CN212573387U - Gas cooling device - Google Patents

Abstract

The utility model discloses a gas cooling device, include: the cooling device comprises a shell, wherein an airflow channel is arranged in the shell, and a cooling medium inlet and a cooling medium outlet are arranged on the shell; the cooling pipeline is arranged in the airflow channel and is communicated with the cooling medium inlet and the cooling medium outlet, the cooling pipeline is used for circulating cooling medium, and the cooling medium can cool the airflow in the airflow channel; the cooling pipeline is bent in the cross section of the airflow channel to form a pipe network unit, the pipe network unit is a plurality of pipe network units, the pipe network units are arranged at intervals along the airflow direction of the airflow channel, and the projections of the adjacent pipe network units on the cross section of the airflow channel are not overlapped, so that the adjacent pipe network units are arranged in a staggered mode. The utility model provides a can promote the gas cooling device that radiating efficiency and volume are less.

Description

Gas cooling device

Technical Field

The utility model relates to a lithography machine technical field especially relates to a gas cooling device.

Background

A plurality of high-power heating elements exist in the photoetching machine, and heat generated by the heating elements is accumulated, so that the ambient temperature is continuously increased. Under some operating mode environment, it is inconvenient direct to heating element contact cooling, for guaranteeing that the component normally works, but usually adopt the mode of taking a breath to take away the heat in the environment that heating element is located, let ambient temperature control in heating element normal operating range.

For example, in the mercury lamp of the exposure system of the lithography machine, when the mercury lamp works, the ambient temperature of the mercury lamp chamber reaches over 100 ℃, and in order to keep the temperature of the lamp chamber constant, the environment is rapidly cooled by adopting an air exchange mode. Due to the fact that the temperature in the lamp chamber is too high, the average temperature in the exhaust pipeline is as high as 80 ℃ under the condition that other cooling measures are not taken. The exhaust pipe passes through the interior of the photoetching machine, and the temperature of airflow in the exhaust pipe is too high, so that the thermosensitive element in the photoetching machine is seriously damaged, and the stability and the reliability of the photoetching machine are adversely affected.

At present, a water cooling mode is adopted for heat dissipation of high-temperature airflow in an exhaust pipe, but in the current water cooling mode, a water channel is only arranged on a shell of the water cooling device, and the shell of the water cooling device is made into an inner-layer and outer-layer mode, namely the shell comprises an inner pipe and an outer layer coated outside the inner pipe, the inner pipe is used for flowing heat dissipation airflow, the outer layer is used for flowing cooling water, and the cooling water can dissipate the heat dissipation airflow. The cooling effect of the cooling mode is limited, and the water cooling device is large in size and limited in applicable environment.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a can promote the gas cooling device that radiating efficiency and volume are less.

To achieve the purpose, the utility model adopts the following technical proposal:

a gas cooling device, comprising:

the cooling device comprises a shell, a cooling medium inlet and a cooling medium outlet, wherein an airflow channel is arranged in the shell;

the cooling pipeline is arranged in the airflow channel and is communicated with the cooling medium inlet and the cooling medium outlet, the cooling pipeline is used for circulating a cooling medium, and the cooling medium can cool the airflow in the airflow channel; the cooling pipeline is in bending type becomes pipe network unit in airflow channel's the cross-section, the pipe network unit is a plurality of, a plurality of the pipe network unit is followed airflow channel's air current direction interval sets up, and is adjacent the pipe network unit is in projection on airflow channel's the cross-section does not overlap, so that it is adjacent the pipe network unit dislocation set.

Optionally, the total cross-sectional area of the gaps on each pipe network unit is greater than or equal to the heat dissipation approval cross-sectional area specified by the gas cooling device.

Optionally, the plurality of pipe network units are overlapped and can be fully distributed on the cross section of the airflow channel.

Optionally, the interval between the adjacent pipe network units is greater than or equal to 1 time of the size of the cooling pipeline in the airflow direction.

Optionally, the number of the cooling pipes is one, and the flow direction of the cooling medium in the cooling pipe is opposite to the airflow direction.

Optionally, the cooling medium inlet and the cooling medium outlet are arranged side by side.

Optionally, the pipe network unit is a rhombic net, and a plurality of rhombuses are formed in the pipe network unit.

Optionally, the pipeline of the pipe network unit is bent in an S shape.

