CN211601249U - refrigerator - Google Patents

Abstract

The utility model provides a refrigerator. The refrigerator includes: a box, the interior of which defines at least a first storage space and a second storage space; a semiconductor refrigeration system, which provides cooling capacity to the first storage space; a compression refrigeration system, which provides cooling to the second storage space cooling capacity, and reduce the temperature of the hot end of the semiconductor refrigeration system; the air supply component is arranged in the first storage space, and the air supply component includes a front cover, a rear cover and a cross-flow fan, and the cross-flow fan is arranged on the front cover and the rear cover In the defined air duct, the cooling capacity generated by the semiconductor refrigeration system is transmitted to the first storage space. The front side of the front cover is provided with an air supply port at the position corresponding to the cross-flow fan, and the lower part of the front side of the front cover is provided with an air return port. The rear side and the top of the back cover jointly define an air intake. In the refrigerator of the utility model, the structure of the air supply assembly is matched with the semiconductor refrigeration system, and the cold energy generated by the semiconductor refrigeration system is transmitted to the first storage space, so that the first storage space can realize deep cooling.

Description

refrigerator

technical field

The utility model relates to the field of household appliances, in particular to a refrigerator.

Background technique

With the continuous development of society and the continuous improvement of people's living standards, people's life rhythm is getting faster and faster, and they may buy and store a lot of food at one time. In order to ensure the storage effect of food, refrigerators have become one of the indispensable household appliances in people's daily life.

The current refrigerators can be generally divided into compression refrigeration refrigerators and semiconductor refrigeration refrigerators according to different types of refrigeration systems. The temperature adjustment accuracy of compression refrigeration refrigerators is relatively low, generally ±3.5 °C, while the temperature adjustment accuracy of semiconductor refrigeration refrigerators can reach ±0.1 °C. Although the temperature adjustment accuracy of semiconductor refrigeration refrigerators is high, it has the following shortcomings: the semiconductor chips in the semiconductor refrigeration system are easily affected by the external ambient temperature. The increase in temperature in turn reduces the cooling capacity. Due to the low efficiency of semiconductor refrigeration systems, they can only be used in small-volume general refrigeration products or to dissipate heat for some key components, and cannot achieve low-temperature refrigeration. In addition, when the semiconductor refrigeration system is applied to a small-volume common refrigeration product, the conventional air duct structure cannot meet the requirements for setting the semiconductor refrigeration system due to the small volume of the refrigeration product.

Utility model content

One purpose of the present invention is to match the air supply assembly of the refrigerator with the semiconductor refrigeration system.

A further purpose of the present invention is to achieve deep cooling in a specific storage space of the refrigerator to meet the storage requirements of ingredients.

In particular, the present invention provides a refrigerator, comprising: a box body, the interior of which defines at least a first storage space and a second storage space; a semiconductor refrigeration system, configured to provide cooling capacity to the first storage space; a compression refrigeration system, configured to provide cooling capacity to the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and an air supply assembly, disposed in the first storage space, and the air supply assembly includes a front cover, a rear cover and a The cross-flow fan is arranged in the air duct defined by the front cover and the rear cover, and is configured to transmit the cooling capacity generated by the semiconductor refrigeration system to the first storage space. The front side of the front cover corresponds to the cross-flow fan. The air supply port is provided with an air return port on the lower part of the front side of the front cover, and an air suction port is jointly defined on the rear side of the front cover and the top of the rear cover.

Optionally, the semiconductor refrigeration system includes: a semiconductor chip, a hot heat exchanger and a cold heat exchanger, wherein the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, and the semiconductor chip has a hot end and a cold end, and the heat The heat exchanger is partially adhered to the hot end, and the cold heat exchanger is partially adhered to the cold end.

Optionally, the compression refrigeration system includes: a compressor, a condenser, a capillary tube and an evaporator, and the heat exchanger is arranged between the capillary tube and the evaporator, and the low-temperature refrigerant absorbs heat when it flows through the heat exchanger, reducing the heat. The temperature of the cold end is also lowered, and the cold end of the cold end is conducted to the cold heat exchanger, and the cross-flow fan transfers the cold heat of the cold heat exchanger to the first storage space.

Optionally, the rear cover includes a vertical part and two raised parts, the two raised parts extend backward from two sides of the top of the vertical part respectively, and the cross-flow fan is clamped between the two raised parts, and the cross-flow fan is clamped between the two raised parts. Below the fan is the air intake.

