CN212812032U

CN212812032U - Centering support piece and miniature sound production device

Info

Publication number: CN212812032U
Application number: CN202022075915.2U
Authority: CN
Inventors: 段均钟; 汪珍珍; 孙婷婷
Original assignee: Merry Technology Suzhou Co Ltd
Current assignee: Merry Technology Suzhou Co Ltd
Priority date: 2020-09-21
Filing date: 2020-09-21
Publication date: 2021-03-26
Anticipated expiration: 2030-09-21

Abstract

The utility model discloses a centering disk and a miniature sound production device, belonging to the technical field of acoustic equipment, wherein the centering disk comprises a central part; the edge part is arranged around the periphery of the central part at intervals; the two first cantilevers are positioned on two opposite sides of the central part, and two ends of the first cantilevers are respectively connected to the central part and the edge part; the two second cantilevers are positioned on the other two opposite sides of the central part, and two ends of the second cantilevers are respectively connected to the central part and the edge part; the first cantilever comprises n layers of base materials, the second cantilever comprises (n + m) layers of base materials, and m is larger than or equal to 1. The utility model provides a centering support piece and miniature sound generating mechanism can improve the audio of miniature sound generating mechanism under the vibrating diaphragm drives, can effectively restrain the amplitude behind the miniature sound generating mechanism increase power, have reduced the cracked risk of lead wire, have effectively improved miniature sound generating mechanism's endurance.

Description

Centering support piece and miniature sound production device

Technical Field

The utility model relates to an acoustics equipment technical field especially relates to a centering support piece and miniature sound generating mechanism.

Background

The speakers used in the current mobile terminals are mostly micro speakers. The micro-speaker comprises a magnetic circuit system, a vibration system and a basin frame for accommodating and fixing the magnetic circuit system and the vibration system.

The vibration system comprises a vibrating diaphragm, a centering disk and a voice coil. The centering support is used for connecting the vibrating diaphragm and the voice coil into a whole so as to ensure that the voice coil is vertical without deflection, the polarization of the vibrating diaphragm is effectively prevented, and the stability of the centering support can influence the performance of the whole micro-speaker. The tip of voice coil loudspeaker voice coil is equipped with the lead wire that is used for providing the electric energy for the voice coil loudspeaker voice coil, and rock in order to prevent that the lead wire transition, the lead wire needs to be fixed on the cantilever at the relative both ends of centering branch piece, the rigidity at centering branch piece both ends has been increased, lead to the four ends rigidity inequality of centering branch piece more easily, make vibration system unbalance, can lead to miniature speaker during operation to appear rocking vibration, miniature speaker works under polarization state for a long time, lead to voice coil loudspeaker voice coil and magnetic circuit collision easily, make the product produce noise or broken string inefficacy.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a centering support piece and miniature sound generating mechanism can improve the audio of miniature sound generating mechanism under the vibrating diaphragm drives, can effectively restrain the amplitude behind the miniature sound generating mechanism increase power, has reduced the cracked risk of lead wire, has effectively improved miniature sound generating mechanism's endurance.

As the conception, the utility model adopts the technical proposal that:

a centering disk comprising:

a central portion;

the edge parts are arranged around the periphery of the central part at intervals;

the two first cantilevers are positioned on two opposite sides of the central part, and two ends of the first cantilevers are respectively connected to the central part and the edge part;

the two second cantilevers are positioned on the other two opposite sides of the central part, and two ends of the second cantilevers are respectively connected to the central part and the edge part;

the first cantilever comprises n layers of base materials, the second cantilever comprises (n + m) layers of base materials, and m is larger than or equal to 1.

Optionally, the first cantilever comprises 3 layers of substrate and the second cantilever comprises 4 layers of substrate.

Optionally, the first cantilever includes two first PI layers and a first adhesive layer located between the two first PI layers, and the second cantilever includes two second PI layers and a second adhesive layer and a copper foil layer stacked between the two second PI layers.

Optionally, the thicknesses of the first PI layer and the first adhesive layer are 12.5 to 50 micrometers respectively, the thicknesses of the second PI layer and the second adhesive layer are 12.5 to 50 micrometers respectively, and the thickness of the copper foil layer is 12 to 18 micrometers.

Optionally, the thickness of the first PI layer is 25 micrometers, the thickness of the first adhesive layer is 12.5 micrometers, the thickness of the second PI layer is 25 micrometers, the thickness of the second adhesive layer is 12.5 micrometers, and the thickness of the copper foil layer is 12 micrometers.

Optionally, the first cantilever comprises 3 layers of substrate and the second cantilever comprises 5 layers of substrate.

