CN212505115U - Fixing tool for electroplating semiconductor chip - Google Patents
Fixing tool for electroplating semiconductor chip Download PDFInfo
- Publication number
- CN212505115U CN212505115U CN202021083061.6U CN202021083061U CN212505115U CN 212505115 U CN212505115 U CN 212505115U CN 202021083061 U CN202021083061 U CN 202021083061U CN 212505115 U CN212505115 U CN 212505115U
- Authority
- CN
- China
- Prior art keywords
- fixing tool
- electroplating
- semiconductor chip
- threaded rod
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000009713 electroplating Methods 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 230000002146 bilateral effect Effects 0.000 claims 3
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a fixing tool for electroplating semiconductor chips, which comprises a supporting plate, wherein an opening is arranged in the supporting plate, two groups of clamping components are symmetrically arranged in the opening and comprise a first clamping plate, a second clamping plate and a threaded rod, a threaded hole is arranged between the supporting plate and the opening, the threaded rod is rotatably arranged in the threaded hole, four groups of supporting components are symmetrically arranged in the supporting plate, the supporting components comprise a fixed block, a fixed seat and a loop bar, the fixed block is symmetrically and fixedly arranged on two sides of the supporting plate, one side of the fixed block, which is far away from the supporting plate, is fixedly connected with the fixed seat through a second spring, and through the adjustable supporting components, the fixing tool can be suitable for electroplating baths with various sizes, improves the utilization rate of the electroplating plates, can fix the chips in a layering way through the clamping components, and in the, displacement can not occur, interference is avoided, and the electroplating effect of the chip is improved.
Description
Technical Field
The utility model relates to a chip electroplating technology field specifically is a fixed frock for semiconductor chip electroplates.
Background
Electroplating, which is a process of plating a thin layer of other metal or alloy on a surface of some metal using an electrolytic principle, is used in various fields including circuit formation of electronic components, printed circuit boards, semiconductor devices, and the like, in which an article to be plated is immersed in an electroplating solution, and desired metal ions are deposited on the surface of the article to be plated by applying a current while the article to be plated is made to serve as a cathode and a metal for electrodeposition is made to serve as an anode, thereby forming a plated film.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fixed frock for semiconductor chip is electroplated, through the supporting component that can adjust, can be applicable to the electroplating bath of various sizes, promoted the rate of utilization of electroplate, through the centre gripping subassembly, can carry out the layering to the chip and fix, in electroplating process, can not take place the displacement, cause the interference, improved the electroplating effect of chip.
In order to achieve the above object, the utility model provides a following technical scheme: a fixing tool for electroplating a semiconductor chip comprises a supporting plate, wherein an opening is formed in the supporting plate, two groups of clamping assemblies are symmetrically arranged on two sides in the opening and comprise a first clamping plate, a second clamping plate and a threaded rod, threaded holes are symmetrically formed in the supporting plate, the threaded rod is connected in the threaded hole in a threaded manner, one end of the threaded rod is rotatably connected with the first clamping plate, one side, away from the threaded rod, of the first clamping plate is fixedly connected with the second clamping plate through a first spring, four groups of supporting assemblies are symmetrically arranged on two sides of the supporting plate and comprise fixing blocks, fixing seats and sleeve rods, the fixing blocks are symmetrically and fixedly arranged on two sides of the supporting plate, one side, away from the supporting plate, of the fixing blocks is fixedly connected with the fixing seats through second springs, the sleeve rods are fixedly arranged on the upper surfaces, the top of the supporting rod is fixedly provided with a support.
Preferably, at least three groups of first grooves are formed in the opposite side of the second clamping plate.
Preferably, the threaded rod penetrates through and extends to one end of the outer portion of the supporting plate, and a handle is fixedly mounted at one end of the outer portion of the supporting plate.
Preferably, the joint of one end of the top of the loop bar and the supporting bar is in threaded connection with a locking nut.
Preferably, at least three groups of second grooves are formed in the bottom surface of the support.
Preferably, spring fixing plates are fixedly mounted at two ends of the first spring and the second spring.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the adjustable supporting component can be suitable for electroplating baths of various sizes, and the utilization rate of the electroplating plate is improved;
2. through the clamping assembly, the chip can be fixed in a layering mode, displacement cannot occur in the electroplating process, interference is caused, and the electroplating effect of the chip is improved.
