipped with, so the probe base plate is indeformable to make the probe with by the contact pad align to grid of side wafer.

Description

Substrate assembly of probe card

Technical Field

The utility model relates to a probe card technical field, concretely relates to base plate assembly of probe card.

Background

As the size of a pad on a wafer and the pitch of the pad are reduced as semiconductor devices are miniaturized, probe cards including a plurality of probes are actively developed around the fine pitch of the probes contacting the pads of the wafer. The conventional method of connecting the probes to the space transformer is to mount the probes on a sacrificial substrate, and then to mount the sacrificial substrate with the probes directly on the space transformer and then to remove the sacrificial substrate. That is, the probes are mounted directly to the space transformer with a sacrificial substrate. However, since this method is to directly mount the probe to the space transformer, if a problem occurs during the mounting of the probe, not only the probe but also the expensive space transformer are wasted. A method of mounting the probes to the space transformer using the probe substrate as a carrier is proposed instead of directly mounting the probes to the space transformer. The method electrically connects the probes and the space transformer by mounting the probes to the probe substrate and contacting the probe substrate with the probes mounted thereon with the space transformer.

Therefore, it is desirable to solve the above problems by providing a substrate assembly for a probe card.

The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

In order to achieve the above object, the present invention provides the following technical solutions: a substrate assembly for a probe card comprising a first probe substrate, characterized in that: the first probe substrate includes a first space transformer, a first coupling member, a first card socket, a second card socket, and a first interposer, the upper surface and the lower surface of the first space transformer each have a plurality of terminals, the plurality of terminals on the lower surface of the first space transformer are electrically connected to the probes, a pitch between the plurality of terminals on the upper surface of the first space transformer is different from a pitch between the plurality of terminals on the lower surface, and the plurality of first coupling members are mounted inside outer peripheral portions of the first probe substrate and the first space transformer, and pressurize the first probe substrate and the first space transformer to closely attach the first probe substrate and the first space transformer.

Preferably, a plurality of holes for mounting the first coupling are formed inside the outer circumferential portions of the first probe substrate and the first space transformer.

Preferably, the device comprises a first connecting unit and a second connecting unit, and the shapes of the first connecting unit and the second connecting unit are matched.

Preferably, the first coupling unit includes a first head pressing the first probe substrate, a recess connecting the first coupling unit and the second coupling unit, and a first post connecting the first head and the recess, and the second coupling unit includes a second head pressing the first space transformer, a protrusion connecting the second coupling unit and the first coupling unit, and a second post connecting the second head and the protrusion.

Preferably, the first head portion and the second head portion are formed so as to protrude from the first probe substrate and the first space transformer surface.

Preferably, the first and second head portions are disposed inside the first probe substrate and the first space transformer.

Preferably, one of the first coupling unit and the second coupling unit is integrated with the first probe substrate or the first space transformer.

Preferably, the first probe substrate is a multilayer substrate composed of a plurality of substrates.

In the technical scheme, the utility model provides a technological effect and advantage:

according to the utility model discloses, the probe base plate and the whole laminating that closely of space converter of probe are equipped with, so the probe base plate is indeformable to make the probe with by the contact pad align to grid of side wafer.

Drawings

For a clearer explanation of the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and it is obvious for those skilled in the art to obtain other drawings according to these drawings.

Fig. 1 is a schematic view of a general structure of a conventional probe card.

Fig. 2 is a schematic structural diagram of a probe card substrate assembly according to an embodiment of the present invention.

Fig. 3 is a side view of a detailed structure of a coupling member according to an embodiment of the present invention.

FIG. 4 is a side view of an exemplary probe card substrate assembly provided with a coupling that is mated in accordance with an embodiment of the present invention.

FIG. 5 is another exemplary side view of a probe card substrate assembly provided with a coupling that is mated in accordance with an embodiment of the present invention.

FIG. 6 is another exemplary side view of a probe card substrate assembly provided with a coupling that is mated in accordance with an embodiment of the present invention.

FIG. 7 is another exemplary side view of a probe card substrate assembly provided with a coupling that is mated in accordance with an embodiment of the present invention.

Fig. 8 is a cross-sectional view of a probe card including a substrate assembly according to an embodiment of the invention.

