CN213336504U - High voltage distribution cabinet wiring node temperature detection device - Google Patents
High voltage distribution cabinet wiring node temperature detection device Download PDFInfo
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- CN213336504U CN213336504U CN202022217922.1U CN202022217922U CN213336504U CN 213336504 U CN213336504 U CN 213336504U CN 202022217922 U CN202022217922 U CN 202022217922U CN 213336504 U CN213336504 U CN 213336504U
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- 238000001931 thermography Methods 0.000 claims abstract description 58
- 238000004891 communication Methods 0.000 claims abstract description 54
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- 238000000034 method Methods 0.000 claims abstract description 15
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000011897 real-time detection Methods 0.000 description 3
- 238000013527 convolutional neural network Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
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- 210000001503 joint Anatomy 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
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Abstract
本实用新型公开了一种高压配电柜接线结点温度检测装置，包括：红外热成像探头、MCU模块、电源模块和通信模块；红外热成像探头设置于高压配电柜接线结点的正前方；MCU模块与红外热成像探头电连接，获取红外热成像探头的热成像数据，并对其进行处理；MCU与通信模块电连接，通过通信模块发送接线结点温度过高的报警数据；电源模块分别与红外热成像探头、MCU模块和通信模块电连接。通过设置于高压配电柜接线结点正前方的红外热成像探头，对接线结点温度进行实时检测，实现了对高压配电柜中接线结点的温度进行快速、准确的检测，且安装位置较为灵活，探测灵敏度高。
The utility model discloses a temperature detection device for a wiring node of a high-voltage power distribution cabinet, comprising: an infrared thermal imaging probe, an MCU module, a power supply module and a communication module; the infrared thermal imaging probe is arranged directly in front of the wiring node of the high-voltage power distribution cabinet ;The MCU module is electrically connected to the infrared thermal imaging probe to obtain the thermal imaging data of the infrared thermal imaging probe and process it; the MCU is electrically connected to the communication module, and the alarm data of the excessive temperature of the wiring node is sent through the communication module; the power module It is respectively electrically connected with the infrared thermal imaging probe, the MCU module and the communication module. Through the infrared thermal imaging probe set in front of the wiring node of the high-voltage power distribution cabinet, the temperature of the wiring node is detected in real time, and the temperature of the wiring node in the high-voltage power distribution cabinet can be quickly and accurately detected, and the installation location It is more flexible and has high detection sensitivity.
Description
Technical Field
The utility model relates to an electrical equipment detects technical field, in particular to high voltage distribution cabinet wiring node temperature-detecting device.
Background
The high-voltage power distribution cabinet is the final-stage equipment in a power distribution system, and whether the high-voltage power distribution cabinet works normally or not directly influences the use of the whole power distribution network. In the common trouble problem of high voltage distribution cabinet, all there is the condition of high temperature in the cabinet. At present, most of distribution room electrical equipment mainly adopt artifical patrol mode to manage, and the distribution room is patrolled the temperature measurement point many, and the manual work is patrolled and examined working strength and is big, inefficiency to, more region is comparatively sealed in the cabinet, and the unable manual work is looked over, can not in time discover the fault point. Once a high-voltage power distribution cabinet breaks down, the high-voltage power distribution cabinet causes loss which cannot be estimated, large-area power failure can be caused, and safety accidents are caused.
At present, a single temperature sensor is mostly adopted for collecting temperature data in a temperature detection alarm mode of the high-voltage power distribution cabinet, and specific temperature numerical value information is only transmitted to a monitoring center through a bus. The mode of adopting the temperature that single temperature sensor gathered often has the equipment fixing to detect the temperature influence too big, detectivity is low excessively, detect consuming time overlength and device wiring problem such as difficult. Most temperature sensors adopt thermocouples or thermistors as sensor materials, the detection temperature area is a circular area, and the detection temperature has larger difference along with the increase of the distance from a heat source.
Disclosure of Invention
The utility model aims at providing a high voltage distribution cabinet wiring node temperature detection device, through setting up in the infrared thermal imaging probe in the direct ahead of high voltage distribution cabinet wiring node, carry out real-time detection to wiring node temperature, realized carrying out quick, accurate detection to the temperature of wiring node in the high voltage distribution cabinet, and the mounted position is comparatively nimble, and detection sensitivity is high.
