CN212113981U - Waveguide circulator and wireless communication equipment - Google Patents
Waveguide circulator and wireless communication equipment Download PDFInfo
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- CN212113981U CN212113981U CN202020601500.1U CN202020601500U CN212113981U CN 212113981 U CN212113981 U CN 212113981U CN 202020601500 U CN202020601500 U CN 202020601500U CN 212113981 U CN212113981 U CN 212113981U
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- 238000004891 communication Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 195
- 239000002184 metal Substances 0.000 claims abstract description 195
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 35
- 230000008054 signal transmission Effects 0.000 claims abstract description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 13
- 230000008859 change Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Abstract
The invention discloses a waveguide circulator, which comprises a substrate, a grounding metal layer, a Y-shaped metal signal line, a metal microstrip line, an embedded ferrite and a bias magnet, wherein the embedded ferrite is embedded in the substrate; the embedded ferrite penetrates through the substrate and is arranged in contact with the lower surface of the Y-shaped metal signal line and the upper surface of the grounding metal layer; the substrate further comprises conductive through holes which are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line is electrically connected with the grounding metal layer through the conductive through holes; the metal microstrip line comprises a metamaterial structure, and is fixedly connected with the Y-shaped metal signal line through the metamaterial structure. Compared with the prior art, the invention greatly reduces the space occupied by the metal microstrip line, is beneficial to the miniaturization of the waveguide circulator, changes the phase and reduces the production cost. The invention also provides wireless communication equipment with the beneficial effects.
Description
Technical Field
The invention relates to the field of wireless communication equipment, in particular to a waveguide circulator and wireless communication equipment.
Background
As a nonreciprocal microwave device, the circulator is often used in wireless communication base stations and radar systems to achieve the functions of isolation of transmitting and receiving signals, interstage isolation of power amplifiers at all stages, and the like. With the deployment of 5G commercial and the gradual and deep research on the application of millimeter wave frequency band, and the requirements for miniaturization, integration and low cost are higher and higher, the market of the chip-scale substrate integrated waveguide circulator will be further expanded.
Substrate Integrated Waveguide (SIW) is a signal transmission line widely used in an Integrated circuit of the Waveguide circulator, and a microstrip line is a transmission line of a printed circuit board or a ceramic Substrate which is widely used at present. The typical connection mode of the signal line and the microstrip line is a gradual change structure connection, but if the connection mode needs to realize smaller reflection loss, a larger gradual change structure needs to be used, more materials are manufactured, and further, the connection mode needs to occupy larger chip area, which is not beneficial to the miniaturization of equipment, and simultaneously needs more production cost, and if the connection mode is used on a wafer-level chip structure with a small size, the reflection loss is overlarge.
Therefore, how to find a waveguide circulator with small occupied space and low material cost is a problem to be solved urgently by the technical personnel in the field.
Disclosure of Invention
The invention aims to provide a waveguide circulator and wireless communication equipment to solve the problems of overlarge volume and high cost of a gradual change structure in the prior art.
In order to solve the technical problem, the invention provides a waveguide circulator, which comprises a substrate, a grounding metal layer, a Y-shaped metal signal line, a metal microstrip line, an embedded ferrite and a bias magnet, wherein the substrate is provided with a plurality of through holes;
the grounding metal layer and the Y-shaped metal signal line are respectively arranged on the upper surface and the lower surface of the substrate; the embedded ferrite penetrates through the substrate and is arranged in contact with the lower surface of the Y-shaped metal signal line and the upper surface of the grounding metal layer;
the bias magnet is arranged on the upper surface of the Y-shaped metal signal line, and a connecting line between the geometric center of the bias magnet and the geometric center of the embedded ferrite is a perpendicular line passing through the geometric center of the Y-shaped metal signal line and on the upper surface of the Y-shaped metal signal line;
the substrate further comprises conductive through holes which are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line is electrically connected with the grounding metal layer through the conductive through holes;
the metal microstrip line comprises a metamaterial structure, and is fixedly connected with the Y-shaped metal signal line through the metamaterial structure.
Optionally, in the waveguide circulator, the conductive through hole is a cylindrical through hole.
Optionally, in the waveguide circulator, a metal conductive layer is disposed in the conductive through hole;
the metal conducting layer covers the inner wall of the conducting through hole, and the Y-shaped metal signal line is electrically connected with the grounding metal layer through the conducting layer.