Description of reference numerals:

10 first probe substrate, 20 first space transformer, 210 first coupling, 211 first coupling, 212 second coupling, 213 first head, 214 first column, 215 recess, 216 second head, 217 second column, 218 protrusion, 220 second space transformer, 230 second probe substrate, 30 first cartridge, 40 second cartridge, 410 third probe substrate, 420 third space transformer, 430 second coupling, 431 third head, 432 fourth head, 440 fourth probe substrate, 450 fourth space transformer, 460 third coupling, 461 fifth head, 462 second protrusion, 50 first interposer, 510 fifth probe substrate, 520 fifth space transformer, 530 fourth coupling, 540 third cartridge, 550 fourth cartridge, 560 second interposer, 60 printed circuit board, 70 flatness adjustment device, 80 probe.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.

Fig. 1 is a schematic view of a general structure of a conventional probe card.

The conventional probe card includes a first probe substrate 10, a first space transformer 20, a first card holder 30, a second card holder 40, a first interposer 50, a printed circuit board, and a flatness adjustment device 70, the first probe substrate 10 is a substrate on which probes 80 are mounted, and an upper surface of the first probe substrate is in contact with the first space transformer 20 so that the probes 80 are electrically connected to the first space transformer 20, the first probe substrate 10 may be a single substrate, or if necessary, a plurality of substrates may be attached to make a multi-layered substrate.

As described above, the probes 80 mounted on the first probe substrate 10 make one-to-one contact with the plurality of pads on the wafer, and transmit the electrical signals received from the semiconductor test equipment to the pads on the wafer, and the probes 80 generally have elasticity and various shapes such as a cantilever beam, a bump, and the like.

The first space transformer 20 functions to transform the pitch, and the pitch between the plurality of contact terminals on the upper surface thereof is different from the pitch between the plurality of contact terminals on the lower surface thereof, for example, the pitch of the lower surface is smaller than the pitch of the upper surface, so that the wide pitch of the upper surface is adjusted by the narrow pitch of the lower surface, and the lower surface of the first space transformer 20 is brought into contact with the first probe substrate 10 to be electrically connected with the probes 80 mounted on the first probe substrate 10.

The first card holder 30 is connected to the second card holder 40, so that the first probe substrate 10 is closely attached to the first space transformer 20, that is, the first card holder 30 contacts the outer peripheral portion of the first probe substrate 10, and applies a force toward the first space transformer 20 to the first probe substrate 10, thereby closely attaching the first probe substrate 10 to the first space transformer 20.

The second card holder 40 is connected to the first card holder 30, and the first space transformer 20 is closely attached to the first probe substrate 10, that is, the second card holder 40 contacts the outer circumferential portion of the first space transformer 20 and applies a force toward the first probe substrate 10 to the first space transformer 20, so that the first space transformer 20 is closely attached to the first probe substrate 10.

The first interposer 50 functions to electrically connect the printed circuit board 60 and the first space transformer 20, and is constituted by elastic contact pieces, and the printed circuit board 60 receives an electrical signal from the semiconductor test apparatus and transmits it to the first interposer 50, and then receives an electrical signal from the first interposer 50 and transmits it to the semiconductor test apparatus.

The flatness adjustment apparatus 70 is used to adjust the flatness of the first probe substrate 10, and the probes 80 mounted on the first probe substrate 10 must be in direct contact with the pads on the wafer, and therefore, the ends of the plurality of probes 80 mounted on the first probe substrate 10 should be arranged in parallel with the plurality of contact pads on the wafer, but the probes 80 are not actually arranged in parallel due to the inclination of the probe substrate, the deformation of the shape, or the distortion of the probe substrate, and therefore, the flatness adjustment apparatus 70 uniformly contacts the probes 80 mounted on the first probe substrate 10 with the pads on the wafer by adjusting the first probe substrate 10 or adjusting the flatness of the first probe substrate 10 and the first space transformer 20.

As described above, in the conventional probe card, the first probe substrate 10 and the first space transformer 20 are closely attached by the first card holder 30 and the second card holder 40, but there is a problem in that the clamping force of the first card holder 30 and the second card holder 40 to the first probe substrate 10 and the first space transformer 20 is applied only to the outer peripheral portions of the first probe substrate 10 and the first space transformer 20, that is, the force clamping the first probe substrate 10 and the first space transformer 20 is not applied to the inner sides of the outer peripheral portions of the first probe substrate 10 and the first space transformer 20, so that the inner sides of the outer peripheral portions of the first probe substrate 10 are bent downward and the inner sides of the outer peripheral portions of the first space transformer 20 are bent upward.

