CN212812127U - High-speed data transmission printed circuit board - Google Patents

Abstract

The utility model relates to a printed circuit board technical field just discloses a high-speed data transmission printed circuit board, including the circuit board main part, circuit board main part bottom swing joint has the upper cover plate, swing joint has insulating heat conduction silicone grease between circuit board main part and the upper cover plate, upper cover plate bottom swing joint has the lower plate, the joint has first heat pipe between upper cover plate and the lower plate, circuit board main part top left and right sides all pegs graft and have quantity for two and run through circuit board main part, upper cover plate and lower plate in proper order and extend to the set screw of lower plate bottom. This high speed data transmission printed circuit board has solved because the degree of integrating is more and more high, has integrateed more and more circuit components on the circuit board, because circuit components's calorific capacity is great, leads to the heat to gather easily and can't distribute away in circuit board inside, and then influences the high speed transmission's of data problem.

Description

High-speed data transmission printed circuit board

Technical Field

The utility model relates to a printed circuit board technical field specifically is a high-speed data transmission printed circuit board.

Background

The printed circuit board is one of important parts in the electronic industry, the printed circuit board can provide mechanical support for fixing and assembling electronic components, and can realize electrical connection between the electronic components, in addition, the printed circuit board is printed with component numbers and some figures, which provides convenience for component insertion, inspection and maintenance, almost every electronic equipment, small electronic watches, calculators, large computers, communication electronic equipment and military weapon systems, only electronic components such as integrated circuits are needed, and the printed circuit board is used for electrical interconnection between the electronic components.

Because the degree of integration is higher and higher, has integrateed more and more circuit components and parts on the circuit board, because circuit components and parts's calorific capacity is great, lead to the heat to gather easily and can't distribute away in circuit board inside, and then influence the high-speed transmission of data, so proposed a high speed data transmission printed circuit board and solved the above-mentioned problem that provides.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a high-speed data transmission printed circuit board possesses and can reduce circuit board temperature itself and components and parts temperature simultaneously, improves the advantage of data transmission stability, has solved because the degree of integrating is more and more high, has integrateed more and more circuit components and parts on the circuit board, because circuit components's calorific capacity is great, leads to the heat to gather easily and can't distribute away in circuit board inside, and then influences the high-speed transmission's of data problem.

(II) technical scheme

For realizing the aforesaid can reduce circuit board temperature itself and components and parts temperature simultaneously, improve data transmission stability's purpose, the utility model provides a following technical scheme: a high-speed data transmission printed circuit board comprises a circuit board main body, an upper cover plate is movably connected with the bottom of the circuit board main body, the insulating heat-conducting silicone grease is movably connected between the circuit board main body and the upper cover plate, the bottom of the upper cover plate is movably connected with a lower bottom plate, the first heat conduction pipe is clamped between the upper cover plate and the lower bottom plate, two fixing screws which penetrate through the circuit board main body, the upper cover plate and the lower bottom plate in sequence and extend to the bottom of the lower bottom plate are inserted into the left side and the right side of the top of the circuit board main body, the bottom of the fixing screw is in threaded connection with a fixing nut positioned at the bottom of the lower bottom plate, both ends of the first heat conduction pipe are movably connected with second heat conduction pipes positioned at the front side of the circuit board main body, a heat dissipation plate is fixedly connected between the two second heat conduction pipes, the heat dissipation plate is characterized in that a heat dissipation fan is fixedly connected to the rear side of the heat dissipation plate, and a heating element is fixedly connected to the top of the circuit board main body.

Preferably, the length and the width of the upper cover plate and the lower base plate are equal to those of the circuit board main body, and a clamping groove matched with the first heat conduction pipe is formed in one side, opposite to the upper cover plate and the lower base plate.

Preferably, first heat pipe and second heat pipe are the copper pipe, positive external screw thread has all been seted up to the equal outer wall in first heat pipe both ends, reverse external screw thread has been seted up to the one end outer wall that the second heat pipe is close to first heat pipe.

Preferably, the first heat pipe and the second heat pipe are fixedly connected through a threaded connector, thread grooves matched with the forward external threads and the reverse external threads are formed in two ends of the threaded connector respectively, and a flow guide hole communicated with the thread grooves is formed in the threaded connector.

Preferably, first heat pipe and heating panel are the S-shaped, heating panel top fixedly connected with the heating panel be linked together annotate oil pipe, annotate oil pipe top threaded connection and have the sealing plug.