Optionally, the pipe of the pipe network unit is bent in a shape of a circle.

Optionally, the inner wall of the casing and/or the cooling pipe is provided with a heat dissipation fin.

Optionally, two ends of the shell are provided with connecting holes, and the shell is connected with an external part through a screw; or

The two ends of the shell are provided with threads, and the shell is connected with an external part through the threads.

Optionally, the gas cooling device further includes:

and the wafer structure is arranged in the airflow channel and used for radiating and supporting the pipe network unit.

Optionally, a detector mounting interface is arranged on the housing, and the detector mounting interface is used for connecting a detector to detect the airflow parameters in the airflow channel.

The utility model discloses an useful part lies in: the cooling pipeline is bent in the cross section of the airflow channel to form a plurality of pipe network units, so that the contact area of the airflow and the cooling pipeline is greatly increased, the contact area of the airflow and a cooling medium is indirectly increased, and the cooling efficiency is improved; the space arrangement in the airflow channel can be fully utilized, so that the whole gas cooling device is small in size and high in applicability; the utility model discloses a gas cooling device can cool off the high temperature air current that reaches 90 ℃ in the photoetching machine to below 56 degrees, satisfies the demand that the complete machine pump drainage air current is less than 60 ℃, and the cooling effect is obvious.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of a gas cooling apparatus according to the present invention;

FIG. 2 is a schematic view of the gas cooling apparatus of FIG. 1 in connection with an exhaust duct and a hot environment in accordance with the present invention;

FIG. 3 is a schematic view of the gas cooling apparatus of FIG. 1 according to another aspect of the present invention;

FIG. 4 is a schematic cross-sectional view of the gas cooling apparatus of FIG. 1 according to the present invention;

FIG. 5 is a schematic structural diagram of an embodiment of a cooling duct according to the present invention;

fig. 6 is a schematic view of another perspective of the cooling duct of fig. 5 according to the present invention;

figure 7 is a schematic side view of the cooling duct of figure 5 in accordance with the present invention;

FIG. 8 is a schematic view of the cooling duct of FIG. 7 taken along section A-A in accordance with the present invention;

figure 9 is a schematic cross-sectional view of the cooling duct of figure 6 taken along plane E in accordance with the present invention;

fig. 10 is a schematic structural view of the cooling pipe of the present invention 7 taken along the F-F section;

FIG. 11 is a schematic view of another embodiment of the gas cooling apparatus of the present invention;

FIG. 12 is a schematic view of another embodiment of the cooling duct of the present invention;

figure 13 is a side view schematic of the cooling duct of figure 12 in accordance with the present invention;

FIG. 14 is a schematic view of the cooling duct of FIG. 13 taken along the line B-B in accordance with the present invention;

fig. 15 is an enlarged view of portion C of fig. 11 in accordance with the present invention;

FIG. 16 is a schematic view of a gas cooling apparatus according to another embodiment of the present invention;

fig. 17 is a schematic cross-sectional view of the gas cooling apparatus of fig. 16 according to the present invention;

figure 18 is a schematic cross-sectional view of the cooling duct of the gas cooling apparatus of figure 16 according to the present invention;

FIG. 19 is a schematic view of the assembly of cooling channels with wafer structures in the gas cooling apparatus of FIG. 16 according to the present invention;

fig. 20 is a schematic view showing the connection of the gas cooling apparatus shown in fig. 16 to an external member according to the present invention.

In the figure:

100. a gas cooling device;

10. a housing; 11. an air flow channel; 12. an airflow inlet; 13. an airflow outlet; 14. a cooling medium inlet; 15. a cooling medium outlet; 16. connecting holes; 17. a detector mounting interface;

20. a cooling duct; 21. a pipe network unit; 22. a wall-attached pipeline;

30. a heat dissipating fin;

40. a quick pipeline connector;

50. and (5) a wafer structure.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1, the present invention provides a gas cooling apparatus, wherein the gas cooling apparatus 100 is mainly used in a lithography machine, but can also be applied to other fields. As shown in FIG. 2, the gas cooling apparatus 100 may be used to connect a thermal environment in a lithography machine, which is the environment in which a heat generating component is located, such as a mercury lamp chamber, to an exhaust duct. As shown in fig. 2, the high-temperature airflow in the thermal environment passes through the gas cooling device 100 and then enters the exhaust duct, so that the temperature of the airflow in the exhaust duct is not too high, and when the airflow in the exhaust duct passes through the inside of the lithography machine, the thermal sensitive element in the lithography machine is not damaged, thereby improving the stability and reliability of the lithography machine.

