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CN211604293U - High-power transmitting circuit of remote controller - Google Patents

High-power transmitting circuit of remote controller Download PDF

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Publication number
CN211604293U
CN211604293U CN202020504116.XU CN202020504116U CN211604293U CN 211604293 U CN211604293 U CN 211604293U CN 202020504116 U CN202020504116 U CN 202020504116U CN 211604293 U CN211604293 U CN 211604293U
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chip
frequency
power
pin
frequency transmitting
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吴晓舟
邹军荣
张汉才
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Shenzhen Maktin Technology Co ltd
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Shenzhen Maktin Technology Co ltd
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Abstract

The utility model discloses a high-power transmitting circuit of a remote controller, which comprises a remote control key, a coding chip, a high-frequency transmitting chip, a sound surface high-frequency resonator, an oscillating circuit, a power amplifying circuit and an antenna; the signal input end of the high-frequency transmitting chip is connected with the output end of the sound surface high-frequency resonator and the output end of the coding chip, the signal output end circuit of the high-frequency transmitting chip is connected with the power amplifying circuit, and the high-frequency transmitting chip modulates the coding signal input by the coding chip and the high-frequency signal input by the sound surface high-frequency resonator and amplifies the power for the first time; the input end of the power amplifying circuit is connected with the signal output end of the high-frequency transmitting chip, the output end of the power amplifying circuit is connected with the antenna, and the modulated signal input by the high-frequency transmitting chip is subjected to secondary power amplification by the power amplifying circuit and then transmitted through the antenna. The utility model discloses make the transmitting power of remote controller big, can carry out remote control to satisfy the remote control demand in fields such as intelligent house.

Description

一种远距离遥控器的大功率发射电路A high-power transmitting circuit of a long-distance remote control

技术领域technical field

本实用新型涉及无线遥控技术领域,尤其涉及一种远距离遥控器的大功率发射电路。The utility model relates to the technical field of wireless remote control, in particular to a high-power transmitting circuit of a long-distance remote control.

背景技术Background technique

遥控器采用无线发射技术控制一定距离内的电子设备执行相应的动作,如在智能家居领域,如门铃遥控器,灯开关遥控器、车库门遥控器等。The remote control uses wireless transmission technology to control electronic devices within a certain distance to perform corresponding actions, such as in the field of smart home, such as doorbell remote control, light switch remote control, garage door remote control, etc.

现有技术中遥控器发射的遥控信号一般采用一次功率放大,其发射功率低,不适合远距离遥控。In the prior art, the remote control signal transmitted by the remote control generally adopts primary power amplification, and its transmission power is low, which is not suitable for long-distance remote control.

因此,现有技术有待发展。Therefore, the existing technology needs to be developed.

实用新型内容Utility model content

鉴于上述现有技术的不足之处,本实用新型的目的在于提供一种远距离遥控器的大功率发射电路,旨在使得遥控器的发射功率大,能进行远距离遥控。In view of the above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a high-power transmitting circuit of a long-distance remote control, which aims to make the transmitting power of the remote control large and enable long-distance remote control.

为了实现上述目的,本实用新型提供如下技术方案:In order to achieve the above object, the utility model provides the following technical solutions:

一种远距离遥控器的大功率高频发射电路,其中,包括遥控按键、编码芯片、高频发射芯片、声表面高频谐振器、振荡电路、功率放大电路及天线;A high-power high-frequency transmitting circuit for a remote remote control, which includes a remote control button, a coding chip, a high-frequency transmitting chip, an acoustic surface high-frequency resonator, an oscillation circuit, a power amplifying circuit and an antenna;

所述编码芯片的输入端连接遥控按键,其输出端连接高频发射芯片,编码芯片对遥控按键的按键信号进行编码并输出编码信号至高频发射芯片;The input end of the encoding chip is connected to the remote control button, and the output end of the encoding chip is connected to the high-frequency transmitting chip, and the encoding chip encodes the key signal of the remote control button and outputs the encoded signal to the high-frequency transmitting chip;