In order to solve the technical problem, the embodiment of the utility model provides a high voltage distribution cabinet wiring node temperature-detecting device, include: the infrared thermal imaging device comprises an infrared thermal imaging probe, an MCU module, a power supply module and a communication module;
the infrared thermal imaging probe is arranged right in front of a wiring node of the high-voltage power distribution cabinet;
the MCU module is electrically connected with the infrared thermal imaging probe, acquires thermal imaging data of the infrared thermal imaging probe and processes the thermal imaging data;
the MCU module is electrically connected with the communication module and used for sending alarm data of overhigh temperature of the wiring node through the communication module;
the power module is electrically connected with the infrared thermal imaging probe, the MCU module and the communication module respectively.
Further, high voltage distribution cabinet wiring junction temperature-detecting device still includes: an alarm module;
the alarm module is electrically connected with the MCU module and receives an alarm signal which is sent by the MCU module and indicates that the temperature of the wiring junction is overhigh.
Further, the alarm module includes: a light alarm unit and/or an audio alarm unit;
the light alarm unit is an LED lamp group;
the audio alarm unit is a loudspeaker.
Further, high voltage distribution cabinet wiring junction temperature-detecting device still includes: a storage module;
the storage module is electrically connected with the MCU module and used for receiving thermal imaging data sent by the MCU module.
Further, the MCU module can receive a control instruction transmitted by the communication module and acquire historical thermal imaging data stored in the storage module according to the control instruction.
Further, the communication module exchanges data with a control center of the high-voltage power distribution cabinet in a wired communication mode and/or a wireless communication mode.
Further, the communication module includes: a GPRS communication unit and/or a WIFI communication unit;
the wireless communication method comprises the following steps: and exchanging data with the control center through the GPRS communication unit or the WIFI communication unit.
Further, the step of transmitting data to the control center by the MCU module through the communication module includes: temperature value information and/or thermal imaging picture information of the connection node.
Further, high voltage distribution cabinet wiring junction temperature-detecting device still includes: a standby power supply module;
the standby power supply module is electrically connected with the power supply module and supplies power to the power supply module when an external power supply circuit is abnormal.
The embodiment of the utility model provides an above-mentioned technical scheme has following profitable technological effect:
through setting up in the infrared thermal imaging probe in high voltage distribution cabinet wiring node dead ahead, carry out real-time detection to wiring node temperature, realized carrying out quick, accurate detection to the temperature of wiring node in the high voltage distribution cabinet, and the mounted position is comparatively nimble, and detectivity is high.
Drawings
Fig. 1 is the embodiment of the utility model provides a high voltage distribution cabinet wiring node temperature-detecting device principle sketch map.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Currently, in the industry, a single temperature sensor is generally adopted to collect temperature data or a worker holds a thermal imager to detect the temperature of each wiring node in a distribution box one by one. The method for acquiring temperature data by using a single temperature sensor can only detect the temperature data of one wiring node each time, and has the defects of complex detection process, inaccurate detection data, single detection information and the like for the power distribution cabinet with more wiring nodes; by adopting the method of collecting temperature data by the handheld thermal imager, the high-voltage cabinet needs to be opened before each detection, and workers need to manually calculate the highest value of the local temperature.
In high voltage distribution cabinet, the line node is the position that the high temperature appears most easily as the tie point of each electric wire in the switch board, and the high temperature condition can appear when using in node contact failure and oxidation, and the temperature can be more and more high along with the increase of live time, and it is very important to discover in time the high temperature node and take measures.
Fig. 1 is the embodiment of the utility model provides a high voltage distribution cabinet wiring node temperature-detecting device principle sketch map.
