CN211788977U - Packaging structure of semiconductor device - Google Patents

Abstract

The utility model relates to a packaging structure for a semiconductor device, comprising a base, a plurality of grooves are opened on the upper end surface of the base, the plurality of grooves are arranged in a ring shape, a heat dissipation pipe is arranged on the upper end surface of the base, and the upper end of the heat dissipation pipe is connected with a semiconductor chip The upper end of the semiconductor chip is connected with a heat conduction plate, and the upper end of the heat conduction plate is provided with a cooling device. Bonding wires are drawn out from both sides of the semiconductor chip, one end of the bonding wires is connected with the bonding pads, and one side of the bonding pads is provided with wiring pins. Wherein, the cooling device includes a bottom plate adhered to the heat conduction plate, a plurality of connecting pipes are fixedly connected on the upper surface of the bottom plate, a heat dissipation plate is arranged on the connecting pipes, and a plurality of heat dissipation rods are arranged on the heat dissipation plate. The packaging structure of the semiconductor device proposed by the utility model can achieve effective heat dissipation, thereby prolonging the service life of the semiconductor device, and effectively avoiding the problem of device damage caused by overheating.

Description

Packaging structure of semiconductor devices

technical field

The utility model relates to the technical field of semiconductor packaging equipment, in particular to a packaging structure of a semiconductor device.

Background technique

Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. Generally speaking, when a packaged semiconductor chip operates, a large amount of heat is generated. If the generated heat energy is not dissipated in time, the internal temperature of the semiconductor package will continue to rise. It is understandable that an excessively high temperature will cause the performance of the semiconductor chip to deteriorate and shorten the service life, and even cause permanent damage in severe cases.

For example, an existing patent (application number: 201921202789.3) proposes a packaging structure for a semiconductor device. The packaging structure for a semiconductor device is used to package a semiconductor device provided with a base and a plurality of pins, and the plurality of pins are arranged side by side on the side of the base. The package structure includes a package shell covering the outside of the base, and an isolation boss arranged between two adjacent pins of the plurality of pins. In this patent, the creepage distance between two adjacent pins is increased, which can avoid the problem of device ignition failure caused by pollution.

However, since the above-mentioned semiconductor device packaging device is not provided with a heat dissipation device, the generated thermal energy cannot be dissipated in time. The internal temperature of the semiconductor package will continue to rise, resulting in the degradation of semiconductor chip performance and shortened lifespan.

Utility model content

The utility model mainly solves the problems of the existing semiconductor device packaging structure, which cannot dissipate the generated heat energy in time because the heat dissipation device is not provided, which leads to the degradation of the semiconductor chip performance and the shortened service life.

The technical scheme adopted by the utility model to solve the above-mentioned technical problems is:

A packaging structure of a semiconductor device includes a base, wherein a plurality of grooves are opened on the upper end surface of the base, the grooves are arranged in a ring shape, a heat dissipation pipe is installed on the upper end of the base, and the The upper end of the heat pipe is connected with a semiconductor chip, the upper end of the semiconductor chip is connected with a heat-conducting plate, the upper end of the heat-conducting plate is provided with a cooling device, the semiconductor chip is wrapped by a packaging colloid, and is drawn out from both sides of the semiconductor chip. There is a welding wire, one end of the welding wire is connected with a welding pad, and one side of the welding pad is provided with a wiring pin;

The cooling device includes a bottom plate, a connecting pipe, a heat dissipation plate and a heat dissipation rod, the bottom plate is bonded to the heat conducting plate, a plurality of the connecting pipes are fixedly connected to the upper surface of the bottom plate, and the connecting pipes are provided with In the heat dissipation plate, a plurality of the heat dissipation rods are arranged on the upper surface of the heat dissipation plate, and the cooling device is fixed by a fixing device.

Preferably, the fixing device includes a telescopic rod and a support rod, the telescopic rod is fixed in the groove, the upper end of the telescopic rod is connected with a horizontal support rod, and one end of the support rod is fixedly connected to the on the bottom plate. In this preferred embodiment, through the fixing device, the function of freely adjusting the height of the cooling device can be realized.

