CN213094549U - Intra-film electronic structure with double-layer membrane - Google Patents
Intra-film electronic structure with double-layer membrane Download PDFInfo
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- CN213094549U CN213094549U CN202021631958.8U CN202021631958U CN213094549U CN 213094549 U CN213094549 U CN 213094549U CN 202021631958 U CN202021631958 U CN 202021631958U CN 213094549 U CN213094549 U CN 213094549U
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Abstract
The utility model provides a take membrane internal electron structure of double-deck diaphragm, top-down includes in proper order: the circuit comprises a first diaphragm, a first circuit layer, an injection molding layer and a second diaphragm; the first circuit layer is provided with a first detection circuit, a first functional circuit and a first conductive circuit; the first detection circuit is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, and the first functional circuit is electrically connected with the first detection circuit through the first conductive circuit; the electronic components forming the first detector circuit and the first functional circuit are attached to the first conductive path. The intramembrane electronic structure body with the double-layer membrane has the advantages of being light, thin, good in integrity, good in sealing performance, moisture-proof, high-temperature resistant, strong in impact resistance, not prone to oxidation and capable of converting electromagnetic wave energy into electric energy to achieve self-power supply, and due to the protection of the double-layer membrane, the electronic structure body is more wear-resistant.
Description
Technical Field
The present invention relates to an electronic structure, and more particularly to an in-film electronic structure with a double-layer diaphragm.
Background
With the development of electronic components toward microminiature and low power consumption, electronic products are becoming increasingly thin, light, thin, convenient and intelligent. However, most conventional electronic products still use batteries for power supply, and the quality of the battery performance directly affects the service life and normal use of the electronic products. The environmental pollution is also caused by improper treatment of the waste batteries. In addition, most of the traditional electronic product structures adopt a split assembly type structure and are composed of injection-molded panels, printed circuit boards, printed circuit board shells, batteries and the like. The printed circuit board and the printed circuit board shell are arranged on the panel in a buckling or screw mode, and then the battery is arranged in the battery bin. The split assembled panel has more parts, complex installation procedures, low structural stability, poor impact resistance, weak waterproof and anti-oxidation capability and larger volume. The printed circuit board is exposed to air and water vapor for a long time, and the printed circuit board is easy to oxidize and enter water.
On the other hand, various energies exist in the surrounding environment, such as abundant radio frequency energy, solar energy, wind energy, vibration energy and the like, and due to the universality of electromagnetic wave energy and the convenience and feasibility of collection, the energy has wide application prospects in a low-power-consumption self-powered system.
SUMMERY OF THE UTILITY MODEL
The purpose of this application is to overcome prior art's not enough, provides a frivolous, the wholeness is good, the leakproofness is good, dampproofing, high temperature resistant, shock resistance is strong, difficult oxidation and can realize self-powered intramembrane electronic structure with electromagnetic wave energy conversion to electric energy.
The embodiment of the application realizes the aim through the following technical scheme.
The embodiment of the application provides a take intramembrane electron structure body of double-deck diaphragm, and top-down includes in proper order: the circuit comprises a first diaphragm, a first circuit layer, an injection molding layer and a second diaphragm; the first circuit layer is provided with a first detection circuit, a first functional circuit and a first conductive circuit; the first detection circuit is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, and the first functional circuit is electrically connected with the first detection circuit through the first conductive circuit; the electronic components forming the first detection circuit are attached to the first conductive path, and the electronic components forming the first functional circuit are attached to the first conductive path.
In some embodiments, the in-film electronic structure with a two-layer film further includes a first design layer printed between the first film and the first circuit layer.
In some embodiments, the in-film electronic structure with a two-layer film further comprises a second design layer printed between the second film and the injection molded layer.
In some embodiments, the first functional circuit is a light emitting circuit comprising at least one light emitting diode or electroluminescent sheet forming a first light emitting region.
In some embodiments, the second pattern layer includes a non-transparent pattern region and further includes a hollow or transparent or semi-transparent light-transmitting region, and the light-transmitting region is opposite to the first light-emitting region.
