CN213301093U - Measuring device capable of simultaneously measuring surface coatings of multiple printed circuit boards - Google Patents
Measuring device capable of simultaneously measuring surface coatings of multiple printed circuit boards Download PDFInfo
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- CN213301093U CN213301093U CN202022473622.XU CN202022473622U CN213301093U CN 213301093 U CN213301093 U CN 213301093U CN 202022473622 U CN202022473622 U CN 202022473622U CN 213301093 U CN213301093 U CN 213301093U
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- 238000000576 coating method Methods 0.000 title claims abstract description 24
- 238000004458 analytical method Methods 0.000 claims abstract description 54
- 239000003792 electrolyte Substances 0.000 claims abstract description 51
- 238000005259 measurement Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 18
- 230000008859 change Effects 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000005868 electrolysis reaction Methods 0.000 abstract description 10
- 238000012360 testing method Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000001514 detection method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 239000003115 supporting electrolyte Substances 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
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Abstract
The utility model provides a but measuring device of a plurality of printed wiring board surface coating of simultaneous measurement, this measuring device includes a plurality of electrolysis analysis units, galvanostat and calibration unit, a plurality of electrolysis analysis units are mutually independent, and every electrolysis analysis unit all includes three electrode unit, electrolyte tank and temperature control unit, three electrode unit includes working electrode, reference electrode and counter electrode, these electrode settings are inside the electrolyte tank, temperature control unit also sets up inside the electrolyte tank. The galvanostat is used to make the current input to the working and counter electrodes of each electroanalysis cell continuous and constant and to plot the electrode potential as a function of time, and the calibration unit is used to calibrate and self-test the galvanostat. The measuring device can avoid the time waste and the risk of electrode pollution caused by repeatedly replacing electrolyte of the measuring device with a single electrolysis analysis unit, and has good measuring reliability.
Description
Technical Field
The utility model belongs to printed circuit board surface coating measurement analysis field, specifically speaking relates to a measuring device that can measure a plurality of printed circuit board surface coatings simultaneously.
Background
Along with the intensive and function integration development of circuit board circuit, the homogeneity requirement to surface coating thickness is higher and higher, and is also more and more difficult to a plurality of surface treatment processes management and control, and X ray fluorescence thickness measuring instrument is because of to testing the thick board, the interference of material is more sensitive, can't distinguish some pure metal layer and intermetallic phase compound moreover, has certain limitation. In particular, a circuit board factory usually has a plurality of surface treatment processes, in the normal production process, the quality process control of each surface treatment process is to perform batch/frequency-fixed monitoring on the plating thickness, and in order to measure the thickness of a plurality of surface treatment coatings more accurately and rapidly and simultaneously, it is necessary to design a multi-groove measuring device capable of meeting the requirement.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a measuring device which can simultaneously measure the surface coatings of a plurality of printed circuit boards, the measuring device comprises a plurality of electrolytic analysis units, a galvanostat and a calibration unit,
the plurality of electrolytic analysis units are independent from each other, and each electrolytic analysis unit comprises a three-electrode unit, an electrolyte tank and a temperature control unit,
the three-electrode unit comprises a working electrode, a reference electrode and a counter electrode, the electrodes are all arranged in the electrolyte tank, and the temperature control unit is also arranged in the electrolyte tank and used for controlling the temperature of the electrolyte in the electrolyte tank.
The galvanostat is used for enabling the current input into the working electrode and the counter electrode of each electrolytic analysis unit to be continuous and constant, monitoring the potential of the working electrode measured by the reference electrode of each electrolytic analysis unit, drawing a curve of the electrode potential along with the change of time according to the potential of the working electrode,
the calibration unit is used for calibrating and self-detecting the galvanostat.
Preferably, the number of the plurality of electrolytic analysis units is 2, 3, 4, 5, 6, 7, 8 or more.
More preferably, the number of the plurality of electrolytic analysis cells is 2.
More preferably, the number of the plurality of electrolytic analysis cells is 3.
More preferably, the number of the plurality of electrolytic analysis cells is 4.
Preferably, the temperature control unit includes a heater for generating heat after being powered on, and a temperature sensor for sensing the temperature of the electrolyte and controlling the power-on state of the heater according to a set temperature value, so that the temperature of the electrolyte is maintained within a predetermined temperature range.
Preferably, the measuring device further comprises a detection instrument for calibrating the calibration unit.
Preferably, the above-mentioned measuring apparatus further comprises an operation unit for inputting the measurement parameter and displaying the measurement result.
Preferably, the operation unit is a computer.
Preferably, the material and dimensions of the electrolyte bath of each electrolytic analysis unit are different for analyzing the thickness of the different material plating of the plurality of printed wiring boards.