Preferably, the telescopic rod includes an inner sliding rod and an outer rod that are connected to each other, the outer rod is a cylindrical hollow structure, the inner sliding rod is used to slide in the outer rod, and the inner sliding rod is used for sliding on the inner sliding rod. A plurality of vertically arranged inner sliding rod through holes are opened, and an outer sliding rod through hole corresponding to the inner sliding rod through hole is opened on the upper part of the outer sliding rod.

Preferably, the grooves are multiple and evenly distributed on the upper surface of the base, the number of the fixing devices is equal to the number of the grooves, and the heat dissipation plate is provided with a plurality of uniformly distributed heat dissipation Great. In this preferred embodiment, the maximum heat dissipation can be achieved through a plurality of heat dissipation rods.

Preferably, the sides of the soldering pads are fixedly abutted and connected to the side surfaces of the encapsulating compound, and a bracket is provided at the bottom of the wiring pin, and the bracket is fixed on the upper surface of the base. In this preferred embodiment, the fixing of the wiring pins can be realized by the bracket.

Preferably, a protective cover is provided on the outer periphery of the bonding wire, and the protective cover is located inside the encapsulating compound. In this preferred embodiment, the protective cover can ensure that the bonding wire is not affected by the encapsulation colloid.

Compared with the prior art, the beneficial effects of the present utility model are:

In the packaging structure of the semiconductor device proposed by the utility model, the cooling liquid encapsulated in the heat dissipation pipe can cool the bottom of the semiconductor chip; the cooling device provided at the upper end, specifically the heat dissipation plate provided above, can cool the upper surface of the semiconductor chip. The heat is dissipated to achieve the cooling effect. Since both the bottom and the top of the semiconductor chip are provided with heat dissipation elements, the effect of overall heat dissipation can be achieved, thereby avoiding the problem of component damage caused by uneven heat dissipation locally.

At the same time, by setting the fixing device and the telescopic rod, the position can be adjusted according to different types of chips in practical applications to ensure that the chips will not be crushed. The packaging structure of the semiconductor device proposed by the utility model has the advantages of simple structure, convenient use, good heat dissipation effect, and good application prospect.

Additional features and advantages of the present disclosure will be set forth in the description that follows, or some may be inferred or unambiguously determined from the description, or may be learned by practicing the above-described techniques of the present disclosure.

In order to make the above-mentioned objects, features and advantages of the present utility model more obvious and easy to understand, preferred embodiments are given below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

1 is an axonometric view of a package structure of a semiconductor device proposed by the present invention;

2 is a schematic diagram of the internal structure of the packaging structure of the semiconductor device proposed by the present invention;

3 is an axonometric view of a telescopic rod in the packaging structure of the semiconductor device proposed by the present invention;

FIG. 4 is a schematic diagram of the connection of the telescopic rod in the packaging structure of the semiconductor device proposed by the present invention.

Description of main symbols:

Detailed ways

In order to facilitate the understanding of the present utility model, the present utility model will be more fully described below with reference to the related drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 1 to FIG. 4, the present utility model provides a technical solution:

A packaging structure of a semiconductor device includes a base 1 , and a plurality of grooves 11 are opened on the upper end surface of the base 1 . The plurality of grooves 11 are arranged in a ring shape.

A heat dissipation pipe 12 is mounted on the upper end of the base 1 , and a semiconductor chip 4 is provided at the upper end of the heat dissipation pipe 12 . In practical applications, the cooling liquid is pre-packaged in the heat dissipation pipe 12 , and the bottom of the semiconductor chip 4 is dissipated through the plurality of heat dissipation pipes 12 .