Optionally, the front cover includes a flat plate portion and an extension portion, and the extension portion extends rearward from the top of the flat plate portion, and the rear side of the extension portion and the top of the rear cover together define an air suction port.

Optionally, the side of the cold heat exchanger facing the vertical part is provided with a plurality of fins, and a longitudinal channel is formed between two adjacent fins, so that the air flows through the cold heat exchanger for heat exchange, and the plurality of fins are formed. The fins are arranged below the cross-flow fan.

Optionally, the air supply assembly further includes: two shutters, respectively disposed on the left and right sides of the cold heat exchanger.

Optionally, the air supply assembly further includes: a heat insulating member, disposed in the air duct, the shape of which is matched with the rear cover.

Optionally, the top center of the heat insulating member is a slope gradually decreasing from front to back, so as to discharge the residual moisture during defrosting.

Optionally, an air induction hood is provided at the air supply port to guide the wind blown by the cross-flow fan to the first storage space; and a plurality of dividing ribs are evenly arranged longitudinally inside the air induction hood to make the air supply uniform.

The refrigerator of the present invention comprises: a box body, the interior of which defines at least a first storage space and a second storage space; a semiconductor refrigeration system configured to provide cooling capacity to the first storage space; a compression refrigeration system configured to Provide cold energy to the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and an air supply assembly, which is arranged in the first storage space, and the air supply assembly includes a front cover, a rear cover and a cross-flow fan. The fan is arranged in the air duct defined by the front cover and the rear cover, and is configured to transmit the cooling energy generated by the semiconductor refrigeration system to the first storage space. The lower part of the front side is provided with an air return port, and the rear side of the front cover and the top of the rear cover jointly define an air suction port. The structure of the air supply assembly is matched with the semiconductor refrigeration system, and the cooling capacity generated by the semiconductor refrigeration system can be smoothly transferred to the first storage space. In addition, the compression refrigeration system reduces the temperature of the hot end of the semiconductor refrigeration system, which can promote the semiconductor refrigeration system to provide cold energy to the first storage space, thereby enabling the first storage space to achieve deep cooling, meeting the storage requirements of food ingredients, and improving the storage of food ingredients. Effect.

Further, the refrigerator of the present invention can ensure that the return air completely passes through the cold heat exchanger for heat exchange, preventing the return air from being sent to the first storage space through other paths without passing through the cold heat exchanger. The air that has been exchanged by the cold heat exchanger directly reaches the air suction port, and can smoothly enter the air duct through the air suction port, and then is blown from the air supply port to the first storage space by the cross-flow fan. The overall structure of the air supply assembly occupies a small volume and can ensure smooth air circulation.

Furthermore, in the refrigerator of the present invention, when the low-temperature refrigerant of the compression refrigeration system flows through the heat exchanger, it absorbs heat, reduces the temperature of the hot end, and the temperature of the cold end decreases accordingly, and the cold energy of the cold end is conducted to the cold heat exchanger. The rear cross-flow fan transmits the cooling capacity of the cold heat exchanger to the first storage space. Combined with the traditional compression refrigeration system of the refrigerator, the heat of the heat exchanger is quickly taken away by the low-temperature refrigerant, and the hot end is maintained in a low temperature environment. The cross-flow fan adopts strong convection heat exchange to achieve deep cooling in the first storage space. The energy consumption during the cooling process is low, and the semiconductor refrigeration system directly converts energy from electrical energy, which effectively avoids noise and improves user experience.

The above and other objects, advantages and features of the present invention will be more apparent to those skilled in the art from the following detailed description of the specific embodiments of the present invention in conjunction with the accompanying drawings.