所述高频发射芯片设置有信号输入端、振荡输入端和信号输出端,所述高频发射芯片的信号输入端连接声表面高频谐振器的输出端及编码芯片的输出端,其信号输出端路连接功率放大电路,高频发射芯片将编码芯片输入编码信号及声表面高频谐振器输入的高频信号进行调制及第一次功率放大;The high-frequency transmitting chip is provided with a signal input terminal, an oscillation input terminal and a signal output terminal. The signal input terminal of the high-frequency transmitting chip is connected to the output terminal of the acoustic surface high-frequency resonator and the output terminal of the coding chip. The terminal is connected to the power amplifying circuit, and the high-frequency transmitting chip modulates and amplifies the first power of the high-frequency signal input by the encoding chip and the high-frequency signal input by the high-frequency resonator of the acoustic surface;

所述振荡电路连接声表面高频谐振器的输入端及高频发射芯片的振荡输入端;The oscillating circuit is connected to the input end of the acoustic surface high-frequency resonator and the oscillating input end of the high-frequency transmitting chip;

所述功率放大电路的输入端连接高频发射芯片的信号输出端,其输出端连接天线,功率放大电路将高频发射芯片输入的已调制信号进行第二次功率放大后经天线发射。The input end of the power amplifying circuit is connected to the signal output end of the high-frequency transmitting chip, and the output end is connected to the antenna.

其中,所述高频发射芯片U1型号为TDH9950,其设置有输入引脚DAT,电源引脚VCC,接地引脚GND,振荡引脚OSC、天线引脚ANT;Wherein, the model of the high-frequency transmitting chip U1 is TDH9950, which is provided with an input pin DAT, a power supply pin VCC, a ground pin GND, an oscillation pin OSC, and an antenna pin ANT;

所述编码芯片U2型号为EV1527,其设置有输出引脚TXD,按键引脚K0至K3;The encoding chip U2 model is EV1527, which is provided with an output pin TXD and key pins K0 to K3;

所述声表面高频谐振器X1设置有输入引脚1和输出引脚2;The surface acoustic high-frequency resonator X1 is provided with an input pin 1 and an output pin 2;

其中:in:

编码芯片U2的按键引脚K0至K3连接遥控按键S4至S1;The key pins K0 to K3 of the coding chip U2 are connected to the remote control keys S4 to S1;

编码芯片U2的输出引脚TXD串联限流电阻R6后连接至述高频发射芯片U1的输入引脚DAT,同时声表面高频谐振器X1的输出引脚2也连接至高频发射芯片U1的输入引脚DAT;The output pin TXD of the coding chip U2 is connected in series with the current limiting resistor R6 and then connected to the input pin DAT of the high-frequency transmitting chip U1. At the same time, the output pin 2 of the high-frequency surface acoustic resonator X1 is also connected to the high-frequency transmitting chip U1. input pin DAT;

高频发射芯片U1的振荡引脚OSC、表面高频谐振器X1的输入引脚1连接振荡电路,高频发射芯片U1的天线引脚ANT连接至功率放大电路的输入端。The oscillation pin OSC of the high-frequency transmitting chip U1 and the input pin 1 of the surface high-frequency resonator X1 are connected to the oscillation circuit, and the antenna pin ANT of the high-frequency transmitting chip U1 is connected to the input end of the power amplifier circuit.

其中,所述功率放大电路包括功放三极管Q1,电阻R1,电感L4、L5,电容C1、C5;Wherein, the power amplifier circuit includes a power amplifier transistor Q1, a resistor R1, inductances L4, L5, and capacitors C1, C5;

