CN213388478U - Hydrofluoric acid resistant pressure sensitive adhesive tape - Google Patents
Hydrofluoric acid resistant pressure sensitive adhesive tape Download PDFInfo
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- CN213388478U CN213388478U CN202022082606.8U CN202022082606U CN213388478U CN 213388478 U CN213388478 U CN 213388478U CN 202022082606 U CN202022082606 U CN 202022082606U CN 213388478 U CN213388478 U CN 213388478U
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- hydrofluoric acid
- sensitive adhesive
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- resistant pressure
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Abstract
本实用新型涉及氢氟酸蚀刻表面保护胶带技术领域，具体涉及一种耐氢氟酸压敏胶带由依次复合的离型层、耐氢氟酸压敏胶层和热收缩层组成，所述耐氢氟酸压敏胶层由耐氢氟酸的丙烯酸压敏胶涂覆于离型层后热固化而成。耐氢氟酸压敏胶层由耐氢氟酸的丙烯酸压敏胶涂覆于离型层后热固化而成，再将耐氢氟酸压敏胶层的一面转移涂至热收缩层，使耐氢氟酸压敏胶层和热收缩层紧密粘合；使用时，撕去离型层，将耐氢氟酸压敏胶层的另一面贴合于基材表面，即可起到保护效果，避免氢氟酸对基材的部分表面进行蚀刻时受保护部分仍被腐蚀，待蚀刻完后清洗，再在80℃‑100℃条件下使热收缩层收缩带动耐氢氟酸压敏胶层一起收缩，从而除去胶带无残胶。
The utility model relates to the technical field of hydrofluoric acid etching surface protection adhesive tapes, in particular to a hydrofluoric acid-resistant pressure-sensitive adhesive tape, which is composed of a release layer, a hydrofluoric acid-resistant pressure-sensitive adhesive layer and a heat shrinkable layer which are sequentially compounded. The hydrofluoric acid pressure-sensitive adhesive layer is made of hydrofluoric acid-resistant acrylic pressure-sensitive adhesive coated on the release layer and then thermally cured. The hydrofluoric acid-resistant pressure-sensitive adhesive layer is formed by coating the hydrofluoric acid-resistant acrylic pressure-sensitive adhesive on the release layer and then heat curing, and then transfer one side of the hydrofluoric acid-resistant pressure-sensitive adhesive layer to the heat shrinkable layer to make the The hydrofluoric acid-resistant pressure-sensitive adhesive layer and the heat-shrinkable layer are tightly bonded; when in use, tear off the release layer, and attach the other side of the hydrofluoric acid-resistant pressure-sensitive adhesive layer to the surface of the substrate to achieve a protective effect , to avoid that the protected part is still corroded when hydrofluoric acid etches part of the surface of the substrate. After the etching is completed, clean it, and then shrink the heat shrinkable layer at 80℃-100℃ to drive the hydrofluoric acid-resistant pressure-sensitive adhesive layer. Shrink together to remove tape without residue.
Description
Technical Field
The utility model relates to a hydrofluoric acid etching surface protection sticky tape technical field, concretely relates to resistant hydrofluoric acid pressure sensitive adhesive tape.
Background
The polymer commonly used for pressure-sensitive adhesives may be a rubber such as natural rubber, polyisobutylene rubber, butyl rubber, and may also be various resins such as atactic polypropylene, acrylic resin, silicone resin, fluorine resin, etc. Fluorine is an active nonmetal, has strong oxidizing ability, and fluorine ions in hydrofluoric acid have small radius, so that the hydrofluoric acid has strong permeability, a compact oxide film cannot prevent the permeation, and the hydrofluoric acid can strongly corrode metal, glass and silicon-containing base materials.
When hydrofluoric acid was etched partial surface of substrate (like the glass screen), current pressure sensitive tape was difficult to play fine guard action, even there was a few pressure sensitive tape to play resistant hydrofluoric acid effect, nevertheless it was torn to remove after the substrate surface and has had the cull, still need additionally clear away through removing the cull technology, has reduced production efficiency, leads to the substrate surface to receive wearing and tearing easily.
