CN213276393U - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- CN213276393U CN213276393U CN202021946447.5U CN202021946447U CN213276393U CN 213276393 U CN213276393 U CN 213276393U CN 202021946447 U CN202021946447 U CN 202021946447U CN 213276393 U CN213276393 U CN 213276393U
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- heat
- temperature control
- heating element
- semiconductor heating
- control device
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Abstract
A temperature control device comprises a shell, a semiconductor heating element and a heat conducting plate. The semiconductor heating element is disposed in the housing. The heat-conducting plate set up in on the semiconductor heating member, the heat-conducting plate is used for supporting the consumptive material. The semiconductor heating element comprises a hot end and a cold end, and the hot end and the cold end are used for providing heat energy and cold energy respectively. The heat conducting plate is used for conducting the heat energy and the cold energy. The temperature control device can effectively control the temperature of the sample.
Description
Technical Field
The application relates to the field of biochemical detection, in particular to a temperature control device.
Background
At present, many diseases are clinically diagnosed by means of in-vitro detection equipment, and the in-vitro detection also plays an extremely important role in the whole process of disease prevention, diagnosis, monitoring and treatment guidance, and is indispensable important equipment for doctors to diagnose and treat. When a doctor makes a diagnosis, the doctor usually needs to interact with an in-vitro detection device by using a sample as a medium.
In the sample detection process, the temperature of the sample and necessary reagents may need to be raised or lowered so that the sample and the reagents are in a proper temperature range, thereby improving the detection accuracy of the sample. However, in the prior art, the sample is heated or cooled unevenly, so that the detection efficiency and the detection accuracy of the sample are reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages in the prior art, it is necessary to provide a device capable of effectively controlling the temperature of a sample.
The application provides a temperature control device, including casing, semiconductor heating member and heat-conducting plate. The semiconductor heating element is disposed in the housing. The heat-conducting plate set up in on the semiconductor heating member, the heat-conducting plate is used for supporting the consumptive material. The semiconductor heating element comprises a hot end and a cold end, and the hot end and the cold end are used for providing heat energy and cold energy respectively. The heat conducting plate is used for conducting the heat energy and the cold energy.
In a possible implementation manner, the temperature control device further comprises a first heat-insulating cotton, and the first heat-insulating cotton is located on the lower surface of the heat-conducting plate.
In a possible implementation manner, the temperature control device further comprises second heat-insulating cotton, and the second heat-insulating cotton is located on the side surface of the heat-conducting plate.
In a possible implementation manner, a containing groove is formed in the first heat preservation cotton, and the semiconductor heating element is arranged in the containing groove.
In a possible implementation manner, the temperature control device further comprises a hollow outer frame, and at least part of the heat conducting plate and at least part of the second heat-preservation cotton are arranged in the outer frame.
In a possible implementation manner, the temperature control device further comprises a heat dissipation member, the semiconductor heating member is arranged on the heat dissipation member, and the heat dissipation member is used for cooling the semiconductor heating member.
In a possible implementation, the temperature control device may further include a fan disposed toward the heat sink.
In one possible implementation, the housing includes a bottom plate and a plurality of side plates disposed at one side of the bottom plate. The bottom plate and a plurality of curb plate enclose jointly to establish and form and accept the chamber. The semiconductor heating element and the heat dissipation element are contained in the containing cavity. One of the side plates is provided with an opening communicated with the containing cavity, and the fan is arranged in the opening.
In a possible implementation manner, the temperature control device further includes a circuit board, and the circuit board is electrically connected with the semiconductor heating element.
In a possible implementation manner, the housing further includes a partition board, the partition board is configured to divide the accommodating cavity into a first accommodating space and a second accommodating space, the semiconductor heating element and the heat dissipation element are located in the first accommodating space, and the circuit board is located in the second accommodating space.
Compare in prior art, this application carries out even heating or cooling through semiconductor heating element to sample or reagent in the consumptive material to can change the temperature of sample or reagent fast, temperature control range is wide and the precision is high, and then improves the detection precision of sample.
Drawings
Fig. 1 is a schematic structural diagram of a temperature control device according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural view of the temperature control device shown in fig. 1 from another angle.
Fig. 3 is an exploded view of the temperature control device shown in fig. 1.
Fig. 4 is a cross-sectional view of the temperature control device shown in fig. 1 taken along IV-IV.