As the probe card is enlarged, the substrate areas of the first probe substrate 10 and the first space transformer 20 are increased, the inner side of the outer circumference of the first probe substrate 10 is bent more and more severely, and if the probe substrate is deformed as the center portion of the first probe substrate 10 is bent, a serious problem occurs in the flatness adjustment of the probe substrate, in which case the probes 80 mounted on the first probe substrate 10 may not uniformly contact the contact pads on the wafer, as described above.

Therefore, when the probe 80 and the first space transformer 20 are electrically connected by the first probe substrate 10, a probe card substrate assembly in which both substrates are brought into close contact with each other is required inside the outer peripheral portion in addition to the outer peripheral portions of the probe substrate and the space transformer.

Figure 2 is a schematic structural diagram of a probe card substrate assembly according to one embodiment of the present invention,

according to the present invention, a probe card substrate assembly includes a first coupling member 210, a second probe substrate 230 and a second space transformer 220, the first coupling member 210 makes the second probe substrate 230 and the second space transformer 220 closely contact each other, the first coupling member 210 applies an acting force toward the second space transformer 220 to the second space transformer 220 by applying an acting force toward the second space transformer 220 to the second probe substrate 230, so that the second probe substrate 230 and the second space transformer 220 closely contact each other, and the first coupling member 210 may be made of a metal having a relatively high rigidity.

As shown in the drawings, the first coupling member 210 is composed of two parts, respectively, a recess and a protrusion, through which the first coupling member and the second space transformer are coupled to each other, but the present invention is not limited thereto, and a single member having only a protrusion may be manufactured so as to be coupled to the recess provided on the second probe substrate 230 or the second space transformer 220, not shown, the inner side of the outer circumference of the second probe substrate 230 includes holes Hole capable of mounting the plurality of first coupling members 210, the number of holes on the second probe substrate 230 should be the same as the number of the first coupling members 210 to be mounted, and in addition, the second probe substrate 230 includes a plurality of probes, not shown, so as to electrically connect the probes to the space transformer 220, the second probe substrate 230 may be manufactured in various ways, such as depositing an insulating film on the surface of a silicon wafer, and also attaching a plurality of substrates, the first space transformer 20 functions as a transforming Pitch, the Pitch between the plurality of contact terminals on the upper surface thereof is different from the Pitch between the plurality of contact terminals on the lower surface, the first space transformer 20 adjusts the wide interval of the upper surface by the narrow interval of the lower surface, the second space transformer 220 is closely attached to the second probe substrate 230 by the first coupling members 210, connection terminals arranged on the surface closely attached to the second probe substrate 230 are not shown to be electrically connected to probes mounted on the second probe substrate 230, and in addition, the second space transformer 220 includes holes Hole capable of mounting a plurality of first coupling members 210, as with the second probe substrate 230, the number of holes should be the same as the number of the first coupling members 210 to be mounted.

Fig. 3 is a side view of a detailed structure of a coupling member according to an embodiment of the present invention.

According to an embodiment of the present invention, there is provided a coupling member including a first coupling unit 211 and a second coupling unit 212, the first coupling unit 211 including a first head 213, a first post 214, and a recess 215, the second coupling unit 212 including a second head 216, a second post 217, and a first protrusion 218, the first head 213 and the second head 216 closely contact the probe substrate and the space transformer when the first coupling unit 211 and the second coupling unit 212 are combined into one coupling member, that is, the first head 213 and the second head 214 apply force to the probe substrate and the space transformer in the direction of an arrow 219 to closely contact the probe substrate and the space transformer, the recess 215 and the first protrusion 218 are shaped to fit each other to combine the first coupling unit 211 and the second coupling unit 212, for example, the recess 215 and the first protrusion 218 may be formed in a bolt and nut form, other combinations besides bolt and nut forms may be used.

The sum of the lengths of the first column 214 and the second column 217 is equal to the thickness of the probe substrate and the space transformer, that is, the sum of the lengths of the first column 214 and the second column 217 is equal to or less than the thickness of the probe substrate and the space transformer to be arranged in a close contact manner, the first column 214 and the second column 217 can be arranged in different lengths, and the length adjustment can be carried out on the premise of keeping the sum of the lengths of the two columns to be constant in consideration of factors such as production convenience.

FIG. 4 is a side view of an exemplary probe card substrate assembly provided with a coupling that is mated in accordance with an embodiment of the present invention.