Optionally, the first cantilever includes two first PI layers and a first adhesive layer located between the two first PI layers, the second cantilever includes three second PI layers and two second adhesive layers, and one second adhesive layer is located between two adjacent second PI layers.

Optionally, the thickness of the central portion and the thickness of the edge portion are respectively 25 to 200 micrometers.

Optionally, the centering branch piece is rectangular, and a side length of the central portion connected to the first cantilever is smaller than a side length of the central portion connected to the second cantilever.

Optionally, the length of the first cantilever is less than the length of the second cantilever.

A miniature sound generating device comprising: the vibrating diaphragm, the voice coil and the centering support sheet are arranged on the base;

the central part of the diaphragm is fixed on the top surface of the central part;

the voice coil comprises a main body and a lead wire extending out of the main body, and the main body is fixedly connected with the central part;

the lead wires are two, the two lead wires and the two first cantilevers are in one-to-one correspondence, and the lead wires are fixed on the corresponding first cantilevers respectively.

Optionally, one end of each of the two leads is connected to two sides of the main body, an opening is formed between the other end of each lead and the main body, and the direction of the opening formed by one lead and the main body is opposite to the direction of the opening formed by the other lead and the main body.

Optionally, the miniature sound generating device is a speaker, an earphone or a receiver.

The utility model provides a centering support piece and miniature sound generating mechanism have following beneficial effect at least:

the number of layers of the base materials in the second cantilever of the centering branch piece is larger than that of the base materials in the first cantilever, when the centering branch piece is installed in the miniature sound production device, the lead can be fixed through the first cantilever, the number of layers of the base materials in the second cantilever is large, the strength and the rigidity of the second cantilever can be increased, the difference between the strength of the second cantilever and the total strength of the first cantilever and the lead is further reduced, the difference between the rigidity of the second cantilever and the overall rigidity of the first cantilever and the lead is reduced, the rigidity and the strength consistency of the two first cantilevers and the two second cantilevers are improved, a vibrating diaphragm in the miniature sound production device is arranged on the centering branch piece, and the central part of the vibrating diaphragm is bonded on the top surface of the central part. When vibration appears in the miniature sound generating device, the vibrating diaphragm can vibrate together with the root of the first cantilever and the root of the second cantilever, and therefore the stress balance of the first cantilever and the second cantilever can improve the balance performance of the vibration system, so that the sound effect of the miniature sound generating device driven by the vibrating diaphragm is improved, the amplitude of the miniature sound generating device after the power is increased can be effectively inhibited, the risk of lead breakage is reduced, and the power resistance of the miniature sound generating device is effectively improved.

Drawings

Fig. 1 is a schematic structural view of a centering support according to an embodiment of the present invention;

fig. 2 is a front view of a centering branch piece according to a first embodiment of the present invention;

fig. 3 is a cross-sectional view a-a of fig. 2 according to the present invention;

fig. 4 is a cross-sectional view B-B of fig. 2 according to the present invention;

fig. 5 is a reference diagram of a usage status of a centralizer according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional view of a second cantilever in a centering branch piece according to a second embodiment of the present invention;

fig. 7 is a schematic structural diagram of a miniature sound generating device provided in the third embodiment of the present invention;

fig. 8 is an exploded schematic view of a miniature sound generating device according to a third embodiment of the present invention.

In the figure:

1. a vibration system; 11. a central portion; 12. an edge portion; 13. a first cantilever; 131. a first PI layer; 132. a first adhesive layer; 14. a second cantilever; 141. a second PI layer; 142. a second adhesive layer; 143. a copper foil layer; 100. a centering support; 101. vibrating diaphragm; 102. a voice coil; 103. a lead wire; 104. an opening; 2. a magnetic circuit system; 3. a basin stand structure.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example one

The embodiment provides a centering support piece, which can reduce the probability of unbalanced rigidity and strength, effectively inhibit the amplitude of a miniature sound generating device after power is increased, and improve the power resistance of the miniature sound generating device.

As shown in fig. 1 to 5, the centering branch piece may include a central portion 11, an edge portion 12, two first suspension arms 13, and two second suspension arms 14.

The edge portion 12 is spaced around the outer periphery of the central portion 11, that is, the edge portion 12 is annular, and a gap exists between the edge portion 12 and the central portion 11, and the two first cantilevers 13 and the two second cantilevers 14 are located in the gap. Specifically, the central portion 11 has four sides, and as shown in fig. 1, two first suspension arms 13 are located at two opposite sides of the central portion 11, two ends of the first suspension arms 13 are respectively connected to the central portion 11 and the edge portion 12, two second suspension arms 14 are located at the other opposite sides of the central portion 11, and two ends of the second suspension arms 14 are respectively connected to the central portion 11 and the edge portion 12.