Referring to fig. 1, 3 and 4, the gas cooling device 100 includes a housing 10 and a cooling duct 20 disposed in the housing 10. As shown in fig. 4, an airflow channel 11 is disposed in the housing 10, and the airflow channel 11 is used for allowing airflow to pass through, please refer to fig. 2 and 4, and the airflow in the thermal environment enters the exhaust duct through the airflow channel 11. As shown in fig. 3, it can be understood that the housing 10 is provided with an airflow inlet 12 and an airflow outlet 13.

Referring to fig. 1, 3 and 4, the cooling duct 20 is disposed in the airflow channel 11, the housing 10 is provided with a cooling medium inlet 14 and a cooling medium outlet 15, and the cooling medium inlet 14 and the cooling medium outlet 15 are communicated with the cooling duct 20, so that the cooling medium enters the cooling duct 20 from the outside of the housing 10 through the cooling medium inlet 14 and is discharged from the cooling medium outlet 15 to the outside of the housing 10. The cooling duct 20 is used for circulating a cooling medium, for example, water, the cooling medium can cool the airflow in the airflow channel 11, and when the airflow flows through the airflow channel 11, the cooling medium in the cooling duct 20 exchanges heat with the airflow through the cooling duct 20 in the airflow channel 11 to cool the airflow.

As shown in fig. 5 to 7, the cooling duct 20 is provided in a coiled manner, and the coiled shape follows the airflow path 11. The cooling duct 20 may be formed integrally with the housing 10 or may be a separate part. As shown in fig. 6 and 8, the cooling duct 20 is bent to form a pipe network unit 21 in the cross section of the airflow channel 11, and specifically, as shown in fig. 6, the cooling duct 20 includes an adherence duct 22 attached to the inner wall of the airflow channel 11 and a pipe network unit 21 bent in the cross section of the airflow channel 11. The pipe network unit 21 which is arranged in the cross section of the airflow channel 11 and is bent can increase the contact area between the airflow and the cooling pipeline 20, fully utilizes the space in the airflow channel 11 and improves the cooling effect. The cooling pipeline 20 can be a single pipeline, that is to say, the wall-attached pipeline 22 and the pipe network unit 21 are both formed by coiling a single cooling pipeline 20 and are connected in series to form a water channel, the general flow direction of the cooling water in the cooling pipeline 20 is opposite to the flow direction of the air flow, so that a unidirectional flow reverse cooling water channel is formed, the unidirectional flow reverse cooling water channel can accelerate the heat transfer and the heat exchange rate, and the heat exchange effect is improved.

Referring to fig. 6 and 9, the number of the pipe network units 21 is several, the several pipe network units 21 are arranged at intervals along the airflow direction a of the airflow channel 11, as shown in fig. 9, the interval between adjacent pipe network units 21 is L, and as shown in fig. 8, the projections of the adjacent pipe network units 21 on the cross section of the airflow channel 11 are not overlapped, that is, the adjacent pipe network units 21 are arranged in a staggered manner, so that the airflow can be in full contact with the pipe network units 21, and the cooling effect is improved. In addition, the space in the airflow channel 11 is fully utilized to arrange the pipe network unit 21, so that the volume of the gas cooling device 100 can be reduced, and on the premise of meeting the cooling requirement, the gas cooling device 100 can be smaller, so that the applicability of the gas cooling device 100 is higher.

The pipe network unit 21 may be bent into various shapes, for example, as shown in fig. 8, the pipe network unit 21 is bent into a diamond-shaped net. Since the pipe network unit 21 is formed by bending, the pipe network unit 21 has gaps, and the total cross-sectional area of the gaps in the pipe network unit 21 is greater than or equal to the heat dissipation approval cross-sectional area specified by the gas cooling device 100, that is, the total cross-sectional area of the gaps in the pipe network unit 21 cannot be less than the specified value with respect to the flow rate of the gas flow in the gas cooling device 100, or the flow rate of the gas flow cannot be reached.