Preferably, the second heat pipe is communicated with a heat dissipation plate, and the heat dissipation fan is located at the top of the circuit board main body.

(III) advantageous effects

Compared with the prior art, the utility model provides a high-speed data transmission printed circuit board possesses following beneficial effect:

the high-speed data transmission printed circuit board can fix the upper cover plate and the lower base plate to the bottom of the circuit board main body by arranging the fixing screw and the fixing nut, can transmit the heat generated by the circuit board main body to the upper cover plate and the lower base plate by arranging the insulating heat conduction silicone grease, increases the heat dissipation area, can install the first heat conduction pipe between the upper cover plate and the lower base plate when the heat dissipation requirement is higher, then connects the first heat conduction pipe and the second heat conduction pipe, fills the heat conduction oil into the first heat conduction pipe, the second heat conduction pipe and the heat dissipation plate through the oil injection pipe, enables the heat generated by the circuit board main body to be uniformly transmitted into the heat conduction oil, then drives the air flow to dissipate the heat dissipation plate through the heat dissipation fan, because the heat dissipation fan is positioned at the top of the circuit board main body, the heat dissipation fan can dissipate the heat of heating components, the purpose of improving data transmission stability to effectual having solved because the degree of integrating is more and more high, integrated more and more circuit components on the circuit board, because circuit components's calorific capacity is great, lead to the heat to gather easily and can't distribute away in circuit board inside, and then influence the problem of the high-speed transmission of data.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view illustrating the connection between the lower plate and the first heat pipe.

In the figure: the heat-conducting circuit board comprises a circuit board body 1, an upper cover plate 2, insulating heat-conducting silicone grease 3, a lower bottom plate 4, a first heat-conducting pipe 5, a fixing screw 6, a fixing nut 7, a second heat-conducting pipe 8, a heat-radiating plate 9, a heat-radiating fan 10 and a heat-generating component 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a high-speed data transmission printed circuit board comprises a circuit board main body 1, an upper cover plate 2 is movably connected to the bottom of the circuit board main body 1, an insulating heat-conducting silicone grease 3 is movably connected between the circuit board main body 1 and the upper cover plate 2, a lower base plate 4 is movably connected to the bottom of the upper cover plate 2, the length and width of the upper cover plate 2 and the lower base plate 4 are equal to the length and width of the circuit board main body 1, a first heat-conducting pipe 5 is clamped between the upper cover plate 2 and the lower base plate 4, a clamping groove matched with the first heat-conducting pipe 5 is formed in one side of the opposite surface of the upper cover plate 2 and the lower base plate 4, two fixing screws 6 are inserted into the left side and the right side of the top of the circuit board main body 1 and sequentially penetrate through the circuit board main body 1, the upper cover plate 2 and the lower base, the two ends of the first heat pipe 5 are movably connected with a second heat pipe 8 which is positioned at the front side of the circuit board main body 1, the first heat pipe 5 and the second heat pipe 8 are both copper pipes, the outer wall of each of the two ends of the first heat pipe 5 is provided with a forward external thread, the outer wall of one end, close to the first heat pipe 5, of the second heat pipe 8 is provided with a reverse external thread, the first heat pipe 5 and the second heat pipe 8 are fixedly connected through a threaded connector, the two ends of the threaded connector are respectively provided with a thread groove matched with the forward external thread and the reverse external thread, a sealing plug communicated with the thread groove is arranged in the threaded connector, a heat dissipation plate 9 is fixedly connected between the two second heat pipes 8, the first heat pipe 5 and the heat dissipation plate 9 are both S-shaped, the top of the heat dissipation plate 9 is fixedly connected with an oil injection pipe, the rear side of the heat dissipation plate 9 is fixedly connected with a heat dissipation fan 10, the heat dissipation fan 10 is positioned at the top of the circuit board main body 1, and the top of the circuit board main body 1 is fixedly connected with a heating element 11.

When in use, the upper cover plate 2 and the lower base plate 4 can be fixed to the bottom of the circuit board main body 1 by arranging the fixing screw 6 and the fixing nut 7, the heat generated by the circuit board main body 1 can be transferred to the upper cover plate 2 and the lower base plate 4 by arranging the insulating heat-conducting silicone grease 3, the heat dissipation area is increased, when the heat dissipation requirement is high, the first heat-conducting pipe 5 can be arranged between the upper cover plate 2 and the lower base plate 4, then the first heat-conducting pipe 5 and the second heat-conducting pipe 8 are connected, the first heat-conducting pipe 5, the second heat-conducting pipe 8 and the heat dissipation plate 9 are filled with heat-conducting oil through the oil injection pipe, the heat generated by the circuit board main body 1 is uniformly transferred into the heat-conducting oil, then the heat dissipation plate 9 is dissipated by driving the air to flow through the heat dissipation fan 10, because the heat dissipation fan 10 is, therefore, the purposes of reducing the temperature of the circuit board and the temperature of components and parts and improving the data transmission stability are achieved.