Description of drawings

Hereinafter, some specific embodiments of the present invention will be described in detail by way of example and not limitation with reference to the accompanying drawings. The same reference numbers in the figures designate the same or similar parts or parts. It will be understood by those skilled in the art that the drawings are not necessarily to scale. In the attached picture:

1 is a schematic structural diagram of a refrigerator according to an embodiment of the present invention;

2 is a schematic diagram of the connection structure of a compression refrigeration system and a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

3 is a schematic structural diagram of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

4 is a schematic structural diagram of a heat exchanger of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

Fig. 5 is the exploded structure schematic diagram of the heat exchanger shown in Fig. 4;

6 is a schematic diagram of a semiconductor refrigeration system in a refrigerator providing cold energy to the first storage space according to an embodiment of the present invention;

7 is a schematic structural diagram of a semiconductor refrigeration system and an air supply assembly in a refrigerator according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of the semiconductor refrigeration system and the air supply assembly from another perspective in FIG. 7;

9 is a front view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

10 is a rear view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

11 is a bottom view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

FIG. 12 is an exploded schematic diagram of an air supply assembly in a refrigerator according to an embodiment of the present invention; and

Fig. 13 is a partial structural schematic diagram of a refrigerator according to an embodiment of the present invention.

Detailed ways

This embodiment provides a refrigerator. The structure of the air supply assembly is matched with the semiconductor refrigeration system, so that the cold energy generated by the semiconductor refrigeration system can be smoothly transferred to the first storage space; the compression refrigeration system is used to reduce the thermal conductivity of the hot end of the semiconductor refrigeration system. The temperature can promote the semiconductor refrigeration system to provide cooling capacity to the first storage space, thereby enabling the first storage space to achieve deep cooling, meeting the storage requirements of the ingredients, and improving the storage effect of the ingredients. 1 is a schematic structural diagram of a refrigerator 100 according to an embodiment of the present invention, FIG. 2 is a schematic structural diagram of a connection between a compression refrigeration system 140 and a semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, and FIG. A schematic structural diagram of a semiconductor refrigeration system 130 in a refrigerator 100 according to an embodiment of the present invention, FIG. 4 is a structural schematic diagram of a heat exchanger 132 of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, and FIG. 5 is FIG. 4 6 is a schematic diagram of the semiconductor refrigeration system 130 in the refrigerator 100 providing cooling capacity to the first storage space 111 according to an embodiment of the present invention. As shown in FIGS. 1 to 6 , the refrigerator 100 of this embodiment may generally include: a box body 110 , a semiconductor refrigeration system 130 , a compression refrigeration system 140 , and an air supply assembly 170 .

The inside of the box body 110 defines at least a first storage space 111 and a second storage space 112 . In fact, the number and structure of storage spaces can be configured according to needs. Moreover, the storage space can be configured as a refrigerating space, a freezing space, a temperature-changing space or a fresh-keeping space according to different uses. Each storage space can be divided into a plurality of storage areas by a partition board, and use a shelf or drawer to store items. As shown in FIG. 1 , four storage spaces may be defined inside the box body 110 of the refrigerator 100 of this embodiment: a first storage space 111 , a second storage space 112 , a third storage space 113 and a fourth storage space Object space 114. The second storage space 112 may be located at the top and set as a refrigerating space; the first storage space 111 and the third storage space 113 may be arranged side by side below the second storage space 112, and the first storage space 111 may be Set as a cryogenic space, the third storage space 113 can be set as a temperature-changing space; the fourth storage space 114 can be set at the bottom and set as a freezing space.

The refrigerator 100 of this embodiment may further include: a door body 120, which is pivotally disposed on the front surface of the box body 110, so that the user can open and close the storage space. The door bodies 120 may be arranged corresponding to the storage spaces, that is, each storage space corresponds to one or more door bodies 120 . The door body 120 can be pivotally opened or can be opened by a drawer. For example, the door body 120 corresponding to the second storage space 112 can be opened by a pivot, and the other storage spaces can be opened by a drawer.

The semiconductor refrigeration system 130 may be configured to provide cooling capacity to the first storage space 111 . The compression refrigeration system 140 may be configured to provide refrigeration to the second storage space 112 . Since the refrigerator 100 of this embodiment is provided with a third storage space 113 and a fourth storage space 114 in addition to the first storage space 111 and the second storage space 112 , the first storage space 111 is refrigerated by a semiconductor In addition to the cooling capacity provided by the system 130 , the cooling capacity of the other storage spaces can be provided by the compression refrigeration system 140 .

It should be noted that the cooling capacity provided by the compression refrigeration system 140 to various types of storage spaces is different, so that the temperatures in the various types of storage spaces are also different. The temperature in the refrigerated space is generally between 2°C and 10°C, preferably between 4°C and 7°C. The temperature range in the freezing space is generally -22°C to -14°C. The optimal storage temperature for different types of items is not the same, and the storage space suitable for storage is also different. For example, fruits and vegetables are suitable for storing in a refrigerated space or a fresh-keeping space, and meat food is suitable for storing in a freezing space. A heating device may be provided inside the temperature-changing space to heat the food.