Preferably, the material and dimensions of the electrolyte bath of each electrolytic analysis unit are the same for analyzing the thickness of the same material plating of the plurality of printed wiring boards.
Preferably, each electrolytic analysis unit is located in a different chamber, and a heater and a temperature sensor are installed in each chamber and connected to the operation unit. The operation unit is used for setting or adjusting the heating temperature and displaying the temperature of the electrolyte sensed by the temperature sensor.
The measuring device of the present invention can operate in oxidation and reduction modes, which can provide thickness information of pure metal layers and the following possible intermetallic phase compounds. The layer detected during the measurement is irreversibly removed. The reduction mode is used to determine the surface condition of the metal layer, the oxide layer is measured and quantified, and all reducing elements (e.g., oxides, sulfides) are successively removed from the surface of the printed wiring board during the measurement.
In the oxidation mode, for thickness detection, a surface of known area is immersed in an anodic solution using a suitable electrolyte to which a constant current is applied. Complete dissolution of the metal layer can be detected by a change in the electrode potential. The current is proportional to the mass of metal that is oxidized. By this process, all the metal layers can be removed from the substrate in succession under the action of the current and the supporting electrolyte, respectively.
In the reduction mode, the measurement follows the same principle as in the oxidation mode, but in the process the coating (e.g. such as a metal oxide) on the surface of the metal layer is reduced by cathodic current. In this mode the reducing element (e.g. oxide) will be assigned a specific potential and removed from the surface during the measurement.
The time at which a specific potential is present at the electrode during oxidation or reduction of the coating is recorded. The time during which this potential lasts after the constant current is applied is called the phase inversion time t. The relationship between the oxidation or reduction masses is determined according to Faraday's law. For metallic or non-metallic coatings, the molecular weight M, the number of electrons n and the density ρ are constants. The plating thickness d depends only on the applied current i and the area a from which the plating is stripped, which is determined by the length and width of the pad on the test specimen. Therefore, the thickness can be obtained by the following equation.
The utility model provides a measuring device contains a plurality of electrolysis analysis unit, utilizes the curve of a plurality of electrode potential along with time variation that every electrolysis analysis unit's three electrode unit can obtain simultaneously to through the operation unit operation and demonstration, as long as utilize above-mentioned formula can be convenient, swift, accurate a plurality of printed wiring board surface coating's of analysis thickness.
Therefore, the utility model discloses following beneficial effect has been reached:
the utility model discloses a but simultaneous measurement a plurality of printed wiring board surface coating's measuring device can avoid having the measuring device of single electrolysis analysis unit to change the time waste that electrolyte brought repeatedly, the risk of electrode pollution and for avoiding polluting the preparation work that leads to. In addition, the calibration unit and the detection device can be used conveniently and quickly, the measurement reliability of the measurement device can be guaranteed constantly, and the temperature control unit can be used for monitoring and maintaining the stability of the measurement environment of the electrolyte.
The utility model discloses a but the thickness of the different material cladding materials of simultaneous measurement a plurality of printed wiring board, also the thickness of the same material cladding material of a plurality of printed wiring board of simultaneous measurement, mutual noninterference.
Drawings
In order to illustrate the embodiments of the present invention more clearly, the following figures will be briefly described, and it is to be understood that the following figures are only one embodiment of the present invention.
Fig. 1 is a schematic structural diagram of a measuring apparatus capable of simultaneously measuring surface coatings of a plurality of printed circuit boards according to an embodiment of the present invention.
FIG. 2 is one of the plurality of electrolytic analysis cells of the measuring device of FIG. 1.
Detailed Description
In the description of the utility model, the material for preparing the main body of the electrolyte tank can be PP, PVC, quartz glass material. The materials of each electrolyte tank may be the same or different for containing the same plating solution or different plating solutions. The size of each electrolyte tank can be the same or different, and is used for measuring the thickness of the surface coating of the printed circuit board with the same shape or different shapes.
The utility model discloses a measuring device's galvanostat can make the current control of input working electrode and counter electrode at 10 mu A ~ 10 mA.
The calibration unit of the measuring device of the present invention comprises an accurate metal film resistance (e.g., resistance of about 1000 ± 0.05% Ohm), whose electrical properties do not change over time.
In the description of the present invention, the working electrode includes but is not limited to gold-plated material, the counter electrode includes but is not limited to platinum material, and the reference electrode includes but is not limited to silver material.
In the description of the present invention, the surface plating of the printed wiring board includes, but is not limited to, a pure metal layer (e.g., tin, silver), an intermetallic compound layer (e.g., Cu)XSnY) And oxide layers (e.g., SuO, CuO, Cu)2O). When the plating types on the surface of the printed circuit board are different, the electrolyte is also replaced by the corresponding electrolyte.