Referring to fig. 1, an embodiment of the present invention provides a high voltage distribution cabinet wiring node temperature detection apparatus, including: the infrared thermal imaging device comprises an infrared thermal imaging probe, an MCU module, a power supply module and a communication module; the infrared thermal imaging probe is arranged right in front of a wiring node of the high-voltage power distribution cabinet; the MCU module is electrically connected with the infrared thermal imaging probe, acquires thermal imaging data of the infrared thermal imaging probe and processes the thermal imaging data; the MCU module is electrically connected with the communication module and sends alarm data of overhigh temperature of the wiring node through the communication module; the power supply module is respectively and electrically connected with the infrared thermal imaging probe, the MCU module and the communication module.
According to the method for collecting temperature information by using the infrared thermal imaging probe in the technical scheme, the temperature data of a plurality of wiring nodes of the whole cabinet can be measured, the temperature image is basically processed by the MCU module, the communication module is used, the processed temperature data is transmitted to the upper computer of the control room, and the method is flexible in installation position, high in measurement accuracy, rich in detection information and convenient to use.
Further, the specific process of the MCU module for processing the thermal imaging data is as follows: firstly, preprocessing a thermal imaging image in thermal imaging data by an MCU module, and performing linear filtering on the thermal imaging image by a wave recorder to eliminate noise in an infrared image; secondly, segmenting the linearly filtered image by adopting a lightweight convolutional neural network MobileNetv2, wherein MobileNetv2 is a convolutional neural network applied to embedded equipment and introduced by Google, and training on a thermal infrared image semantic segmentation data set SODA; and finally, realizing the division of each region of the thermal imaging image, namely each heating device, each wiring node, the cabinet body and other regions, calculating the average temperature and the maximum temperature value of each region, and storing the temperature data and the thermal infrared image data.
According to the technical scheme, the temperature of the wiring node is detected in real time through the infrared thermal imaging probe arranged in front of the wiring node of the high-voltage power distribution cabinet, the temperature of the wiring node in the high-voltage power distribution cabinet is detected quickly and accurately, the installation position is flexible, and the detection sensitivity is high.
Optionally, the device for detecting the temperature of the connection node of the high voltage distribution cabinet further comprises: and an alarm module. The alarm module is electrically connected with the MCU module and receives an alarm signal which is sent by the MCU module and indicates that the temperature of the wiring node is too high.
Specifically, the alarm module includes: a light alarm unit and/or an audio alarm unit; the light alarm unit is an LED lamp group; the audio alarm unit is a loudspeaker.
In addition, high voltage distribution cabinet junction temperature-detecting device still includes: and a storage module. The storage module is electrically connected with the MCU module and used for receiving thermal imaging data sent by the MCU module.
Further, the MCU module can receive the control instruction transmitted by the communication module and acquire the historical thermal imaging data stored in the storage module according to the control instruction.
Optionally, the communication module exchanges data with a control center of the high voltage distribution cabinet in a wired communication manner and/or a wireless communication manner.
Specifically, the communication module includes: a GPRS communication unit and/or a WIFI communication unit; the wireless communication method includes: and data exchange is carried out with the control center through the GPRS communication unit or the WIFI communication unit.
Further, the MCU module transmits data to the control center through the communication module, and the data transmission comprises the following steps: temperature value information and/or thermographic picture information of the connection node.
Optionally, the high-voltage distribution cabinet connection node temperature detection device generally adopts a direct-current 5V voltage power supply mode. In addition, high voltage distribution cabinet junction temperature-detecting device still includes: and a standby power supply module. The standby power supply module is electrically connected with the power supply module and supplies power to the power supply module when the external power supply circuit is abnormal.
The high-voltage power distribution cabinet wiring node temperature detection device is small in module number, small in occupied size, flexible in position setting of the infrared thermal imaging probe, high in wiring node temperature detection precision of the high-voltage power distribution cabinet, diversified in temperature detection information reporting mode and high in reliability. The maintainer can be according to alarm module accurately fast to the high region of junction temperature of butt joint go on the location to quick processing.