Description of the main elements
Heat conductive body 31
First heat insulation cotton 40
Second heat insulation cotton 41
Heat sink 60
Accommodating cavity 101
First opening 120
First receiving space 1011
Second receiving space 1012
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 4, a temperature control device 100 is provided according to an embodiment of the present disclosure. When a consumable (not shown) is transferred to the temperature control apparatus 100, the temperature control apparatus 100 is used to heat or cool a sample or a reagent in the consumable. In this embodiment, the consumable may be, but is not limited to, a deep hole plate.
The temperature control device 100 includes a case 10, a semiconductor heating member 20 disposed in the case 10, and a heat conductive plate 30 disposed on the semiconductor heating member 20. The heat-conducting plate 30 is used to support consumables and is made of a heat-conducting material.
As shown in fig. 3, the semiconductor heating element 20 has a hot end 21 and a cold end 22 for providing thermal or cold energy. The heat or cold energy is conducted to the consumable through the heat conductive plate 30, thereby heating or cooling the sample in the consumable. In one embodiment, the semiconductor heating element 20 includes a galvanic couple formed by two different types of semiconductor materials connected in series, and when the semiconductor heating element 20 is powered on (not shown), heat transfer between two ends of the galvanic couple is generated by using the Peltier effect of the semiconductor materials, and the heat is transferred from one end to the other end, that is, the semiconductor heating element 20 can cool and heat at two terminals, respectively, thereby forming a cold end 22 and a hot end 21. In order to improve the heat dissipation efficiency, the number of the semiconductor heating elements 20 may be set to two or more.
In one embodiment, a protection switch 23 is also connected between the semiconductor heating element 20 and the power supply. When the temperature generated by the semiconductor heating element 20 is higher than the temperature threshold value, the protection switch 23 is used for disconnecting the electric connection between the semiconductor heating element 20 and the power supply, and the sample or the reagent in the consumable is prevented from deteriorating under the condition of overhigh temperature. Wherein, the temperature threshold can be set according to actual needs, for example, the temperature threshold can be set to be 100 ℃.
In one embodiment, the temperature control device 100 further comprises a first thermal insulation cotton 40 and a second thermal insulation cotton 41. The first heat-insulating cotton 40 is located on the lower surface of the heat-conducting plate 30, and the second heat-insulating cotton 41 is located on the side surface of the heat-conducting plate 30. The first insulation wool 40 and the second insulation wool 41 serve to insulate heat, thereby reducing heat loss on the heat conductive plate 30. The second thermal insulation cotton 41 may be a hollow rectangle. Further, the first heat-insulating cotton 40 may be provided with a receiving groove 401 therein, and the semiconductor heating element 20 may be located in the receiving groove 401.
Further, as shown in fig. 4, the heat conductive plate 30 includes a heat conductive body portion 31 and a flange 32. The heat conductive body portion 31 includes a side wall, and the flange 32 is formed by extending a portion of the side wall outward. The first thermal insulation cotton 40 is located on the lower surface of the heat conducting main body portion 31, and the vertical projection of the heat conducting main body portion 31 on the first thermal insulation cotton 40 may be entirely located in the first thermal insulation cotton 40. The second thermal insulation cotton 41 is located on the side wall of the heat conducting main body portion 31, and is sandwiched between the flange 32 and the first thermal insulation cotton 40.
The temperature control device 100 may further include a hollow outer frame 50. At least part of the heat-conducting plate 30 and at least part of the second insulating cotton 41 are located in the outer frame 50, so that the heat-conducting plate 30 and the second insulating cotton 41 are positioned above the semiconductor heating element 20.
In one embodiment, the temperature control device 100 further includes a heat sink 60, and the heat sink 60 is used for cooling the semiconductor heating element 20. The semiconductor heating member 20 may be located on the heat radiating member 60, that is, the semiconductor heating member 20 is located between the heat conductive plate 30 and the heat radiating member 60. The heat sink 60 may include a plurality of heat dissipation fins 61, and thus has a large heat dissipation area.
