CN213401194U

CN213401194U - Mini LED lamp panel

Info

Publication number: CN213401194U
Application number: CN202022380596.6U
Authority: CN
Inventors: 李秀富
Original assignee: Suzhou Dongyan Electronic Technology Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2020-10-23
Filing date: 2020-10-23
Publication date: 2021-06-08
Anticipated expiration: 2030-10-23

Abstract

The utility model provides a Mini LED lamp plate, include: a plurality of small modules 1 and a printed circuit board 2, a plurality of small modules 1 being attached to an upper surface of the printed circuit board 2, the small modules 1 comprising: the LED lamp comprises a colloid layer 11, a plurality of LED chips 12, a reflecting layer 13 and a substrate 14, wherein the reflecting layer 13 is arranged on the upper surface of the substrate 14, the LED chips 12 are arranged on the upper surface of the reflecting layer 13, the colloid layer 11 encapsulates the LED chips 12, and the LED chips 12 and the reflecting layer 13 are fixed; the upper surface of the printed circuit board 2 is provided with solder paste which can be welded with the small module 1. The utility model discloses a Mini LED lamp plate need not splice the equipment to can carry out regional accurate accuse light, the rate of reprocessing is low.

Description

Mini LED lamp panel

Technical Field

The utility model relates to a display device technical field, more specifically relates to a Mini LED lamp plate.

Background

The backlight module of the television or the computer display device is divided into an edge type backlight module and a direct type backlight module, and the edge type backlight module is the biggest difference between the edge type backlight module and the direct type backlight module; simultaneously, straight following formula backlight unit adopts the LED backlight to make intensive dot matrix, and the LED backlight includes: the LED lamp strip, the Mini LED lamp panel and the like are placed behind the screen and directly irradiate the screen, so that the direct type backlight module is clear in image quality and good in picture effect, and is widely applied.

The Mini LED lamp panel, also known as the sub-millimeter LED lamp panel, means that the size of the LED crystal grain is about 100 micrometers, according to the estimation in the industry, the liquid crystal display television panel adopting the Mini LED backlight design has a price of about 60% -80% of that of the traditional OLED television panel, but the brightness and the image quality are similar to those of the traditional OLED television panel or the image effect is better, and the power saving efficiency is higher.

Adopt straight following formula backlight unit of Mini LED lamp plate, do benefit to LED encapsulation factory production as required, a display device need be assembled by several Mini LED lamp plates, is put at the internal cavity of display device by 3-4 Mini LED lamp plates pendulum promptly, upwards gives out light from the bottom. Therefore, a seam will be formed between one Mini LED lamp panel and the other Mini LED lamp panel, if the size of the seam is large, or the height difference exists between the two Mini LED lamp panels, after the picture is lightened by the Mini LED lamp panels, a black line (as shown in figure 1) will be formed at the seam, and therefore the visual effect is influenced.

In order to solve the problem of splicing, in the prior art, all adopt artificial mode to assemble to adopt mechanical structure's mode to solve splicing, if adopt the backup pad to support the Mini LED lamp plate and cover the splicing between 2 Mini LED lamp plates, these modes have improved the convenience of equipment to a certain extent, however, still need the manual work to assemble, can not need the concatenation equipment, on the other hand, the quantity of the LED chip of a Mini LED lamp plate is more, be difficult for regional accurate accuse light, and repair rate is high.

In view of this, the utility model provides a Mini LED lamp plate need not splice the equipment to can carry out regional accurate accuse light, the rate of reprocessing is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a Mini LED lamp plate need not splice the equipment to can carry out regional accurate accuse light, the rate of reprocessing is low.

The utility model discloses a Mini LED lamp plate, with a plurality of little modules through SMT machine paste dress on a PCB base plate, the size of PCB base plate matches with display device's size, consequently directly will the utility model discloses a Mini LED lamp plate use can, need not assemble, also do not have the problem of piece. Further, the size of the small module is smaller than that of the traditional Mini LED lamp plate, for example, only 64 LED chips are arranged on one small module, and after the number of the LED chips on each small module is reduced, on one hand, accurate light control in a region is easy, and region control is easy; on the other hand, current LED chip, the inherent defective rate of one thousandth that dispatches from the factory, the quantity of LED chip in traditional Mini LED lamp plate be several hundred-several tens of thousands, in nearly 1-3 Mini LED lamp plates, have the LED chip to be the damage in having a Mini LED lamp plate, consequently reprocess the rate height, the cost is extravagant big, but the utility model discloses a small module size is little, and the reprocess rate is low, appears bad LED chip in a small module, and the quantity of extravagant other LED chips is few, and the cost is extravagant few.

