CN213340772U

CN213340772U - Conductive terminal and electronic device

Info

Publication number: CN213340772U
Application number: CN202022415641.7U
Authority: CN
Inventors: 金平; 胡松涛; 彭必辉
Original assignee: Zhejiang Holip Electronic Technology Co Ltd
Current assignee: Zhejiang Holip Electronic Technology Co Ltd
Priority date: 2020-10-27
Filing date: 2020-10-27
Publication date: 2021-06-01
Anticipated expiration: 2030-10-27

Abstract

The utility model discloses a conductive terminal and electron device, conductive terminal includes: a terminal body including a substrate portion and a pin extending from the substrate portion to one side of the substrate portion; and a heat radiation fin extending from the base plate portion to a side of the base plate portion away from the leads. The radiating fins are added on the terminal body of the conductive terminal to increase the radiating surface and the heat capacity of the terminal, so that the current-carrying capacity of the conductive terminal can be improved under the condition that the pin position and the thickness of the conductive terminal are not changed, and meanwhile, the layout of a PCB (printed circuit board) does not need to be changed.

Description

Conductive terminal and electronic device

Technical Field

The embodiment of the utility model provides a relate to the electronic equipment field, especially relate to a be applicable to the welding conductive terminal on the circuit board and including this conductive terminal's electron device.

Background

In an electronic device, a circuit connection is realized by soldering conductive terminals on a circuit board. In the prior art, the conductive terminals usually adopt standard right-angled arch terminals, wherein the current-carrying capacity of the terminals is increased by changing the thickness or width of the conductive terminals, which imposes restrictions on the miniaturization of the circuit board. In addition, if the thickness or width of the conductive terminals is increased, the layout of the Circuit Board may need to be changed, which may result in redesign of the pin positions of the Circuit Board, thereby failing to achieve multiplexing of a Printed Circuit Board (PCB) and increasing costs.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to solve at least one of the above problems and disadvantages in the prior art.

According to an aspect of the present invention, there is provided a conductive terminal, including: a terminal body including a substrate portion and a pin extending from the substrate portion to one side of the substrate portion; and a heat radiation fin extending from the base plate portion to a side of the base plate portion away from the leads.

According to the utility model discloses an electrically conductive terminal, the pin respectively with relative both sides portion of base plate portion is connected and perpendicular to base plate portion extends.

According to the utility model discloses an electrically conductive terminal, radiating fin follows the first end of base plate portion extends to keeping away from of base plate portion one side of pin.

According to the utility model discloses an electrically conductive terminal, radiating fin is the structure of buckling.

According to the utility model discloses an electrically conductive terminal, radiating fin includes first extension and second extension, first extension with the end connection of base plate portion is perpendicular base plate portion extends, the second extension with the free end connection of first extension is on a parallel with base plate portion and orientation the second end of base plate portion with first end is relative extends.

According to the utility model discloses an electrically conductive terminal, first end with junction between the first extension with junction between the second extension adopts the arc structure.

According to the utility model discloses an electrically conductive terminal, radiating fin's free end is round chamfer.

According to the utility model discloses an electrically conductive terminal, the terminal body with radiating fin makes through punching press an organic whole.

According to the utility model discloses an electrically conductive terminal of embodiment, the base plate portion is provided with the mounting hole that is used for installing conductive element.

According to an embodiment of another aspect of the present invention, there is provided an electronic device, the electronic device includes a circuit board and the conductive terminal as described above, the conductive terminal is installed on the circuit board.

According to the utility model discloses above-mentioned various embodiments's conductive terminal and electron device increases radiating area and the heat capacity that radiating fin increases the terminal through the terminal body at conductive terminal, can improve the current-carrying capacity of terminal like this under the unchangeable condition of conductive terminal's foot position and thickness, need not change the overall arrangement of circuit board simultaneously. In addition, the area of the radiating fin can be flexibly adjusted according to the size of the current-carrying capacity.

Drawings

These and/or other aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the preferred embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic perspective view illustrating a conductive terminal according to an exemplary embodiment of the present invention;

fig. 2 is another perspective view of the conductive terminal shown in fig. 1;

fig. 3 is a schematic perspective view illustrating a portion of an electronic device according to an exemplary embodiment of the present invention;

fig. 4 is a schematic diagram illustrating an electronic device according to an exemplary embodiment of the present invention; and

fig. 5 is a partial schematic view of the electronic device shown in fig. 4.

Detailed Description

While the present invention will be fully described with reference to the accompanying drawings, which contain preferred embodiments of the invention, it is to be understood that those skilled in the art can, prior to this description, modify the embodiments described herein while obtaining the technical effects of the invention. Therefore, it should be understood that the foregoing description is a broad disclosure directed to persons of ordinary skill in the art, and is not intended to limit the exemplary embodiments of the invention described herein.

Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.

According to the present general inventive concept, there is provided a conductive terminal including a terminal body and a heat dissipation fin, the terminal body including a base plate portion and a pin extending from the base plate portion to one side of the base plate portion; the heat dissipation fins extend from the base plate portion to a side of the base plate portion away from the leads.

According to another general inventive concept of the present invention, there is provided an electronic device including a circuit board and the conductive terminal as described above, the conductive terminal being mounted on the circuit board.

Fig. 1 is a schematic perspective view illustrating a conductive terminal according to an exemplary embodiment of the present invention; fig. 2 is another perspective view of the conductive terminal shown in fig. 1; fig. 3 is a schematic perspective view illustrating a portion of an electronic device according to an exemplary embodiment of the present invention; fig. 4 is a schematic diagram illustrating an electronic device according to an exemplary embodiment of the present invention; and FIG. 5 is a partial schematic view of the electronic device shown in FIG. 4.

In an exemplary embodiment, as shown in fig. 1 and 2, an electrically conductive terminal 10 according to the present invention includes a terminal body including a base plate portion 1 and a pin 2, the base plate portion 1 having opposite ends: a first end E1 and a second end E2; two surfaces located opposite: upper surface P1 and lower surface P2 and two opposite sides: a first side S1 and a second side S2; the leads 2 may include a plurality of, for example, 2, 3, and 4 … leads 2 connected to two opposite sides (the first side S1 and the second side S2) of the substrate portion 1 and extending from the substrate portion 1 to one side (the lower side as viewed in fig. 1) of the substrate portion 1. The conductive terminal 10 further includes a heat dissipating fin 3, the heat dissipating fin 3 extends from the substrate portion 1 to a side (an upper side as shown in fig. 1) of the conductive terminal 10 far from the pin 2, and by adding the heat dissipating fin 3 to the terminal body of the conductive terminal 10, a heat exchange area between the conductive terminal 10 and air can be increased, thereby increasing heat dissipation, and simultaneously increasing a volume of the conductive terminal 10 to increase heat capacity. This can improve the current-carrying capacity of the terminal without changing the pin position and thickness of the conductive terminal 10, and at the same time, the layout of the circuit board does not need to be changed. The size of the heat dissipation fins 3 can be flexibly adjusted according to the magnitude of the current-carrying capacity, and the heat dissipation capability of the conductive terminals 10 can be realized by adjusting the size of the heat dissipation fins 3.

In the exemplary embodiment shown in fig. 1 and 2, the leads 2 are respectively connected to the positions of the two opposite side portions of the substrate portion 1 near the second end E2 of the substrate portion 1 and extend to one side of the substrate portion 1 substantially perpendicular to the substrate portion 1, however, it should be understood by those skilled in the art that the leads may be at any position of the substrate portion 1 as long as the leads are adapted to the connection position on the circuit board, for example, in other embodiments of the present invention, the leads 2 may be connected to other positions of the substrate portion 1, for example, the middle position of the two opposite side portions of the substrate portion 1.

In an exemplary embodiment, as shown in fig. 1 and 2, the heat radiation fins 3 extend from the first end E1 of the base plate portion 1 to a side (upper side as shown in fig. 1) of the base plate portion 1 away from the lead 2. However, it should be understood by those skilled in the art that the heat dissipation fin may be located at any position as long as the position of the heat dissipation fin does not block or affect the connection and placement of other devices, and meets the requirements of heat dissipation and current-carrying capacity, for example, in some other embodiments of the present invention, the heat dissipation fin 3 may also extend from the second end E2 of the substrate portion 1 or substantially the middle of the substrate portion 1 to the side of the substrate portion 1 away from the pin 2.

In an exemplary embodiment, as shown in fig. 1 and 2, the heat dissipating fins 3 are of a bent structure. Specifically, the heat dissipation fin 3 includes a first extension portion 31 and a second extension portion 32, the first extension portion 31 being connected to the first end E1 of the base plate portion 1 and extending perpendicularly to the base plate portion 1, the second extension portion 32 being connected to the free end of the first extension portion 31 and extending substantially parallel to the base plate portion 1 and toward the second end E2 of the base plate portion 1. However, it should be understood by those skilled in the art that in some other embodiments of the present invention, the heat dissipating fin 3 may also be an arc structure or a planar structure (for example, the heat dissipating fin includes only the first extension), and of course, the heat dissipating fin may also be a more bent structure, as long as the heat dissipating fin is adapted to the space on the circuit board.