Optionally, in the waveguide circulator, a metal filler block is arranged in the conductive through hole;
the metal filling block is filled in the conductive through hole, and the Y-shaped metal signal wire is electrically connected with the grounding metal layer through the metal filling block.
Optionally, in the waveguide circulator, the metal conductive layer is a copper conductive layer or a tungsten conductive layer;
or
The metal filling block is a metal copper filling block or a metal tungsten filling block.
Optionally, in the waveguide circulator, the waveguide circulator is a hexagonal waveguide circulator.
Optionally, in the waveguide circulator, the embedded ferrite is a cylindrical ferrite.
Optionally, in the waveguide circulator, a size of the waveguide circulator ranges from 1 mm to 3 mm, inclusive.
A wireless communication device comprising a waveguide circulator as claimed in any one of the preceding claims.
The invention provides a waveguide circulator, which comprises a substrate, a grounding metal layer, a Y-shaped metal signal line, a metal microstrip line, an embedded ferrite and a bias magnet, wherein the embedded ferrite is embedded in the substrate; the grounding metal layer and the Y-shaped metal signal line are respectively arranged on the upper surface and the lower surface of the substrate; the embedded ferrite penetrates through the substrate and is arranged in contact with the lower surface of the Y-shaped metal signal line and the upper surface of the grounding metal layer; the bias magnet is arranged on the upper surface of the Y-shaped metal signal line, and a connecting line between the geometric center of the bias magnet and the geometric center of the embedded ferrite is a perpendicular line passing through the geometric center of the Y-shaped metal signal line and on the upper surface of the Y-shaped metal signal line; the substrate further comprises conductive through holes which are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line is electrically connected with the grounding metal layer through the conductive through holes; the metal microstrip line comprises a metamaterial structure, and is fixedly connected with the Y-shaped metal signal line through the metamaterial structure. According to the invention, the connection mode of the signal line and the microstrip line in the prior art is improved from gradual change structure connection to connection through the metamaterial structure, and the introduced microstructure in the metamaterial helps to realize impedance matching of the metal microstrip line and the substrate integrated waveguide in different frequency bands. The invention also provides wireless communication equipment with the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of one embodiment of a waveguide circulator provided by the invention;
FIG. 2 is a cross-sectional view of one embodiment of a waveguide circulator provided by the present invention;
FIG. 3 is a partial schematic structural view of another embodiment of a waveguide circulator provided by the invention.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide a waveguide circulator, the structure diagram of one specific implementation mode of which is shown in fig. 1, and the waveguide circulator comprises a substrate 1, a grounding metal layer 2, a Y-shaped metal signal line 3, a metal microstrip line 4, an embedded ferrite 5 and a bias magnet 6;
the grounding metal layer 2 and the Y-shaped metal signal line 3 are respectively arranged on the upper surface and the lower surface of the substrate 1; the embedded ferrite 5 penetrates through the substrate 1 and is arranged in contact with the lower surface of the Y-shaped metal signal wire 3 and the upper surface of the grounding metal layer 2;
the bias magnet 6 is arranged on the upper surface of the Y-shaped metal signal wire 3, and a connecting line between the geometric center of the bias magnet 6 and the geometric center of the embedded ferrite 5 is a perpendicular line of the upper surface of the Y-shaped metal signal wire 3 passing through the geometric center of the Y-shaped metal signal wire 3;
the substrate 1 further comprises conductive through holes 7, the conductive through holes 7 are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line 3 and the grounding metal layer 2 are electrically connected through the conductive through holes 7;
the metal microstrip line 4 comprises a metamaterial structure 9, and the metal microstrip line 4 is fixedly connected with the Y-shaped metal signal line 3 through the metamaterial structure 9.
In addition, the conductive through hole 7 is a cylindrical through hole, the cylindrical through hole is convenient to process, and the processing precision is high.
As a preferred embodiment, the ground metal layer 2 is disposed on the lower surface of the substrate 1 through a vacuum coating or electroplating process; the Y-shaped metal signal line 3 is manufactured on the upper surface of the substrate 1 through a vacuum coating or electroplating process and forms a specific waveguide pattern through photoetching, and similarly, the metal microstrip line 4 is manufactured on the upper surface of the substrate 1 through a vacuum coating or electroplating process and forms a specific microstrip pattern through photoetching.
The conductive through holes 7 are formed on the substrate 1 through an etching process, it should be noted that the conductive through holes 7 are sealed by the Y-shaped metal signal lines 3 and the ground metal layer 2 from two sides, and the positions of the conductive through holes 7 are only marked with emphasis in fig. 1 and 3.