A Mini LED lamp panel, comprising: a plurality of small modules 1 and a printed circuit board 2, a plurality of small modules 1 being attached to an upper surface of the printed circuit board 2, the small modules 1 comprising: the LED lamp comprises a colloid layer 11, a plurality of LED chips 12, a reflecting layer 13 and a substrate 14, wherein the reflecting layer 13 is arranged on the upper surface of the substrate 14, the LED chips 12 are arranged on the upper surface of the reflecting layer 13, the colloid layer 11 encapsulates the LED chips 12, and the LED chips 12 and the reflecting layer 13 are fixedly connected; the upper surface of the printed circuit board 2 is provided with solder paste which can be welded with the small module 1.

In some embodiments, the substrate 14 includes: BT substrate, FPC substrate, polyimide substrate, and polyester resin substrate.

In some embodiments, the reflective layer 13 includes: one of a silver-plated reflective layer, a copper-plated reflective layer, a reflective sheet, or white oil, and preferably, the reflective layer 13 includes: a silvered reflective layer, or a reflective sheet.

In some embodiments, the plurality of LED chips 12 are uniformly distributed on the upper surface of the reflective layer 13 in rows and columns.

Further, the LED chip 12 includes: one or more of a blue light LED chip, a red light LED chip, a green light LED chip, a blue-green light LED chip, a yellow light LED chip, an orange light LED chip and an amber light LED chip.

Further, the dominant wavelength range of the LED chip 12 is 380-470 nm.

In some embodiments, the colloid layer 11 is a transparent base colloid composed of one or more of pure silica gel, silicone resin, and epoxy resin.

Further, the colloid layer 11 is a high-reflectivity colloid formed by adding fluorescent powder into the transparent base colloid, or the colloid layer 11 is a high-reflectivity colloid formed by adding one or more of titanium dioxide, silicon dioxide, boron nitride, aluminum oxide, silver or chromium into the transparent base colloid.

In some embodiments, the small module 1 further comprises: and the support 15 is arranged on the upper surface of the reflecting layer 13, the LED chip 12 is arranged on the upper surface of the bottom surface of the support 15, and the colloid layer 11 encapsulates the LED chip 12 in the cavity of the support 15. The support 15 plays the effect of preventing the mutual crosstalk between the small modules, improves the accuracy of regional accuse light of every small module, does not receive the interference of the light of other small modules.

Further, the colloid layer 11 adopts an LED package manner to package the LED chip 12 in the cavity of the support 15.

Further, the frame 15 is composed of a frame bottom 151 and a frame side 152, and the inner surfaces of the frame bottom 151 and the frame side 152 have a light reflecting effect, and the reflectivity is greater than 90%.

Further, the thickness of the bottom surface 151 of the bracket is 0.2-0.3mm, the inner surface of the bottom surface 151 of the bracket is copper foil, and the inner surface of the side surface 152 of the bracket is white plastic.

In some embodiments, a plurality of small modules 1 are mounted on the top surface of a printed circuit board 2 in a taping or palletizing manner.

Drawings

Fig. 1 is a schematic structural diagram of a small module according to the present application.

Fig. 2 is another structural schematic diagram of the small module of the present application.

Fig. 3 is a schematic structural diagram of the Mini LED lamp panel of the present application.

Description of the main element symbols:

Detailed Description

The following examples are described to aid in the understanding of the present invention and are not, and should not be construed to limit the scope of the invention in any way.

In the following description, those skilled in the art will recognize that components may be described throughout this discussion as separate functional units (which may include sub-units), but those skilled in the art will recognize that various components or portions thereof may be divided into separate components or may be integrated together (including being integrated within a single system or component).

Also, connections between components or systems within the figures are not intended to be limited to direct connections. Rather, data between these components may be modified, reformatted, or otherwise changed by the intermediate components. Additionally, additional or fewer connections may be used. It should also be noted that the terms "coupled," "connected," or "input" and "fixed" are understood to encompass direct connections, indirect connections, or fixed through one or more intermediaries.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "side", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships commonly recognized in the product of the application, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Example 1:

a Mini LED lamp panel, comprising: a plurality of small modules 1 and a printed circuit board 2, the small modules 1 are as shown in fig. 1, a plurality of small modules 1 are attached on the upper surface of the printed circuit board 2, the small modules 1 comprise: the LED lamp comprises a colloid layer 11, a plurality of LED chips 12, a reflecting layer 13 and a substrate 14, wherein the reflecting layer 13 is arranged on the upper surface of the substrate 14, the LED chips 12 are arranged on the upper surface of the reflecting layer 13, the colloid layer 11 encapsulates the LED chips 12, and the LED chips 12 and the reflecting layer 13 are fixedly connected; the upper surface of the printed circuit board 2 is provided with a tin weldable small module 1.

The substrate 14 is: BT substrate, reflective layer 13 is: the silvered reflecting layer, a plurality of LED chips 12 are evenly distributed on the upper surface of the reflecting layer 13 according to the mode of rows and columns, and the LED chips 12 are: and a blue LED chip. The colloid layer 11 is a transparent base colloid made of pure silica gel and silicone resin. A plurality of small modules 1 are attached to the upper surface of a printed circuit board 2 in a braid or palletized manner.