In addition, all the pipe network units 21 can be fully distributed on the cross section of the airflow channel 11 after being overlapped, so that the contact area between the cooling pipeline 20 and the airflow can be increased as much as possible, and the cooling effect is improved. And because each pipe network unit 21 is provided with a gap and the adjacent pipe network units 21 are arranged at intervals, the flow of the air flow is not influenced at all.

In one embodiment, as shown in fig. 9, the distance L between adjacent pipe network units 21 is greater than or equal to 1 time the dimension H of the cooling duct 20 in the air flow direction a, so that the adjacent pipe network units 21 have a sufficient distance therebetween for the air flow to pass through.

As mentioned above, referring to fig. 8, the pipe network unit 21 can be bent into a diamond-shaped net, and a plurality of diamonds are formed in the pipe network unit 21, as shown in fig. 8, wherein the vertex angle b of each diamond is smaller than 90 °.

As shown in fig. 6, the cooling duct 20 is a flat duct, and the surface area of the cooling duct 20 can be increased as much as possible, and as shown in fig. 3, the cooling duct 20 can be integrally formed with the housing 10 by 3D printing. Fig. 10 is a schematic structural view of the cooling pipe of the present invention shown in fig. 7, taken along the section F-F, and as shown in fig. 10, the radius R of the fillet at the end of the cooling pipe 20 is less than 4 mm. The cooling duct 20 has a duct wall thickness of greater than 0.3mm, preferably 0.5-1.2 mm. As shown in fig. 1, the inner walls of the cooling medium inlet 14 and the cooling medium outlet 15 of the housing 10 may be threaded to be connected to an external pipe.

In one embodiment, in order to improve the heat dissipation effect, as shown in fig. 4, heat dissipation fins 30 may be further disposed on the inner wall of the housing 10 and/or the cooling pipe 20, and in fig. 4, the cooling pipe 20 is a flat pipe, and the heat dissipation fins 30 are disposed on the inner wall of the housing 10. As shown in fig. 4, the heat dissipating fins 30 include fins perpendicular to the inner wall of the casing 10 and fins inclined with respect to the inner wall of the casing 10, and the fins inclined with respect to the inner wall of the casing 10 form an angle of 45 ° with the inner wall of the casing 10. The number of the heat dissipation fins 30 is multiple, and the heat dissipation fins can be specifically arranged as required, and the gap between the adjacent heat dissipation fins 30 is larger than or equal to 2 times of the fin thickness, so that smooth circulation of air flow is ensured.

Referring to fig. 1, the cooling medium inlet 14 and the cooling medium outlet 15 are arranged side by side, and the cooling medium inlet 14 and the cooling medium outlet 15 are arranged at one position, which is advantageous for increasing the assembly rate, and the connection of the cooling medium inlet 14 and the cooling medium outlet 15 to the external pipe can be completed at one position, and if the cooling medium inlet 14 and the cooling medium outlet 15 are arranged at different positions, the assembly time is wasted.

Referring to fig. 2, the housing 10 is provided at both ends thereof with coupling holes 16, and the housing 10 is coupled to an external member (e.g., an exhaust passage) by screws. The gas cooling device 100 is connected to the external member by inserting a screw into the connecting hole 16 and locking the screw to the external member. Specifically, mounting flange faces are arranged at two ends of the shell 10, the connecting holes 16 are formed in the mounting flange faces, the mounting flange faces can be tightly attached to external parts, airtightness and assembly convenience are improved, adaptability of the gas cooling device 100 is improved, and the gas cooling device 100 can be conveniently matched with the external parts.

Referring to fig. 11 to 14, in one embodiment, the cooling pipe 20 is a circular pipe, and may be formed by a bending process or 3D printing. As shown in fig. 14, the pipe of the pipe network unit 21 is bent in an S-shape.

Fig. 15 is an enlarged view of a portion C in fig. 11 according to the present invention, and as shown in fig. 15, when the cooling pipe 20 is a circular pipe, the heat dissipation fins 30 may be welded to the cooling pipe 20, so as to improve the heat dissipation effect of the cooling pipe 20.

As shown in fig. 12, a quick pipe connector 40 is provided at an inlet and an outlet of the cooling pipe 20, the quick pipe connector 40 is welded to the cooling pipe 20, and the cooling pipe 20 is connected to an external pipe by the quick pipe connector 40.

