CN212748049U - Analog monitor based on thermal imaging - Google Patents
Analog monitor based on thermal imaging Download PDFInfo
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- CN212748049U CN212748049U CN202021299373.0U CN202021299373U CN212748049U CN 212748049 U CN212748049 U CN 212748049U CN 202021299373 U CN202021299373 U CN 202021299373U CN 212748049 U CN212748049 U CN 212748049U
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- 238000001931 thermography Methods 0.000 title claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 33
- 238000004891 communication Methods 0.000 claims abstract description 25
- 238000012544 monitoring process Methods 0.000 claims abstract description 4
- 239000003990 capacitor Substances 0.000 claims description 25
- 239000013078 crystal Substances 0.000 claims description 20
- 238000004088 simulation Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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Abstract
The utility model relates to a thermal imaging technology field discloses a better and stronger thermal imaging simulation watch-dog of interference killing feature of stability based on, possesses: the infrared image sensor is configured at the front end of the monitor and used for acquiring an infrared image of a monitoring target area; the signal input end of the signal processing circuit is connected with the signal output end of the infrared image sensor and is used for receiving the infrared image and converting the infrared image into a digital signal; and the signal input end of the communication circuit is connected with the signal output end of the signal processing circuit, and the digital signal is input into the communication circuit in the form of an interrupt signal.
Description
Technical Field
The utility model relates to a thermal imaging technology field, more specifically say, relate to a based on thermal imaging simulation watch-dog.
Background
Thermal infrared imaging images an object by being sensitive to thermal infrared, and further reflects the temperature field of the surface of a monitored target. At present, when a monitor processes temperature transmission input by a thermal imaging sensor, temperature parameters displayed by a monitor terminal are not accurate enough due to instability and poor anti-interference capability of digital signals output by a signal processing circuit.
Therefore, how to improve the stability and the anti-interference capability of the digital signal becomes a technical problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, the digital signal's to the above-mentioned signal processing circuit output of prior art stability and interference killing feature are relatively poor, lead to the temperature parameter of watch-dog terminal demonstration accurate defect inadequately, provide a better and the stronger thermal imaging simulation watch-dog of the anti-jamming feature of stability based on.
The utility model provides a technical scheme that its technical problem adopted is: a thermal imaging-based analog monitor is constructed, comprising:
the infrared image sensor is configured at the front end of the monitor and used for acquiring an infrared image of a monitoring target area;
the signal input end of the signal processing circuit is connected with the signal output end of the infrared image sensor and is used for receiving the infrared image and converting the infrared image into a digital signal;
and the signal input end of the communication circuit is connected with the signal output end of the signal processing circuit, and the digital signal is input into the communication circuit in the form of an interrupt signal.
In some embodiments, the signal processing circuit comprises a signal processor, a signal input of the signal processor is connected with a signal output of the infrared image sensor,
the signal output end of the signal processor is coupled to the signal input end of the communication circuit.
In some embodiments, the signal processing circuit further comprises a first resistor, a first capacitor and a second resistor,
one end of the first resistor, one end of the first capacitor and one end of the second resistor are respectively connected with the signal output end of the infrared image sensor,
the other end of the first resistor is connected with the signal input end of the signal processor,
and the other ends of the first capacitor and the second resistor are connected with a common end of the infrared image sensor.
In some embodiments, the signal processing circuit further comprises a second capacitor, a third resistor and a fifth resistor connected in series,
one end of the second capacitor is connected with one output end of the signal processor, and one end of the fifth resistor is connected with the other output end of the signal processor.
In some embodiments, the communication circuit comprises an RF transceiver having a signal input connected to the signal output of the signal processor for receiving the digital signal and transmitting the digital signal to a terminal.
In some embodiments, the communication circuit further comprises a first crystal oscillator and a second crystal oscillator,
one end of the first crystal oscillator is connected with an external clock input end of the RF transceiver,
the other end of the first crystal oscillator is connected with the other external clock input end of the RF transceiver,
one end of the second crystal oscillator is connected with an analog end of the RF transceiver,
and the other end of the second crystal oscillator is connected with the other analog end of the RF transceiver.
Based on thermal imaging simulation watch-dog in, infrared image sensor is used for acquireing infrared image to carry out the preliminary treatment to this infrared image, in order to produce effective signal of telecommunication, then input signal processing circuit, through enlargiing and state control processing, and then export correct waveform signal (corresponding digital signal), transmit to the terminal through communication circuit, can solve the problem that leads to the temperature parameter inaccurate inadequately because of the digital signal unstability of signal processing circuit output and interference killing feature is relatively poor effectively.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
FIG. 1 is a circuit diagram of a portion of a thermal imaging analog monitor-based embodiment of the present invention;
fig. 2 is a partial communication circuit diagram of an embodiment of the present invention based on a thermal imaging analog monitor.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, in the first embodiment of the thermal imaging analog monitor of the present invention, the thermal imaging analog monitor includes an infrared image sensor RE, a signal processing circuit 100, and a communication circuit 200.