其中,高频发射芯片U1的天线引脚ANT通过电容C3连接至功放三极管Q1的基极,同时功放三极管Q1的基极连接有与电容C3并联的偏置电阻R1,功放三极管Q1的集电极并联有电感L4及电容C1、C5,电阻R1及电感L4的另一端连接电源VCC,电容C1的另一端串联电感L5后连接至天线ANT,功放三极管Q1的发射极及电容C5的另一端接地。Among them, the antenna pin ANT of the high-frequency transmitter chip U1 is connected to the base of the power amplifier transistor Q1 through the capacitor C3, and the base of the power amplifier transistor Q1 is connected to the bias resistor R1 in parallel with the capacitor C3, and the collector of the power amplifier transistor Q1 is connected in parallel There is an inductor L4 and capacitors C1 and C5. The other end of the resistor R1 and the inductor L4 is connected to the power supply VCC. The other end of the capacitor C1 is connected to the antenna ANT in series with the inductor L5. The emitter of the power amplifier transistor Q1 and the other end of the capacitor C5 are grounded.

其中,所述振荡电路包括电感L1、L2及电容C2、C6;Wherein, the oscillation circuit includes inductors L1, L2 and capacitors C2, C6;

所述电感L2与电容C6并联,且电感L2及电容C6的一端共同连接电源VCC,电容C6另一端接地,电感L2另一端连接表面高频谐振器X1的输入引脚1、电感L2的一端、及电容C2的一端,电感L1的另一端连接高频发射芯片U1的振荡引脚OSC,电容C2的另一端接地。The inductor L2 is connected in parallel with the capacitor C6, and one end of the inductor L2 and the capacitor C6 is commonly connected to the power supply VCC, the other end of the capacitor C6 is grounded, and the other end of the inductor L2 is connected to the input pin 1 of the surface high-frequency resonator X1, one end of the inductor L2, and one end of the capacitor C2, the other end of the inductor L1 is connected to the oscillation pin OSC of the high frequency transmitting chip U1, and the other end of the capacitor C2 is grounded.

本实用新型的远距离遥控器的大功率发射电路,通过高频发射芯片将遥控信号进行第一次放大,再将第一次放大的信号经过功率放大电路进行第二次放大,这样遥控信号经过两次放大后其发射功率大大提高,可达到17dBm左右,可以进行远距离的遥控。The high-power transmitting circuit of the long-distance remote controller of the utility model amplifies the remote control signal for the first time through a high-frequency transmitting chip, and then the signal amplified for the first time is amplified by the power amplifying circuit for the second time, so that the remote control signal passes through After two amplifications, its transmit power is greatly improved, and can reach about 17dBm, which can be used for long-distance remote control.

附图说明Description of drawings

图1为本实用新型远距离遥控器的大功率发射电路第一种实施方式的原理示意图。FIG. 1 is a schematic diagram of the principle of the first embodiment of the high-power transmitting circuit of the remote remote controller of the present invention.

图2为本实用新型大功率发射电路的示意图。FIG. 2 is a schematic diagram of a high-power transmitting circuit of the present invention.

图3为图2中高频发射芯片、声表面高频谐振器、及振荡电路的连接示意图。FIG. 3 is a schematic diagram of the connection of the high-frequency transmitting chip, the surface acoustic surface high-frequency resonator, and the oscillating circuit in FIG. 2 .

附图标记说明:Description of reference numbers:

100-发射电路,10-遥控按键,20-编码芯片,30-高频发射芯片,40-声表面高频谐振器,50-振荡电路,60-功率放大电路,70-天线。100-transmitting circuit, 10-remote control button, 20-encoding chip, 30-high-frequency transmitting chip, 40-acoustic surface high-frequency resonator, 50-oscillating circuit, 60-power amplifier circuit, 70-antenna.

具体实施方式Detailed ways

下面结合附图和实施例对本实用新型进一步说明,实施例的内容不作为对本实用新型的保护范围的限制。The present utility model will be further described below in conjunction with the accompanying drawings and embodiments, and the contents of the embodiments are not intended to limit the protection scope of the present utility model.

请参考图1至图2,为本实用新型的一种远距离遥控器的大功率高频发射电路100的原理框图,包括遥控按键10、编码芯片20、高频发射芯片30、声表面高频谐振器40、振荡电路50、功率放大电路60及天线70。Please refer to FIG. 1 to FIG. 2 , which are schematic block diagrams of a high-power high-frequency transmitting circuit 100 of a long-distance remote control of the present invention, including a remote control button 10, an encoding chip 20, a high-frequency transmitting chip 30, a high-frequency acoustic surface The resonator 40 , the oscillation circuit 50 , the power amplifier circuit 60 and the antenna 70 .

