CN212278660U - Radiating assembly and remote controller - Google Patents

Abstract

The utility model provides a heat radiation component and a remote controller, wherein the heat radiation component comprises a mainboard, a heat conduction piece and a heat radiation piece; the main board is provided with a first surface and a second surface opposite to the first surface; the heat conducting piece is arranged on one side of the first surface of the main board; the heat dissipation piece is arranged on one side of the second surface of the main board; wherein, at least part of the heat conduction piece and at least part of the heat dissipation piece are respectively attached to different areas of the mainboard, so that the heat of the mainboard can be conducted to the heat conduction piece and the heat dissipation piece for heat dissipation. When dispelling the heat to the mainboard, produced vibration or noise when this radiator unit can avoid or optimize dispelling the heat to the remote controller.

Description

Radiating assembly and remote controller

Technical Field

The utility model relates to a heat abstractor technical field especially relates to a radiator unit and remote controller.

Background

Products such as unmanned aerial vehicles and unmanned vehicles need to be matched with a remote controller for remote background control. The radio frequency, image transmission and other functional systems on the remote controller can generate heat in the working process, and if the heat cannot be dissipated in time, internal devices on the remote controller can not work normally due to overhigh temperature. In order to dissipate heat generated by the remote controller in time, a heat dissipation fan is usually disposed in the remote controller, and the air flow formed by the heat dissipation fan is used to dissipate heat of internal devices of the remote controller. However, in this heat dissipation method, the heat dissipation fan generates vibration or noise during operation, which is relatively noisy.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model provides a radiator unit and remote controller aims at avoiding or optimizing produced vibration or noise when radiator unit dispels the heat to the remote controller.

According to the utility model discloses an in the first aspect, the utility model provides a radiator unit for the electron device heat dissipation in the remote controller, this radiator unit includes:

a main board having a first surface and a second surface opposite to the first surface;

the heat conducting piece is arranged on one side of the first surface of the main board;

the heat dissipation piece is arranged on one side of the second surface of the main board;

at least part of the heat conduction piece and at least part of the heat dissipation piece are respectively attached to different areas of the mainboard, so that the heat of the mainboard can be conducted to the heat conduction piece and the heat dissipation piece to dissipate the heat.

The heat dissipation assembly of the present invention is characterized in that the heat generated by the motherboard is conducted to the heat conducting member and the heat dissipating member, so that the heat conducting member and the heat dissipating member radiate the heat transferred from the motherboard to the air to dissipate the heat.

The utility model discloses an among the heat dissipation assembly, heat-conducting member includes following at least one: the heat-conducting adhesive layer, the heat-conducting metal piece, the metal radiator and the heat-radiating fins; and/or, the heat sink comprises at least one of: the heat-conducting adhesive layer, the heat-conducting metal piece, the metal radiator and the heat-radiating fins.

The utility model discloses an among the radiator unit, the heat-conducting piece the mainboard with the range upon range of setting of heat dissipation piece.

The utility model discloses an among the heat dissipation assembly, heat-conducting member includes: a heat conductive contact portion in contact with a first surface of the main board; an extension portion extending outward from an outer edge of the thermally conductive contact portion.

In the heat dissipating module of the present invention, the heat dissipating member includes: the heat dissipation substrate is at least partially contacted with the mainboard; the heat dissipation structure is arranged on the heat dissipation base body; the heat of the mainboard can be conducted to the heat dissipation base body and/or the heat dissipation structure to dissipate the heat.

The utility model discloses an among the radiator unit, the heat dissipation base member forms the accepting groove, the accepting groove is used for acceping at least one components and parts on the mainboard.

The utility model discloses an among the radiator unit, the diapire of accepting groove contact in at least one components and parts on the mainboard.

The utility model discloses an among the radiator unit, the heat dissipation structure includes: the first radiating fins are arranged on the surface of the radiating base body deviating from the main board.

The utility model discloses an among the radiator unit, the heat dissipation structure still includes: and the second radiating fins are arranged on the side part of the radiating base body.

According to the utility model discloses a second aspect, the utility model provides a remote controller, include: a housing; and the heat dissipation assembly of any one of the above embodiments is arranged on the housing.