In some embodiments, first diaphragm and second diaphragm are made by thermoplastic deformable material, process into the cell-phone shell shape with the layer of moulding plastics after thermoplastic processing, including frame and the bottom plate of being connected with the frame, the frame is connected with the bottom plate and is formed the holding tank that is used for holding the cell-phone, and the one side in first diaphragm place is the inside of holding tank, and the one side in second diaphragm place is the outside of holding tank.
In some embodiments, the in-film electronic structure with a double-layer diaphragm further includes a second circuit layer, the second circuit layer is disposed between the injection molding layer and the second diaphragm, and the second circuit layer is provided with a second detector circuit, a second functional circuit and a second conductive circuit; the second conductive circuit is printed on the second film, the second detection circuit is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, and the second functional circuit is electrically connected with the second detection circuit through the second conductive circuit; the electronic components forming the second detection circuit are attached to the second conductive circuit, and the electronic components forming the second functional circuit are attached to the second conductive circuit; the second functional circuit is a light emitting circuit, which comprises at least one light emitting diode or an electroluminescent sheet to form a second light emitting area.
In some embodiments, the in-film electronic structure with the double-layer film further includes a first pattern layer printed between the first film and the first circuit layer, the first pattern layer includes a non-transparent pattern region and a hollow or transparent or semitransparent light-transmitting region, and the light-transmitting region is opposite to the second light-emitting region.
In some embodiments, further comprising a first insulating layer and/or a first protective layer and/or a first adhesive layer and/or a second insulating layer and/or a second protective layer and/or a second adhesive layer; the first insulating layer is printed on the first conductive circuit in a way of avoiding the contact pad of the first conductive circuit; the first protective layer is printed on the first circuit layer and covers the first circuit layer; a first adhesive layer is printed between the first circuit layer and the injection molding layer; the second insulating layer is printed on the second conductive circuit by avoiding the contact pad of the second conductive circuit; the second protective layer is printed on the second circuit layer and covers the second circuit layer; and a second adhesive layer is printed between the second circuit layer and the injection molding layer.
In some embodiments, the first functional circuit is a communication circuit, and comprises a low-power-consumption WIFI chip or/and a bluetooth chip or/and an RFID chip or/and a GPS chip.
In some embodiments, the first circuit layer and/or the second circuit layer is further provided with a direct current control circuit for controlling the direct current signals output by the first detector circuit and the second detector circuit, and electronic components forming the direct current control circuit are attached to the conducting circuit.
In some embodiments, the first membrane and the second membrane are made of PC, PET, PVC, PP, PMMA, PC + PMMA leather or cloth, the injection molding layer is made of PC, PET, PVC, PP, PMMA, ABS, PC + ABS or TPU, and the first conductive circuit and the second conductive circuit are made of conductive silver paste, conductive carbon paste or conductive copper paste.