所述编码芯片20的输入端连接遥控按键10,其输出端连接高频发射芯片30,编码芯片20对遥控按键10的按键信号进行编码并输出编码信号至高频发射芯片30。The input end of the encoding chip 20 is connected to the remote control button 10 , and the output end of the encoding chip 20 is connected to the high frequency transmitting chip 30 .

所述高频发射芯片30设置有信号输入端、振荡输入端和信号输出端,所述高频发射芯片30的信号输入端连接声表面高频谐振器40的输出端及编码芯片20的输出端,其信号输出端路连接功率放大电路60,高频发射芯片30将编码芯片20输入编码信号及声表面高频谐振器40输入的高频信号进行调制及第一次功率放大。声表面高频谐振器40提供高频的载波信号,如433.92Mhz的载波信号,而编码芯片20提供原始的遥控编码信号,遥控编码信号和载波信号在高频发射芯片30中进行混频调制,并经过第一次功率放大。The high-frequency transmitting chip 30 is provided with a signal input terminal, an oscillation input terminal and a signal output terminal. , the signal output terminal is connected to the power amplifier circuit 60, and the high-frequency transmitting chip 30 modulates and amplifies the first power of the coded signal input from the coding chip 20 and the high-frequency signal input from the surface acoustic surface high-frequency resonator 40. The acoustic surface high-frequency resonator 40 provides a high-frequency carrier signal, such as a 433.92Mhz carrier signal, while the coding chip 20 provides the original remote control coding signal, and the remote control coding signal and the carrier signal are mixed and modulated in the high-frequency transmitting chip 30, And after the first power amplification.

所述振荡电路50连接声表面高频谐振器40的输入端及高频发射芯片30的振荡输入端;振荡电路50为表面高频谐振器40及高频发射芯片30提供工作频率。The oscillating circuit 50 is connected to the input end of the surface acoustic high frequency resonator 40 and the oscillating input end of the high frequency transmitting chip 30 ;

所述功率放大电路60的输入端连接高频发射芯片30的信号输出端,其输出端连接天线70,功率放大电路60将高频发射芯片30输入的已调制信号进行第二次功率放大后经天线70发射。The input end of the power amplifying circuit 60 is connected to the signal output end of the high-frequency transmitting chip 30, and its output end is connected to the antenna 70. The power amplifying circuit 60 performs a second power amplification on the modulated signal input by the high-frequency transmitting chip 30, Antenna 70 transmits.

这样,本实用新型的发射电路100将遥控信号经过两次功率放大,大大提高了信号的发射功率,相对于现有遥控器一般最大为10dBm的功率,本实用新型遥控信号的发射功率可达到17dBm左右,能进行远距离的遥控,如远距离开启车库门等。In this way, the transmitter circuit 100 of the present invention amplifies the power of the remote control signal twice, which greatly improves the transmit power of the signal. Compared with the conventional remote control whose power is generally 10dBm at the maximum, the transmitter power of the remote control signal of the present invention can reach 17dBm. Left and right, can carry out long-distance remote control, such as long-distance open garage door and so on.

具体地,如图2所示,所述高频发射芯片U1型号为TDH9950,其设置有输入引脚DAT,电源引脚VCC,接地引脚GND,振荡引脚OSC、天线引脚ANT。输入引脚DAT为高频发射芯片U1的信号输入端,振荡引脚OSC为高频发射芯片U1的的振荡输入端,天线引脚ANT为高频发射芯片U1的信号输出端。Specifically, as shown in FIG. 2 , the model of the high-frequency transmitting chip U1 is TDH9950, which is provided with an input pin DAT, a power supply pin VCC, a ground pin GND, an oscillation pin OSC, and an antenna pin ANT. The input pin DAT is the signal input end of the high frequency transmitting chip U1, the oscillation pin OSC is the oscillation input end of the high frequency transmitting chip U1, and the antenna pin ANT is the signal output end of the high frequency transmitting chip U1.

