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CN213123041U - RFID intelligent label - Google Patents

RFID intelligent label Download PDF

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Publication number
CN213123041U
CN213123041U CN202021492095.0U CN202021492095U CN213123041U CN 213123041 U CN213123041 U CN 213123041U CN 202021492095 U CN202021492095 U CN 202021492095U CN 213123041 U CN213123041 U CN 213123041U
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CN
China
Prior art keywords
antenna
layer
substrate
paper
antenna layer
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Active
Application number
CN202021492095.0U
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Chinese (zh)
Inventor
孙斌
何健
徐�明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Grandtag Electronics Co ltd
Original Assignee
Jiangsu Grandtag Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Jiangsu Grandtag Electronics Co ltd filed Critical Jiangsu Grandtag Electronics Co ltd
Priority to CN202021492095.0U priority Critical patent/CN213123041U/en
Application granted granted Critical
Publication of CN213123041U publication Critical patent/CN213123041U/en
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Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a RFID intelligent label, including substrate and chip module, be provided with the district that holds that is used for holding chip module on the up end of substrate, chip module bond set up in hold in the district, the area that holds the district is less than the area of substrate up end, the lower terminal surface of substrate is connected with first antenna layer, chip module includes chip body and positive antenna, positive antenna include the basic unit and set up in the second antenna layer of terminal surface under the basic unit, the chip body set up in on the lower terminal surface on second antenna layer, just the chip body with second antenna layer electricity is connected, first antenna layer with chip body coupling is connected. Compared with the prior art, the utility model discloses a chip modular structure is small and exquisite, sets up its bonding in the district that holds of substrate, and then has dwindled the volume of product greatly, has simple structure, compactness, small characteristics, and processing is convenient, low in production cost.

Description

RFID intelligent label
Technical Field
The utility model relates to a radio frequency communication technical field especially relates to a RFID intelligent label.
Background
The RFID tag is an electronic tag, is a non-contact automatic identification technology, identifies a target object and obtains related data through a radio frequency signal, does not need manual intervention in identification work, and serves as a wireless version of a bar code.
At present, RFID label on the market still has certain defect, if RFID label thickness is big, bulky, and manufacturing cost is high, and it appears with the situation of card usually, and is intelligent convenient inadequately when using, and is unfavorable for popularizing and applying in commodity circulation face list, all kinds of drop and flexible label design field.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to above-mentioned problem, provide a RFID smart label to solve the problem of proposing among the above-mentioned background art.
The utility model aims at realizing through the following technical scheme:
the utility model provides a RFID intelligent label, includes substrate and chip module, be provided with the district that holds that is used for holding chip module on the up end of substrate, chip module bond set up in hold in the district, the area that holds the district is less than the area of substrate up end, the lower terminal surface of substrate is connected with first antenna layer, chip module includes chip body and front antenna, front antenna include the basic unit and set up in the second antenna layer of terminal surface under the basic unit, the chip body set up in on the lower terminal surface on second antenna layer, just the chip body with second antenna layer electricity is connected, first antenna layer with chip body coupling connection.
As a preferred embodiment of the present invention, the first antenna layer is an aluminum foil or a copper foil.
As a preferred embodiment of the present invention, the first antenna layer is bonded to the lower end surface of the base material by means of a first adhesive layer.
As an optimized scheme of the utility model, the second antenna layer bond in with the help of the second glue film on the lower terminal surface of basic unit.
As a preferred embodiment of the present invention, the second antenna layer is an aluminum foil or a copper foil.
As a preferred scheme of the utility model, the base material is any one of coated paper, glassine paper, offset paper, fragile paper and heat-sensitive paper; the base layer is any one of coated paper, glassine paper, offset paper, fragile paper and thermosensitive paper.
As a preferred scheme of the utility model, the thickness of substrate is less than 1 mm.
As an optimized scheme of the utility model, the antenna body that first antenna layer formed including processing, the projection of antenna body in vertical side at least partially with the projection of chip module in vertical side coincides mutually.
As an optimized scheme of the utility model, the antenna body is including four rectangular antenna frames that are array distribution, every the inboard integration of rectangular antenna frame is provided with crooked antenna, and all crooked antenna communicates each other.
The beneficial effects of the utility model are that, compared with the prior art, the utility model discloses a chip module structure is small and exquisite, sets up its bonding in the district that holds of substrate, and then has dwindled the volume of product greatly, has simple structure, compactness, and small characteristics, and processing is convenient, low in production cost, secondly, the utility model discloses a substrate, basic unit do not adopt the PET membrane, have the pollution-free characteristics of environmental protection, and in addition, the chip module can form magnetic field, electric field, appearance resistance effect with the first antenna layer of terminal surface under the substrate through electromagnetic induction, play signal transmission, receive the effect of reinforcing, improve the sensitivity of RFID label, simplify the RFID label use procedure, improve the popularization nature.
Drawings
FIG. 1 is a schematic structural diagram of an RFID smart tag;
FIG. 2 is a rear view of an RFID smart tag;
FIG. 3 is a front view of an RFID smart tag.
In the figure:
1. a substrate; 2. a chip module; 3. a glue layer; 4. a first antenna layer; 5. a chip body; 6. a base layer; 7. a second antenna layer; 8. a first glue layer; 9. a second adhesive layer; 10. an antenna body.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings. It is to be understood that the embodiments described herein are merely illustrative of the present invention and are not limiting thereof.
Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of an RFID smart tag; FIG. 2 is a rear view of an RFID smart tag; FIG. 3 is a front view of an RFID smart tag.
In this embodiment, an RFID smart tag includes a substrate 1 and a chip module 2, the substrate 1 is thermal paper, the thickness of the substrate 1 is smaller than 1mm, a receiving area for receiving the chip module 2 is disposed on an upper end surface of the substrate 1, the chip module 2 is bonded in the receiving area through a glue layer 3, the area of the receiving area is smaller than that of an upper end surface of the substrate 1, the rest of the upper end surface of the substrate 1 can print company-related information as required, a lower end surface of the substrate 1 is connected with a first antenna layer 4, the chip module 2 includes a chip body 5 and a front antenna, the front antenna includes a second antenna layer 7 disposed on a lower end surface of the base layer 6, the base layer 6 is thermal paper, the chip body 5 is disposed on a lower end surface of the second antenna layer 7, the chip body 5 is electrically connected with the second antenna layer 7, and the first antenna layer 4 is coupled with the chip body 5.
Specifically, in this embodiment, the first antenna layer 4 is an aluminum foil, and the first antenna layer 4 is bonded to the lower end surface of the base material 1 by a first adhesive layer 8; the second antenna layer 7 is an aluminum foil, and the second antenna layer 7 is bonded to the lower end face of the base layer 6 by means of a second adhesive layer 9.
Specifically, in this embodiment, the first antenna layer 4 includes an antenna body 10 formed by etching, and a projection of the antenna body 10 in the vertical direction at least partially coincides with a projection of the chip module 2 in the vertical direction; further, the antenna body 10 includes four right-angle antenna frames distributed in an array, each of the right-angle antenna frames is integrally provided with a bent antenna at an inner side thereof, and all the bent antennas are communicated with each other.
It should be mentioned that, although in this embodiment, substrate, basic unit all adopt thermal paper, the utility model discloses be not limited to this, the substrate can also adopt coated paper, glassine, offset paper or breakable paper, and the basic unit can also adopt coated paper, glassine, offset paper or breakable paper.
It should be mentioned that, although in this embodiment, the first antenna layer 4 is an aluminum foil, the present invention is not limited thereto, and the first antenna layer 4 can also adopt a copper foil, and likewise, although in this embodiment, the second antenna layer 7 is an aluminum foil, the present invention is not limited thereto, and the second antenna layer 7 can also adopt a copper foil.
Above-mentioned RFID intelligent label's chip module 2 structure is small and exquisite, set up its bonding in substrate 1 holds the district, the volume of product has been reduced greatly, and the electric-magnetic field is formed through electromagnetic induction to chip module 2, and small characteristics, and processing is convenient, low in production cost, in addition, chip module 2 can pass through electromagnetic induction with substrate 1 lower terminal surface's first antenna layer 4, the electric field, hold the reactance effect, play signal transmission, receive the effect of reinforcing, the sensitivity of RFID label is improved, simplify RFID label use flow, the promotion nature is improved.
The above embodiments have been merely illustrative of the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and does not depart from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims.