Referring to fig. 16 to 19, in one embodiment, the housing 10 of the gas cooling device 100 is substantially cylindrical, specifically, a diamond column or a rectangular column. As shown in fig. 16, both ends of the housing 10 may be provided with screw threads so that the gas cooling device 100 is connected to an external part through the screw threads of both ends of the housing 10 (as shown in fig. 20).

As shown in fig. 18, in one embodiment, the pipes of the pipe network unit 21 may be bent in a zigzag shape.

Referring to fig. 17, the gas cooling device 100 further includes a wafer structure 50, the wafer structure 50 is a metal sheet with meshes, the wafer structure 50 is disposed in the airflow channel 11 of the housing 10 and used for dissipating heat and supporting the pipe network unit 21, a slot is disposed on the wafer structure 50, and the pipe network unit 21 can be clamped in the slot on the wafer structure 50, so that the wafer structure 50 supports the pipe network unit 21. Meanwhile, the chip structure 50 can also achieve auxiliary heat dissipation.

Referring to fig. 1, a detector mounting interface 17 is disposed on the housing 10, and the detector mounting interface 17 is used for connecting a detector to detect the airflow in the airflow channel 11 and monitor the temperature, pressure and speed of the airflow in real time.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (13)

1. A gas cooling device, comprising:

the cooling device comprises a shell (10), wherein an airflow channel (11) is arranged in the shell (10), and a cooling medium inlet (14) and a cooling medium outlet (15) are arranged on the shell (10);

the cooling pipeline (20) is arranged in the airflow channel (11) and is communicated with the cooling medium inlet (14) and the cooling medium outlet (15), the cooling pipeline (20) is used for circulating a cooling medium, and the cooling medium can cool the airflow in the airflow channel (11); cooling tube (20) are in bend formation pipe network unit (21) in airflow channel's (11) cross-section, pipe network unit (21) are a plurality of, a plurality of pipe network unit (21) are followed airflow channel's (11) air current direction interval sets up, and is adjacent pipe network unit (21) are in projection on airflow channel's (11) cross-section does not overlap, so that adjacent pipe network unit (21) dislocation set.

2. A gas cooling arrangement according to claim 1, characterised in that:

the total cross-sectional area of the gaps on each pipe network unit (21) is larger than or equal to the specified heat dissipation approved cross-sectional area of the gas cooling device.

3. A gas cooling arrangement according to claim 2, characterised in that:

the pipe network units (21) are overlapped and can be fully distributed on the cross section of the airflow channel (11).

4. A gas cooling arrangement according to claim 2, characterised in that:

the interval between the adjacent pipe network units (21) is larger than or equal to 1 time of the size of the cooling pipeline (20) along the airflow direction.

5. A gas cooling arrangement according to claim 1, characterised in that:

the cooling pipeline (20) is one, and the flow direction of the cooling medium in the cooling pipeline (20) is opposite to the air flow direction.

6. A gas cooling arrangement according to claim 1, characterised in that:

the cooling medium inlet (14) is arranged next to the cooling medium outlet (15).

7. A gas cooling arrangement according to claim 1, characterised in that:

the pipe network unit (21) is in a rhombic net shape, and a plurality of rhombuses are formed in the pipe network unit (21).

8. A gas cooling arrangement according to claim 1, characterised in that:

the pipeline of the pipe network unit (21) is bent in an S shape.

9. A gas cooling arrangement according to claim 1, characterised in that:

the pipeline of the pipe network unit (21) is bent in a shape of a Chinese character 'hui'.

10. A gas cooling arrangement according to claim 1, characterised in that:

and heat radiating fins (30) are arranged on the inner wall of the shell (10) and/or the cooling pipeline (20).

11. A gas cooling arrangement according to claim 1, characterised in that:

two ends of the shell (10) are provided with connecting holes (16), and the shell (10) is connected with an external part through screws; or

The two ends of the shell (10) are provided with threads, and the shell (10) is connected with an external part through the threads.

12. A gas cooling arrangement according to claim 1, characterised in that:

further comprising:

and the wafer structure (50) is arranged in the airflow channel (11) and used for dissipating heat and supporting the pipe network unit (21).

13. A gas cooling arrangement according to claim 1, characterised in that:

the shell (10) is provided with a detector mounting interface (17), and the detector mounting interface (17) is used for connecting a detector to detect the airflow parameters in the airflow channel (11).

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