More importantly, in addition to providing cooling capacity to the storage space, the compression refrigeration system 140 may also be configured to reduce the temperature of the hot end 136 of the semiconductor refrigeration system 130 . It is difficult for the hot end 136 of the semiconductor refrigeration system 130 to dissipate heat, which may cause the temperature of the hot end 136 to increase, thereby reducing the cooling capacity. The compression refrigeration system 140 reduces the temperature of the hot end 136 of the semiconductor refrigeration system 130 in a timely manner, which can facilitate the semiconductor refrigeration system 130 to provide cooling capacity to the first storage space 111 , thereby enabling the first storage space 111 to achieve deep cooling, satisfying the storage of food ingredients. requirements to improve the storage effect of ingredients.

As shown in FIG. 6 , the air supply assembly 170 may be disposed in the first storage space 111 , and the air supply assembly 170 includes a front cover 171 , a rear cover 172 and a cross-flow fan 173 . The cross-flow fan 173 is disposed in the air duct 160 defined by the front cover 171 and the rear cover 172 , and is configured to transmit the cooling energy generated by the semiconductor refrigeration system 130 to the first storage space 111 . The front side of the front cover 171 is provided with an air supply port 161 corresponding to the position of the cross-flow fan 173 , the lower part of the front side of the front cover 171 is provided with an air return port 162 , and the rear side of the front cover 171 and the top of the rear cover 172 together define an air suction port 163 .

It should be noted that the box body 110 may further include an inner tank 115 , and the air supply assembly 170 may be disposed on the back of the inner tank 115 of the first storage space 111 . The “front” and “rear” in the front cover 171 and the rear cover 172 are directional descriptions in the normal use state of the refrigerator 100 , that is, the front cover 171 is closer to the door body 120 than the rear cover 172 . The positions of the air supply port 161 , the air return port 162 and the air suction port 163 are set to match the air inlet and outlet modes of the cross-flow fan 173 to promote air circulation. The included angle between the air inlet and outlet directions of the cross-flow fan 173 is 90°, so that the lower part of the cross-flow fan 173 can enter the air and the front part can discharge the air. In the refrigerator 100 of the present embodiment, the structure of the air supply assembly 170 is matched with the semiconductor refrigeration system 130 , and the cooling capacity generated by the semiconductor refrigeration system 130 can be smoothly transferred to the first storage space 111 .

As shown in FIGS. 2 and 3 , the semiconductor refrigeration system 130 may include: a semiconductor chip 131 , a hot heat exchanger 132 and a cold heat exchanger 133 . The semiconductor chip 131 is disposed between the hot heat exchanger 132 and the cold heat exchanger 133, and the semiconductor chip 131 has a hot end 136 and a cold end 137, the hot heat exchanger 132 is partially adhered to the hot end 136, and the cold heat exchanger 133 is partially adhered to the cold end 137 .

In a preferred embodiment, the semiconductor refrigeration system 130 may further include: a thermally conductive layer 134 and a thermal insulation layer 135 . The thermal conductive layer 134 is made of high thermal conductivity material, the heat exchanger 132 is partially adhered to the hot end 136 through the thermal conductive layer 134 , and the cold heat exchanger 133 is partially adhered to the cold end 137 through the thermal conductive layer 134 . Due to the high thermal conductivity of the thermally conductive layer 134 , good heat conduction can be formed between the heat exchanger 132 and the hot end 136 and between the cold end 137 and the cold heat exchanger 133 . Specifically, the material of the thermally conductive layer 134 may include, but is not limited to, thermally conductive silicone grease and liquid metal.

The material of the heat insulating layer 135 is a material with low thermal conductivity, and the heat insulating layer 135 is disposed between the heat exchanger 132 and the cold heat exchanger 133 at a position other than the semiconductor chip 131, and is configured to insulate the heat heat exchanger 132 and the cold heat exchanger 131. Heater 133. Since the semiconductor chip 131 is usually thin, the distance between the heat heat exchanger 132 and the cold heat exchanger 133 is relatively short, and an insulating layer 135 is added between the heat heat exchanger 132 and the cold heat exchanger 133 outside the semiconductor chip 131 . The heat transfer between the hot heat exchanger 132 and the cold heat exchanger 133 can be effectively prevented, which affects the cooling effect. Specifically, the material of the heat insulating layer 135 may include, but is not limited to: foam, foam material, PE cotton, and aerogel.

