CN212965937U - Notebook computer with heat dissipation air cavity isolation - Google Patents
Notebook computer with heat dissipation air cavity isolation Download PDFInfo
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- CN212965937U CN212965937U CN202022198136.1U CN202022198136U CN212965937U CN 212965937 U CN212965937 U CN 212965937U CN 202022198136 U CN202022198136 U CN 202022198136U CN 212965937 U CN212965937 U CN 212965937U
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Abstract
The utility model provides a notebook computer with heat dissipation air cavity isolation, wherein a heat dissipation area is isolated from the internal elements of the notebook computer through a partition plate; the heat dissipation area is provided with a turbine fan and a heat dissipation module; the heat dissipation area is covered with a heat dissipation cover plate; the heat dissipation module is provided with a heat dissipation plate assembly, a heat pipe radiator and section heat dissipation fins which are connected in sequence; the heat of the heating element in the notebook computer can be efficiently and rapidly taken away from the inside of the computer body, and the heat dissipation function is realized. Meanwhile, internal electrical elements of the whole notebook computer are isolated from the external severe environment, the normal work of the notebook computer under the use condition of severe environments such as high temperature and the like is ensured, and the influence of sand dust, humid air or salt spray mold on the notebook computer is reduced. The problem that sand dust, humid air or salt spray mold enters the machine from the notebook computer heat dissipation air hole to damage electrical elements such as a CPU, a display card and a power supply of the notebook computer and further influence the normal operation of the notebook computer is avoided or reduced.
Description
Technical Field
The utility model relates to a notebook computer heat dissipation technical field especially relates to a notebook computer with heat dissipation wind cavity is kept apart.
Background
At present, when the notebook computer is widely applied, the stable operation of the notebook computer and the normal operation of the notebook computer are always required to be satisfied. Because the notebook computer is convenient to carry, in the using process, the notebook computer can be used in various environments, such as using environments such as sand dust, humid air or salt fog mould, the phenomenon that the sand dust, the humid air or the salt fog mould enters the machine from the notebook computer heat dissipation air hole is caused, electric elements such as a CPU (central processing unit), a display card and a power supply of the notebook computer are damaged, the normal operation of the notebook computer is further influenced, the notebook computer cannot normally work, and the use of the notebook computer by a user is influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough among the above-mentioned prior art, the utility model provides a notebook computer with heat dissipation wind chamber is kept apart, include: the heat dissipation device comprises a shell, a heat dissipation part and a heat dissipation opening, wherein the shell is provided with a heat dissipation area and a heat dissipation opening;
the heat dissipation area and the internal elements of the notebook computer are mutually isolated by the partition board;
the heat dissipation area is provided with a turbine fan and a heat dissipation module;
the heat dissipation area is covered with a heat dissipation cover plate;
the heat dissipation module is provided with a heat dissipation plate assembly, a heat pipe radiator and section heat dissipation fins which are connected in sequence;
the section heat radiation fins are arranged close to the exhaust outlet of the turbofan;
the heat dissipation plate assembly is fixedly arranged on the shell and is arranged close to the heat dissipation opening;
the heat pipe radiator is arranged in the radiating area in a bending mode.
It should be further noted that, after the heat pipe radiator is flattened and bent according to the preset layout area of the heat dissipation area, one end of the heat pipe radiator is connected with the heat dissipation plate assembly in a welding manner;
the other end of the heat pipe radiator is connected with the section radiating fins in a welding mode.
It should be further noted that a plurality of heat dissipation holes are arranged on the heat dissipation cover plate, and the heat dissipation holes are arranged in a matrix form;
the heat dissipation holes on the heat dissipation cover plate are air inlets.
It should be further noted that a fan cable rubber plug is also connected to the housing;
the fan cable rubber buffer is assembled on the hole site that the casing was reserved through interference fit mode.
It should be further noted that the heat dissipation plate assembly is provided with a heat dissipation plate, a placement groove is arranged in the middle of the heat dissipation plate, and the other end of the heat pipe radiator is placed in the placement groove and is welded with the groove wall of the placement groove;
four corners at the bottom of the heat dissipation plate are respectively provided with a rubber supporting seat;
and mounting holes are respectively arranged at the four corners close to the heat dissipation plate.
It is further noted that the turbofan is assembled to the casing by screws.
It should be further noted that the heat dissipation plate assembly is an aluminum milled red copper heat dissipation plate assembly.
The casing adopts an aluminum milled notebook computer casing.