In the description of the present invention, since the correct measurement result is based on the change of the accurate measurement current with time, the calibration unit calibrates the measurement accuracy of the current and the voltage with its metal film resistance (e.g., 1000 ± 0.05% Ohm), and its electrical property does not change with time.
The present invention will be described in detail with reference to the accompanying drawings.
As shown in FIG. 1, a measuring apparatus 1 capable of simultaneously measuring the surface coatings of a plurality of printed wiring boards comprises three electrolytic analysis units: a first electrolytic analysis unit 11, a second electrolytic analysis unit 12 and a third electrolytic analysis unit 13, a galvanostat 14 and a calibration unit 15.
The first electrolytic analysis unit 11, the second electrolytic analysis unit 12, and the third electrolytic analysis unit 13 are independent from each other, and each electrolytic analysis unit includes a three-electrode unit, an electrolytic bath, and a temperature control unit.
Fig. 2 shows more clearly the structure of the first electrolytic analysis cell 11 of the measuring device of fig. 1. The first electrolytic analysis cell 11 is located in the first chamber 100 and includes a reference electrode 111, a working electrode 112, a counter electrode 113, and an electrolyte bath 114. Reference electrode 111, working electrode 112, and counter electrode 113 are placed within electrolyte bath 114. A heater 115 and a temperature sensor 116 are also provided in the electrolyte tank 114. The heater 115 is used to heat the electrolyte in the electrolyte tank 114 after being energized. The temperature sensor 116 is used to sense the temperature of the electrolyte, and controls the power-on and power-off states of the heater 115 according to the set temperature and the sensed temperature such that the temperature of the electrolyte is within a predetermined temperature range. Specifically, when the temperature sensor 116 senses that the temperature of the electrolyte is less than the set temperature, the heater 115 is controlled to be in the power-on state to heat the electrolyte, and when the temperature sensor 116 senses that the temperature of the electrolyte is equal to or greater than the set temperature, the heater 115 is controlled to be in the power-off state to no longer heat the electrolyte. The heater 115 and the temperature sensor 116 are connected to an external operation unit through the galvanostat 14, respectively, for setting and displaying the temperature of the electrolyte. The first electrolytic analysis cell 11 further includes a valve 119 provided in a side wall of the electrolyte tank 114 for discharging the electrolyte from the electrolyte tank 114.
The second electrolytic analysis unit 12 and the third electrolytic analysis unit 13 of the measuring apparatus 1 shown in fig. 1, which can simultaneously measure the surface plating of a plurality of printed wiring boards, have the same structure and components as the first electrolytic analysis unit 11 shown in fig. 2.
In the example shown in fig. 1, the measuring apparatus 1 capable of simultaneously measuring the surface coatings of a plurality of printed circuit boards further includes a galvanostat 14 and a calibration unit 15. The galvanostat 14 is used to simultaneously and respectively make the currents input to the respective working and counter electrodes of the first, second and third electrolytic analysis units 11, 12, 13 constant, and simultaneously and respectively monitor the working electrode potential measured from the reference electrode of each electrolytic analysis unit, from which the electrode potential of each electrolytic analysis unit is plotted as a function of time. Calibration unit 15 effect is right the galvanostat carries out inside calibration and self-detection, the utility model discloses a when measuring device calibration, with galvanostat 14 and calibration unit 15 intercommunication, open circuit potential compensation, calibration unit 15 detects and calibrates negative potential digital-to-analog converter to galvanostat 21's positive potential digital-to-analog converter, negative potential digital-to-analog converter and current amplifier respectively, then the degree of accuracy of self-detection voltage under the constant voltage mode to detect the integrality of electric quantity output.
In the example shown in fig. 1, the measuring apparatus 1 capable of simultaneously measuring the surface coatings of a plurality of printed circuit boards further includes a detecting instrument 16 (e.g., a multimeter) and a computer 17. The multimeter is used for detecting the resistance of the calibration unit 15 and measuring the resistance of the calibration unit 15 in a range greater than 1 kOhm. The application program of the computer 17 can support multiple windows, operate multiple analysis units simultaneously, and can display output information of the analysis units, such as images or numerical values, respectively.
In the example shown in fig. 1, the galvanostat 14 and the calibration unit 15 are located in a fourth chamber 400. The side wall of the chamber 400 is further provided with a switch 18, a power supply port 19, an operation unit port 20, a voltage interface 21 and a COM port 21'. The switch 18 is used to control the energization of the entire measuring device. The power supply port 19 is used to connect the measuring apparatus 1 to an external power supply through a wire. The operating unit port 20 is used to access the computer 17 to the measuring device 1. The voltage interface 21 and the COM interface 21' are used to connect the detection device 16 (multimeter) to the measuring apparatus 1.