Moreover, the first cantilever 13 may include n layers of base materials, and the second cantilever 14 may include n + m layers of base materials, where m is greater than or equal to 1, and m is a positive integer, that is, the number of layers of base materials in the second cantilever 14 is greater than that of the base materials in the first cantilever 13 in this embodiment.

In the centering sheet provided in this embodiment, the number of layers of the base material in the second cantilever 14 is greater than the number of layers of the base material in the first cantilever 13, when the centering sheet is installed in the miniature sound generating apparatus, the lead 103 can be fixed by the first cantilever 13, and the number of layers of the base material in the second cantilever 14 is greater, so that the strength and the rigidity of the second cantilever 14 can be increased, and further, the difference between the strength of the second cantilever 14 and the total strength of the first cantilever 13 and the lead 103 is reduced, and the difference between the rigidity of the second cantilever 14 and the overall rigidity of the first cantilever 13 and the lead 103 is reduced, so that the consistency of the strength and the rigidity of the two first cantilevers 13 and the two second cantilevers 14 is improved, the vibrating diaphragm in the miniature sound generating apparatus is disposed on the centering sheet, and the central portion of the vibrating diaphragm is bonded to the top surface. When vibration appears in the miniature sound generating device, the vibrating diaphragm can vibrate together with the root of the cantilever, and the balance performance of the vibration system can be improved due to the stress balance of the cantilever, so that the miniature sound generating sound effect driven by the vibrating diaphragm is improved, the amplitude of the miniature sound generating device after power is increased can be effectively inhibited, the risk of breakage of the lead wire 103 is reduced, and the power resistance of the miniature sound generating device is effectively improved.

Illustratively, as shown in fig. 3, the first cantilever 13 includes 3 layers of the substrate, and as shown in fig. 4, the second cantilever 14 includes 4 layers of the substrate. The material of the substrate in this embodiment may be polyimide (abbreviated as PI), an adhesive, copper foil, or the like.

Further, as shown in fig. 3, the first cantilever 13 may include two first PI layers 131 and a first adhesive layer 132 located between the two first PI layers 131, wherein the first PI layer 131 is made of PI, and the first adhesive layer 132 is made of an adhesive. The first adhesive layer 132 is used for bonding and fixing two first PI layers, and the thickness of the first adhesive layer 132 can be adjusted as required, for example, when the first cantilever 13 needs to be thin, the thickness of the first adhesive layer 132 can be reduced on the premise of ensuring that two first PI layers 131 are bonded. If the stiffness and strength of the first cantilever 13 need to be large, the thickness of the first adhesive layer 132 can be increased.

Furthermore, the thicknesses of the first PI layer 131 and the first adhesive layer 132 are 12.5 to 50 micrometers, respectively, which can meet the requirements of most electronic devices. Preferably, the thickness of the first PI layer 131 is 25 micrometers and the thickness of the first adhesive layer 132 is 12.5 micrometers.

Alternatively, as shown in fig. 4, the second cantilever 14 may include two second PI layers 141, and a second adhesive layer 142 and a copper foil layer 143 stacked between the two second PI layers 141. Illustratively, one second PI layer 141, one second adhesive layer 142, one copper foil layer 143, and another second PI layer 141 are sequentially disposed from top to bottom, and the provision of the copper foil layer 143 can increase the hardness of the second cantilever 14, and thus can increase the bending resistance of the second cantilever 14. Alternatively, the material of the second PI layer 141 is PI, the material of the second adhesive layer 142 is an adhesive, the second adhesive layer 142 is used for bonding the copper foil layer 143 and one second PI layer 141, and the copper foil layer 143 may also be connected by bonding.

Furthermore, the thicknesses of the second PI layer 141 and the second adhesive layer 142 are 12.5 to 50 micrometers, respectively, and the thickness of the copper foil layer 143 is 12 to 18 micrometers, so as to meet the requirements of most electronic devices. Preferably, the thickness of the second PI layer 141 is 25 micrometers, the thickness of the second adhesive layer 142 is 12.5 micrometers, and the thickness of the copper foil layer 143 is 12 micrometers.

Optionally, the thickness of the central portion 11 and the edge portion 12 is 25 to 200 μm, respectively, which can meet the requirements of most electronic devices. Preferably, the thicknesses of the central portion 11 and the edge portion 12 may be the same, or the thicknesses of the central portion 11 and the edge portion 12 may be equal to the thickness of the first suspension arm 13 or the second suspension arm 14. When the thicknesses of the central portion 11 and the first suspension arm 13 or the second suspension arm 14 are different, the connection position between the central portion 11 and the first suspension arm 13 may adopt a smooth transition manner to prevent scratching other structures, and similarly, the connection positions between the first suspension arm 13 and the edge portion 12, the connection position between the second suspension arm 14 and the central portion 11, and the connection position between the second suspension arm 14 and the edge portion 12 adopt a smooth transition manner.