As shown in FIG. 2, the compression refrigeration system 140 may include: a compressor 141, a condenser 142, a capillary tube 143 and an evaporator 144, and the heat exchanger 132 is arranged between the capillary tube 143 and the evaporator 144, and the low-temperature refrigerant flows When passing through the heat exchanger 132, heat is absorbed, the temperature of the hot end 136 is lowered, and the temperature of the cold end 137 is decreased accordingly. The cold energy is transferred to the first storage space 111 . As shown in FIGS. 2 to 5 , the heat exchanger 132 is connected to the capillary tube 143 through the liquid inlet pipe 151 , and is connected to the evaporator 144 through the liquid outlet pipe 152 .

In addition, the heat exchanger 132 is in the shape of a flat plate with a groove 155 formed therein. The low-temperature refrigerant flows into the groove 155 through the liquid inlet pipe 151 , flows along the groove 155 and then flows out through the liquid outlet pipe 152 . Preferably, the shape of the grooves 155 is a curve with a preset number of inflection points, which can increase the flow area of the low-temperature refrigerant inside the heat exchanger 132 , improve the heat exchange efficiency, and effectively reduce the temperature of the hot end 136 . In a specific embodiment, as shown in FIGS. 4 and 5 , the heat exchanger 132 may include a cover plate 153 and a back plate 154 , the back plate 154 is provided with a groove 155 , and the cover plate 153 is covered with in the groove 155. In some other embodiments, the inside of the heat exchanger 132 may also use other forms such as punching holes or arranging copper pipes to realize the flow of the low-temperature refrigerant inside the heat exchanger 132 .

In a specific embodiment, after the temperature of the hot end 136 is lowered, the temperature of the cold end 137 is subsequently lowered to the first temperature value. The refrigeration principle of the semiconductor refrigeration system 130 mainly utilizes the Peltier effect: when a current passes through a circuit composed of different conductors, in addition to generating irreversible Joule heat, the joints of different conductors will be separated according to the direction of the current. Endothermic and exothermic phenomena occur. After the semiconductor chip 131 is powered on, a temperature difference occurs between the hot end 136 and the cold end 137 . Therefore, after the temperature of the hot end 136 is lowered, the temperature of the cold end 137 is lowered to the first temperature value.

Further, after the temperature of the cold end 137 decreases to the first temperature value, the cold energy of the cold end 137 is conducted to the cold heat exchanger 133 . It should be noted that the cold end 137 and the cold heat exchanger 133 are disposed on the side close to the first storage space 111 so as to reduce the temperature of the first storage space 111 . Specifically, an air supply port 161 may be provided at the corresponding position of the cross-flow fan 173 to send cold energy to the first storage space 111; The air is returned to the semiconductor refrigeration system 130, thus forming an air circulation.

In a preferred embodiment, after the cold heat of the cold heat exchanger 133 is transferred to the first storage space 111, the temperature of the first storage space 111 is lowered to a second temperature value, wherein the first temperature value is lower At the second temperature value, the second temperature value is -30°C to -60°C. That is to say, there will be a certain loss in the process of conducting the cold energy of the cold end 137 to the first storage space 111 , for example, the first temperature value may be 5°C lower than the second temperature value. The second temperature value of the first storage space 111 can reach -30°C to -60°C, which can meet the storage requirements of some special ingredients.

A specific embodiment will be described below: when the compression refrigeration system 140 is operating, the low-temperature refrigerant absorbs heat when it flows through the heat exchanger 132, and the heat exchanger 132 and the hot end 136 are adhered by the heat conducting layer 134 to achieve The temperature of the hot end 136 is lowered. When the semiconductor chip 131 is energized, a temperature difference is generated between the hot end 136 and the cold end 137 due to the Peltier effect, and the temperature of the cold end 137 decreases to the first temperature value. Conducted to the cold heat exchanger 133, the cross-flow fan 173 in the air duct 160 transmits the cold heat of the cold heat exchanger 133 to the first storage space 111, so that the internal temperature is lowered to the second temperature value, realizing deep cooling Function.