Example 2:

a Mini LED light panel, as shown in fig. 2 and 3, comprising: a plurality of small modules 1 and a printed circuit board 2, the small modules 1 being as shown in fig. 1, the plurality of small modules 1 being attached to an upper surface of the printed circuit board 2, the small modules 1 comprising: the LED lamp comprises a colloid layer 11, a plurality of LED chips 12, a reflecting layer 13 and a substrate 14, wherein the reflecting layer 13 is arranged on the upper surface of the substrate 14, the LED chips 12 are arranged on the upper surface of the reflecting layer 13, the colloid layer 11 encapsulates the LED chips 12, and the LED chips 12 and the reflecting layer 13 are fixedly connected; the upper surface of the printed circuit board 2 is provided with a small module 1 which can be welded by solder paste.

The substrate 14 is an FPC substrate, the reflective layer 13 is a reflective sheet, the LED chips 12 are uniformly distributed on the upper surface of the reflective layer 13 in rows and columns, and the LED chips 12 are: and a blue LED chip. The colloid layer 11 is made of high-reflectivity colloid prepared by adding titanium dioxide and boron nitride into pure silica gel and epoxy resin.

The small module 1 further comprises: and the support 15 is arranged on the upper surface of the reflecting layer 13, the LED chip 12 is arranged on the upper surface of the bottom surface of the support 15, and the colloid layer 11 encapsulates the LED chip 12 in the cavity of the support 15. The support 15 plays the effect of preventing the mutual crosstalk between the small modules, improves the accuracy of regional accuse light of every small module, does not receive the interference of the light of other small modules. The colloid layer 11 adopts an LED packaging manner to package the LED chip 12 in the cavity of the support 15. The frame 15 is composed of a frame bottom 151 and a frame side 152, and the inner surfaces of the frame bottom 151 and the frame side 152 have a light reflecting effect, and the reflectivity is more than 90%. The thickness of the bottom surface 151 of the holder is 0.2mm, the inner surface of the bottom surface 151 of the holder is copper foil, and the inner surface of the side surface 152 of the holder is white plastic. A plurality of small modules 1 are attached to the upper surface of a printed circuit board 2 in a braid or palletized manner.

While various aspects and embodiments have been disclosed herein, it will be apparent to those skilled in the art that other aspects and embodiments can be made without departing from the spirit of the disclosure, and that several modifications and improvements can be made without departing from the spirit of the disclosure. The various aspects and embodiments disclosed herein are presented by way of example only and are not intended to limit the present disclosure, which is to be controlled in the spirit and scope of the appended claims.

Claims

1. The utility model provides a Mini LED lamp plate which characterized in that includes: a plurality of small modules (1) and a printed circuit board (2), a plurality of small modules (1) are attached to the upper surface of a printed circuit board (2), the small modules (1) include: the LED packaging structure comprises a colloid layer (11), a plurality of LED chips (12), a reflecting layer (13) and a substrate (14), wherein the reflecting layer (13) is arranged on the upper surface of the substrate (14), the LED chips (12) are arranged on the upper surface of the reflecting layer (13), and the colloid layer (11) is used for packaging the LED chips (12) and connecting and fixing the LED chips (12) and the reflecting layer (13); the upper surface of the printed circuit board (2) is provided with solder paste which can be welded with the small module (1).

2. The Mini LED light panel of claim 1, wherein the substrate (14) comprises: one of a BT substrate, an FPC substrate, a polyimide substrate or a terylene resin substrate.

3. A Mini LED light panel according to claim 1, where the reflective layer (13) comprises: one of a silver-plated reflective layer, a copper-plated reflective layer, a reflective sheet, or white oil.

4. A Mini LED light panel according to claim 3, where the reflective layer (13) comprises: a silvered reflective layer, or a reflective sheet.

5. A Mini LED lamp panel according to claim 1, wherein the plurality of LED chips (12) are evenly distributed in rows and columns on the upper surface of the reflective layer (13).

6. The Mini LED lamp panel of claim 5, wherein the LED chip (12) comprises: one or more of a blue light LED chip, a red light LED chip, a green light LED chip, a blue-green light LED chip, a yellow light LED chip, an orange light LED chip and an amber light LED chip.

7. The Mini LED light panel of claim 1, wherein the small module (1) further comprises: the LED lamp comprises a support (15), wherein the support (15) is arranged on the upper surface of the reflecting layer (13), an LED chip (12) is arranged on the upper surface of the bottom surface of the support (15), and the colloid layer (11) encapsulates the LED chip (12) in a cavity of the support (15).

8. The Mini LED lamp panel according to claim 7, wherein the support (15) is composed of a support bottom (151) and support side surfaces (152), the inner surfaces of the support bottom (151) and the support side surfaces (152) have a light reflecting effect, and the reflectivity is greater than 90%.