According to the technical scheme, the utility model has the advantages of it is following:
the utility model provides an among the notebook computer with heat dissipation wind chamber is kept apart, heat dissipation area forms a heat dissipation cavity based on turbofan and heat dissipation module, air intake, air outlet. The heat of the heating element in the notebook computer can be efficiently and rapidly taken away from the inside of the computer body, and the heat dissipation function is realized. Meanwhile, internal electrical elements of the whole notebook computer are isolated from the external severe environment, the normal work of the notebook computer under the use condition of severe environments such as high temperature and the like is ensured, and the influence of sand dust, humid air or salt spray mold on the notebook computer is reduced. The problem that sand dust, humid air or salt spray mold enters the machine from the notebook computer heat dissipation air hole to damage electrical elements such as a CPU, a display card and a power supply of the notebook computer and further influence the normal operation of the notebook computer is avoided or reduced.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a notebook computer with isolated cooling air chambers;
FIG. 2 is a schematic view of a heat sink assembly;
FIG. 3 is a schematic diagram of an embodiment of a notebook computer with a heat dissipation air cavity isolation.
Description of reference numerals:
1-machine shell, 2-heat dissipation area, 3-heat dissipation port, 4-turbofan, 5-heat dissipation cover plate, 6-heat dissipation plate assembly, 7-heat pipe radiator, 8-section heat dissipation fin, 9-heat dissipation hole, 10-fan cable rubber plug, 11-heat dissipation plate, 12-placement groove, 13-rubber support seat and 14-mounting hole.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the features in the following embodiments and examples may be combined with each other without conflict.
The present invention provides a notebook computer with a heat dissipating air cavity isolation, it should be understood that when a component or layer is referred to as being "on" another component or layer, and is "connected" or "coupled" to another component or layer, it may be directly on another component or layer, directly connected or coupled to the other component or layer, and intermediate components or layers may also be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the notebook computer with the isolation of the heat dissipation air cavity, the spatial relativity terms convenient for description, such as "under …", "below", "lower", "above", etc., may be used to describe the relationship between one element or feature and another element or feature as shown in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.
Specifically, as shown in fig. 1 to 3, the method includes: the heat dissipation device comprises a machine shell 1, wherein a heat dissipation area 2 and a heat dissipation port 3 are arranged on the machine shell 1; the heat dissipation area 2 is isolated from the internal elements of the notebook computer by a partition plate; the internal components of the notebook computer can be a CPU, a display card, a mainboard, a power supply and the like.
The heat dissipation area 2 is provided with a turbofan 4 and a heat dissipation module; the heat dissipation area 2 is covered with a heat dissipation cover plate 5; the heat radiation module is provided with a heat radiation plate component 6, a heat pipe radiator 7 and a section heat radiation fin 8 which are connected in sequence; the section bar radiating fins 8 are arranged close to the air outlet of the turbofan 4; the heat dissipation plate assembly 6 is fixedly arranged on the machine shell 1, and the heat dissipation plate assembly 6 is arranged close to the heat dissipation port 3; the heat pipe radiator 7 is arranged in the heat dissipation area 2 in a bent manner.
Therefore, after the notebook computer with the heat dissipation air cavity isolation is assembled, the heat dissipation area 2 and the internal elements of the notebook computer are isolated from each other through the partition plate; the turbofan 4 and the heat dissipation module in the heat dissipation area 2 perform a heat dissipation function. The heat dissipation area 2 forms a heat dissipation cavity based on the turbofan 4, the heat dissipation module, the air inlet and the air outlet. The heat of the heating element in the notebook computer can be efficiently and rapidly taken away from the inside of the computer body, and the heat dissipation function is realized. Meanwhile, internal electrical elements of the whole notebook computer are isolated from the external severe environment, the normal work of the notebook computer under the use condition of severe environments such as high temperature and the like is ensured, and the influence of sand dust, humid air or salt spray mold on the notebook computer is reduced. The problem that sand dust, humid air or salt spray mold enters the machine from the notebook computer heat dissipation air hole to damage electrical elements such as a CPU, a display card and a power supply of the notebook computer and further influence the normal operation of the notebook computer is avoided or reduced.
In the utility model, after the heat pipe radiator 7 is flattened and bent according to the preset layout area of the heat dissipation area 2, one end of the heat pipe radiator 7 is connected with the heat dissipation plate assembly 6 in a welding mode; the other end of the heat pipe radiator 7 is connected with the section bar radiating fins 8 in a welding mode.
The specific shape of the heat pipe radiator 7 can be set according to the internal layout condition of the notebook computer, and the specific shape is not limited.
The heat dissipation plate assembly 6 is provided with a heat dissipation plate 11, the middle part of the heat dissipation plate 11 is provided with a placement groove 12, and the other end of the heat pipe radiator 7 is placed in the placement groove 12 and is connected with the groove wall of the placement groove 12 in a welding mode; four corners at the bottom of the heat dissipation plate 11 are respectively provided with a rubber support base 13; mounting holes 14 are provided near the four corners of the heat radiating plate 11, respectively.
In the utility model, a plurality of heat dissipation holes 9 are arranged on the heat dissipation cover plate 5, and the heat dissipation holes 9 are arranged in a matrix form; the heat dissipation holes 9 on the heat dissipation cover plate 5 are air inlets. Of course, the air inlet can be arranged at other positions, and the specific arrangement position of the air inlet is not limited.