The embodiment of the utility model provides a radiator unit and remote controller avoids or has optimized radiator fan and produces vibration or noise when dispelling the heat to the mainboard, has improved user's use and has experienced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of a remote controller according to an embodiment of the present invention, wherein the remote controller is in a retracted state;

fig. 2 is a schematic structural diagram of a remote controller according to an embodiment of the present invention, wherein the remote controller is in an extended state;

fig. 3 is a cross-sectional view of a remote controller according to an embodiment of the present invention;

fig. 4 is an exploded view of a remote controller according to an embodiment of the present invention;

fig. 5 is an exploded view of the remote controller according to another embodiment of the present invention;

fig. 6 is a schematic partial structural view of a remote controller according to an embodiment of the present invention, in which a lower case and a heat sink assembly are shown;

fig. 7 is a schematic structural view of a heat dissipation assembly according to an embodiment of the present invention at an angle;

fig. 8 is a schematic structural view of a heat dissipation assembly at another angle according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of a motherboard according to an embodiment of the present invention;

fig. 10 is an angular schematic view of a heat-conducting member according to an embodiment of the present invention;

fig. 11 is a schematic structural view of a heat-conducting member at another angle according to an embodiment of the present invention;

fig. 12 is a schematic view of a heat sink according to an embodiment of the present invention at an angle;

fig. 13 is a schematic structural view of a heat sink provided in an embodiment of the present invention at another angle;

fig. 14 is an enlarged partial schematic view of the heat sink of fig. 13 at a.

Description of reference numerals:

1000. a remote controller;

10. a heat dissipating component;

100. a main board; 110. a first surface; 120. a second surface;

200. a heat conductive member; 210. a thermally conductive contact; 220. an extension portion;

300. a heat sink; 310. a heat-dissipating substrate; 311. a first side; 312. a second face; 313. a first side portion; 314. a second side portion; 315. an accommodating groove; 316. a movable channel; 320. a heat dissipation structure; 321. a first heat radiation fin; 3211. a spacer section; 322. a second heat radiation fin; 323. a third heat radiation fin;

20. a housing; 201. an upper shell; 202. a lower case;

30. a holding mechanism.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

The utility model discloses an inventor has improved radiator unit and remote controller to avoid or optimize produced vibration or noise when radiator unit dispels the heat to the remote controller. Specifically, the utility model provides a heat radiation component, include: a main board having a first surface and a second surface opposite to the first surface; the heat conducting piece is arranged on one side of the first surface of the main board; the heat dissipation piece is arranged on one side of the second surface of the main board; at least part of the heat conduction piece and at least part of the heat dissipation piece are respectively attached to different areas of the mainboard, so that the heat of the mainboard can be conducted to the heat conduction piece and the heat dissipation piece to dissipate the heat.

The utility model also provides a remote controller, include: a housing; and the heat dissipation assembly of any one of the above embodiments is arranged on the housing.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

An embodiment of the utility model provides a controlling means, this controlling means can with electronic equipment between carry out radio communication, or communicate through the electric connecting wire. The control device may be a remote controller or a game pad, and the electronic device may be an aircraft, a movable vehicle, a movable ship, a game console, and the like. The control device communicates with the electronic device to control operation of the electronic device.

The following explains the control device as a remote controller.

Referring to fig. 1 to 5, in some embodiments, the remote controller 1000 includes a heat dissipation assembly 10 and a housing 20, and the heat dissipation assembly 10 is disposed on the housing 20. The heat sink assembly 10 is used to dissipate heat from the electronics within the remote control 1000. Specifically, the housing 20 includes an upper case 201 and a lower case 202, and the upper case 201 and the lower case 202 cooperate to form an accommodating space in which the heat dissipation assembly 10 is disposed.

Referring to fig. 1 to 5, in some embodiments, the remote controller 1000 further includes a holding mechanism 30. The holding mechanism 30 is capable of moving relative to the housing 20 to provide the remote controller 1000 with an extended state for holding the mobile terminal and a retracted state for carrying the remote controller 1000. The mobile terminal may be a mobile phone, a tablet computer or other devices capable of pre-installing or installing the control program by the user. In some embodiments, retaining mechanism 30 is slidably connected with heat sink 300.