Compared with the traditional electronic product, the in-film electronic structure with the double-layer membrane can convert electromagnetic wave energy into electric energy to realize self power supply without installing a battery or supplying power by an external power supply. In addition, the circuit layer is embedded between the diaphragm and the injection molding layer, the diaphragm, the injection molding layer and the injection molding layer are combined into a non-detachable structure body, and the problem that a plastic panel, a printed circuit board and a printed circuit board shell of a traditional electronic product are different parts and need to be assembled in a multi-task sequence is solved. Thickness can be more frivolous than the built-up part thickness of traditional equipment back, and because of its characteristic that can not split, more has dampproofing, high temperature resistant, shock resistance is strong, difficult advantage of oxidation, and the molding is three-dimensional various, simple structure, has improved the performance and the competitiveness of product, and owing to the protection that has double-deck diaphragm for this electronic structure is more wear-resisting.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a first embodiment of an in-film electronic structure with a two-layer membrane provided herein;
FIG. 2 is a circuit block diagram of a first circuit layer of an in-film electronic structure with a two-layer membrane provided herein;
FIG. 3 is a cross-sectional structural view of a second embodiment of an in-film electronic structure with a two-layer membrane as provided herein;
FIG. 4 is a schematic structural diagram of a third embodiment of an in-film electronic structure with a bilayer membrane as provided herein;
FIG. 5 is a block circuit diagram of a second circuit layer of the in-film electronic structure with a two-layer membrane provided herein;
fig. 6 is a cross-sectional view of a fourth embodiment of an in-film electronic structure with a two-layer membrane according to the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the term "connected" should be interpreted broadly, and may be, for example, a fixed connection, a detachable connection, a mechanical connection, an electrical connection, a direct connection, or an indirect connection via an intermediate medium; "printed on XXX" is also to be understood in a broad sense, either directly on XXX or indirectly via an intermediate medium; "on XXX" is also to be understood in a broad sense, either directly on XXX or indirectly via an intermediary; "attached to XXX" is also to be understood in a broad sense, either directly or indirectly via an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and 2, an intra-film electronic structure with a double-layer film is provided in an embodiment of the present application, and includes a first film 1, a first circuit layer 2, an injection-molded layer 3, and a second film 4. The first circuit layer 2 is arranged between the first membrane 1 and the injection molding layer 3. The first circuit layer 2 is provided with a first detector circuit 21, a first function circuit 22, and a first conductive trace 23. The first conductive trace 23 is printed on the first film 1, the first detector circuit 21 is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, the first function circuit 22 is electrically connected with the first detector circuit 21 through the first conductive trace 23, and the first detector circuit 21 provides power for the first function circuit 22. The electronic components 211 constituting the first detector circuit 21 are attached to the first conductive traces 23, and in the present embodiment, only one electronic component 211 is shown, but in other embodiments, the number of electronic components 211 may be plural. The first functional circuit 22 is electrically connected to the first detector circuit 21 via the first conductive path 23, and the electronic component 221 constituting the first functional circuit 22 is attached to the first conductive path 23. The second membrane 4 is attached to the injection layer 3.
The utility model provides an in-film electronic structure body of double-deck diaphragm in area comprises first diaphragm 1, first circuit layer 2, the layer of moulding plastics 3, second diaphragm 4, because each layer is all very thin and first diaphragm 1, the soft flexible of second diaphragm 4 for the shape of this in-film electronic structure body can design wantonly, can satisfy the demand of different products. Compared with the traditional electronic product, the novel LED lamp is lighter and thinner, and has the characteristics of good integrity, good sealing property, high temperature resistance, strong impact resistance and difficulty in water inflow and oxidation when a circuit is not exposed in the air due to the non-detachable characteristic. And because of the protection of the double-layer membrane, the electronic structure is more wear-resistant.
Referring to fig. 3, in some embodiments, the in-film electronic structure with a two-layer film further includes a first pattern layer 5 and/or a second pattern layer 6, the first pattern layer 5 is disposed between the first film 1 and the first circuit layer 2, and the second pattern layer 6 is printed between the second film 4 and the injection molded layer 3. The material of the first pattern layer 5 is black/white/color ink, and is directly printed on a part or all of the area on the first film 1. The first conductive tracks 23 are printed directly on the first pattern layer 5. The material of the second pattern layer 6 is black/white/color ink, and is directly printed on the second film 4 in a part or all of the area. The first pattern layer 5 and the second pattern layer 6 both play a role in decorating and shielding the circuit layer, so that the product is more attractive. When the first membrane 1 is the back of a product, and the second membrane 4 is the front of the product, the color printing ink can be printed on the second membrane 4 to form decorative patterns, white printing ink is further printed on the first membrane 1 to form ground color, so that the decorative patterns of the product look clearer from the front, the decorative patterns look brighter and more vivid due to the ground color, and meanwhile, the two pattern layers can both play a role of shielding the circuit layer. Similarly, when the second film 4 is the back of the product and the first film 1 is the front of the product, the first film 1 may be printed with color ink to form a decorative pattern, and further printed with white ink to form a ground color on the second film 4. It is also possible to brush a pattern on optionally one of the membranes.