Drawings
Fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is a schematic view of a partial structure of the present invention.
In the figure: 1. a support plate; 2. a port; 3. a clamping assembly; 301. a first splint; 302. a second splint; 303. a threaded rod; 304. a first spring; 4. a threaded hole; 5. a support assembly; 501. a fixed block; 502. a fixed seat; 503. a loop bar; 504. a second spring; 505. a strut; 506. a support; 6. a first groove; 7. a handle; 8. locking the nut; 9. a second groove; 10. and a spring fixing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a fixing tool for electroplating a semiconductor chip comprises a supporting plate 1, wherein a through hole 2 is formed in the supporting plate 1, two groups of clamping components 3 are symmetrically arranged on two sides in the through hole 2, the two groups of clamping components 3 comprise a first clamping plate 301, a second clamping plate 302 and a threaded rod 303, threaded holes 4 are symmetrically formed in the supporting plate 1, the threaded rod 303 is rotatably installed in the threaded holes 4, one end of the threaded rod 303 is rotatably connected with the first clamping plate 301, the distance between the two groups of opposite clamping plates can be adjusted conveniently according to the size of the chip to fix the chip, a handle 7 is fixedly installed at one end, penetrating through the threaded rod 303 and extending to the outer portion of the supporting plate 1, the threaded rod 303 can be adjusted conveniently by hand, one side, away from the threaded rod 303, of the first clamping plate 301 is fixedly connected with the second clamping plate 302 through a first spring 304, the first spring 304, at least three groups of first grooves 6 are formed in one side, opposite to the second clamping plate 302, of the second clamping plate, so that the chips can be conveniently fixed in a layered mode, and displacement and interference can not occur during electroplating, four groups of supporting assemblies 5 are symmetrically arranged on two sides of the supporting plate 1, each supporting assembly 5 comprises a fixing block 501, a fixing seat 502 and a sleeve rod 503, the fixing blocks 501 are symmetrically and fixedly arranged on two sides of the supporting plate 1, one side, far away from the supporting plate 1, of each fixing block 501 is fixedly connected with the fixing seat 502 through a second spring 504, the sleeve rods 503 are fixedly arranged on the upper surface of the fixing seats 502, supporting rods 505 are slidably arranged in the sleeve rods 503, so that the height of the telescopic device can be conveniently adjusted according to the depth of an electroplating pool, locking nuts 8 are in threaded connection with the joints of the supporting rods 505 at one ends of the tops of the sleeve rods 503 and the supporting rods 505, so that the, the device can be conveniently fixed in position according to the size of the electroplating pool when being suspended in the electroplating pool, and the spring fixing plates 10 are fixedly arranged at the two ends of the first spring 304 and the second spring 504.
The working principle is as follows: during operation, be fixed in the opening 2 of seting up in the layer board 1 through centre gripping subassembly 3 with the chip, first recess 6 through the relative one side setting of second splint 302 is fixed with the chip layering, in electroplating process, can not take place the displacement, cause the interference, the electroplating effect of chip has been improved, first spring 304 plays elastic buffer's effect to the chip, the protection chip is not damaged, adjusting threaded rod 303 is according to the further clamp of chip size fixedly, the second spring 504 that sets up is according to the size of a dimension of electroplating bath tensile or withdrawal and support 506 cooperation, with the device is fixed in the electroplating bath, the rate of utilization of electroplating plate has been promoted, the second recess 9 of the fixed setting in support 506 bottom surface fixes the device in most suitable position, the supporting component 5 of setting, the height of adjustable branch 505, lock nut 8 is further fixed the device height.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a fixed frock for semiconductor chip electroplates, includes layer board (1), its characterized in that: opening (2) has been seted up in layer board (1), bilateral symmetry is provided with two sets of centre gripping subassembly (3) in opening (2), and two sets of centre gripping subassembly (3) include first splint (301), second splint (302) and threaded rod (303), threaded hole (4) have been seted up to layer board (1) bilateral symmetry, threaded rod (303) threaded connection is in threaded hole (4), threaded rod (303) one end is rotated with first splint (301) and is connected, threaded rod (303) one side is kept away from to first splint (301) is through first spring (304) and second splint (302) fixed connection, four sets of supporting component (5) are installed to layer board (1) bilateral symmetry, supporting component (5) include fixed block (501), fixing base (502) and loop bar (503), fixed block (501) symmetry fixed mounting is in layer board (1) both sides, fixed block (501) are kept away from layer board (1) one side and are passed through second spring (504) and fixing base (502) fixed connection, loop bar (503) fixed mounting is in fixing base (502) upper surface, slidable mounting has branch (505) in loop bar (503), branch (505) top fixed mounting has support (506).