According to an embodiment of the present invention, there is provided a probe card substrate assembly including a third probe substrate 410, a third space transformer 420, and a second coupling member 430, wherein a lower surface of the third probe substrate 410 is provided with a probe, an upper surface of which is closely attached to a lower surface of the third space transformer 420, and further, the third probe substrate 410 includes a plurality of holes Hole through which the second coupling member 430 passes, the holes being located inside a peripheral portion of the third probe substrate 410, for example, the holes being located at a central position of the third probe substrate 410, the third probe substrate 410 is pressed upward by a third head portion 431 of the second coupling member 430 mounted on a lower surface of the third probe substrate 410 so as to be closely attached to a lower surface of the third space transformer 420, an upper surface of the third space transformer 420 is not shown connected to an interposer, and the lower surface is closely attached to an upper surface of the third probe substrate 410, the third space transformer 420 includes a plurality of holes Hole through which the second coupling member 430 passes, the holes are located inside the outer circumference of the third space transformer 420, for example, the holes may be located at the center of the third space transformer 420, the third space transformer 420 is pressed downward by the third head 431 of the second coupling member 430 mounted on the upper surface thereof to be closely attached to the upper surface of the third probe substrate 410, the second coupling member 430 passes through the holes of the third probe substrate 410 and the third space transformer 420 to be inserted into the third probe substrate 410 and the third space transformer 420, and the third head 431 and the fourth head 432 located at the top and bottom ends of the second coupling member 430 pressurize the third probe substrate 410 and the third space transformer 420, such that the third probe substrate 410 and the third space transformer 420 are closely attached by the pressurization of the third head 431 and the fourth head 432.

The third and fourth heads 431 and 432 of the second coupling member 430 described so far are exposed on the surfaces of the third probe substrate 410 and the third space transformer 420, but the third and fourth heads 431 and 432 of the second coupling member 430 may be disposed inside the third probe substrate 410 and the third space transformer 420 according to a design in consideration of the size and position of the probe mounted on the lower surface of the third probe substrate 410, or the contact state of the upper surface of the third space transformer 420 with the interposer, not shown, and the like.

The case where the third and fourth heads 431 and 432 of the second coupling 430 are disposed inside the third probe substrate 410 and the third space transformer 420 will be described with reference to fig. 5.

Fig. 5 is a side view of another example of a probe card substrate assembly provided by coupling members being closely combined according to an embodiment of the present invention, and according to another example of the substrate assembly, a head portion and other portions of the second coupling member 430 are inserted into holes formed in the third probe substrate 410 and the third space transformer 420, so that the head portion is disposed inside the substrate assembly as shown in fig. 5, and the second coupling member 430 does not protrude outward from the substrate assembly when the substrate assembly is manufactured.

In one example and another example of the substrate assembly of fig. 4 and 5 described above, the second coupling member 430 is composed of two parts including a protrusion and a recess, which are combined to form the substrate assembly, and for this case, the protrusion may take the form of a bolt and the recess may take the form of a nut.

Fig. 6 and 7 are side views of another example of a probe card substrate assembly provided by a coupling tight-coupling, according to another embodiment of the present invention, wherein, as seen in fig. 6 and 7, the third coupling member 460 has only a protrusion, coupling it with a recess coupling structure of the fourth probe substrate 440 or the fourth space transformer 450, that is, as shown in fig. 6, the third coupling member 460 has only the second projection 462, the third coupling member 460 is inserted into a hole formed on the fourth space transformer 450, the second protruding part 462 is matched with the concave part formed on the fourth probe substrate 440, and a hole is formed on the fourth probe substrate 440, a concave coupling structure is formed on the fourth space transformer 450, through which the third coupling member 460 is coupled, and as also shown in fig. 7, the fifth head 461 of the third coupling member 460 may also be disposed inside the fourth probe substrate 440 and the fourth space transformer 450.

