CN212954989U - Conductive adhesive - Google Patents
Conductive adhesive Download PDFInfo
- Publication number
- CN212954989U CN212954989U CN202020471252.3U CN202020471252U CN212954989U CN 212954989 U CN212954989 U CN 212954989U CN 202020471252 U CN202020471252 U CN 202020471252U CN 212954989 U CN212954989 U CN 212954989U
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- Prior art keywords
- conductive
- ball
- layer
- elastic resin
- balls
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- 239000000853 adhesive Substances 0.000 title abstract description 22
- 230000001070 adhesive effect Effects 0.000 title abstract description 22
- 239000000956 alloy Substances 0.000 claims abstract description 34
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 57
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000002356 single layer Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 26
- 238000002844 melting Methods 0.000 abstract description 17
- 230000008018 melting Effects 0.000 abstract description 17
- 239000012790 adhesive layer Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 9
- 239000000084 colloidal system Substances 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract description 3
- 239000000155 melt Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 13
- 238000005476 soldering Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000004927 fusion Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The utility model discloses a conductive adhesive, this conductive adhesive includes: the conductive ball comprises an adhesive layer, a plurality of conductive balls distributed in the adhesive layer and a plurality of low-melting-point alloy balls/powder distributed in the adhesive layer in a scattered manner. The utility model discloses it has a plurality of low melting point alloy balls/powder to distribute in the glue film, and when electronic component interconnect, low melting point alloy ball/powder melts under high temperature for electronic component's electricity is connected more firmly, can not take place the skew. Meanwhile, a one-step mixing mode of the conductive balls, the low-melting-point alloy balls/powder and the colloid is adopted, the formula process is simplified, the flexibility of specification performance adjustment is improved, and the product characteristics are realized conveniently.
Description
Technical Field
The utility model particularly relates to a conductive adhesive and application thereof.
Background
In the field of electronic industry, anisotropic conductive adhesives are widely used for mounting electronic parts such as IC chips on a substrate. With the demand for high density wiring in small electronic devices such as mobile phones and notebook computers, the conventional anisotropic conductive adhesive is becoming unable to meet the demand.
Prior patent TW531868B discloses a soldering type anisotropic conductive adhesive, including: the adhesive material and a plurality of conductive particles arranged in the adhesive material, wherein each arranged conductive particle comprises a conductive ball, a welding layer and a soldering flux layer. The welding layer is arranged on the surface of the welding layer to cover the ball body, and the soldering flux layer is arranged on the welding layer. This structure can't carry out fine connection to electronic component, and the fixity is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a conducting resin.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a conductive paste comprising: the conductive ball comprises an adhesive layer, a plurality of conductive balls distributed in the adhesive layer and a plurality of low-melting-point alloy balls/powder distributed in the adhesive layer in a scattered manner.
The utility model discloses a conducting resin has dispersed a plurality of low melting point alloy balls/powder in the glue film, and when electronic component interconnect, low melting point alloy ball/powder melts under high temperature for electronic component's electricity is connected more firmly, can not take place the skew. Meanwhile, a one-step mixing mode of the conductive balls, the low-melting-point alloy balls/powder and the colloid is adopted, the formula process is simplified, the flexibility of specification performance adjustment is improved, and the product characteristics are realized conveniently.
On the basis of the technical scheme, the following improvements can be made:
preferably, the low melting point alloy ball/powder can be one or a combination of more of silver, nickel, tin and indium.
With the preferred embodiment, the melting point of the low-melting-point alloy ball/powder is less than 300 ℃, more preferably less than 160 ℃.
Preferably, each of the conductive balls includes: a solid metal ball; or the elastic resin ball and the metal layer coated on the surface of the elastic resin ball; or, comprising: the elastic resin ball comprises an elastic resin ball, a metal layer coated on the surface of the elastic resin ball and a plurality of low-melting-point alloy salient points arranged on the metal layer; or, comprising: the elastic resin ball, the metal layer coated on the surface of the elastic resin ball and the insulating layer coated on the surface of the metal layer; or, comprising: the elastic resin ball comprises an elastic resin ball, a metal layer coated on the surface of the elastic resin ball, a plurality of low-melting-point alloy salient points arranged on the metal layer and an insulating layer coated on the outermost side.
With the above preferred arrangement, various forms of conductive balls can be used.
Preferably, the adhesive layer includes: resin, soldering flux and a deoxidizer.
By adopting the preferable scheme, the added soldering flux and the oxidant have the functions of removing the oxide on the surface of the low-melting-point alloy ball/powder and assisting fusion welding of the low-melting-point alloy ball/powder during hot-press welding.
