CN211702280U - Dampproofing formula switch that easily dispels heat - Google Patents
Dampproofing formula switch that easily dispels heat Download PDFInfo
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- CN211702280U CN211702280U CN202020546014.4U CN202020546014U CN211702280U CN 211702280 U CN211702280 U CN 211702280U CN 202020546014 U CN202020546014 U CN 202020546014U CN 211702280 U CN211702280 U CN 211702280U
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- heat dissipation
- shell
- copper
- heat
- dissipation frame
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a dampproofing formula switch that easily dispels heat, concretely relates to switch technical field, including the shell, set up in the inside heat dissipation casing of shell, set up in the inside structure subassembly of heat dissipation casing, structure subassembly includes the circuit board, sets up electronic component on the circuit board and is located the installation mechanism of circuit board bottom, a plurality of louvres have been seted up on the shell, the heat dissipation casing includes copper heat dissipation frame board and lower copper heat dissipation frame board, it has a plurality of heat radiation fins, and is a plurality of all to arrange in proper order on the outer wall of copper heat dissipation frame board and lower copper heat dissipation frame board heat radiation fins's outer end all with shell inner wall fixed connection, it is provided with the heat conduction rubber washer with the junction of lower copper heat dissipation frame board to go up copper heat dissipation frame board. The utility model discloses need not to restrict the quantity of switch shell trompil, under the prerequisite of having guaranteed the switch heat-sinking capability for outside humid air can not cause the damage to its inside components and parts, has prolonged life.
Description
Technical Field
The utility model relates to a switch technical field, more specifically say, the utility model relates to a dampproofing easy heat dissipation formula switch.
Background
A switch is a device that performs an information exchange function in a communication system. In computer network systems, the switching concept was proposed as an improvement to the shared mode of operation. The HUB is a sharing device, the HUB itself cannot identify the destination address, when a host a in the same lan transmits data to a host B, the data packet is transmitted in a broadcast manner over the network using the HUB as a framework, and each terminal determines whether to receive the data packet by verifying the address information of the packet header.
Because the integration level of the existing switch is higher and higher, the heat productivity is higher and higher in the process of using the switch for a long time, the problem that the heat dissipation of the switch is difficult is very serious, and more openings are required to be arranged for heat dissipation; when the switch worked for a long time in the place of comparison humidity, because air humidity is too high, often can lead to the switch mainboard to wet for the switch mainboard takes place the short circuit, can not normally work, needs the quantity and the size of restriction switch trompil. Therefore, how to make the switch have good heat dissipation capability and moisture resistance capability at the same time is a problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a following technical scheme: a moisture-proof heat-dissipation-easy type switch comprises a shell, a heat dissipation shell arranged in the shell and a structural component arranged in the heat dissipation shell, wherein the structural component comprises a circuit board, an electronic element arranged on the circuit board and an installation mechanism positioned at the bottom of the circuit board;
the installation mechanism is including being fixed in the copper contact board on the copper heat dissipation frame inner wall down, being fixed in the connecting plate at copper contact board top and laminating in the heat conduction cushion at connecting plate top, the laminating of heat conduction cushion top and circuit board bottom, it has first screw still to run through on the circuit board, first screw downwardly extending is to in the connecting plate.
In a preferred embodiment, a heat conducting copper pipe penetrates through the bottom of the copper contact plate, and two ends of the heat conducting copper pipe extend towards two sides of the copper contact plate and are attached to the inner wall of the lower copper heat dissipation frame plate.
In a preferred embodiment, the housing comprises an upper shell and a lower shell, two clamping plates are arranged at the joint of the upper shell and the lower shell, the two clamping plates are respectively arranged on the outer walls of the upper shell and the lower shell, a second screw penetrates through the two clamping plates, and the upper shell and the lower shell are detachably mounted through the clamping plates and the second screw.
In a preferred embodiment, the boundary between the upper housing and the lower housing and the boundary between the upper copper heat dissipating frame plate and the lower copper heat dissipating frame plate are at the same height, and the heat dissipating hole is opened in the region between the adjacent heat dissipating fins.
In a preferred embodiment, the first screw is further sleeved with an insulating pad, and the insulating pad is arranged between the top end of the first screw and the circuit board.
In a preferred embodiment, the bottom of the housing is provided with a plurality of support feet.
The utility model discloses a technological effect and advantage:
the utility model discloses need not to restrict the quantity of switch shell trompil, under the prerequisite of having guaranteed the switch heat-sinking capability for outside humid air can not cause the damage to its inside components and parts, has prolonged life.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the structure of the heat dissipation casing of the present invention.