Fig. 8 is a cross-sectional view of a probe card including a substrate assembly according to an embodiment of the present invention, a fifth probe substrate 510 is disposed at a position directly contacting a pad, not shown, of a wafer to be tested of the probe card, as described above, a probe directly contacting the pad of the wafer is mounted on a lower surface of the fifth probe substrate 510, not shown, the fifth probe substrate 510 is coupled to a fifth space transformer 520 to electrically connect the probe and the fifth space transformer 520, and therefore, the fifth probe substrate 510 must be closely attached to the fifth space transformer 520, for which purpose, an outer circumferential portion of the fifth probe substrate 510 is closely attached to the fifth space transformer 520 through a third chuck 540 and an inner circumferential portion thereof is closely attached to the fifth space transformer 520 through a fourth coupling member 530, the fifth probe substrate 510 includes a plurality of holes for mounting a fourth coupling member 530, the positions of which may be determined in consideration of positions of the probe mounted on the fifth probe substrate 510, such a fifth probe substrate 510 may be a single substrate or a multi-layered substrate composed of a plurality of substrates, a lower surface of the fifth space transformer 520 contacts the fifth probe substrate 510, an upper surface thereof contacts the second interposer 560, the space transformer 510 is used to adjust the spacing between contact pads and is electrically connected to probes through the fifth probe substrate 510, an outer circumferential portion of the fifth space transformer 520 is closely attached to the fifth probe substrate 510 through the fourth card holder 550, an inner circumferential portion thereof is closely attached to the fifth probe substrate 510 through the fourth coupling member 530, like the fifth probe substrate 510, the fifth space transformer 520 includes a plurality of holes for mounting the fourth coupling member 530, whose positions may be determined in consideration of the positions of probes mounted on the fifth probe substrate 510, the fourth coupling member 530 is mounted in the holes of the fifth probe substrate 510 and the fifth space transformer 520, the fourth link 530 presses the fifth probe substrate 510 and the fifth space transformer 520 by the heads at both ends, and as described above, the heads at both ends of the fourth link 530 may be placed outside or inside the fifth probe substrate 510 and the fifth space transformer 520.

The third card holder 540 and the fourth card holder 550 press outer circumferential portions of the fifth probe substrate 510 and the fifth space transformer 520, respectively, i.e., the third card holder 540 and the fourth card holder 550 apply an upward force to the fifth probe substrate 510 and a downward force to the fifth space transformer 520, thereby closely attaching the fifth probe substrate 510 and the fifth space transformer 520.

As described above, according to the probe card substrate assembly provided by an embodiment of the present invention, the outer peripheral portions of the third card holder 540 and the fourth card holder 550 are closely attached, and the inner side of the middle portion is also closely attached by the fourth coupling member 530, so that the fifth probe substrate 510 is not bent or twisted due to the load, resulting in a gap between the fifth probe substrate 510 and the fifth space transformer 520, and the probes and the contact pads are uniformly arranged.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A substrate assembly of a probe card comprising a first probe substrate (10), characterized in that: the first probe substrate (10) includes a first space transformer (20), a first coupling (210), a first card holder (30), a second card holder (40), and a first interposer (50), the upper surface and the lower surface of the first space transformer (20) are respectively provided with a plurality of terminals, the plurality of terminals on the lower surface of the first space transformer (20) are electrically connected with the probes (80), a pitch between a plurality of terminals on an upper surface of the first space transformer (20) is different from a pitch between a plurality of terminals on a lower surface, and a plurality of first coupling members (210) are mounted inside outer peripheral portions of the first probe substrate (10) and the first space transformer (20), and pressurizing the first probe substrate (10) and the first space transformer (20) to enable the first probe substrate (10) and the first space transformer (20) to be tightly attached.

2. The substrate assembly of a probe card of claim 1, wherein: a plurality of holes for mounting the first coupling member (210) are formed inside the outer peripheral portions of the first probe substrate (10) and the first space transformer (20).

3. The substrate assembly of a probe card of claim 1, wherein: the connecting device comprises a first connecting unit (211) and a second connecting unit (212), wherein the first connecting unit (211) and the second connecting unit (212) are matched in shape.

4. The substrate assembly of claim 3, wherein: the first coupling unit (211) includes a first head (213) pressing the first probe substrate (10), a recess (215) connecting the first coupling unit (211) and the second coupling unit (212), and a first post (214) connecting the first head (213) and the recess (215), and the second coupling unit (212) includes a second head (216) pressing the first space transformer (20), a protrusion (218) connecting the second coupling unit (212) and the first coupling unit (211), and a second post (217) connecting the second head (216) and the protrusion (218).

5. The substrate assembly of claim 4, wherein: the first head (213) and the second head (216) are made to protrude on the surfaces of the first probe substrate (10) and the first space transformer (20).

6. The substrate assembly of claim 4, wherein: the first head (213) and the second head (216) are disposed inside the first probe substrate (10) and the first space transformer (20).

7. The substrate assembly of claim 4, wherein: one of the first coupling unit (211) and the second coupling unit (212) is integrated with the first probe substrate (10) or the first space transformer (20).

8. The substrate assembly of a probe card of claim 4, wherein: the first probe substrate (10) is a multilayer substrate composed of a plurality of substrates.

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