Claims (9)

1. An RFID smart tag, characterized in that: including substrate and chip module, be provided with the district that holds that is used for holding chip module on the up end of substrate, chip module bond set up in hold in the district, the area that holds the district is less than the area of substrate up end, the lower terminal surface of substrate is connected with first antenna layer, chip module includes chip body and front antenna, front antenna include the basic unit and set up in the second antenna layer of terminal surface under the basic unit, the chip body set up in on the lower terminal surface on second antenna layer, just the chip body with second antenna layer electricity is connected, first antenna layer with chip body coupling connects.
2. The RFID smart tag of claim 1, wherein: the first antenna layer is an aluminum foil or a copper foil.
3. The RFID smart tag of claim 2, wherein: the first antenna layer is adhered to the lower end face of the base material through a first adhesive layer.
4. The RFID smart tag of claim 3, wherein: the second antenna layer is bonded to the lower end face of the base layer through a second adhesive layer.
5. The RFID smart tag of claim 4, wherein: the second antenna layer is an aluminum foil or a copper foil.
6. The RFID smart tag of any one of claims 1 to 5, wherein: the base material is any one of coated paper, glassine paper, offset paper, fragile paper and thermal sensitive paper; the base layer is any one of coated paper, glassine paper, offset paper, fragile paper and thermosensitive paper.
7. The RFID smart tag of claim 6, wherein: the thickness of the substrate is less than 1 mm.
8. The RFID smart tag of claim 7, wherein: the first antenna layer comprises a processed antenna body, and at least part of projection of the antenna body in the vertical direction is coincided with projection of the chip module in the vertical direction.
9. The RFID smart tag of claim 8, wherein: the antenna body is including being four right angle antenna frames of array distribution, every the inboard integration of right angle antenna frame is provided with crooked antenna, and all crooked antenna communicates each other.
CN202021492095.0U 2020-07-24 2020-07-24 RFID intelligent label Active CN213123041U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021492095.0U CN213123041U (en) 2020-07-24 2020-07-24 RFID intelligent label

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021492095.0U CN213123041U (en) 2020-07-24 2020-07-24 RFID intelligent label

Publications (1)

Publication Number Publication Date
CN213123041U true CN213123041U (en) 2021-05-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021492095.0U Active CN213123041U (en) 2020-07-24 2020-07-24 RFID intelligent label

Country Status (1)

Country Link
CN (1) CN213123041U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111738393A (en) * 2020-07-24 2020-10-02 江苏科睿坦电子科技有限公司 RFID intelligent label and manufacturing process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111738393A (en) * 2020-07-24 2020-10-02 江苏科睿坦电子科技有限公司 RFID intelligent label and manufacturing process thereof

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