In summary, in the high-speed data transmission printed circuit board, the upper cover plate 2 and the lower base plate 4 can be fixed to the bottom of the circuit board body 1 by arranging the fixing screw 6 and the fixing nut 7, the heat generated by the circuit board body 1 can be transferred to the upper cover plate 2 and the lower base plate 4 by arranging the insulating heat-conducting silicone grease 3, so as to increase the heat dissipation area, when the heat dissipation requirement is high, the first heat pipe 5 can be installed between the upper cover plate 2 and the lower base plate 4, then the first heat pipe 5 and the second heat pipe 8 are connected, the first heat pipe 5, the second heat pipe 8 and the heat dissipation plate 9 are filled with heat-conducting oil through the oil injection pipe, so that the heat generated by the circuit board body 1 is uniformly transferred into the heat-conducting oil, then the heat dissipation plate 9 is dissipated by driving the air to flow through the heat dissipation fan 10, because the heat dissipation fan 10 is located at the top of, thereby reached and to have reduced circuit board temperature itself and components and parts temperature simultaneously, improved data transmission stability's purpose to effectual solution has integrated more and more circuit components and parts on the circuit board owing to the degree of integrating is more and more high, because circuit components and parts's calorific capacity is great, leads to the heat to gather easily and can't distribute away in circuit board inside, and then influences the problem of the high-speed transmission of data.

It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A high-speed data transmission printed circuit board comprises a circuit board main body (1), and is characterized in that: the heat-conducting circuit board comprises a circuit board main body (1), wherein an upper cover plate (2) is movably connected to the bottom of the circuit board main body (1), insulating heat-conducting silicone grease (3) is movably connected between the circuit board main body (1) and the upper cover plate (2), a lower base plate (4) is movably connected to the bottom of the upper cover plate (2), a first heat-conducting pipe (5) is clamped between the upper cover plate (2) and the lower base plate (4), two fixing screws (6) which penetrate through the circuit board main body (1), the upper cover plate (2) and the lower base plate (4) in sequence and extend to the bottom of the lower base plate (4) are inserted into the left side and the right side of the top of the circuit board main body (1), fixing nuts (7) located at the bottom of the lower base plate (4) are connected to the bottom of the fixing screws (6) in a threaded manner, and, two fixedly connected with heating panel (9) between second heat pipe (8), heating panel (9) rear side fixedly connected with radiator fan (10), circuit board main part (1) top fixedly connected with heating element (11).

2. A high speed data transmission printed circuit board according to claim 1, wherein: the length and the width of the upper cover plate (2) and the lower base plate (4) are equal to those of the circuit board main body (1), and a clamping groove matched with the first heat conduction pipe (5) is formed in one side of the opposite surface of the upper cover plate (2) and the lower base plate (4).

3. A high speed data transmission printed circuit board according to claim 1, wherein: first heat pipe (5) and second heat pipe (8) are the copper pipe, forward external screw thread has all been seted up to the equal outer wall in first heat pipe (5) both ends, reverse external screw thread has been seted up to the one end outer wall that second heat pipe (8) are close to first heat pipe (5).

4. A high speed data transmission printed circuit board according to claim 3, wherein: first heat pipe (5) and second heat pipe (8) pass through threaded connection head fixed connection, the thread groove with forward external screw thread and reverse external screw thread looks adaptation is seted up respectively at the threaded connection head both ends, set up the water conservancy diversion hole that is linked together with the thread groove in the threaded connection head.

5. A high speed data transmission printed circuit board according to claim 1, wherein: first heat pipe (5) and heating panel (9) are the S-shaped, heating panel (9) top fixedly connected with the oiling pipe that is linked together with heating panel (9), oiling pipe top threaded connection has the sealing plug.

6. A high speed data transmission printed circuit board according to claim 1, wherein: the second heat conduction pipe (8) is communicated with the heat dissipation plate (9), and the heat dissipation fan (10) is located on the top of the circuit board main body (1).

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