The embodiment of the application combines the first pattern layer 5 and/or the second pattern layer 6, the first circuit layer 2 and the injection molding layer 3 into a part which can not be detached, solves the problem that the traditional electronic product has the problems that plastic parts, decorative patterns and a printed circuit board are different parts and need assembling of a multitask sequence, is thinner and thinner in thickness, and has the advantages of various pattern changes, friction resistance, difficult oxidation and color change, corrosion resistance, environmental protection, attractive and fashionable appearance.
In some embodiments, first detection circuit 21 comprises at least one Schottky detection diode for collecting electromagnetic wave signals and converting the electromagnetic wave signals into DC signals.
In some embodiments, the first functional circuit 22 is a light emitting circuit that includes at least one light emitting diode or electroluminescent sheet that forms a first light emitting region. Further, the second pattern layer 6 includes a non-transparent pattern region, and further includes a hollow or transparent or semi-transparent light transmission region, the light transmission region is opposite to the first light emitting region, for example, the light transmission region is right above the first light emitting region, so as to improve light transmittance, and an arrow in the figure is a light transmission route. Further, first diaphragm 1 and second diaphragm 4 are made by thermoplastic deformable material, process into cell-phone shell shape (not shown in the figure) with the layer of moulding plastics after through thermoplastic processing, including frame and the bottom plate of being connected with the frame, the frame is connected with the bottom plate and is formed the holding tank that is used for holding the cell-phone, and first diaphragm 1 place one side is the inside of holding tank, and second diaphragm 4 place one side is the outside of holding tank. When the mobile phone has an incoming call, the electromagnetic wave emitted by the mobile phone becomes strong, the first detection circuit 21 detects the electromagnetic wave signal, and converts the electromagnetic wave signal into a direct current signal for the light emitting diode or the electroluminescent sheet to emit light. At this moment, the mobile phone shell has both a mobile phone protection function and a caller identification function.
Referring to fig. 4, 5 and 6, in some embodiments, a second circuit layer 7 is further included, the second circuit layer 7 is disposed between the injection molding layer 3 and the second diaphragm 4, and the second circuit layer 7 is provided with a second detector circuit 71, a second functional circuit 72 and a second conductive trace 73; the second conductive trace 73 is printed on the second membrane 4, the second detector circuit 71 is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, and the second function circuit 72 is electrically connected with the second detector circuit 71 through the second conductive trace 73; an electronic component attachment 711 constituting the second detector circuit 71 is attached to the second conductive path 73, and an electronic component 721 constituting the second functional circuit 72 is attached to the second conductive path 73; the second functional circuit 72 is a light emitting circuit that includes at least one light emitting diode or electroluminescent strip that forms a second light emitting area. Further, the first pattern layer 5 includes a non-transparent pattern region and a hollow or transparent or semitransparent light transmission region, the light transmission region is opposite to the second light emitting region, for example, the light transmission region is right above the second light emitting region, so that the light transmission rate is improved, and an arrow in the figure is a light transmission route. In some embodiments, the in-film electronic structure may be used as an electromagnetic wave detector. The double-layer film and the double-layer light are emitted, so that the light-emitting visual area of the electronic structure in the film is larger.
In some embodiments, the first circuit layer 2 is further provided with a first antenna 24 printed on the first film 1 and electrically connected to the first detector circuit 21, and the first antenna 24 is used to enhance the collection of electromagnetic wave signals and increase the dc signal output by the first detector circuit 21. Further, the first antenna 24 is in a wavy line shape, a continuous plane shape, or a mesh plane shape, but is not limited thereto, and the larger the area of the first antenna 24 is, the stronger the collection capability of the electromagnetic wave signal is. Similarly, the second circuit layer 7 is also provided with a second antenna 74 printed on the second membrane 4.