2. The fixing tool for electroplating the semiconductor chip according to claim 1, wherein the fixing tool comprises: at least three groups of first grooves (6) are formed in the opposite side of the second clamping plate (302).
3. The fixing tool for electroplating the semiconductor chip according to claim 1, wherein the fixing tool comprises: the threaded rod (303) penetrates through and extends to one end of the outer portion of the supporting plate (1) and is fixedly provided with a handle (7).
4. The fixing tool for electroplating the semiconductor chip according to claim 1, wherein the fixing tool comprises: and a locking nut (8) is in threaded connection with the joint of one end of the top of the loop bar (503) and the support bar (505).
5. The fixing tool for electroplating the semiconductor chip according to claim 1, wherein the fixing tool comprises: at least three groups of second grooves (9) are formed in the bottom surface of the support (506).
6. The fixing tool for electroplating the semiconductor chip according to claim 1, wherein the fixing tool comprises: and spring fixing plates (10) are fixedly arranged at two ends of the first spring (304) and the second spring (504).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021083061.6U CN212505115U (en) | 2020-06-12 | 2020-06-12 | Fixing tool for electroplating semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021083061.6U CN212505115U (en) | 2020-06-12 | 2020-06-12 | Fixing tool for electroplating semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212505115U true CN212505115U (en) | 2021-02-09 |
Family
ID=74396115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021083061.6U Expired - Fee Related CN212505115U (en) | 2020-06-12 | 2020-06-12 | Fixing tool for electroplating semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212505115U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061965A (en) * | 2021-02-23 | 2021-07-02 | 安徽绿能技术研究院有限公司 | Electroplating equipment and electroplating method for solar cell piece solder strip |
| CN113512752A (en) * | 2021-05-08 | 2021-10-19 | 河北博威集成电路有限公司 | An electroplating fixture for compound semiconductor microwave chips |
| CN113891623A (en) * | 2021-09-30 | 2022-01-04 | 广州市力驰微电子科技有限公司 | Switching power supply control chip and system with protection function |
| CN114505796A (en) * | 2022-02-18 | 2022-05-17 | 桂林芯隆科技有限公司 | Clamping fixture for end face coating of semiconductor laser chip |
| CN115386942A (en) * | 2022-09-23 | 2022-11-25 | 湖南艾尔时钟表有限公司 | Efficient electroplating equipment and electroplating method for watch movement |
| CN117589674A (en) * | 2023-11-23 | 2024-02-23 | 重庆赛宝工业技术研究院有限公司 | A kind of fixture for chip testing |
-
2020
- 2020-06-12 CN CN202021083061.6U patent/CN212505115U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061965A (en) * | 2021-02-23 | 2021-07-02 | 安徽绿能技术研究院有限公司 | Electroplating equipment and electroplating method for solar cell piece solder strip |
| CN113512752A (en) * | 2021-05-08 | 2021-10-19 | 河北博威集成电路有限公司 | An electroplating fixture for compound semiconductor microwave chips |
| CN113891623A (en) * | 2021-09-30 | 2022-01-04 | 广州市力驰微电子科技有限公司 | Switching power supply control chip and system with protection function |
| CN114505796A (en) * | 2022-02-18 | 2022-05-17 | 桂林芯隆科技有限公司 | Clamping fixture for end face coating of semiconductor laser chip |
| CN115386942A (en) * | 2022-09-23 | 2022-11-25 | 湖南艾尔时钟表有限公司 | Efficient electroplating equipment and electroplating method for watch movement |
| CN117589674A (en) * | 2023-11-23 | 2024-02-23 | 重庆赛宝工业技术研究院有限公司 | A kind of fixture for chip testing |
| CN117589674B (en) * | 2023-11-23 | 2024-09-17 | 重庆赛宝工业技术研究院有限公司 | Clamp for chip test |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210209 |
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| CF01 | Termination of patent right due to non-payment of annual fee |