Specifically, the infrared image sensor RE is used for acquiring an infrared image of a target in a monitored area, and may be understood as follows: the body temperature emits infrared rays with the wavelength of about 10 mu m through heat, the infrared rays are concentrated on the infrared image sensor RE after being enhanced through the Fresnel filter, the infrared rays have strong thermal effect, the infrared image sensor RE converts the heat change into the electric quantity change, and the generated electric signals are processed and amplified through the signal processing circuit 100.
Specifically, the infrared image sensor RE is disposed at the front end of the monitor, and is configured to acquire an infrared image of the monitoring target area, pre-process the infrared image to generate a valid electrical signal, and then input the valid electrical signal to the signal processing circuit 100.
The signal processing circuit 100 is used for performing amplification and state control processing on an input analog signal (corresponding to an infrared image) to obtain a correct waveform signal (corresponding to a digital signal).
The signal input terminal of the signal processing circuit 100 is connected to the signal output terminal of the infrared image sensor RE, and is configured to receive the infrared image, amplify and perform state control processing on the infrared image to obtain a digital signal for transmission, and output the digital signal to the communication circuit 200.
The communication circuit 200 has functions of task scheduling, time management, primitive communication, and the like, and can transmit infrared image information to a terminal in a network (Zigbee protocol stack).
The signal input of the communication circuit 200 is connected to the signal output of the signal processing circuit 100, wherein the signal processing circuit 100 inputs a digital signal in the form of an interrupt signal into the communication circuit 200.
The form of the interrupt signal can be understood as: the output terminal of the signal processing circuit 100 outputs a high level for about 1s, and can be output only once for about 5 s.
By using the technical scheme, the signal processing circuit 100 is used for amplifying and controlling the state of the input infrared image, so that a correct waveform signal (corresponding to a digital signal) is output, and then the waveform signal is input into the communication circuit 200 in an interrupt signal mode, so that the problem of inaccurate temperature parameters caused by unstable digital signals output by the signal processing circuit and poor anti-interference capability can be effectively solved.
In some embodiments, a signal processor U101 may be provided in the signal processing circuit 100 in order to improve the stability of the infrared image. The signal processor U101 is a digital-analog hybrid integrated circuit including an operational amplifier, a voltage comparator, a state controller, a delay time timer, a lock-out time timer, and a reference voltage source.
An analog signal (corresponding to an infrared image) is input into a signal input end (corresponding to a pin 14) of the signal processor U101, amplified by a two-stage operational amplifier and then enters a voltage comparator, and a correct waveform signal is output under the control of a state controller and a time delay unit.
Specifically, a signal input terminal (corresponding to the 14-pin) of the signal processor U101 is connected to a signal output terminal (corresponding to the S-terminal) of the infrared image sensor RE, and a signal output terminal (corresponding to the V0 terminal) of the signal processor U101 is connected to a signal input terminal (corresponding to the 34-36-pins) of the communication circuit 200.
That is, the input infrared image is processed by the signal processor U101, converted into a digital signal, and then output to the communication circuit 200 in the form of an interrupt signal, thereby improving the stability and anti-interference of signal transmission.
In some embodiments, in order to improve the performance of the signal processing circuit 100, a first resistor R101, a first capacitor C101, and a second resistor R102 may be disposed in the signal processing circuit 100, wherein the resistances of the first resistor R101 and the second resistor R102 may be selected to be 10K Ω, and the capacitance of the first capacitor C101 may be selected to be 0.01 μ F.
The first capacitor C101 and the second resistor R102 are used to determine the signal delay time, which is about 1 s.
Specifically, the first capacitor C101 and the second resistor R102 are connected in parallel, and are used for eliminating interference so as to improve the accuracy of the input infrared image signal.
Furthermore, one end of the first resistor R101, one end of the first capacitor C101, and one end of the second resistor R102 are respectively connected to the signal output end (corresponding to 2 pins) of the infrared image sensor RE.
The other end of the first resistor R101 is connected to a signal input terminal (corresponding to 14 pins) of the signal processor U101, and the other ends of the first capacitor C101 and the second resistor R102 are connected to a common terminal (corresponding to 3 pins) of the infrared image sensor RE.
That is, the infrared image signal acquired by the infrared image sensor RE is input to the signal processor U101 through the first resistor R101 and the first capacitor C101 and the second resistor R102 connected in parallel, and is subjected to a two-stage amplification process by the signal processor U101 (internal integrated circuit), and a correct waveform signal is output under the control of the state controller and the time delay unit.