In some embodiments, the first circuit layer 2 is further provided with a first dc control circuit 25 for controlling, for example amplifying, a dc signal output by the first detector circuit 21. The electronic components 251 constituting the first dc control circuit 25 are attached to the first conductive traces 23, and in the present embodiment, only one electronic component 251 is shown, but in other embodiments, the number of electronic components 251 may be plural. Similarly, the second circuit layer 7 is also provided with a second dc control circuit 75, and electronic components 751 constituting the second dc control circuit 75 are attached to the second conductive traces 73.
The first membrane 1 and the second membrane 4 are transparent flexible films, and the used material may be PC, PET, PVC, PP, PMMA, PC + PMMA leather or cloth, but is not limited thereto. The materials of the first conductive trace 23, the second conductive trace 73, and the first antenna 24 and the second antenna 74 are, but not limited to, conductive silver paste, conductive carbon paste, or conductive copper paste. The material used for the injection molding layer 3 may be PC, PET, PVC, PP, PMMA, ABS, PC + ABS, TPU, or the like, but is not limited thereto. The electronic components used in the first and second detector circuits 21 and 71 and the first and second functional circuits 22 and 72 are chips, resistors, capacitors, diodes, transistors, and other low power consumption electronic components, but are not limited thereto.
Referring to fig. 3 and 6, in some embodiments, a first insulating layer 8 and/or a second insulating layer 9 are further included, the material of the first insulating layer 8 and the second insulating layer 9 is varnish or other ink with an insulating effect, the first insulating layer 8 is printed on the first conductive trace 23 away from the contact pad (for mounting an electronic component) of the first conductive trace 23, and the second insulating layer 9 is printed on the second conductive trace 73 away from the contact pad (for mounting an electronic component) of the second conductive trace 73, so as to prevent signal interference between circuits.
In some embodiments, the protective layer further includes a first protective layer 10 and/or a second protective layer 11, and the material of the first protective layer 10 and the second protective layer 11 is varnish or UV ink. The first protective layer 10 is printed on the first circuit layer 2, covers the first circuit layer 2, further covers the first pattern layer 5, and has a protective effect on the first circuit layer 2 and the first pattern layer 5, and the thermal conductivity of the first protective layer 10 is low, so that the first film 1, the first circuit layer 2 and the first pattern layer 5 can be prevented from being damaged by high temperature during molding and injection molding. The second protective layer 11 is printed on the second circuit layer 7, covers the second circuit layer 7, further covers the second pattern layer 6, and protects the second circuit layer 7 and the second pattern layer 6, and the second protective layer 11 has low thermal conductivity, so that the second membrane 4, the second circuit layer 7 and the second pattern layer 6 are not damaged by high temperature during molding and injection molding.
In some embodiments, a first adhesive layer 12 and/or a second adhesive layer 13 are further included, and the first adhesive layer 12 is printed between the first circuit layer 2 and the injection molding layer 3, which helps to improve the bonding force between the injection molding layer 3 and the first circuit layer 2 and the first protective layer 10 during injection molding. The second adhesive layer 13 is printed between the second circuit layer 7 and the injection molding layer 3, and contributes to improving the bonding force between the injection molding layer 3 and the second circuit layer 7 and the second protective layer 11 during injection molding.
In some embodiments, the first functional circuit 22 is a communication circuit including a low power WIFI chip or/and a bluetooth chip or/and an RFID chip or/and a GPS chip. The method can be used in the fields of warehouse management, article searching, intelligent home control and the like.
The above is only the preferred embodiment of the present invention, and the patent scope of the present invention is not limited thereby, and all the equivalent structure changes made by the contents of the specification and the drawings of the present invention or the direct/indirect application in other related technical fields are utilized under the inventive concept of the present invention. Are included within the scope of the present invention.
Claims (11)
1. An intramembrane electronic structure body with a double-layer membrane is characterized by sequentially comprising from top to bottom: the circuit comprises a first diaphragm, a first circuit layer, an injection molding layer and a second diaphragm; the first circuit layer is provided with a first detection circuit, a first functional circuit and a first conductive circuit; the first conductive circuit is printed on the first film, the first detection circuit is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, and the first functional circuit is electrically connected with the first detection circuit through the first conductive circuit; the electronic components constituting the first detector circuit are attached to the first conductive path, and the electronic components constituting the first functional circuit are attached to the first conductive path.