Referring to fig. 6 to 8 in combination with fig. 3 to 5, the heat dissipation assembly 10 includes a main board 100, a heat conduction member 200, and a heat dissipation member 300. The electronic components in the remote controller 1000 are provided on the main board 100. It is understood that other electronic components can be disposed in the remote controller 1000, which is not limited herein.

Referring to fig. 9, in conjunction with fig. 3 and 7, the main board 100 has a first surface 110 and a second surface 120 opposite to the first surface 110. The heat conductive member 200 is disposed on one side of the first surface 110 of the main board 100. The heat sink 300 is provided at one side of the second surface 120 of the main board 100.

At least a portion of the heat conducting member 200 and at least a portion of the heat dissipating member 300 are respectively attached to different regions of the motherboard 100, for example, the heat conducting member 200 is attached to at least a portion of the first surface 110, and the heat dissipating member 300 is attached to at least a portion of the second surface 120, so that heat of the motherboard 100 can be conducted to the heat conducting member 200 and the heat dissipating member 300 to dissipate the heat.

The heat dissipation assembly 10 of the above embodiment is attached to different areas of the motherboard 100 through the heat conducting member 200 and the heat dissipation member 300, and radiates heat generated by the motherboard 100 outwards by means of the heat conducting member 200 and the heat dissipation member 300, and the heat generated by the motherboard 100 can be dissipated without using a heat dissipation fan, so that vibration or noise generated when the heat dissipation fan dissipates heat to the motherboard 100 is avoided or optimized, and the cost of the product can be reduced.

It is understood that the main board 100 includes a circuit board and a processing unit disposed on the circuit board. The circuit board is a printed circuit board, and the processing unit comprises a chip for completing signal processing and electronic components of related circuits. Of course, the main board 100 may further include other circuit units, such as an image processing unit for image processing.

Illustratively, the motherboard 100 includes a Software Def i new Rad i o (SDR) or Wi re l ess F i de l ity (Wi Fi) graphics unit.

For example, the components such as the processor chip or the processing chip disposed on the circuit board are usually located on the heating element on the motherboard 100, and the heating element on the circuit board can be dissipated by the heat conduction member 200 and the heat dissipation member 300. The heat conducting member 200 can be attached to one or more heating elements to conduct heat from the heating elements to the heat conducting member 200 for heat dissipation.

In some embodiments, heat generated from the motherboard 100 is conducted to the heat conduction member 200 and the heat dissipation member 300, so that the heat conduction member 200 and the heat dissipation member 300 radiate the heat transferred from the motherboard 100 to the air. Specifically, at least a portion of the heat conduction member 200 and at least a portion of the heat dissipation member 300 are attached to different regions of the motherboard 100, respectively, heat generated by the motherboard 100 can be conducted to the heat conduction member 200 and the heat dissipation member 300, and the heat conduction member 200 and the heat dissipation member 300 radiate the heat to the surrounding air. The heat conducting element 200 and the heat dissipating member 300 have a large enough surface area contacting with air, so that the heat dissipating effect of heat radiation is ensured, the heat generated by the main board 100 is effectively dissipated in time, the normal operation of the main board 100 is ensured, and meanwhile, the excessive heat is prevented from being transmitted to the housing 20, so that a user does not feel too high temperature and influence the use experience when using the remote controller 1000.

In some embodiments, the thermal conductive member 200 includes at least one of a thermal adhesive layer, a thermal conductive metal member, a metal heat sink, a heat sink, and the like. The heat sink 300 includes at least one of a heat conductive adhesive layer, a heat conductive metal member, a metal heat sink, heat dissipation fins, and the like. The heat conductive member 200 and the heat sink 300 may be made of a metal material or a non-metal material having a good heat conductive property, for example, one or more materials of aluminum, aluminum oxide, silicon nitride, graphene, and the like, and are not particularly limited. Illustratively, the heat conductive member 200 is a heat conductive metal member. The heat sink 300 is a heat sink having heat dissipation fins.

In some embodiments, a heat conductive adhesive layer, such as a heat conductive silicone, may be disposed between the heat conductive member 200 and the main board 100 to improve the heat conductive effect and efficiently conduct the heat generated by the main board 100 to the heat conductive member 200. In some embodiments, a heat conductive adhesive layer, such as a heat conductive silicone, may be disposed between the heat sink 300 and the motherboard 100 to improve the heat conductive effect and efficiently conduct the heat generated by the motherboard 100 to the heat sink 300.