In some embodiments, the signal processing circuit 100 further includes a second capacitor C102, a third resistor R103, and a fifth resistor R105 connected in series, wherein the capacitance of the second capacitor C102 is 10 μ F, and the resistance of the third resistor R103 is 100K Ω.
The second capacitor C102 and the third resistor R103 are used to determine the signal lock-out time, which is about 5 s.
Specifically, one end of the second capacitor C102 is connected to one output end (corresponding to 16 pins) of the signal processor U101, and one end of the fifth resistor R105 is connected to the other output end (corresponding to 12 pins) of the signal processor U101.
In some embodiments, to improve the accuracy of signal transmission, an RF transceiver U201 may be provided in the communication circuit 200, which has extremely high receiving sensitivity and interference resistance.
Specifically, a signal input terminal (corresponding to pins 34-36) of the RF transceiver U201 is connected to a signal output terminal (corresponding to pin 2) of the signal processor U201, and is configured to receive a digital signal and transmit the digital signal to a terminal through radio frequency.
In some embodiments, the communication circuit 200 further includes a first crystal oscillator X201 and a second crystal oscillator X202 for providing stable pulse signals to meet the operation requirements of the RF transceiver U201.
Specifically, one end of the first crystal oscillator X201 is connected to one end of the eighth capacitor C208 and one external clock input end (corresponding to 23 pins) of the RF transceiver U201, and the other end of the first crystal oscillator X201 is connected to one end of the ninth capacitor C209 and the other external clock input end (corresponding to 22 pins) of the RF transceiver U201.
One end of the second oscillator X202 is connected to one end of the tenth capacitor C210 and one analog end (corresponding to 33 pins) of the RF transceiver U201, and the other end of the second oscillator X202 is connected to the other analog end (corresponding to 32 pins) of the RF transceiver U202 at one end of the eleventh capacitor C211.
Two crystal oscillators, namely 32MHz (corresponding to a first crystal oscillator X201) and 32.768kHz (corresponding to a second crystal oscillator X202), are adopted, wherein the second crystal oscillator X202 is mainly applied to a sleep timer and can be removed to reduce the cost if not needed in practical application; the RF end receives and transmits the antenna after being processed.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (6)
1. A thermal imaging-based analog monitor, comprising:
the infrared image sensor is configured at the front end of the monitor and used for acquiring an infrared image of a monitoring target area;
the signal input end of the signal processing circuit is connected with the signal output end of the infrared image sensor and is used for receiving the infrared image and converting the infrared image into a digital signal;
and the signal input end of the communication circuit is connected with the signal output end of the signal processing circuit, and the digital signal is input into the communication circuit in the form of an interrupt signal.
2. The thermal imaging based analog monitor of claim 1,
the signal processing circuit comprises a signal processor, the signal input end of the signal processor is connected with the signal output end of the infrared image sensor,
the signal output end of the signal processor is coupled to the signal input end of the communication circuit.
3. The thermal imaging based analog monitor of claim 2,
the signal processing circuit also comprises a first resistor, a first capacitor and a second resistor,
one end of the first resistor, one end of the first capacitor and one end of the second resistor are respectively connected with the signal output end of the infrared image sensor,
the other end of the first resistor is connected with the signal input end of the signal processor,
and the other ends of the first capacitor and the second resistor are connected with a common end of the infrared image sensor.
4. The thermal imaging based analog monitor of claim 3,
the signal processing circuit also comprises a second capacitor, a third resistor and a fifth resistor which are connected in series,
one end of the second capacitor is connected with one output end of the signal processor, and one end of the fifth resistor is connected with the other output end of the signal processor.
5. The thermal imaging based analog monitor of claim 2,
the communication circuit comprises an RF transceiver, wherein a signal input end of the RF transceiver is connected with a signal output end of the signal processor, and the RF transceiver is used for receiving the digital signal and transmitting the digital signal to a terminal.
6. The thermal imaging based analog monitor of claim 5,
the communication circuit further comprises a first crystal oscillator and a second crystal oscillator,
one end of the first crystal oscillator is connected with an external clock input end of the RF transceiver,
the other end of the first crystal oscillator is connected with the other external clock input end of the RF transceiver,
one end of the second crystal oscillator is connected with an analog end of the RF transceiver,
and the other end of the second crystal oscillator is connected with the other analog end of the RF transceiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021299373.0U CN212748049U (en) | 2020-07-06 | 2020-07-06 | Analog monitor based on thermal imaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021299373.0U CN212748049U (en) | 2020-07-06 | 2020-07-06 | Analog monitor based on thermal imaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212748049U true CN212748049U (en) | 2021-03-19 |
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| CN202021299373.0U Active CN212748049U (en) | 2020-07-06 | 2020-07-06 | Analog monitor based on thermal imaging |
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| CN (1) | CN212748049U (en) |
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2020
- 2020-07-06 CN CN202021299373.0U patent/CN212748049U/en active Active
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