In an exemplary embodiment, as shown in fig. 1 and 2, the connection between the first end E1 and the first extension 31, and the connection between the first extension 31 and the second extension 32 are in an arc-shaped structure, for example, with a radius of curvature of 0.1mm to 0.3mm, etc., to avoid stress concentration.

In an exemplary embodiment, as shown in fig. 1 to 3, the free end portion of the heat dissipating fin 3 is formed with a scraping prevention portion 33. In the illustrated embodiment, the scraping prevention portion 33 is a rounded chamfer, so that other objects can be prevented from hooking the heat dissipating fin 3 to loosen the connection between the conductive terminal 10 and the circuit board 20.

In an exemplary embodiment, as shown in fig. 1 and 2, the terminal body and the heat radiating fins 3 may be integrally formed by punching using a conductive material plate (e.g., a copper plate, etc.) so as to simplify the manufacturing process.

In an exemplary embodiment, as shown in fig. 1, 2 and 4, the substrate section 1 is provided with a through hole 4 for mounting the conductive element 40 (e.g., conductive pillar), and the through hole 4 extends through the substrate section 1, i.e., the through hole 4 extends from the upper surface P1 to the lower surface P2.

As shown in fig. 3, the present invention further provides an electronic assembly 100, the electronic assembly 100 includes a circuit board 20, and the conductive terminal 10 as described above, wherein the pin of the conductive terminal 10 is mounted on the circuit board 20 by soldering, for example, and the circuit board 20 may be a Printed Circuit Board (PCB). Further, other electronic components 30 are provided on the circuit board 20.

As shown in fig. 4, the present invention also provides an electronic device, such as a frequency converter. The electronic device comprises an electronic assembly 100 as described above. The pins of the conductive terminals 10 of the electronic assembly 100 are mounted on the circuit board 20 by soldering, for example, and the conductive terminals 10 are connected to the capacitors 50 located below the circuit board 20 through conductive elements 40 (e.g., conductive posts) passing through holes on the substrate portion thereof. In use, heat generated by the circuit board 20 is transferred to the heat dissipating fins 3 via the terminal body, and then the heat dissipating fins 3 exchange heat with air around the heat dissipating fins 3, for example, air flowing through the heat dissipating fins 3 as indicated by arrows in fig. 5, so as to accelerate heat dissipation.

According to the utility model discloses conductive terminal, electronic component and electron device of above-mentioned various embodiments increase radiating area and heat capacity that radiating fin increases conductive terminal through the terminal body at conductive terminal, can improve the current-carrying capacity of terminal like this under the unchangeable condition of conductive terminal's foot position and thickness, need not change the overall arrangement of circuit board simultaneously. The area of the radiating fin can be flexibly adjusted according to the size of the current-carrying capacity. In addition, through increasing the radiating fin on the terminal body, the identification characteristic of conductive terminal has been improved to avoid appearing the mistake assembly.

It will be appreciated by those skilled in the art that the embodiments described above are exemplary and can be modified by those skilled in the art, and that the structures described in the various embodiments can be freely combined without conflict in structure or principle.

Having described preferred embodiments of the present invention in detail, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the scope and spirit of the appended claims, and the invention is not to be limited to the exemplary embodiments set forth in the specification.

Claims

1. An electrically conductive terminal, comprising:

a terminal body including a substrate portion and a pin extending from the substrate portion to one side of the substrate portion; and

a heat sink fin extending from the base plate portion to a side of the base plate portion distal from the leads.

2. An electrically conductive terminal as claimed in claim 1, wherein the pins are respectively connected to opposite sides of the base portion and extend perpendicularly thereto.

3. An electrically conductive terminal as claimed in claim 2, wherein the heat sink fins extend from the first end portion of the base plate portion to a side of the base plate portion remote from the pins.

4. The conductive terminal as claimed in claim 3, wherein the heat dissipating fins are bent.

5. The conductive terminal of claim 4, wherein the heat sink fins include a first extension portion connected to the end of the base plate portion and extending perpendicular to the base plate portion, and a second extension portion connected to a free end of the first extension portion and extending parallel to the base plate portion and toward a second end of the base plate portion opposite the first end.

6. The conductive terminal of claim 5, wherein a junction between the first end and the first extension, and a junction between the first extension and the second extension are arcuate in configuration.

7. An electrically conductive terminal as claimed in claim 4, wherein the free ends of the heat dissipating fins are rounded off.

8. The conductive terminal as claimed in any one of claims 1 to 7, wherein the terminal body and the heat dissipating fin are integrally formed by stamping.

9. An electrically conductive terminal as claimed in any one of claims 1 to 7, wherein the base plate portion is provided with mounting holes for mounting electrically conductive elements.

10. An electronic device comprising a circuit board and an electrically conductive terminal according to any one of claims 1-8 mounted on the circuit board.