The embodiment of the utility model provides a aim at protecting a high voltage distribution cabinet wiring node temperature-detecting device, include: the infrared thermal imaging device comprises an infrared thermal imaging probe, an MCU module, a power supply module and a communication module; the infrared thermal imaging probe is arranged right in front of a wiring node of the high-voltage power distribution cabinet; the MCU module is electrically connected with the infrared thermal imaging probe, acquires thermal imaging data of the infrared thermal imaging probe and processes the thermal imaging data; the MCU is electrically connected with the communication module and sends alarm data of overhigh temperature of the wiring node through the communication module; the power supply module is respectively and electrically connected with the infrared thermal imaging probe, the MCU module and the communication module. The technical scheme has the following effects:
through setting up in the infrared thermal imaging probe in high voltage distribution cabinet wiring node dead ahead, carry out real-time detection to wiring node temperature, realized carrying out quick, accurate detection to the temperature of wiring node in the high voltage distribution cabinet, and the mounted position is comparatively nimble, and detectivity is high.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (9)
1. The utility model provides a high voltage distribution cabinet junction temperature-detecting device that connects which characterized in that includes: the infrared thermal imaging device comprises an infrared thermal imaging probe, an MCU module, a power supply module and a communication module;
the infrared thermal imaging probe is arranged right in front of a wiring node of the high-voltage power distribution cabinet;
the MCU module is electrically connected with the infrared thermal imaging probe, acquires thermal imaging data of the infrared thermal imaging probe and processes the thermal imaging data;
the MCU module is electrically connected with the communication module and used for sending alarm data of overhigh temperature of the wiring node through the communication module;
the power module is electrically connected with the infrared thermal imaging probe, the MCU module and the communication module respectively.
2. The apparatus for detecting the junction temperature of a high voltage distribution cabinet according to claim 1, further comprising: an alarm module;
the alarm module is electrically connected with the MCU module and receives an alarm signal which is sent by the MCU module and indicates that the temperature of the wiring junction is overhigh.
3. The device for detecting the junction temperature of a high-voltage distribution cabinet according to claim 2,
the alarm module includes: a light alarm unit and/or an audio alarm unit;
the light alarm unit is an LED lamp group;
the audio alarm unit is a loudspeaker.
4. The apparatus for detecting the junction temperature of a high voltage distribution cabinet according to claim 1, further comprising: a storage module;
the storage module is electrically connected with the MCU module and used for receiving thermal imaging data sent by the MCU module.
5. The device for detecting the junction temperature of a high-voltage distribution cabinet according to claim 4,
the MCU module can receive the control instruction transmitted by the communication module and acquire the historical thermal imaging data stored in the storage module according to the control instruction.
6. The device for detecting the junction temperature of a high-voltage distribution cabinet according to claim 1,
and the communication module exchanges data with a control center of the high-voltage power distribution cabinet in a wired communication mode and/or a wireless communication mode.
7. The device for detecting the junction temperature of a high-voltage distribution cabinet according to claim 6,
the communication module includes: a GPRS communication unit and/or a WIFI communication unit;
the wireless communication method comprises the following steps: and exchanging data with the control center through the GPRS communication unit or the WIFI communication unit.
8. The device for detecting the junction temperature of a high-voltage distribution cabinet according to claim 6,
the MCU module transmits data to the control center through the communication module, and the data transmission comprises the following steps: temperature value information and/or thermal imaging picture information of the connection node.
9. The apparatus for detecting the junction temperature of a high voltage distribution cabinet according to claim 1, further comprising: a standby power supply module;
the standby power supply module is electrically connected with the power supply module and supplies power to the power supply module when an external power supply circuit is abnormal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022217922.1U CN213336504U (en) | 2020-09-29 | 2020-09-29 | High voltage distribution cabinet wiring node temperature detection device |
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| CN202022217922.1U CN213336504U (en) | 2020-09-29 | 2020-09-29 | High voltage distribution cabinet wiring node temperature detection device |
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| CN213336504U true CN213336504U (en) | 2021-06-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114923579A (en) * | 2022-03-29 | 2022-08-19 | 窦贤斌 | Device for monitoring temperature of cable head of high-voltage power distribution cabinet |
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- 2020-09-29 CN CN202022217922.1U patent/CN213336504U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114923579A (en) * | 2022-03-29 | 2022-08-19 | 窦贤斌 | Device for monitoring temperature of cable head of high-voltage power distribution cabinet |
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