In a preferred embodiment, the embedded ferrite 5 is a cylindrical ferrite, the bias magnet 6 is a cylindrical bias magnet 6, and a bias magnetic field of the bias magnet 6 is perpendicular to an upper surface of the Y-shaped metal signal line 3.
As shown in fig. 1, the conductive vias 7 may be arranged in two rows along the metal microstrip line 4, and electromagnetic waves are confined to propagate forward in the two rows of vias. Fig. 2 is a cross-sectional view of the waveguide circulator in which the positional relationship of the embedded ferrite 5 with other structures can be seen.
It should be noted that the Y-shaped metal signal line 3 is a 120-degree axisymmetric metal signal line.
As a preferred embodiment, the size of the waveguide circulator ranges from 1 mm to 3 mm, including an end value, such as any one of 1.0 mm, 2.0 mm, or 3.0 mm, and the size in the present invention refers to the length of the long axis of the waveguide circulator, which can be adjusted according to the actual situation.
The waveguide circulator provided by the invention comprises a substrate 1, a grounding metal layer 2, a Y-shaped metal signal wire 3, a metal microstrip line 4, an embedded ferrite 5 and a bias magnet 6; the grounding metal layer 2 and the Y-shaped metal signal line 3 are respectively arranged on the upper surface and the lower surface of the substrate 1; the embedded ferrite 5 penetrates through the substrate 1 and is arranged in contact with the lower surface of the Y-shaped metal signal wire 3 and the upper surface of the grounding metal layer 2; the bias magnet 6 is arranged on the upper surface of the Y-shaped metal signal wire 3, and a connecting line between the geometric center of the bias magnet 6 and the geometric center of the embedded ferrite 5 is a perpendicular line of the upper surface of the Y-shaped metal signal wire 3 passing through the geometric center of the Y-shaped metal signal wire 3; the substrate 1 further comprises conductive through holes 7, the conductive through holes 7 are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line 3 and the grounding metal layer 2 are electrically connected through the conductive through holes 7; the metal microstrip line 4 comprises a metamaterial structure 9, and the metal microstrip line 4 is fixedly connected with the Y-shaped metal signal line 3 through the metamaterial structure 9. According to the invention, the connection mode of the signal line and the microstrip line in the prior art is improved from gradual change structure connection to connection through the metamaterial structure 9, and the introduced microstructure in the metamaterial helps to realize impedance matching of the metal microstrip line 4 and the integrated waveguide of the substrate 1 in different frequency bands, so that compared with the prior art, the space occupied by the metal microstrip line 4 is greatly reduced, the miniaturization of the waveguide circulator is facilitated, meanwhile, the smaller volume means less raw material consumption, and the production cost is reduced through phase change.
On the basis of the first embodiment, the conductive via 7 is further limited to obtain a second embodiment, and a schematic partial structure of the second embodiment is shown in fig. 3, and includes a substrate 1, a ground metal layer 2, a Y-shaped metal signal line 3, a metal microstrip line 4, an embedded ferrite 5, and a bias magnet 6;
the grounding metal layer 2 and the Y-shaped metal signal line 3 are respectively arranged on the upper surface and the lower surface of the substrate 1; the embedded ferrite 5 penetrates through the substrate 1 and is arranged in contact with the lower surface of the Y-shaped metal signal wire 3 and the upper surface of the grounding metal layer 2;
the bias magnet 6 is arranged on the upper surface of the Y-shaped metal signal wire 3, and a connecting line between the geometric center of the bias magnet 6 and the geometric center of the embedded ferrite 5 is a perpendicular line of the upper surface of the Y-shaped metal signal wire 3 passing through the geometric center of the Y-shaped metal signal wire 3;
the substrate 1 further comprises conductive through holes 7, the conductive through holes 7 are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line 3 and the grounding metal layer 2 are electrically connected through the conductive through holes 7;
the metal microstrip line 4 comprises a metamaterial structure 9, and the metal microstrip line 4 is fixedly connected with the Y-shaped metal signal line 3 through the metamaterial structure 9;
a metal filling block 8 is arranged in the conductive through hole 7;
the metal filling block 8 is filled in the conductive through hole 7, and the Y-shaped metal signal line 3 and the ground metal layer 2 are electrically connected through the metal filling block 8.