Referring to fig. 3 and 7, in some embodiments, the heat-conducting member 200, the main board 100, and the heat sink 300 are stacked. Specifically, the first surface 110 of the main board 100 is parallel to a plane formed by the length direction and the width direction of the main board 100, so that the area of the main board 100 that can contact with the heat conduction member 200 or the heat dissipation member 300 can be larger, and the heat dissipation effect can be improved.

The heat-conducting member 200, the main board 100, and the heat sink 300 may be connected by any suitable connection means. For example, the heat conduction member 200 is fastened to the motherboard 100 by a fastener such as a screw, and the heat dissipation member 300 is fastened to the motherboard 100 by a fastener such as a screw. After the heat conduction member 200, the main board 100, and the heat sink 300 are assembled, the assembly is locked to the lower case 202.

Referring to fig. 10 and 11 in conjunction with fig. 3 to 5 and 7, in some embodiments, the heat-conducting member 200 includes a heat-conducting contact portion 210 and an extension portion 220. The thermal contact portion 210 is in contact with the first surface 110 of the main board 100. The extension portion 220 extends outward from the outer edge of the thermal contact portion 210. Thus, the area of the heat conducting piece 200 contacting with air is larger, the heat radiation area is increased, and the heat radiation effect is ensured.

In some embodiments, the thermally conductive contacts 210 can be in contact with one or more heat generating elements on the motherboard 100. After the heat on the motherboard 100 is conducted to the thermal contact portion 210, the heat can be radiated to the air through the thermal contact portion 210 on one hand, and can be conducted to the extension portion 220 through the thermal contact portion 210 on the other hand, and then the heat is radiated to the air through the extension portion 220, thereby improving the heat dissipation efficiency.

The shapes of the thermal contact 210 and the extension 220 may be designed according to actual requirements. Illustratively, the thermal contact portion 210 and the extension portion 220 are both plate-shaped so as to be attached to the main board 100, and increase a contact area with air, ensuring a heat radiation effect. Illustratively, the heat generating elements of the motherboard 100 are disposed between the circuit board of the motherboard 100 and the thermal contact portion 210. The distance between the first surface 110 of the motherboard 100 and the thermal contact portion 210 is less than or equal to the distance between the first surface 110 of the motherboard 100 and the extension portion 220. Therefore, on one hand, electronic components on the main board 100 can be avoided, and on the other hand, enough assembly space can be conveniently reserved for the main board 100 and the heat dissipation member 300.

Referring to fig. 12-14 in conjunction with fig. 3 and 7, in some embodiments, a heat spreader 300 includes a heat spreader base 310 and a heat spreader structure 320. At least a portion of the heat-dissipating substrate 310 is in contact with the motherboard 100. The heat dissipation structure 320 is disposed on the heat dissipation substrate 310. The heat of the motherboard 100 can be conducted to the heat dissipation substrate 310 and/or the heat dissipation structure 320 to dissipate the heat. The heat dissipation structure 320 can increase the contact area of the heat dissipation member 300 with air, ensuring the heat radiation effect.

In some embodiments, the motherboard 100 may only contact the heat dissipation substrate 310, and at least a portion of the heat generated by the motherboard 100 is conducted to the heat dissipation member 300 and then radiated to the air through the heat dissipation substrate 310 and the heat dissipation structure 320, so as to dissipate the heat on the motherboard 100. In some embodiments, the motherboard 100 may also be simultaneously contacted with the heat dissipation structure 320, that is, both the heat dissipation base 310 and the heat dissipation structure 320 are contacted with the motherboard 100, at least a portion of heat generated by the motherboard 100 may be contacted and conducted to the heat dissipation base 310 and the heat dissipation structure 320, and then radiated to the air through the heat dissipation base 310 and the heat dissipation structure 320, so as to dissipate the heat on the motherboard 100.