所述编码芯片U2型号为EV1527,其设置有输出引脚TXD,按键引脚K0至K3;按键引脚K0至K3为编码芯片U2的输入端,输出引脚TXD为编码芯片U2的输出端。The encoding chip U2 has a model of EV1527, and is provided with an output pin TXD and key pins K0 to K3; the key pins K0 to K3 are the input ends of the encoding chip U2, and the output pin TXD is the output end of the encoding chip U2.

所述声表面高频谐振器X1设置有输入引脚1和输出引脚2。The SFA high-frequency resonator X1 is provided with an input pin 1 and an output pin 2 .

其中:in:

编码芯片U2的按键引脚K0至K3连接遥控按键S4至S1。4个按键可进行16种编码组合。可以理解,按键数目可实际需求进行扩充。The key pins K0 to K3 of the coding chip U2 are connected to the remote control keys S4 to S1. 4 keys can perform 16 kinds of coding combinations. It can be understood that the number of keys can be expanded according to actual needs.

编码芯片U2的输出引脚TXD串联限流电阻R6后连接至述高频发射芯片U1的输入引脚DAT,同时声表面高频谐振器X1的输出引脚2也连接至高频发射芯片U1的输入引脚DAT。编码芯片U2通过输出引脚TXD输出遥控信号至高频发射芯片U1的输入引脚DAT,声表面高频谐振器X1的通过输出引脚2输出高频载波信号至高频发射芯片U1的输入引脚DAT。The output pin TXD of the coding chip U2 is connected in series with the current limiting resistor R6 and then connected to the input pin DAT of the high-frequency transmitting chip U1. At the same time, the output pin 2 of the high-frequency surface acoustic resonator X1 is also connected to the high-frequency transmitting chip U1. Input pin DAT. The encoding chip U2 outputs the remote control signal to the input pin DAT of the high-frequency transmitting chip U1 through the output pin TXD, and the high-frequency carrier signal of the acoustic surface high-frequency resonator X1 outputs the high-frequency carrier signal to the input pin of the high-frequency transmitting chip U1 through the output pin 2. feet dat.

高频发射芯片U1的振荡引脚OSC、表面高频谐振器X1的输入引脚1连接振荡电路50,高频发射芯片U1的天线引脚ANT连接至功率放大电路60的输入端。The oscillation pin OSC of the high frequency transmitting chip U1 and the input pin 1 of the surface high frequency resonator X1 are connected to the oscillation circuit 50 , and the antenna pin ANT of the high frequency transmitting chip U1 is connected to the input end of the power amplifier circuit 60 .

请继续参考图2,本实用新型大功率发射电路100中的功率放大电路60包括功放三极管Q1,电阻R1,电感L4、L5,电容C1、C5。Please continue to refer to FIG. 2 , the power amplifier circuit 60 in the high-power transmitting circuit 100 of the present invention includes a power amplifier transistor Q1 , a resistor R1 , inductors L4 , L5 , and capacitors C1 , C5 .

其中,高频发射芯片U1的天线引脚ANT通过电容C3连接至功放三极管Q1的基极,同时功放三极管Q1的基极连接有与电容C3并联的偏置电阻R1,功放三极管Q1的集电极并联有电感L4及电容C1、C5,电阻R1及电感L4的另一端连接电源VCC,电容C1的另一端串联电感L5后连接至天线ANT,功放三极管Q1的发射极及电容C5的另一端接地。Among them, the antenna pin ANT of the high-frequency transmitter chip U1 is connected to the base of the power amplifier transistor Q1 through the capacitor C3, and the base of the power amplifier transistor Q1 is connected to the bias resistor R1 in parallel with the capacitor C3, and the collector of the power amplifier transistor Q1 is connected in parallel There is an inductor L4 and capacitors C1 and C5. The other end of the resistor R1 and the inductor L4 is connected to the power supply VCC. The other end of the capacitor C1 is connected to the antenna ANT in series with the inductor L5. The emitter of the power amplifier transistor Q1 and the other end of the capacitor C5 are grounded.