A fan cable rubber plug 10 is also connected to the casing 1; the fan cable rubber plug 10 is assembled on the hole site reserved in the casing 1 in an interference fit mode.
The turbo fan 4 is assembled to the casing 1 by screws. Thus, the installation and the disassembly are convenient. The heat dissipation plate assembly 6 is made of aluminum and red copper. The case 1 is an aluminum milled notebook computer case 1. Thus, the heat dissipation effect can be improved. The heat dissipation port 3 is disposed at a side portion of the notebook computer, and may be disposed at other positions, and the specific position is not limited.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The utility model provides a notebook computer with heat dissipation wind cavity is kept apart which characterized in that includes: the heat dissipation device comprises a machine shell (1), wherein a heat dissipation area (2) and a heat dissipation port (3) are arranged on the machine shell (1);
the heat dissipation area (2) is isolated from the internal elements of the notebook computer through a partition plate;
the heat dissipation area (2) is provided with a turbofan (4) and a heat dissipation module;
a heat dissipation cover plate (5) is covered on the heat dissipation area (2);
the heat dissipation module is provided with a heat dissipation plate assembly (6), a heat pipe radiator (7) and a section heat dissipation fin (8) which are connected in sequence;
the section heat radiation fins (8) are arranged close to the air outlet of the turbofan (4);
the radiating plate component (6) is fixedly arranged on the shell (1), and the radiating plate component (6) is arranged close to the radiating port (3);
the heat pipe radiator (7) is arranged in the radiating area (2) in a bending mode.
2. The notebook computer with cooling air cavity isolation of claim 1,
after the heat pipe radiator (7) is flattened and bent according to the preset layout area of the heat dissipation area (2), one end of the heat pipe radiator (7) is connected with the heat dissipation plate assembly (6) in a welding mode;
the other end of the heat pipe radiator (7) is connected with the section bar radiating fins (8) in a welding mode.
3. The notebook computer with cooling air cavity isolation of claim 1,
a plurality of heat dissipation holes (9) are formed in the heat dissipation cover plate (5), and the heat dissipation holes (9) are arranged in a matrix form;
the heat dissipation holes (9) on the heat dissipation cover plate (5) are air inlets.
4. The notebook computer with cooling air cavity isolation of claim 1,
a fan cable rubber plug (10) is also connected to the casing (1);
the fan cable rubber plug (10) is assembled on a hole position reserved in the shell (1) in an interference fit mode.
5. The notebook computer with cooling air cavity isolation of claim 2,
the heat dissipation plate assembly (6) is provided with a heat dissipation plate (11), the middle position of the heat dissipation plate (11) is provided with a placement groove (12), and the other end of the heat pipe radiator (7) is placed in the placement groove (12) and is welded with the groove wall of the placement groove (12);
four corners at the bottom of the heat dissipation plate (11) are respectively provided with a rubber supporting seat (13);
mounting holes (14) are respectively arranged at the four corners close to the heat dissipation plate (11).
6. The notebook computer with cooling air cavity isolation of claim 1,
the turbofan (4) is assembled to the casing (1) by screws.
7. The notebook computer with cooling air cavity isolation of claim 1,
the heat dissipation plate assembly (6) is formed by milling a red copper heat dissipation plate assembly (6) by aluminum.
8. The notebook computer with cooling air cavity isolation of claim 1,
the shell (1) is an aluminum milled notebook computer shell (1).
9. The notebook computer with cooling air cavity isolation of claim 1,
the heat dissipation opening (3) is arranged on the side of the notebook computer.
Priority Applications (1)
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CN202022198136.1U CN212965937U (en) | 2020-09-29 | 2020-09-29 | Notebook computer with heat dissipation air cavity isolation |
Applications Claiming Priority (1)
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CN202022198136.1U CN212965937U (en) | 2020-09-29 | 2020-09-29 | Notebook computer with heat dissipation air cavity isolation |
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CN212965937U true CN212965937U (en) | 2021-04-13 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113190098A (en) * | 2021-05-11 | 2021-07-30 | 深圳市创智成科技股份有限公司 | Heat radiation module for notebook computer |
CN116048194A (en) * | 2022-07-07 | 2023-05-02 | 荣耀终端有限公司 | Notebook computer |
-
2020
- 2020-09-29 CN CN202022198136.1U patent/CN212965937U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113190098A (en) * | 2021-05-11 | 2021-07-30 | 深圳市创智成科技股份有限公司 | Heat radiation module for notebook computer |
CN116048194A (en) * | 2022-07-07 | 2023-05-02 | 荣耀终端有限公司 | Notebook computer |
CN116048194B (en) * | 2022-07-07 | 2024-03-19 | 荣耀终端有限公司 | Notebook computer |
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