It should be noted that, when the semiconductor chip 131 is not energized, the compression refrigeration system 140 operates normally, and the low-temperature refrigerant still flows through the heat exchanger 132 to cool the hot end 136, although there is no temperature difference between the hot end 136 and the cold end 137, However, the cold energy can still be transferred to the first storage space 111 through the cold end 137, the cold heat exchanger 133, and the cross-flow fan 173 in sequence. Although the amount of cooling transmitted to the first storage space 111 is smaller than that when the semiconductor chip 131 is powered on, the first storage space 111 can still be used as a normal freezing space without additional power consumption. In addition, when the compression refrigeration system 140 stops running, by applying a reverse voltage to the semiconductor chip 131, the hot end 136 and the cold end 137 can be interchanged, so that the cold heat exchanger 133 can be heated and defrosted.

It should be emphasized that the temperature difference between the hot end 136 and the cold end 137 is not fixed. In a low temperature environment, the temperature difference between the two may be 20°C to 30°C, and in a normal environment, the temperature of the two will be larger. Some. That is to say, in a low temperature environment, it is difficult to realize the low temperature of the cold end 137, and it is also difficult to realize the cryogenic function of the storage space. The refrigerator 100 of this embodiment, combined with the traditional compression refrigeration system 140 , quickly takes away the heat of the heat exchanger 132 by the low-temperature refrigerant, maintains the hot end 136 in a low temperature environment, and uses the hot end 136 of the semiconductor chip 131 and the cold end 137's own temperature difference, the temperature of the cold end 137 is further reduced, and then the cross-flow fan 173 is used for strong convection heat exchange to realize the deep cooling of the first storage space 111. The energy consumption during the cooling process is low, and the semiconductor refrigeration system 130 is powered by electric energy. Directly convert energy, effectively avoid noise, and improve user experience.

7 is a schematic structural diagram of the semiconductor refrigeration system 130 and the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, and FIG. 8 is a structural schematic diagram of the semiconductor refrigeration system 130 and the air supply assembly 170 in FIG. 7 from another perspective. 9 is a front view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, FIG. 10 is a rear view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, and FIG. 11 is according to the present invention A bottom view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, FIG. 12 is an exploded schematic view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, and FIG. 13 is the refrigerator 100 according to an embodiment of the present invention. Schematic diagram of the local structure. FIG. 13 is actually a structural diagram of the air supply assembly 170 after removing the front cover 171 and the cold heat exchanger 133 , so as to show the positional relationship between the cross-flow fan 173 and the cold heat exchanger 133 .

As shown in FIG. 12 , the rear cover 172 may include a vertical portion 174 and two protruding portions 177 . The two protruding portions 177 extend backward from the top and two sides of the vertical portion 174 respectively, and the cross-flow fan 173 is clamped on the two protruding portions 177 . Between the protruding portions 177 , the air suction port 163 is located below the cross-flow fan 173 . The front cover 171 may include a flat plate part 178 and an extension part 179 , and the extension part 179 extends rearward from the top of the flat plate part 178 .

As shown in FIG. 12 and FIG. 13 , the side of the cold heat exchanger 133 facing the vertical portion 174 is provided with a plurality of fins 138 , and a longitudinal channel 139 is formed between two adjacent fins 138 , so that the air flows through the cold heat exchanger 138 . The heat exchanger 133 performs heat exchange. In addition, the plurality of fins 138 are provided below the cross-flow fan 173 . The heat-exchanged air enters the air duct 160 directly through the air suction port 163 below the cross-flow fan 173 , and then the cross-flow fan 173 changes its direction by 90° and blows out from the front air supply port 161 . The air supply assembly 170 further includes: two shutters 175 , which are respectively disposed on the left and right sides of the cold heat exchanger 133 . The limitation of the shutter 175 and the vertical portion 174 of the rear cover 172 enables the air at the bottom of the cold heat exchanger 133 to flow only along the longitudinal passages 139 of the fins 138 to ensure that the air is completely blown out by the cross-flow fan 173 after heat exchange. . In a preferred embodiment, the shielding member 175 may be made of foam.