As shown in fig. 2, the centering piece is rectangular, specifically, the outline of the central portion 11 and the outline of the edge portion 12 are both rectangular, the first suspension arm 13 is connected to the edge of the central portion 11 opposite to the edge portion 12, the second suspension arm 14 is connected to the edge of the central portion 11 opposite to the edge portion 12, the length of the side of the central portion 11 connected to the first suspension arm 13 is less than the length of the side connected to the second suspension arm 14, that is, the two ends of the first suspension arm 13 are respectively connected to the short side of the central portion 11 and the short side of the edge portion 12, and the two ends of the second suspension arm 14 are respectively connected to the long side of the central portion 11 and the long side of.

Further, as shown in fig. 5, the length of the first cantilever 13 may be smaller than that of the second cantilever 14, that is, the lead 103 in this embodiment is still disposed on the first cantilever 13 with a smaller length. It will be appreciated that the length of the first cantilever 13 may also be greater than or equal to the length of the second cantilever 14. For example, the lead 103 may be fixed on the first cantilever 13 by means of gluing.

Alternatively, the widths of the first suspension arm 13 and the second suspension arm 14 may be adjusted according to actual needs, for example, according to the size of the gap between the central portion 11 and the edge portion 12 and the wire diameter of the lead 103.

In the present embodiment, as shown in fig. 2, one end of the second suspension arm 14 located at the upper side of the central portion 11 is connected to the left end portion of the central portion 11, and one end of the second suspension arm 14 located at the lower side of the central portion 11 is connected to the right end portion of the central portion 11, so as to facilitate the balance of the entire structure of the centering spacer, and similarly, one end of the first suspension arm 13 located at the left side of the central portion 11 is connected to the lower end portion of the central portion 11, and one end of the first suspension arm 13 located at the right side of the central portion 11 is connected to the upper end portion of the central portion 11, so as.

In the centering support piece provided by the embodiment, the lead 103 is fixed on the first cantilever 13, and the second cantilever 14 is made of a hardened material relative to the first cantilever 13, so that the strength and rigidity of the four cantilevers are adjusted consistently, the vibration system can be balanced, and the problems of uneven pulling force and rigidity caused by the lead 103 can be effectively solved.

Example two

The difference between the damper provided in this embodiment and the damper in the first embodiment is the structure of the second suspension arm 14.

As shown in FIG. 6, the second cantilever 14 in this embodiment comprises 5 layers of substrate. Specifically, the second suspension 14 may include three second PI layers 141 and two second adhesive layers 142, and one second adhesive layer 142 is disposed between each two adjacent second PI layers 141. The thickness of the first adhesive layer 142 may be adjusted as needed to ensure that the strength and the rigidity of the second cantilever 14 are consistent with the strength and the rigidity of the first cantilever 13 to which the lead 103 is fixed, respectively, and ensure that the bending resistance of the second cantilever 14 is consistent with the bending resistance of the first cantilever 13 to which the lead 103 is fixed, so as to improve the stability of the vibration system.

Furthermore, in the embodiment, the thicknesses of the second PI layer 141 and the second adhesive layer 142 are 12.5 to 50 micrometers, which can meet the requirements of most electronic devices. Preferably, in the present embodiment, the thickness of the second PI layer 141 is 25 micrometers, and the thickness of the second adhesive layer 142 is 12.5 micrometers.

Other structures in this embodiment are the same as the corresponding structures in the first embodiment, and have the same beneficial effects, for example, the first cantilever 13 includes 3 layers of base materials, and the three layers of base materials are two first PI layers 131 and a first adhesive layer 132 located between the two first PI layers 131, which is not described herein again in this embodiment.

EXAMPLE III

The present embodiment further provides a miniature sound generating apparatus, as shown in fig. 7 and 8, the miniature sound generating apparatus may include: a magnetic circuit system 2, a vibration system 1, and a frame structure 3 for housing and fixing the magnetic circuit system 2 and the vibration system 1. The specific arrangement of the magnetic circuit system 2 and the frame structure 3 can refer to the prior art, and is not described in detail in this embodiment.