Disclosure of Invention
In order to overcome the defects and deficiencies in the prior art, the utility model aims to provide a pressure-sensitive adhesive tape which is easy to remove adhesive and is resistant to hydrofluoric acid.
The purpose of the utility model is realized through the following technical scheme: the hydrofluoric acid-resistant pressure-sensitive adhesive tape is composed of a release layer, a hydrofluoric acid-resistant pressure-sensitive adhesive layer and a thermal shrinkage layer which are sequentially compounded, wherein the hydrofluoric acid-resistant pressure-sensitive adhesive layer is formed by coating hydrofluoric acid-resistant acrylic acid pressure-sensitive adhesive on the release layer and then thermally curing.
Preferably, the release layer is a release film.
Preferably, the heat shrinkable layer is a POF heat shrinkable film.
Preferably, the thickness of the release layer is 50-100 μm.
Preferably, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer is 10-30 μm.
Preferably, the thickness of the heat-shrinkable layer is 30 to 60 μm.
The beneficial effects of the utility model reside in that: the hydrofluoric acid resistant pressure sensitive adhesive tape is formed by coating hydrofluoric acid resistant acrylic acid pressure sensitive adhesive on a release layer and then thermally curing, and then transferring and coating one surface of the hydrofluoric acid resistant pressure sensitive adhesive layer to a thermal shrinkage layer to enable the hydrofluoric acid resistant pressure sensitive adhesive layer and the thermal shrinkage layer to be tightly bonded; when the adhesive tape is used, the release layer is torn off, the other surface of the hydrofluoric acid resistant pressure sensitive adhesive layer is attached to the surface of the base material, the protective effect can be achieved, the situation that the protected part is still corroded when part of the surface of the base material is etched by hydrofluoric acid is avoided, the adhesive tape is cleaned after the etching is finished, the thermal shrinkage layer shrinks to drive the hydrofluoric acid resistant pressure sensitive adhesive layer to shrink together under the condition of 80-100 ℃, and therefore the adhesive tape is removed and no adhesive residue exists.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
the reference signs are: 1. a release layer; 2. a hydrofluoric acid resistant pressure sensitive adhesive layer; 3. a heat-shrinkable layer.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying drawings, which are not intended to limit the present invention.
As shown in fig. 1, the hydrofluoric acid resistant pressure sensitive adhesive tape comprises a release layer 1, a hydrofluoric acid resistant pressure sensitive adhesive layer 2 and a thermal shrinkage layer 3 which are sequentially compounded, wherein the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is formed by coating hydrofluoric acid resistant acrylic acid pressure sensitive adhesive on the release layer 1 and then thermally curing.
According to the hydrofluoric acid resistant pressure sensitive adhesive tape, the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is formed by coating hydrofluoric acid resistant acrylic acid pressure sensitive adhesive on the release layer 1 and then thermally curing, and then one side of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is transferred and coated to the thermal shrinkage layer 3, so that the hydrofluoric acid resistant pressure sensitive adhesive layer 2 and the thermal shrinkage layer 3 are tightly bonded; when the adhesive tape is used, the release layer 1 is torn off, the other surface of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is attached to the surface of the base material, the protective effect can be achieved, the situation that the protected part is still corroded when part of the surface of the base material is etched by hydrofluoric acid is avoided, the adhesive tape is cleaned after the etching is finished, the thermal shrinkage layer 3 is shrunk to drive the hydrofluoric acid resistant pressure sensitive adhesive layer 2 to shrink together at the temperature of 80-100 ℃, and therefore the adhesive tape is removed and no adhesive residue exists. The acrylic pressure-sensitive adhesive resistant to hydrofluoric acid is a pressure-sensitive adhesive sold on the market, has the characteristics of thermosetting and hydrofluoric acid resistance, and is only used as an application.