三极管Q1的基极作为功率放大电路60的输入端,高频发射芯片U1将第一次功率放大的遥控信号经U1的天线引脚ANT输出,并经过电容C3滤波电源的低频干扰后输入至三极管Q1的基极,然后经过三极管Q1的第二次功率放大后经过电感L5输出,并由至天线ANT对外发射。电感L4、L5,电容C1、C5进行滤波选频以匹配天线。The base of the transistor Q1 is used as the input terminal of the power amplifying circuit 60. The high-frequency transmitting chip U1 outputs the remote control signal of the first power amplification through the antenna pin ANT of U1, and filters the low-frequency interference of the power supply by the capacitor C3 and then inputs it to the transistor. The base of Q1 is then output through the inductor L5 after the second power amplification of the transistor Q1, and is transmitted from the antenna ANT to the outside. Inductors L4 and L5, and capacitors C1 and C5 perform filtering and frequency selection to match the antenna.

如图3所示,所述振荡电路50包括电感L1、L2及电容C2、C6。As shown in FIG. 3 , the oscillation circuit 50 includes inductors L1 and L2 and capacitors C2 and C6 .

所述电感L2与电容C6并联,且电感L2及电容C6的一端共同连接电源VCC,电容C6另一端接地,电感L2另一端连接表面高频谐振器X1的输入引脚1、电感L2的一端、及电容C2的一端,电感L1的另一端连接高频发射芯片U1的振荡引脚OSC,电容C2的另一端接地。振荡电路50为表面高频谐振器X1及高频发射芯片U1提供基础的工作频率。The inductor L2 is connected in parallel with the capacitor C6, and one end of the inductor L2 and the capacitor C6 is commonly connected to the power supply VCC, the other end of the capacitor C6 is grounded, and the other end of the inductor L2 is connected to the input pin 1 of the surface high-frequency resonator X1, one end of the inductor L2, and one end of the capacitor C2, the other end of the inductor L1 is connected to the oscillation pin OSC of the high frequency transmitting chip U1, and the other end of the capacitor C2 is grounded. The oscillation circuit 50 provides the basic operating frequency for the surface high-frequency resonator X1 and the high-frequency transmitting chip U1.

本实用新型提出的远距离遥控器的大功率发射电路100,通过高频发射芯片30将遥控信号进行第一次放大,再将第一次放大的信号经过功率放大电路60进行第二次放大,这样遥控器中的遥控信号经过大功率发射电路100的两次放大后其发射功率大大提高,可达到17dBm左右,可以进行远距离的遥控,以满足在智能家居等领域中的远距离遥控需求。The high-power transmitting circuit 100 of the long-distance remote control proposed by the present invention amplifies the remote control signal for the first time through the high-frequency transmitting chip 30, and then amplifies the signal amplified for the first time through the power amplifying circuit 60 for the second time. In this way, after the remote control signal in the remote control is amplified twice by the high-power transmitting circuit 100, the transmit power is greatly improved, and can reach about 17dBm, which can be used for long-distance remote control to meet the needs of long-distance remote control in fields such as smart homes.

以上所述仅为清楚地说明本实用新型所作的举例,并非因此限制本实用新型的专利范围,这里无法对所有的实施方式予以穷举,凡是在本实用新型的构思下,利用本实用新型技术方案中的内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本实用新型的专利保护范围内。The above is only an example to clearly illustrate the present invention, and is not intended to limit the patent scope of the present invention. It is impossible to list all the embodiments here. Equivalent structural transformations made by the content in the scheme, or direct/indirect application in other related technical fields are all included in the scope of patent protection of the present invention.