It should be noted that the heights of the plurality of fins 138 of the cold heat exchanger 133 are the same, wherein the height of the fins 138 refers to the size of the fins 138 in the front-rear direction. Moreover, as shown in FIG. 7 , FIG. 9 and FIG. 10 , a plurality of air return ports 162 may be provided, and the sizes of the plurality of air return ports 162 are the same. In this way, the return air can reach the bottom of the cold heat exchanger 133 evenly through the plurality of return air ports 162, and then uniformly exchange heat through the plurality of fins 138 of the cold heat exchanger 133, so that the distribution of the air volume to the cold heat exchanger 133 is more reasonable. Improve heat exchange efficiency.

As shown in FIG. 12 , the air supply assembly 170 further includes: a heat insulating member 176 disposed in the air duct 160 , the shape of which is matched with the rear cover 172 . The center of the top of the heat insulating member 176 is a slope gradually decreasing from front to back, so as to discharge the residual moisture during defrosting. It should be noted that the lowest point of the slope at the center of the top of the heat insulating member 176 is lower than the cross-flow fan 173 , and the highest point of the slope is also lower than the air supply port 161 of the front cover 171 , so as not to affect the air outlet of the cross-flow fan 173 . The heat insulating member 176 has a heat insulating function, which can effectively prevent the temperature rise of the first storage space 111 from being too large when a reverse voltage is applied to defrost the cold heat exchanger 133 .

When defrosting the cold heat exchanger 133, residual moisture may exist in the air duct 160. Therefore, the top center of the heat insulating member 176 is set as a slope that gradually decreases from front to back, so that the residual moisture can be discharged in time to avoid Affect the work of the cross-flow fan 173. Specifically, the residual moisture can be discharged to the cold heat exchanger 133 and discharged to the outside of the refrigerator 100 together with the defrosting water of the cold heat exchanger 133 . It should be noted that, as shown in FIG. 12 , the bottoms of the rear cover 172 and the heat insulating member 176 are both higher than the air return port 162 of the front cover 171 . As mentioned above, the lower part of the front side of the front cover 171 is provided with the air return port 162, which actually means that the bottom of the back cover 172 and the heat insulating member 176 are above the air return port 162, so that the air passing through the air return port 162 can reach the cold heat exchange smoothly. the bottom of the device 133.

As shown in FIG. 7 , FIG. 8 , FIG. 9 and FIG. 12 , a draft hood 166 may be provided at the air supply port 161 to guide the wind blown by the cross-flow fan 173 to the first storage space 111 . The draft hood 166 has a guiding effect on the air supply direction, so as to prevent the wind blown by the cross-flow fan 173 from directly returning into the return air port 162, thereby effectively avoiding a short circuit between the supply air and the return air. In addition, a plurality of dividing ribs 167 may be evenly arranged in the longitudinal direction inside the draft hood 166 to make the air supply uniform.

Since the air supply assembly 170 can be disposed on the back of the inner pot 115 of the first storage space 111 , in fact, the inner pot 115 cooperates to define the air circulation path. For example, when the return air reaches the bottom of the cold heat exchanger 133 from the return air port 162, the bottom of the inner tank 115 is limited. In short, after the temperature of the air in the first storage space 111 rises, the air returns to the bottom of the cold heat exchanger 133 through the return air port 162, flows upward through the cold heat exchanger 133 for heat exchange, and then enters the air duct 160 through the air suction port 163, and then enters the air duct 160 through the air suction port 163. It is blown out through the air outlet 161 via the cross-flow fan 173, thus forming an air circulation.

In the refrigerator 100 of the present embodiment, the structure of the air supply assembly 170 is matched with the semiconductor refrigeration system 130 , and the cooling capacity generated by the semiconductor refrigeration system 130 can be smoothly transferred to the first storage space 111 . In addition, the compression refrigeration system 140 lowers the temperature of the hot end 136 of the semiconductor refrigeration system 130, which can facilitate the semiconductor refrigeration system 130 to provide cooling capacity to the first storage space 111, thereby enabling the first storage space 111 to achieve deep cooling to meet the requirements of food ingredients. Storage requirements, improve the storage effect of ingredients.

Further, the refrigerator 100 of this embodiment can ensure that the return air completely passes through the cold heat exchanger 133 for heat exchange, preventing the return air from being sent to the first storage space 111 through other paths without passing through the cold heat exchanger 133 for heat exchange. The air exchanged by the cold heat exchanger 133 directly reaches the air suction port 163 , and can smoothly enter the air duct 160 through the air suction port 163 , and then is blown from the air supply port 161 to the first storage space 111 by the cross-flow fan 173 . The overall structure of the air supply assembly 170 occupies a small volume and can ensure smooth air circulation.