Preferably, the conductive adhesive has a single-layer or multi-layer structure.
By adopting the preferable scheme, the single-layer structure is simple in process, and the multi-layer structure can better improve the capture rate of the conductive balls.
Preferably, when the conductive adhesive has a multi-layer structure, the conductive balls are distributed in the connection layer close to the connection surface.
By adopting the preferable scheme, the capture rate of the electric ball is improved better.
Preferably, the conductive balls are randomly distributed in the connection layer.
By adopting the preferable scheme, the process is simple.
Preferably, the conductive balls are distributed in the connection layer in an array.
By adopting the preferable scheme, the capture rate of the conductive balls is further improved.
The utility model discloses still disclose the application of a conducting resin, at electronic component's connection position coating conducting resin.
Preferably, the electronic components coated with the conductive paste are connected by a thermocompression bonding process.
By adopting the preferable scheme, the method has the functions of removing the oxide on the surface of the low-melting-point alloy ball/powder and assisting fusion welding of the low-melting-point alloy ball/powder during hot-press welding.
Drawings
Fig. 1 is a schematic structural diagram of a conductive adhesive according to an embodiment of the present invention.
Fig. 2 is a second schematic structural diagram of the conductive adhesive according to the embodiment of the present invention.
Fig. 3 is a third schematic structural diagram of the conductive adhesive according to the embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a conductive ball according to an embodiment of the present invention.
Fig. 5 is a second schematic structural diagram of a conductive ball according to an embodiment of the present invention.
Fig. 6 is a third schematic structural view of a conductive ball according to an embodiment of the present invention.
Fig. 7 is a fourth schematic structural view of a conductive ball according to an embodiment of the present invention.
Fig. 8 is a schematic view illustrating an application of the conductive adhesive according to an embodiment of the present invention.
Wherein: 1-adhesive layer, 2-conductive ball, 21-elastic resin ball, 22-metal layer, 23-low melting point alloy salient point, 24-insulating layer, 3-low melting point alloy ball/powder and 4-connecting layer.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In order to achieve the object of the present invention, in some embodiments of a conductive adhesive, as shown in fig. 1, the conductive adhesive includes: the adhesive layer 1, a plurality of conductive balls 2 distributed in the adhesive layer 1 and a plurality of low melting point alloy balls/powder 3 distributed in the adhesive layer 1 in a scattered manner.
The utility model discloses a conducting resin has dispersed a plurality of low melting point alloy balls/powder in glue film 1, and when electronic component interconnect, low melting point alloy ball/powder 3 melts under high temperature for electronic component's electricity is connected more firmly, can not take place the skew. Meanwhile, the conductive ball 2, the low-melting-point alloy ball/powder 3 and the colloid are mixed at one time, so that the formula process is simplified, the flexibility of specification and performance adjustment is improved, and the product characteristics are realized. In fig. 1, PET is a base material.
In order to further optimize the effect of the present invention, in other embodiments, the rest of the features are the same, except that the low melting point alloy ball/powder 3 may be one or more of silver, nickel, tin and indium.
With the preferred embodiment described above, the melting point of the low melting point alloy ball/powder 3 is less than 300 deg.C, more preferably less than 160 deg.C. The low melting point alloy ball/powder 3 is not limited to one or a combination of more of silver, nickel, tin and indium, and may be other metals or a mixture of other metals.
In order to further optimize the effect of the present invention, in other embodiments, the rest of the features are the same, except that each conductive ball 2 includes: a solid metal ball; or elastic resin balls 21 and metal layers 22 (shown in fig. 4) covering the surfaces of the elastic resin balls 21; or, comprising: an elastic resin ball 21, a metal layer 22 coated on the surface of the elastic resin ball 21, and a plurality of low melting point alloy bumps 23 (shown in fig. 6) provided on the metal layer 22; or, comprising: an elastic resin ball 21, a metal layer 22 covering the surface of the elastic resin ball 21, and an insulating layer 24 covering the surface of the metal layer 22 (as shown in fig. 5); or, comprising: the elastic resin ball 21, the metal layer 22 coated on the surface of the elastic resin ball 21, the plurality of low melting point alloy bumps 23 disposed on the metal layer 22, and the insulating layer 24 coated on the outermost side (as shown in fig. 7).
With the above preferred arrangement, various forms of the conductive balls 2 may be used.
In order to further optimize the effect of the present invention, in other embodiments, other features are the same, except that the glue layer 1 includes: resin, soldering flux and a deoxidizer.