The difference between this embodiment and the above embodiment is that the conductive through hole 7 is defined to have the metal filling block 8, and the rest of the structure is the same as that of the above embodiment, and is not described herein again.
In this embodiment, the metal filling block 8 is used to fill the conductive through hole 7, so that the ground metal layer 2 is electrically connected to the Y-shaped metal signal line 3, and the conductive through hole 7 filled with the metal filling block 8 has stronger signal transmission capability and smaller loss, thereby further reducing reflection loss and improving signal fidelity.
Of course, besides the method provided in this embodiment, there are other structures, such as a metal conductive layer disposed in the conductive through hole 7; the metal conducting layer covers the inner wall of the conducting through hole 7, and the Y-shaped metal signal wire 3 is electrically connected with the grounding metal layer 2 through the conducting layer. The metal conducting layer attached to the inner wall of the conducting through hole 7 is used for realizing the electric connection between the Y-shaped metal signal wire 3 and the grounding metal layer 2, so that the metal material consumption can be obviously reduced, and the cost is saved.
As a preferred embodiment, the metal conductive layer is a copper conductive layer or a tungsten conductive layer or other conductive metal layer; or the metal filling block 8 is a metal copper filling block or a metal tungsten filling block or other metal filling blocks, the conductivity of copper is better, and the mechanical strength of tungsten is higher and the tungsten is more resistant to high temperature.
Referring to fig. 3, the Y-shaped metal signal line 3 coincides with the symmetry axis of the microstrip line.
On the basis of the second embodiment, the conductive via 7 is further limited to obtain a third embodiment, and a schematic partial structure diagram of the third embodiment is the same as that of the first embodiment, and includes a substrate 1, a ground metal layer 2, a Y-shaped metal signal line 3, a metal microstrip line 4, an embedded ferrite 5, and a bias magnet 6;
the grounding metal layer 2 and the Y-shaped metal signal line 3 are respectively arranged on the upper surface and the lower surface of the substrate 1; the embedded ferrite 5 penetrates through the substrate 1 and is arranged in contact with the lower surface of the Y-shaped metal signal wire 3 and the upper surface of the grounding metal layer 2;
the bias magnet 6 is arranged on the upper surface of the Y-shaped metal signal wire 3, and a connecting line between the geometric center of the bias magnet 6 and the geometric center of the embedded ferrite 5 is a perpendicular line of the upper surface of the Y-shaped metal signal wire 3 passing through the geometric center of the Y-shaped metal signal wire 3;
the substrate 1 further comprises conductive through holes 7, the conductive through holes 7 are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line 3 and the grounding metal layer 2 are electrically connected through the conductive through holes 7;
the metal microstrip line 4 comprises a metamaterial structure 9, and the metal microstrip line 4 is fixedly connected with the Y-shaped metal signal line 3 through the metamaterial structure 9;
a metal filling block 8 is arranged in the conductive through hole 7;
the metal filling block 8 is filled in the conductive through hole 7, and the Y-shaped metal signal wire 3 is electrically connected with the grounding metal layer 2 through the metal filling block 8;
the waveguide circulator is a hexagonal waveguide circulator.
The difference between the present embodiment and the foregoing embodiment is that the waveguide circulator is defined as a hexagonal waveguide circulator in the present embodiment, and the rest of the structure is the same as that of the foregoing embodiment, and therefore, the detailed description thereof is omitted.
The waveguide circulator is limited to be a hexagonal waveguide circulator in the specific embodiment, on one hand, the hexagonal waveguide circulator is a 120-degree axisymmetric pattern and corresponds to the Y-shaped metal signal line 3, three output ends of the Y-shaped metal signal line 3 can respectively correspond to three nonadjacent sides of a hexagon, so that the manufacturing process is simplified, and on the other hand, the hexagonal waveguide circulator occupies less space compared with other shapes, so that the device is more beneficial to miniaturization, and the material cost is further reduced.