Furthermore, in the refrigerator 100 of the present embodiment, the low-temperature refrigerant of the compression refrigeration system 140 absorbs heat when it flows through the heat exchanger 132 , reducing the temperature of the hot end 136 , and the temperature of the cold end 137 decreases accordingly, and the cold end 137 The cooling capacity of the cold heat exchanger 133 is transferred to the first storage space 111 after the cross-flow fan 173 transfers the cooling capacity of the cold heat exchanger 133 to the first storage space 111 . Combined with the traditional compression refrigeration system 140 of the refrigerator 100, the heat of the heat exchanger 132 is quickly taken away by the low-temperature refrigerant, the hot end 136 is maintained in a low temperature environment, and the temperature difference between the hot end 136 and the cold end 137 of the semiconductor chip 131, The temperature of the cold end 137 is further lowered, and then the cross-flow fan 173 is used for strong convection heat exchange to realize the deep cooling of the first storage space 111. The energy consumption during the cooling process is low, and the semiconductor refrigeration system 130 directly converts energy from electric energy, effectively Avoid noise and improve user experience.

By now, those skilled in the art will recognize that although various exemplary embodiments of the present invention have been shown and described in detail herein, without departing from the spirit and scope of the present invention, Numerous other variations or modifications consistent with the principles of the present invention are directly identified or derived from the disclosure of the present invention. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims (10)

1. A refrigerator, characterized by comprising:

the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body;

the semiconductor refrigeration system is configured to provide cold energy to the first storage space;

the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and

the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and a cross-flow fan,

the cross-flow fan is arranged in an air duct defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigerating system to the first storage space,

the front side of the front cover is provided with an air supply outlet corresponding to the position of the cross-flow fan, the lower part of the front side of the front cover is provided with an air return inlet, and the rear side of the front cover and the top of the rear cover jointly define an air suction inlet.

2. The refrigerator according to claim 1,

the semiconductor refrigeration system includes: a semiconductor chip, a hot heat exchanger and a cold heat exchanger, wherein the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, and

the semiconductor chip has the hot side and the cold side, the hot heat exchanger is partially bonded to the hot side, and the cold heat exchanger is partially bonded to the cold side.

3. The refrigerator according to claim 2,

the compression refrigeration system includes: a compressor, a condenser, a capillary tube and an evaporator, and

the heat exchanger is arranged between the capillary tube and the evaporator, a low-temperature refrigerant absorbs heat when flowing through the heat exchanger, the temperature of the hot end is reduced, the temperature of the cold end is reduced accordingly, and the cold energy of the cold end is transmitted to the cold heat exchanger and then transmitted to the first storage space by the cross flow fan.

4. The refrigerator according to claim 3,

the rear cover includes a vertical portion and two convex portions,

two of the protrusions extend backward from two sides of the top of the vertical part, respectively, and

the cross-flow fan is clamped between the two protruding portions, and the air suction opening is formed below the cross-flow fan.

5. The refrigerator according to claim 4,

the front cover includes a flat plate portion and an extended portion, and

the extension part extends backwards from the top of the flat plate part,

the rear side of the extension part and the top of the rear cover jointly define the air suction opening.

6. The refrigerator according to claim 5,

a plurality of fins are arranged on one side of the cold heat exchanger facing the vertical part, and a longitudinal channel is formed between every two adjacent fins so as to lead the air to flow through the cold heat exchanger for heat exchange, and

the plurality of fins are arranged below the cross flow fan.

7. The refrigerator of claim 6, wherein the air supply assembly further comprises:

and the two shielding pieces are respectively arranged at the left side and the right side of the cold heat exchanger.

8. The refrigerator of claim 7, wherein the air supply assembly further comprises:

and the heat preservation piece is arranged in the air duct, and the shape of the heat preservation piece is matched with that of the rear cover.

9. The refrigerator according to claim 8,

the top center of the heat preservation piece is an inclined plane which gradually decreases from front to back so as to discharge residual moisture during defrosting.

10. The refrigerator according to claim 1,

an induced draft cover is arranged at the air supply port to guide the air blown out by the cross flow fan to the first storage space; and is

A plurality of partition ribs are uniformly arranged in the draught hood in the longitudinal direction, so that air supply is uniform.

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