The reference signs are: the heat dissipation structure comprises a shell 1, a heat dissipation shell 2, a circuit board 3, heat dissipation holes 4, an upper copper heat dissipation frame plate 5, a lower copper heat dissipation frame plate 6, heat dissipation fins 7, a heat conduction rubber gasket 8, a copper contact plate 9, a connecting plate 10, a heat conduction rubber gasket 11, a first screw 12, a heat conduction copper pipe 13, an upper shell 14, a lower shell 15, a clamping plate 16, a second screw 17, an insulating pad 18 and a support pad pin 19.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
As shown in fig. 1-2, a moisture-proof heat-dissipating switch comprises a housing 1, a heat-dissipating housing 2 disposed inside the housing 1, and a structural assembly disposed inside the heat-dissipating housing 2, wherein the structural assembly includes a circuit board 3, an electronic component disposed on the circuit board 3, and an installation mechanism located at the bottom of the circuit board 3, the housing 1 is provided with a plurality of heat-dissipating holes 4, the heat-dissipating housing 2 includes an upper copper heat-dissipating frame 5 and a lower copper heat-dissipating frame 6, a plurality of heat-dissipating fins 7 are sequentially arranged on outer walls of the upper copper heat-dissipating frame 5 and the lower copper heat-dissipating frame 6, outer ends of the plurality of heat-dissipating fins 7 are fixedly connected to an inner wall of the housing 1, and a heat-conductive rubber gasket 8 is disposed at a joint of the upper copper heat-dissipating frame;
on the basis, the upper copper heat dissipation frame plate 5 and the lower copper heat dissipation frame plate 6 form a sealed space inside through the heat conduction rubber gasket 8, namely, the inside of the heat dissipation shell 2 is relatively sealed, in the working process, heat in the heat dissipation shell 2 is transferred through the heat dissipation fins 7 outside the heat dissipation shell 2 and is conducted to the outer shell 1, the space inside the heat dissipation shell 2 is not in direct contact with the outside, gas circulation cannot occur, and when the heat dissipation shell is used in a humid environment, the humid air outside cannot damage components in the heat dissipation shell 2;
the mounting mechanism comprises a copper contact plate 9 fixed on the inner wall of the lower copper heat dissipation frame plate 6, a connecting plate 10 fixed on the top of the copper contact plate 9 and a heat conduction rubber mat 11 attached to the top of the connecting plate 10, the top of the heat conduction rubber mat 11 is attached to the bottom of the circuit board 3, a first screw 12 penetrates through the circuit board 3, the first screw 12 extends downwards into the connecting plate 10, and the circuit board 3 of the switch is mounted on the connecting plate 10 through the first screw 12;
in the working process, heat generated by the component devices on the circuit board 3 is conducted through the heat-conducting rubber mat 11 between the connecting plate 10 and the circuit board 3, the heat is transmitted to the lower copper heat-radiating frame plate 6 through the copper contact plate 9, and the heat radiated on the circuit board 3 is directly radiated through the commercial copper heat-radiating frame plate through gas;
a heat conducting copper pipe 13 penetrates through the bottom of the copper contact plate 9, two ends of the heat conducting copper pipe 13 extend towards two sides of the copper contact plate 9 and are attached to the inner wall of the lower copper heat dissipation frame plate 6, and at the lower copper heat dissipation frame plate 6 which mainly conducts heat of the circuit board 3, the heat conducting copper pipe 13 is utilized to increase the contact area between the copper contact plate 9 and the lower copper heat dissipation frame plate 6 and accelerate the dissipation of heat of components of the circuit board 3;
the shell 1 comprises an upper shell 14 and a lower shell 15, two clamping plates 16 are arranged at the joint of the upper shell 14 and the lower shell 15, the two clamping plates 16 are respectively arranged on the outer walls of the upper shell 14 and the lower shell 15, second screws 17 penetrate through the two clamping plates 16, and the upper shell 14 and the lower shell 15 are detachably mounted through the clamping plates 16 and the second screws 17;
furthermore, because the outer ends of the heat dissipation fins 7 are fixedly connected with the inner wall of the shell 1, the heat dissipation shell 2 can be opened along with the opening of the shell 1, when the upper shell 14 and the lower shell 15 are installed, the heat conduction rubber gasket 8 between the upper copper heat dissipation frame plate 5 and the lower copper heat dissipation frame plate 6 can be extruded, and the clamping plate 16 and the second screw 17 can also play a role in pressing the heat conduction rubber gasket 8, so that a relatively sealed environment is formed inside the heat dissipation shell 2;
the boundary of the upper shell 14 and the lower shell 15 and the boundary of the upper copper heat dissipation frame plate 5 and the lower copper heat dissipation frame plate 6 are at the same height, the heat dissipation holes 4 are formed in the areas between the adjacent heat dissipation fins 7, and because the space inside the heat dissipation shell 2 is relatively sealed, the heat dissipation holes 4 formed in the shell 1 cannot cause moisture to corrode the inside of the heat dissipation shell 2, and can dissipate heat accumulated between the heat dissipation fins 7, so that the heat is prevented from being accumulated among the heat dissipation fins 7 in a large quantity;
first screw 12 outside still overlaps and is equipped with insulating pad 18, and insulating pad 18 sets up between first screw 12 top and circuit board 3, and insulating pad 18 provides insulating effect, and shell 1 bottom is provided with a plurality of support pad feet 19, promotes the stability that shell 1 placed.