In this embodiment, the release layer 1 is a release film.
By adopting the technical scheme, the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 is convenient to protect before use, and the hydrofluoric acid-resistant effect is prevented from being reduced due to the fact that hydrofluoric acid permeates along gaps in the etching process caused by the fact that the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 is stained with water or dust.
In the present embodiment, the heat shrinkable layer 3 is a POF heat shrinkable film.
By adopting the technical scheme, the POF heat shrinkable film is a commercially available heat shrinkable film which shrinks under the condition of 80-100 ℃, is short for biaxially oriented polyolefin shrink film, has high transparency, high shrinkage, high toughness, high heat sealing performance, excellent antistatic property and cold resistance, is safe and reliable, and is only used as a soft shrink film.
In this embodiment, the thickness of the release layer 1 is 50 to 100 μm.
By adopting the technical scheme, the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 is protected by enough thickness before use, and the hydrofluoric acid-resistant effect is prevented from being reduced due to permeation of hydrofluoric acid along gaps in the etching process caused by water or dust of the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2. Preferably, the thickness of the release layer is 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 80 μm, 90 μm or 100 μm, and more preferably, the thickness of the release layer is 65 μm.
In the embodiment, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is 10-30 μm.
By adopting the technical scheme, if the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is less than 10 microns, the hydrofluoric acid resistant effect is poor due to too thin thickness, and if the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is more than 30 microns, the hydrofluoric acid resistant time is longer, the hydrofluoric acid etching process is completed excessively, waste is caused, and the cost is higher. Preferably, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer is 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 25 μm, 28 μm or 30 μm, and more preferably, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer is 20 μm.
In this embodiment, the thickness of the heat-shrinkable layer 3 is 30 to 60 μm.
By adopting the technical scheme, the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 is ensured to be driven to shrink when the film is thermally shrunk, so that the film is convenient to remove. Preferably, the thickness of the heat-shrinkable layer is 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 45 μm, 48 μm, 50 μm, 55 μm, 58 μm or 60 μm, and more preferably, the thickness of the heat-shrinkable layer is 40 μm.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (6)
1. A hydrofluoric acid resistant pressure sensitive adhesive tape characterized by: the anti-corrosion and anti-corrosion coating is characterized by comprising a release layer, a hydrofluoric acid-resistant pressure-sensitive adhesive layer and a thermal shrinkage layer which are sequentially compounded, wherein the hydrofluoric acid-resistant pressure-sensitive adhesive layer is formed by coating hydrofluoric acid-resistant acrylic acid pressure-sensitive adhesive on the release layer and then thermally curing.
2. The hydrofluoric acid resistant pressure sensitive adhesive tape of claim 1, wherein: the release layer is a release film.
3. The hydrofluoric acid resistant pressure sensitive adhesive tape of claim 1, wherein: the heat-shrinkable layer is a POF heat-shrinkable film.
4. The hydrofluoric acid resistant pressure sensitive adhesive tape of claim 1, wherein: the thickness of the release layer is 50-100 μm.
5. The hydrofluoric acid resistant pressure sensitive adhesive tape of claim 1, wherein: the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer is 10-30 mu m.
6. The hydrofluoric acid resistant pressure sensitive adhesive tape of claim 1, wherein: the thickness of the heat shrinkable layer is 30-60 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022082606.8U CN213388478U (en) | 2020-09-21 | 2020-09-21 | Hydrofluoric acid resistant pressure sensitive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022082606.8U CN213388478U (en) | 2020-09-21 | 2020-09-21 | Hydrofluoric acid resistant pressure sensitive adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213388478U true CN213388478U (en) | 2021-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022082606.8U Active CN213388478U (en) | 2020-09-21 | 2020-09-21 | Hydrofluoric acid resistant pressure sensitive adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213388478U (en) |
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2020
- 2020-09-21 CN CN202022082606.8U patent/CN213388478U/en active Active
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