Claims (4)

1. A high-power high-frequency transmitting circuit of a remote controller is characterized by comprising a remote control key, a coding chip, a high-frequency transmitting chip, a sound surface high-frequency resonator, an oscillating circuit, a power amplifying circuit and an antenna;
the input end of the coding chip is connected with the remote control key, the output end of the coding chip is connected with the high-frequency transmitting chip, and the coding chip codes a key signal of the remote control key and outputs a coding signal to the high-frequency transmitting chip;
the high-frequency transmitting chip is provided with a signal input end, an oscillation input end and a signal output end, the signal input end of the high-frequency transmitting chip is connected with the output end of the sound surface high-frequency resonator and the output end of the coding chip, the signal output end of the high-frequency transmitting chip is connected with the power amplifying circuit, and the high-frequency transmitting chip modulates the coding signal input by the coding chip and the high-frequency signal input by the sound surface high-frequency resonator and amplifies the power for the first time;
the oscillation circuit is connected with the input end of the sound surface high-frequency resonator and the oscillation input end of the high-frequency transmitting chip;
the input end of the power amplifying circuit is connected with the signal output end of the high-frequency transmitting chip, the output end of the power amplifying circuit is connected with the antenna, and the modulated signal input by the high-frequency transmitting chip is subjected to secondary power amplification by the power amplifying circuit and then transmitted through the antenna.
2. The high-power high-frequency transmitting circuit according to claim 1, wherein the high-frequency transmitting chip U1 is model number TDH9950, and is provided with an input pin DAT, a power supply pin VCC, a ground pin GND, an oscillation pin OSC, and an antenna pin ANT;
the encoding chip U2 is EV1527 in model, and is provided with an output pin TXD and key pins K0-K3;
the sound surface high-frequency resonator X1 is provided with an input pin 1 and an output pin 2;
wherein:
the key pins K0 to K3 of the coding chip U2 are connected with remote control keys S4 to S1;
an output pin TXD of the coding chip U2 is connected with an input pin DAT of the high-frequency emission chip U1 after being connected with a current-limiting resistor R6 in series, and an output pin 2 of the sound surface high-frequency resonator X1 is also connected with the input pin DAT of the high-frequency emission chip U1;
the oscillation pin OSC of the high-frequency transmitting chip U1 and the input pin 1 of the surface high-frequency resonator X1 are connected to an oscillation circuit, and the antenna pin ANT of the high-frequency transmitting chip U1 is connected to an input terminal of a power amplification circuit.
3. The high-power high-frequency transmitting circuit according to claim 2, wherein the power amplifying circuit comprises a power amplifier transistor Q1, a resistor R1, inductors L4 and L5, capacitors C1 and C5;
an antenna pin ANT of the high-frequency transmitting chip U1 is connected to a base electrode of a power amplifier triode Q1 through a capacitor C3, a base electrode of the power amplifier triode Q1 is connected with a bias resistor R1 connected with a capacitor C3 in parallel, a collector electrode of the power amplifier triode Q1 is connected with an inductor L4, capacitors C1 and C5 in parallel, the other ends of the resistor R1 and the inductor L4 are connected with a power supply VCC, the other end of the capacitor C1 is connected with an inductor L5 in series and then connected to the antenna ANT, and an emitting electrode of the power amplifier triode Q1 and the other end of the capacitor C5 are grounded.
4. The high power high frequency transmitting circuit according to claim 2, wherein the oscillating circuit comprises inductors L1, L2 and capacitors C2, C6;
the inductor L2 is connected in parallel with the capacitor C6, one end of the inductor L2 and one end of the capacitor C6 are connected with a power supply VCC, the other end of the capacitor C6 is grounded, the other end of the inductor L2 is connected with the input pin 1 of the surface high-frequency resonator X1, one end of the inductor L2 and one end of the capacitor C2, the other end of the inductor L1 is connected with the oscillation pin OSC of the high-frequency emission chip U1, and the other end of the capacitor C2 is grounded.
CN202020504116.XU 2020-04-08 2020-04-08 High-power transmitting circuit of remote controller Expired - Fee Related CN211604293U (en)

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