Referring to fig. 12 to 14, specifically, the heat dissipation substrate 310 has a first surface 311 and a second surface 312 opposite to the first surface 311. The first surface 311 of the heat-dissipating substrate 310 is in contact with the second surface 120 of the motherboard 100. The second side 312 of the heat-dissipating substrate 310 is disposed away from the motherboard 100.

Referring to fig. 12 to 14, in some embodiments, the heat dissipation structure 320 includes first heat dissipation fins 321. The first heat dissipation fins 321 are disposed on a surface of the heat dissipation base 310 away from the motherboard 100. Specifically, the first heat sink fins 321 are disposed on the second surface 312 of the heat sink base 310.

The number of the first heat dissipation fins 321 may be set according to actual requirements, for example, one, two, three or more. Referring to fig. 12 to 14, when the number of the first heat dissipation fins 321 is multiple, the multiple first heat dissipation fins 321 are disposed on the second surface 312 of the heat dissipation base 310 at intervals. The adjacent first heat dissipation fins 321 form the spacer 3211, and the surfaces of the heat dissipation fins 321 and the spacer 3211 can contact with air, so that the contact area between the heat dissipation member 300 and the air is increased, and the heat dissipation effect is ensured. Generally, the larger the number of the first heat dissipation fins 321, the larger the contact area with the air, which is more advantageous for heat dissipation.

In some embodiments, the plurality of first heat dissipation fins 321 are disposed on the second surface 312 of the heat dissipation base 310 at intervals in parallel. The heat sink 300 may be made of an aluminum material and manufactured through an aluminum drawing process or an aluminum extrusion process, thereby forming a plurality of first heat dissipation fins 321 arranged in parallel at intervals. The selection of the material and the process is beneficial to ensuring that the heat dissipation member 300 has good heat conduction and heat dissipation effects, and simultaneously, the processing cost of the product is reduced.

Referring to fig. 12 to 14, in some embodiments, the heat dissipation structure 320 further includes second heat dissipation fins 322. The second heat sink fins 322 are disposed on the side of the heat sink base 310. The first heat dissipation fins 321 and the second heat dissipation fins 322 are disposed on different sides of the heat dissipation base 310, so that the heat dissipation structure 320 can contact air at different positions, and heat generated by the motherboard 100 can be effectively dissipated sufficiently, thereby improving heat dissipation efficiency.

Referring to fig. 12 to 14, specifically, the heat dissipation base 310 further has a first side portion 313 and a second side portion 314 opposite to the first side portion 313. The first side 313 and the second side 314 connect the first face 311 and the second face 312 of the heat-dissipating substrate 310. The second heat dissipation fins 322 are disposed on the first side portion 313 and/or the second side portion 314. The second heat dissipation fins 322 may be provided only on the first side portion 313, the second heat dissipation fins 322 may be provided only on the second side portion 314, and the second heat dissipation fins 322 may be provided on both the first side portion 313 and the second side portion 314.

The number of the second heat dissipation fins 322 can be set according to actual requirements, such as one, two, three or more. Illustratively, the first side portion 313 and the second side portion 314 of the heat-dissipating base 310 are each provided with one second heat-dissipating fin 322.

The relative positions of the second heat dissipation fins 322 and the heat dissipation base 310 can be designed according to actual requirements. For example, the second heat sink fins 322 may extend outwardly from the first side 313 of the heat sink base 310. The second heat dissipation fins 322 are substantially perpendicular to the first side portion 313.

In some embodiments, the first heat dissipation fins 321 and the second heat dissipation fins 322 are both square sheets, which can effectively increase the contact area between the heat dissipation member 300 and the air, thereby improving the heat dissipation efficiency. In other embodiments, the first heat dissipation fins 321 and the second heat dissipation fins 322 may be designed into any other suitable shape according to actual requirements, such as a cone shape.

Referring to fig. 12 to 14, in some embodiments, the heat dissipation substrate 310 forms a receiving groove 315, and the receiving groove 315 is used for receiving at least one component on the motherboard 100. Specifically, the heat generating element of the motherboard 100 is disposed in the receiving slot 315, and the heat generated by the heat generating element can be dissipated by conducting to the heat dissipating substrate 310.