A heat-conducting plate 13 is provided on the upper surface of the semiconductor chip 4 , and a cooling device 2 is provided on the upper surface of the heat-conducting plate 13 . In this embodiment, the heat generated by the top of the semiconductor chip 4 is absorbed by the heat conducting plate 13 . As can be seen from FIG. 2 , the periphery of the above-mentioned semiconductor chip 4 is wrapped by the encapsulating compound 14 . In addition, bonding wires 41 are respectively drawn out from both sides of the semiconductor chip 4 , one end of the bonding wires 41 is connected to the bonding pad 42 , and one side of the bonding pad 42 is provided with a wiring pin 43 .

Specifically, the above-mentioned cooling device 2 includes a bottom plate 21 , a connecting pipe 22 , a heat dissipation plate 23 and a heat dissipation rod 24 . The bottom plate 21 is adhered to the heat-conducting plate 13 , and a plurality of connecting pipes 22 are fixed on the upper surface of the bottom plate 21 . A heat dissipation plate 23 is provided at the top of the connecting pipe 22 , and a plurality of heat dissipation rods 24 are provided on the upper surface of the heat dissipation plate 23 . In this embodiment, the cooling device 2 is fixed by the fixing device 3 .

1 , 3 and 4 , the above-mentioned fixing device 3 includes a telescopic rod 31 and a support rod 32 , the telescopic rod 31 is movably arranged in the groove 11 , and the upper end of the telescopic rod 31 is connected with a horizontal support rod 32 . One end of the support rod 32 is fixedly connected to the bottom plate 21 . In addition, the telescopic rod 31 includes an inner sliding rod 33 and an outer rod 34 which are connected to each other. Wherein, the outer rod 34 is a cylindrical hollow structure with an opening at the upper end. In practical applications, the inner sliding rod 33 is used to move up and down inside the opening of the outer rod 34 . In addition, the inner sliding rod 33 is provided with a plurality of vertically arranged inner sliding rod through holes 331 . The upper part of the outer rod 34 is provided with an outer rod through hole 341 corresponding to the inner sliding rod through hole.

The inner bottom of the outer rod 34 is provided with a spring member, and the telescopic movement is realized between the inner sliding rod 33 and the outer rod 34 through the action of elastic force. In addition, by arranging a plurality of inner sliding rod through holes 331 on the inner sliding rod 33 and setting the outer rod through holes 341 on the outer rod 34, the positioning between the inner sliding rod through holes 331 and the outer rod through holes 341 is matched and positioned. , so as to realize the unified adjustment of the height of the telescopic rod 31 .

At the same time, the grooves 11 are multiple and evenly distributed on both sides of the base 1 . In this embodiment, the number of the fixing devices 3 is equal to the number of the grooves 11 . It can be understood that the fixing device 3 can enhance the stability of the cooling device 2 . In addition, a plurality of evenly distributed heat dissipation rods 24 are arranged in the heat dissipation plate 23 to ensure maximum heat dissipation.

Referring to FIG. 1 and FIG. 2 , the side edges of the solder pads 42 and the side surfaces of the encapsulant 14 are fixedly abutted and connected to each other. A bracket 15 is provided at the bottom of the wiring pin 43 , and the bracket 15 is fixed on the upper surface of the base 1 . In addition, a protective cover 44 is sleeved on the outer periphery of the bonding wire 41 , and the protective cover 44 is located inside the encapsulant 14 . In this embodiment, the protective cover 44 can achieve the effect that the bonding wire 41 is not affected by the encapsulation colloid.

The specific operation mode of the present utility model is as follows:

According to the position of the semiconductor chip 4, the height of the cooling device 2 is adjusted by the fixing device 3, so that the bottom plate 21 is pressed on the heat-conducting plate 13, and is electrically connected with the external wires through the wiring pins 43;

When the semiconductor chip 4 starts to operate and the temperature rises, the heat dissipation pipe 12 at the bottom of the semiconductor chip 4 dissipates heat from the bottom of the semiconductor chip 4 through the cooling liquid in the heat dissipation pipe 12;

In addition, the heat on the top of the semiconductor chip 4 is absorbed by the heat-conducting plate 13 , and the heat is then conducted upwards, transmitted to the heat-dissipating plate 23 through the connecting pipe 22 , and finally dissipated by the plurality of heat-dissipating rods 24 arranged in the heat-dissipating plate 23 . The packaging structure of the semiconductor device proposed by the present invention can simultaneously perform heat dissipation treatment on the bottom and the top of the semiconductor chip 4 , thereby ensuring the heat dissipation effect and meeting practical application requirements.