Further, the temperature control apparatus 100 may further include a fan 70. The fan 70 is disposed toward the heat sink 60 for radiating heat conducted on the heat sink 60 to the outside. In the present embodiment, in order to improve the heat dissipation efficiency, the number of the fans 70 may be two or more. In one embodiment, the housing 10 includes a bottom plate 11 and a plurality of side plates 12 disposed at one side of the bottom plate 11. For example, the bottom plate 11 may be arranged close to a rectangle. The four side plates 12 are fixed to four edges of the bottom plate 11, respectively, so that the housing 10 is substantially rectangular. The bottom plate 11 and the plurality of side plates 12 are collectively enclosed to form a housing chamber 101, and the semiconductor heating element 20 and the heat sink 60 are housed in the housing chamber 101. One of the side plates 12 is provided with a first opening 120 communicated with the receiving cavity 101, and the fan 70 is disposed in the first opening 120.
The other side plate 12 further has a second opening 121 (see fig. 1) communicating with the accommodating cavity 101. The second opening 121 and the first opening 120 are respectively located at two opposite sides of the accommodating cavity 101. Thus, the second opening 121, the receiving cavity 101 and the first opening 120 form a heat dissipation passage, and when the fan 70 is operated, the heat conducted on the heat sink 60 can be quickly dissipated to the outside.
In an embodiment, the housing 10 further comprises a partition 13, in particular, the partition 13 may be fixed between two oppositely arranged side plates 12. The partition 13 serves to improve the structural strength of the case 10. The partition 13 is used to divide the receiving cavity 101 into two independent receiving spaces, namely a first receiving space 1011 and a second receiving space 1012. The semiconductor heating element 20 and the heat sink 60 may be located in the first receiving space 1011.
In one embodiment, the temperature control device 100 further includes a circuit board 80. The circuit board 80 is electrically connected to the semiconductor heating element 20 for controlling heating or cooling of the semiconductor heating element 20. The circuit board 80 may be fixed on the bottom plate 11 and received in the receiving cavity 101, for example, the circuit board 80 may be received in the second receiving space 1012.
This application heats or cools off through semiconductor heating element 20 sample or reagent in to the consumptive material to can change the temperature of sample or reagent fast, the wide and precision of temperature control scope is high (the temperature can change at 4 ℃ to 90 ℃ within range, and the temperature control precision is at 1 ℃), and then improves the detection precision of sample.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.
Claims (10)
1. A temperature control apparatus, comprising:
a housing;
a semiconductor heating element disposed in the housing; and
the heat conducting plate is arranged on the semiconductor heating element and used for supporting consumables;
the semiconductor heating element comprises a hot end and a cold end, the hot end and the cold end are respectively used for providing heat energy and cold energy, and the heat conducting plate is used for conducting the heat energy and the cold energy.
2. The temperature control device of claim 1, further comprising a first thermal cotton, the first thermal cotton located on a lower surface of the thermal conductive plate.
3. The temperature control device of claim 2, further comprising second thermal cotton positioned on a side of the thermally conductive plate.
4. The temperature control device according to claim 3, wherein a receiving groove is provided in the first heat-insulating cotton, and the semiconductor heating element is disposed in the receiving groove.
5. The temperature control apparatus of claim 3, further comprising a hollow outer frame, at least a portion of the heat-conducting plate and at least a portion of the second insulating cotton being disposed in the outer frame.
6. The temperature control device according to claim 1, further comprising a heat radiating member on which the semiconductor heating element is disposed, the heat radiating member being for cooling the semiconductor heating element.
7. The temperature control device of claim 6, further comprising a fan disposed toward the heat sink.
8. The temperature control apparatus according to claim 7, wherein the housing includes a bottom plate and a plurality of side plates provided on one side of the bottom plate, the bottom plate and the plurality of side plates together enclose a receiving cavity in which the semiconductor heating element and the heat dissipating element are received, one of the side plates is provided with an opening communicating with the receiving cavity, and the fan is provided in the opening.
9. The temperature control apparatus according to claim 8, further comprising a circuit board electrically connected to the semiconductor heating element.
10. The temperature control apparatus according to claim 9, wherein the housing further comprises a partition for dividing the housing chamber into a first housing space in which the semiconductor heating element and the heat radiating element are located and a second housing space in which the circuit board is located.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021946447.5U CN213276393U (en) | 2020-09-08 | 2020-09-08 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021946447.5U CN213276393U (en) | 2020-09-08 | 2020-09-08 | Temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213276393U true CN213276393U (en) | 2021-05-25 |
Family
ID=75940769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021946447.5U Active CN213276393U (en) | 2020-09-08 | 2020-09-08 | Temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213276393U (en) |
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2020
- 2020-09-08 CN CN202021946447.5U patent/CN213276393U/en active Active
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