The vibration system 1 may include a diaphragm 101, a voice coil 102, and the damper 100 in the first embodiment or the second embodiment. The center of the diaphragm 101 is fixed on the top surface of the center portion 11 of the centering support 100, the voice coil 102 includes a main body and two leads 103 extending from the main body, the main body is fixedly connected to the center portion 11, the two leads 103 are in one-to-one correspondence with the two first cantilevers 13, and each lead 103 is fixed on its corresponding first cantilever 13. Specifically, at least a part of the lead wire 103 is bonded to the first suspension 13, and one end of the lead wire 103 is connected to the voice coil 102, and the other end of the lead wire 103 is connected to a terminal on the frame structure 3.

Further, as shown in fig. 8, one ends of two leads 103 are respectively connected to two sides of the voice coil 102, and openings 104 are respectively formed between the other ends of the two leads 103 and the main body, and the orientation of one lead 103 and the main body forming opening 104 is opposite to the orientation of the other lead 103 and the main body forming opening 104, so as to facilitate the balance of the two ends of the centering branch piece 100.

Optionally, the miniature sound generating device in this embodiment is a speaker, an earphone, a receiver, or the like, which is not limited in this embodiment.

The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A centering disk, comprising:

a central portion (11);

edge portions (12) provided at intervals around the outer periphery of the central portion (11);

two first suspension arms (13), wherein the two first suspension arms (13) are positioned on two opposite sides of the central part (11), and two ends of the first suspension arms (13) are respectively connected to the central part (11) and the edge part (12);

two second suspension arms (14), wherein the two second suspension arms (14) are positioned at the other two opposite sides of the central part (11), and two ends of the second suspension arms (14) are respectively connected to the central part (11) and the edge part (12);

the first cantilever (13) comprises n layers of base materials, the second cantilever (14) comprises (n + m) layers of base materials, and m is more than or equal to 1.

2. The centromere of claim 1, characterized in that the first cantilever (13) comprises 3 layers of substrate and the second cantilever (14) comprises 4 layers of substrate.

3. The rdl according to claim 2, wherein the first suspension arm (13) comprises two first PI layers (131) and a first adhesive layer (132) between the two first PI layers (131), and the second suspension arm (14) comprises two second PI layers (141) and a second adhesive layer (142) and a copper foil layer (143) stacked between the two second PI layers (141).

4. The rdl according to claim 3, wherein the thickness of the first PI layer (131) and the first adhesive layer (132) is 12.5-50 microns, the thickness of the second PI layer (141) and the second adhesive layer (142) is 12.5-50 microns, and the thickness of the copper foil layer (143) is 12-18 microns.

5. The centring disk as claimed in claim 4, characterised in that the thickness of the first PI layer (131) is 25 microns, the thickness of the first adhesive layer (132) is 12.5 microns, the thickness of the second PI layer (141) is 25 microns, the thickness of the second adhesive layer (142) is 12.5 microns and the thickness of the copper foil layer (143) is 12 microns.

6. The centromere of claim 1, characterized in that the first cantilever (13) comprises 3 layers of substrate and the second cantilever (14) comprises 5 layers of substrate.

7. The centralizer according to claim 6, wherein the first cantilever (13) comprises two first PI layers (131) and a first adhesive layer (132) between the two first PI layers (131), the second cantilever (14) comprises three second PI layers (141) and two second adhesive layers (142), and one second adhesive layer (142) is between two adjacent second PI layers (141).

8. The stabilizer according to claim 1, wherein the thickness of the central portion (11) and the thickness of the edge portion (12) are each 25 to 200 μm.

9. The centring disk according to claim 1, characterised in that it is rectangular and the side length of the central part (11) connecting the first cantilever (13) is smaller than the side length of the central part connecting the second cantilever (14).

10. The centring disk according to any of claims 1 to 9, characterised in that the length of the first cantilever (13) is smaller than the length of the second cantilever (14).

11. A miniature sound generating apparatus, comprising: a diaphragm (101), a voice coil (102) and a spider as claimed in any one of claims 1 to 10;

the central part of the diaphragm (101) is fixed on the top surface of the central part (11);

the voice coil (102) comprises a main body and a lead (103) extending from the main body, and the main body is fixedly connected with the central part (11);

the number of the leads (103) is two, the leads (103) and the two first cantilevers (13) are in one-to-one correspondence, and the leads (103) are respectively fixed on the corresponding first cantilevers (13).

12. The miniature sound generating device according to claim 11, wherein one end of each of said leads (103) is connected to each side of said body, and an opening is formed between the other end of said lead (103) and said body, and one of said leads (103) and said body forms an opening in a direction opposite to the direction of the other of said leads (103) and said body.

13. The miniature sound generating apparatus of claim 11 or 12, wherein said miniature sound generating apparatus is a speaker, an earphone or a receiver.