By adopting the preferable scheme, the added soldering flux and the oxidant have the functions of removing the oxide on the surface of the low-melting-point alloy ball/powder and assisting the fusion welding of the low-melting-point alloy ball/powder 3 during the hot-press welding.
In order to further optimize the implementation effect of the present invention, in other embodiments, the rest of the feature technologies are the same, except that the conductive adhesive has a single-layer or multi-layer structure.
By adopting the preferable scheme, the single-layer structure has simple process, and the multi-layer structure can better improve the capture rate of the conductive balls 2.
In order to further optimize the implementation effect of the present invention, in other embodiments, other feature technologies are the same, except that, when the conductive adhesive is a multilayer structure, the conductive balls 2 are distributed on the connection layer 4 near the connection surface.
By adopting the preferable scheme, the capture rate of the electric ball is improved better.
As shown in fig. 2, further, the conductive balls 2 are randomly distributed on the connection layer 4.
By adopting the preferable scheme, the process is simple.
As shown in fig. 3, further, the conductive balls 2 are distributed in an array on the connection layer 4.
With the above preferred embodiment, the capture rate of the conductive balls 2 is further improved. And in order to further increase the capture rate of the conductive balls 2, the conductive balls 2 may be distributed on the side close to the connection surface of the connection layer 4.
The utility model discloses still disclose the application of a conducting resin, at electronic component's connection position coating conducting resin.
Preferably, the electronic components coated with the conductive paste are connected by a thermocompression bonding process.
By adopting the preferable scheme, the method has the functions of removing the oxide on the surface of the low-melting-point alloy ball/powder and assisting fusion welding of the low-melting-point alloy ball/powder during hot-press welding. The welding conduction mode is adopted, and the colloid in the adhesive layer 1 can adopt thermosetting type or thermoplastic resin or mixed type.
As shown in fig. 8, the conductive adhesive disclosed in the present application is used to adhere the pins of the IC chip to the TFT-LCD, and the conductive adhesive is used to electrically connect one end of the FPC to the TFT-LCD and one end of the FPC to the PCB.
The various embodiments above may be implemented in cross-parallel.
With regard to the preferred embodiments of the present invention, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the inventive concept, and these are within the scope of the present invention.
Claims (6)
1. A conductive paste comprising: the conductive ball structure comprises a glue layer and a plurality of conductive balls distributed in the glue layer, and is characterized by further comprising a plurality of low-melting-point alloy balls distributed in the glue layer in a scattered manner.
2. The conductive paste as claimed in claim 1, wherein each of the conductive balls comprises: a solid metal ball; or, the elastic resin ball, coat the metal layer on the surface of said elastic resin ball; or, comprising: the elastic resin ball comprises an elastic resin ball, a metal layer coated on the surface of the elastic resin ball, and a plurality of low-melting-point alloy salient points arranged on the metal layer; or, comprising: the elastic resin ball comprises an elastic resin ball, a metal layer coated on the surface of the elastic resin ball and an insulating layer coated on the surface of the metal layer; or, comprising: the elastic resin ball comprises an elastic resin ball, a metal layer coated on the surface of the elastic resin ball, a plurality of low-melting-point alloy salient points arranged on the metal layer and an insulating layer coated on the outermost side.
3. The conductive paste as claimed in claim 1 or 2, wherein the conductive paste has a single-layer or multi-layer structure.
4. The conductive paste as claimed in claim 3, wherein when the conductive paste has a multi-layer structure, the conductive balls are distributed in a connection layer adjacent to the connection surface.
5. The conductive paste as claimed in claim 4, wherein the conductive balls are randomly distributed in the connection layer.
6. The conductive paste as claimed in claim 4, wherein the conductive balls are distributed in the connection layer in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020471252.3U CN212954989U (en) | 2020-04-02 | 2020-04-02 | Conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020471252.3U CN212954989U (en) | 2020-04-02 | 2020-04-02 | Conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212954989U true CN212954989U (en) | 2021-04-13 |
Family
ID=75340994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020471252.3U Active CN212954989U (en) | 2020-04-02 | 2020-04-02 | Conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212954989U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111334221A (en) * | 2020-04-02 | 2020-06-26 | 苏州鑫导电子科技有限公司 | A kind of conductive adhesive and its application |
-
2020
- 2020-04-02 CN CN202020471252.3U patent/CN212954989U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111334221A (en) * | 2020-04-02 | 2020-06-26 | 苏州鑫导电子科技有限公司 | A kind of conductive adhesive and its application |
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