The invention also provides wireless communication equipment which comprises any one of the waveguide circulators. The waveguide circulator provided by the invention comprises a substrate 1, a grounding metal layer 2, a Y-shaped metal signal wire 3, a metal microstrip line 4, an embedded ferrite 5 and a bias magnet 6; the grounding metal layer 2 and the Y-shaped metal signal line 3 are respectively arranged on the upper surface and the lower surface of the substrate 1; the embedded ferrite 5 penetrates through the substrate 1 and is arranged in contact with the lower surface of the Y-shaped metal signal wire 3 and the upper surface of the grounding metal layer 2; the bias magnet 6 is arranged on the upper surface of the Y-shaped metal signal wire 3, and a connecting line between the geometric center of the bias magnet 6 and the geometric center of the embedded ferrite 5 is a perpendicular line of the upper surface of the Y-shaped metal signal wire 3 passing through the geometric center of the Y-shaped metal signal wire 3; the substrate 1 further comprises conductive through holes 7, the conductive through holes 7 are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line 3 and the grounding metal layer 2 are electrically connected through the conductive through holes 7; the metal microstrip line 4 comprises a metamaterial structure 9, and the metal microstrip line 4 is fixedly connected with the Y-shaped metal signal line 3 through the metamaterial structure 9. According to the invention, the connection mode of the signal line and the microstrip line in the prior art is improved from gradual change structure connection to connection through the metamaterial structure 9, and the introduction of the microstructure in the metamaterial helps to realize impedance matching of the metal microstrip line 4 and the substrate integrated waveguide of the substrate 1 in different frequency bands, so that compared with the prior art, the space occupied by the metal microstrip line 4 is greatly reduced, the miniaturization of the waveguide circulator is facilitated, meanwhile, the smaller size means less raw material consumption, and the phase change reduces the production cost.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.
It is to be noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The waveguide circulator and the wireless communication device provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (9)
1. A waveguide circulator is characterized by comprising a substrate, a grounding metal layer, a Y-shaped metal signal line, a metal microstrip line, an embedded ferrite and a bias magnet;
the grounding metal layer and the Y-shaped metal signal line are respectively arranged on the upper surface and the lower surface of the substrate; the embedded ferrite penetrates through the substrate and is arranged in contact with the lower surface of the Y-shaped metal signal line and the upper surface of the grounding metal layer;
the bias magnet is arranged on the upper surface of the Y-shaped metal signal line, and a connecting line between the geometric center of the bias magnet and the geometric center of the embedded ferrite is a perpendicular line passing through the geometric center of the Y-shaped metal signal line and on the upper surface of the Y-shaped metal signal line;
the substrate further comprises conductive through holes which are periodically arranged in the signal transmission direction, and the Y-shaped metal signal line is electrically connected with the grounding metal layer through the conductive through holes;
the metal microstrip line comprises a metamaterial structure, and is fixedly connected with the Y-shaped metal signal line through the metamaterial structure.
2. The waveguide circulator of claim 1 wherein the conductive via is a cylindrical via.
3. The waveguide circulator of claim 2 wherein a metal conductive layer is disposed within the conductive via;
the metal conducting layer covers the inner wall of the conducting through hole, and the Y-shaped metal signal line is electrically connected with the grounding metal layer through the conducting layer.
4. The waveguide circulator of claim 2 wherein a metal filler block is disposed within the conductive via;
the metal filling block is filled in the conductive through hole, and the Y-shaped metal signal wire is electrically connected with the grounding metal layer through the metal filling block.
5. The waveguide circulator of claim 3 wherein the metal conductive layer is a copper conductive layer or a tungsten conductive layer.
6. The waveguide circulator of claim 1 wherein the waveguide circulator is a hexagonal waveguide circulator.
7. The waveguide circulator of claim 1 wherein the embedded ferrite is a cylindrical ferrite.
8. The waveguide circulator of claim 1 wherein the waveguide circulator has a size ranging from 1 mm to 3 mm, inclusive.
9. A wireless communication device comprising a waveguide circulator as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020601500.1U CN212113981U (en) | 2020-04-21 | 2020-04-21 | Waveguide circulator and wireless communication equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020601500.1U CN212113981U (en) | 2020-04-21 | 2020-04-21 | Waveguide circulator and wireless communication equipment |
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| CN212113981U true CN212113981U (en) | 2020-12-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403879A (en) * | 2020-04-21 | 2020-07-10 | 苏州睿新微系统技术有限公司 | Waveguide circulator and wireless communication equipment |
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2020
- 2020-04-21 CN CN202020601500.1U patent/CN212113981U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403879A (en) * | 2020-04-21 | 2020-07-10 | 苏州睿新微系统技术有限公司 | Waveguide circulator and wireless communication equipment |
| CN111403879B (en) * | 2020-04-21 | 2024-10-18 | 苏州睿新微系统技术有限公司 | Waveguide circulator and wireless communication equipment |
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