It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art and related fields without creative efforts shall fall within the protection scope of the present disclosure. The structures, devices, and methods of operation of the present invention, not specifically described and illustrated, are generally practiced by those of ordinary skill in the art without specific recitation or limitation.
Claims (6)
1. The utility model provides a dampproofing easy heat dissipation formula switch, includes the shell, sets up in the inside heat dissipation casing of shell, sets up in the inside structural component of heat dissipation casing, structural component includes the circuit board, sets up the electronic component on the circuit board and is located the installation mechanism of circuit board bottom, its characterized in that: the shell is provided with a plurality of heat dissipation holes, the heat dissipation shell comprises an upper copper heat dissipation frame plate and a lower copper heat dissipation frame plate, a plurality of heat dissipation fins are sequentially arranged on the outer walls of the upper copper heat dissipation frame plate and the lower copper heat dissipation frame plate, the outer ends of the plurality of heat dissipation fins are fixedly connected with the inner wall of the shell, and a heat conduction rubber gasket is arranged at the joint of the upper copper heat dissipation frame plate and the lower copper heat dissipation frame plate;
the installation mechanism is including being fixed in the copper contact board on the copper heat dissipation frame inner wall down, being fixed in the connecting plate at copper contact board top and laminating in the heat conduction cushion at connecting plate top, the laminating of heat conduction cushion top and circuit board bottom, it has first screw still to run through on the circuit board, first screw downwardly extending is to in the connecting plate.
2. The moisture-proof heat-dissipating switch according to claim 1, wherein: the bottom of the copper contact plate is penetrated with a heat conduction copper pipe, and two ends of the heat conduction copper pipe extend towards two sides of the copper contact plate and are attached to the inner wall of the lower copper heat dissipation frame plate.
3. The moisture-proof heat-dissipating switch according to claim 1, wherein: the shell comprises an upper shell and a lower shell, wherein the joint of the upper shell and the lower shell is provided with two clamping plates, the two clamping plates are respectively arranged on the outer walls of the upper shell and the lower shell, a second screw penetrates through the two clamping plates, and the upper shell and the lower shell are detachably mounted through the clamping plates and the second screw.
4. The moisture-proof heat-dissipating switch according to claim 3, wherein: the boundary between the upper shell and the lower shell and the boundary between the upper copper heat dissipation frame plate and the lower copper heat dissipation frame plate are at the same height, and the heat dissipation holes are formed in the areas between the adjacent heat dissipation fins.
5. The moisture-proof heat-dissipating switch according to claim 1, wherein: the first screw is further sleeved with an insulating pad, and the insulating pad is arranged between the top end of the first screw and the circuit board.
6. The moisture-proof heat-dissipating switch according to claim 1, wherein: the bottom of the shell is provided with a plurality of supporting foot pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020546014.4U CN211702280U (en) | 2020-04-14 | 2020-04-14 | Dampproofing formula switch that easily dispels heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020546014.4U CN211702280U (en) | 2020-04-14 | 2020-04-14 | Dampproofing formula switch that easily dispels heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702280U true CN211702280U (en) | 2020-10-16 |
Family
ID=72782762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020546014.4U Active CN211702280U (en) | 2020-04-14 | 2020-04-14 | Dampproofing formula switch that easily dispels heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211702280U (en) |
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2020
- 2020-04-14 CN CN202020546014.4U patent/CN211702280U/en active Active
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