2. The in-film electronic structure with a two-layer film of claim 1, further comprising a second design layer printed between the second film and the injection molded layer.
3. The in-film electronic structure with a double-layered membrane of claim 2, wherein the first functional circuit is a light emitting circuit comprising at least one light emitting diode or electroluminescent sheet forming a first light emitting zone.
4. The in-film electronic structure with a double-layer film as claimed in claim 3, wherein the second pattern layer comprises a non-transparent pattern region and further comprises a hollow or transparent or semi-transparent light-transmitting region, and the light-transmitting region is opposite to the first light-emitting region.
5. The in-film electronic structure with a dual-layer film as claimed in claim 4, wherein said first film and said second film are made of a thermoplastic deformable material, and are processed into a shape of a mobile phone case by thermoplastic processing and said injection layer, and comprise a frame and a bottom plate connected to said frame, said frame is connected to said bottom plate to form a receiving groove for receiving a mobile phone, said first film is located on a side of said receiving groove, and said second film is located on a side of said receiving groove.
6. The in-film electronic structure with a double-layer film according to claim 3 or 4, further comprising a second circuit layer provided between the injection-molded layer and the second film, the second circuit layer being provided with a second detector circuit, a second functional circuit, and a second conductive trace; the second conductive circuit is printed on the second film, the second detection circuit is used for collecting electromagnetic wave signals and converting the electromagnetic wave signals into direct current signals, and the second functional circuit is electrically connected with the second detection circuit through the second conductive circuit; electronic components forming the second detection circuit are attached to the second conductive circuit, and electronic components forming the second functional circuit are attached to the second conductive circuit; the second functional circuit is a light emitting circuit, and comprises at least one light emitting diode or an electroluminescent sheet to form a second light emitting area.
7. The in-film electronic structure with a two-layer film as claimed in claim 6, further comprising a first pattern layer printed between the first film and the first circuit layer, wherein the first pattern layer comprises a non-transparent pattern region and further comprises a hollow or transparent or translucent light-transmitting region, and the light-transmitting region is opposite to the second light-emitting region.
8. The in-film electronic structure with a two-layer film according to claim 7, further comprising a first insulating layer and/or a first protective layer and/or a first adhesive layer and/or a second insulating layer and/or a second protective layer and/or a second adhesive layer; the first insulating layer is printed on the first conductive traces avoiding contact pads of the first conductive traces; the first protective layer is printed on the first circuit layer and covers the first circuit layer; a first adhesive layer is printed between the first circuit layer and the injection molding layer; the second insulating layer is printed on the second conductive traces avoiding contact pads of the second conductive traces; the second protective layer is printed on the second circuit layer and covers the second circuit layer; and a second adhesive layer is printed between the second circuit layer and the injection molding layer.
9. The in-film electronic structure with a double-layer film of claim 1, wherein the first functional circuit is a communication circuit comprising a low-power WIFI chip or/and a bluetooth chip or/and an RFID chip or/and a GPS chip.
10. The in-film electronic structure with a two-layer film according to any one of claims 1, 2, 3, 4, 5, and 9, further comprising a first pattern layer printed between the first film and the first circuit layer.
11. The in-film electronic structure with a two-layer film of claim 6, further comprising a first design layer printed between the first film and the first circuit layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021631958.8U CN213094549U (en) | 2020-08-07 | 2020-08-07 | Intra-film electronic structure with double-layer membrane |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021631958.8U CN213094549U (en) | 2020-08-07 | 2020-08-07 | Intra-film electronic structure with double-layer membrane |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023245904A1 (en) * | 2022-06-20 | 2023-12-28 | 无锡小天鹅电器有限公司 | Diaphragm, display panel, display device and household appliance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023245904A1 (en) * | 2022-06-20 | 2023-12-28 | 无锡小天鹅电器有限公司 | Diaphragm, display panel, display device and household appliance |
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