Referring to fig. 3 and 7, in some embodiments, the bottom wall of the receiving cavity 315 contacts at least one component on the motherboard 100. Specifically, one or more heating elements on the motherboard 100 contact the bottom wall of the receiving cavity 315, so that heat generated by the heating elements on the motherboard 100 can be conducted to the heat dissipation substrate 310 and then radiated to the air through the heat dissipation substrate 310, and/or conducted to the heat dissipation structure 320 through the heat dissipation substrate 310 and then radiated to the air through the heat dissipation structure 320, thereby achieving heat dissipation.

Referring to fig. 12 to 14, in some embodiments, third heat dissipation fins 323 extend outward from two opposite sides of the opening of the receiving slot 315, and the third heat dissipation fins 323 can increase a contact area between the heat dissipation member 300 and air, so as to improve a heat dissipation effect.

Referring to fig. 3 and 7, in some embodiments, the third heat dissipation fins 323 are in contact with the second surface 120 of the motherboard 100, so that heat on the motherboard 100 can be conducted to the third heat dissipation fins 323 to dissipate heat, thereby further improving the heat dissipation effect.

Referring to fig. 12-14, in some embodiments, the heat dissipating substrate 310 has a movable channel 316, and the holding mechanism 30 can slide in the movable channel 316 to switch the remote control 1000 between the extended state and the retracted state.

The embodiment of the utility model provides a radiator unit 10 and remote controller 1000, laminate in mainboard 100's different regions respectively through at least partial heat-conducting piece 200 and at least partial heat dissipation piece 300, with the help of the produced heat external radiation of mainboard 100 of heat-conducting piece 200 and heat dissipation piece 300, need not to use radiator fan to spill out the produced heat of mainboard 100, and then avoided or optimized radiator fan and produced vibration or noise when dispelling the heat to mainboard 100, user's use experience has been improved.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (11)

1. A heat sink assembly for dissipating heat from an electronic device in a remote control, the heat sink assembly comprising:

a main board having a first surface and a second surface opposite to the first surface;

the heat conducting piece is arranged on one side of the first surface of the main board;

the heat dissipation piece is arranged on one side of the second surface of the main board;

at least part of the heat conduction piece and at least part of the heat dissipation piece are respectively attached to different areas of the mainboard, so that the heat of the mainboard can be conducted to the heat conduction piece and the heat dissipation piece to dissipate the heat.

2. The heat dissipating assembly of claim 1, wherein heat generated by the motherboard is conducted to the heat conducting member and the heat dissipating member, so that the heat conducting member and the heat dissipating member radiate the heat transferred from the motherboard to the air to dissipate the heat.

3. The heat dissipation assembly of claim 1, wherein the thermally conductive member comprises at least one of: the heat-conducting adhesive layer, the heat-conducting metal piece, the metal radiator and the heat-radiating fins; and/or the presence of a gas in the gas,

the heat sink includes at least one of: the heat-conducting adhesive layer, the heat-conducting metal piece, the metal radiator and the heat-radiating fins.

4. The heat dissipation assembly of claim 3, wherein the heat conduction member, the main plate, and the heat dissipation member are stacked.

5. The heat dissipation assembly of claim 1, wherein the thermally conductive member comprises:

a heat conductive contact portion in contact with a first surface of the main board;

an extension portion extending outward from an outer edge of the thermally conductive contact portion.

6. The heat dissipation assembly of any of claims 1-5, wherein the heat dissipation member comprises:

the heat dissipation substrate is at least partially contacted with the mainboard;

the heat dissipation structure is arranged on the heat dissipation base body; the heat of the mainboard can be conducted to the heat dissipation base body and/or the heat dissipation structure to dissipate the heat.

7. The heat dissipation assembly of claim 6, wherein the heat dissipation substrate defines a receiving cavity for receiving at least one component on the motherboard.

8. The heat dissipation assembly of claim 7, wherein a bottom wall of the receiving cavity contacts at least one component on the motherboard.

9. The heat dissipating assembly of claim 6, wherein the heat dissipating structure comprises:

the first radiating fins are arranged on the surface of the radiating base body deviating from the main board.

10. The heat dissipating assembly of claim 6, wherein the heat dissipating construction further comprises:

and the second radiating fins are arranged on the side part of the radiating base body.

11. A remote control, comprising:

a housing; and

the heat removal assembly of any of claims 1-10, disposed on the housing.

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