Finally, it should be noted that the above-mentioned embodiments are only specific implementations of the present utility model, and are used to illustrate the technical solutions of the present utility model, rather than restricting them, and the protection scope of the present utility model is not limited thereto. Although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: any person skilled in the art who is familiar with the technical field within the technical scope disclosed by the present utility model can still record the descriptions in the foregoing embodiments. Modifications or changes can be easily imagined in the technical solutions, or equivalent replacements are made to some of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention, All should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (6)

1. A packaging structure for a semiconductor device, comprising a base (1), characterized in that a plurality of grooves (11) are formed on the upper end surface of the base (1), and the plurality of grooves (11) are in the shape of Circular arrangement, a heat dissipation pipe (12) is installed on the upper end of the base (1), a semiconductor chip (4) is connected to the upper end of the heat dissipation pipe (12), and a heat conduction plate (4) is connected to the upper end of the semiconductor chip (4). 13), a cooling device (2) is provided on the upper end of the thermally conductive plate (13), the semiconductor chip (4) is wrapped by the encapsulating compound (14), and a cooling device (2) is drawn from both sides of the semiconductor chip (4). a welding wire (41), one end of the welding wire (41) is connected to a welding pad (42), and one side of the welding pad (42) is provided with a wiring pin (43); The cooling device (2) comprises a bottom plate (21), a connecting pipe (22), a heat dissipation plate (23) and a heat dissipation rod (24), the bottom plate (21) is bonded to the heat conducting plate (13), and the The upper surface of the bottom plate (21) is fixedly connected with a plurality of the connecting pipes (22), the connecting pipes (22) are provided with the cooling plates (23), and the upper surface of the cooling plates (23) is provided with A plurality of the cooling rods (24), and the cooling device (2) is fixed by a fixing device (3). 2 . The packaging structure of a semiconductor device according to claim 1 , wherein the fixing device ( 3 ) comprises a telescopic rod ( 31 ) and a support rod ( 32 ), and the telescopic rod ( 31 ) is fixed to the In the groove (11), the upper end of the telescopic rod (31) is connected with a horizontal support rod (32), and one end of the support rod (32) is fixedly connected to the bottom plate (21). 3 . The packaging structure of a semiconductor device according to claim 2 , wherein the telescopic rod ( 31 ) comprises an inner sliding rod ( 33 ) and an outer rod ( 34 ) that are connected to each other, and the outer rod ( 34 ) It is a cylindrical hollow structure, the inner sliding rod (33) is used for sliding in the outer sliding rod (34), and a plurality of vertically arranged inner sliding rod through holes are opened on the inner sliding rod (33). (331), an outer sleeve rod through hole (341) corresponding to the inner sliding rod through hole (331) is opened on the upper part of the outer sleeve rod (34). 4. The packaging structure of a semiconductor device according to claim 1, characterized in that, the grooves (11) are a plurality of and are evenly distributed on the upper surface of the base (1), and the fixing device (3) The number of the grooves (11) is equal to that of the grooves (11), and a plurality of uniformly distributed heat dissipation rods (24) are arranged in the heat dissipation plate (23). 5 . The packaging structure of a semiconductor device according to claim 1 , wherein the side edges of the soldering pads ( 42 ) are fixedly abutted and connected with the side surfaces of the encapsulating compound ( 14 ). The bottom of the foot (43) is provided with a bracket (15), and the bracket (15) is fixed on the upper surface of the base (1). 6 . The packaging structure of a semiconductor device according to claim 1 , wherein a protective sleeve ( 44 ) is sleeved on the outer periphery of the bonding wire ( 41 ), and the protective sleeve ( 44 ) is located in the encapsulating compound. 7 . (14) INTERIOR.

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