The working process of simultaneously measuring the thickness of the surface coatings (the coating materials are respectively tin, tin oxide and copper oxide, and silver) of 3 printed circuit boards by using the measuring device is as follows:
when in use, a corresponding proper amount of electrolyte (1.0 mol/L HCl solution of electrolyte for detecting tin; 0.01mol/L NaOH solution of electrolyte for detecting tin oxide and copper oxide; and 200g/L K g of electrolyte for detecting silver) is respectively added into the electrolyte tanks of the first electrolysis analysis unit 11, the second electrolysis analysis unit 12 and the third electrolysis analysis unit 133PO4And 50g/L KSCN solution), setting the temperature of the electrolyte, clamping the printed circuit board sample to be tested on the respective working electrodes, and putting the printed circuit board sample into an electrolyte tank. The measured surface plating type buttons (tin, tin oxide and copper oxide, and silver) for each electrolytic analysis cell are selected via the application interface on the computer 17. Clicking the start button or pressing the space bar to start the measurement, a curve of the electrode potential over time will appear in the application main window. And obtaining the thickness of each plating layer according to the curve and the thickness calculation formula.
Through the above description, it can be seen that the measuring device for simultaneously measuring the surface coatings of a plurality of printed circuit boards of the present invention is simple in operation, and the switching between different electrolyte tanks is simple and quick in terms of coating type selection. The application program supports multiple windows, multiple modules are analyzed simultaneously, interference is avoided, and the working efficiency is greatly improved.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A measuring device capable of simultaneously measuring the surface coatings of a plurality of printed circuit boards is characterized by comprising a plurality of electrolytic analysis units, a galvanostat and a calibration unit,
the plurality of electrolytic analysis units are independent from each other, and each electrolytic analysis unit comprises a three-electrode unit, an electrolyte tank and a temperature control unit,
the three-electrode unit comprises a working electrode, a reference electrode and a counter electrode, the electrodes are all arranged in the electrolyte tank, the temperature control unit is also arranged in the electrolyte tank and is used for controlling the temperature of the electrolyte in the electrolyte tank,
the galvanostat is used for enabling the current input into the working electrode and the counter electrode of each electrolytic analysis unit to be continuous and constant, monitoring the potential of the working electrode measured by the reference electrode of each electrolytic analysis unit, drawing a curve of the electrode potential along with the change of time according to the potential of the working electrode,
the calibration unit is used for calibrating and self-detecting the galvanostat.
2. The apparatus for measuring surface plating of a plurality of printed wiring boards simultaneously as claimed in claim 1, wherein the number of said plurality of electrolytic analysis units is 2, 3, 4, 5, 6, 7, 8 or more.
3. The apparatus as claimed in claim 1 or 2, wherein the temperature control unit comprises a heater and a temperature sensor, the heater is used for generating heat after being electrified, and the temperature sensor is used for sensing the temperature of the electrolyte and controlling the electrified state of the heater according to a set temperature value.
4. The apparatus as claimed in claim 1 or 2, further comprising a detecting device for calibrating the calibration unit.
5. The measuring apparatus for simultaneously measuring the surface coatings of a plurality of printed wiring boards as claimed in claim 1 or 2, further comprising an operation unit for inputting measurement parameters and displaying the measurement results.
6. The apparatus as claimed in claim 5, wherein the operation unit is a computer.
7. The apparatus for measuring the surface plating of a plurality of printed wiring boards simultaneously as claimed in claim 1 or 2, wherein the material and size of the electrolytic bath of each electrolytic analysis unit are different for analyzing the thickness of the plating of different materials of a plurality of printed wiring boards.
8. The apparatus for measuring the surface plating of a plurality of printed wiring boards simultaneously as claimed in claim 1 or 2, wherein the material and size of the electrolytic bath of each electrolytic analysis unit are the same for analyzing the thickness of the plating of different materials of a plurality of printed wiring boards.
9. The apparatus for measuring surface plating of a plurality of printed wiring boards simultaneously as set forth in claim 3, wherein each of the electrolytic analysis units is located in a respective chamber, and wherein said heater and temperature sensor are installed in each chamber and connected to an external operation unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022473622.XU CN213301093U (en) | 2020-10-30 | 2020-10-30 | Measuring device capable of simultaneously measuring surface coatings of multiple printed circuit boards |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022473622.XU CN213301093U (en) | 2020-10-30 | 2020-10-30 | Measuring device capable of simultaneously measuring surface coatings of multiple printed circuit boards |
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| CN213301093U true CN213301093U (en) | 2021-05-28 |
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| CN202022473622.XU Active CN213301093U (en) | 2020-10-30 | 2020-10-30 | Measuring device capable of simultaneously measuring surface coatings of multiple printed circuit boards |
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| CN (1) | CN213301093U (en) |
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