CN211509633U - Cooling device and switching power supply system - Google Patents

Abstract

The utility model relates to a power electronic equipment's cooling technology field, concretely relates to cooling device and switching power supply system. The utility model discloses the manufacturing cost and the running cost that aim at solving current cooling device existence are higher, the radiating efficiency is lower to and there is the potential safety hazard scheduling problem. The heating device is completely or partially immersed into the liquid phase-change heat exchange working medium, the phase-change heat exchange working medium absorbs heat of the heating device and changes into gas in a phase mode, the gas is condensed and releases heat when contacting with the surface of the shell or the heat dissipation device and changes into liquid in a phase mode, and the circulation is carried out in the way, so that the cooling of the heating device is realized. The structure and the heat exchange process of the utility model are simple; the phase-change heat exchange working medium has high latent heat of vaporization and few system heat exchange links, and the phase-change rate of the phase-change heat exchange working medium can be automatically adjusted according to different heating degrees of the heating device, so that the heat dissipation efficiency of the heating device is improved; and the phase-change heat exchange working medium is not conductive, and the safety of the cooling device is not affected.

Description

Cooling device and switching power supply system

technical field

The utility model relates to the technical field of cooling of power electronic equipment, in particular to a cooling device and a switching power supply system.

Background technique

Switching power supply is a high-frequency power conversion device, widely used in industrial automation control, computer cases, digital products and other fields. The switching power supply is densely arranged with heating elements such as switching tubes, diodes, and transformers, and has the characteristics of high operating frequency, small size, and high power density, which makes the switching power supply very easy to heat up. In order to prevent the high temperature of the switching power supply from affecting its work The performance even leads to damage to the power supply. Generally, a cooling device is installed on the switching power supply.

The patent application with publication number CN108036285A discloses an LED driving power supply with a cooling device. The application connects the driving power supply body with a cooling mechanism, and the cooling mechanism includes a ceramic heat exchanger, a heat sink, a condenser, an evaporator, a compressor and Cooling water pipe; the ceramic heat exchanger transfers the absorbed heat generated by the driving power supply body to the heat sink; one end of the cooling water pipe is attached to the heat sink, and the other end of the cooling water pipe is attached to the condenser; the compressor transfers the steam from the evaporator After being pressurized, it is sent to the condenser. The steam is liquefied in the condenser to reduce the water temperature in the cooling water pipe. The steam is liquefied and then enters the evaporator for vaporization to form a refrigeration cycle. The temperature of the water in the cooling water pipe is reduced to drive the power supply body. refrigeration.

However, the structure of the above-mentioned cooling device is complicated, and the compressors, evaporators and other devices in it need to consume extra electric energy, which makes the manufacturing and operation cost of the cooling device relatively high; It cannot be automatically adjusted according to the heating power of the driving power supply body, resulting in low heat dissipation efficiency; in addition, if the cooling water pipe leaks, it will also affect the safety and reliability of the cooling device.

Accordingly, there is a need in the art for a new cooling device and switching power supply system to solve the above problems.

Utility model content

In order to solve the above problems in the prior art, that is, in order to solve the problems of high manufacturing and operation costs, low heat dissipation efficiency, and potential safety hazards in the existing cooling device, the present invention provides a cooling device and switching power supply system.

A cooling device provided by the utility model comprises a casing, a closed chamber is formed inside the casing, the closed chamber is also filled with an insulating phase-change heat medium, and the heating device is completely or partially immersed in a liquid state in the phase-change thermal working medium; and a gaseous phase-change thermal working medium space is formed between the liquid surface of the phase-change thermal working medium and the shell.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further includes a heat-dissipating device for heat exchange with the gaseous phase-change heat working medium.

As a preferred technical solution of the cooling device provided by the present invention, the heating element is arranged on the bottom of the casing; the heat dissipation element is arranged on the top surface of the casing.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device includes at least one of cooling fins, fans, cooling water coils and condensers. If the natural heat dissipation of the casing is used to meet the requirements, additional heat dissipation components may not be included.

As a preferred technical solution of the cooling device provided by the present invention, the heat dissipation device includes a heat dissipation fin and a fan, the heat dissipation fin is arranged on the outer surface of the casing, and the fan is mounted on the heat dissipation fin Alternatively, the radiating element includes a cooling water coil, and the cooling water coil is arranged inside the casing; or, the radiating element includes a condenser, and the condenser is arranged on the outer surface of the casing.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further includes a first adapter, the first adapter is penetrated on the casing, and the first adapter is connected to the casing. The bodies are sealed; the first adapter is used for the electrical connection between the heating device and the external power supply and/or load of the housing.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further includes a temperature sensor and a second adapter; the temperature sensor is arranged inside the closed chamber; the second adapter is inserted through the on the casing, and the second adapter is sealed with the casing; the temperature sensor is electrically connected to a temperature monitoring system outside the casing through the second adapter.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further comprises a pressure gauge, the pressure gauge is arranged on the casing, and the pressure gauge is used to monitor the internal pressure of the casing; and /Or, a pressure regulating valve is further included, the pressure regulating valve is arranged on the casing, and is used to adjust the internal pressure of the casing. If there is no monitoring requirement, the pressure gauge, pressure regulating valve, temperature sensor and the monitoring system connected to it in the system can be removed.

As the preferred technical solution of the cooling device provided by the utility model, the phase-change heat working medium used in the system has the characteristics of high insulation, low boiling point, stable physical and chemical properties, good flow performance, high latent heat of vaporization, and environmental protection. The boiling point temperature of the thermal working fluid can be selected according to the optimal working temperature of the heating device, and the boiling point is generally selected at 30-70 degrees Celsius. The phase-change thermal working medium includes at least one or more combinations of hydrofluoroether, hydrofluorocarbon and alcohol compounds; or, the phase-change thermal working medium has a boiling point between 30 and 70 degrees Celsius.

In addition, the present invention also provides a switching power supply system, comprising a switching power supply and any of the above cooling devices; the switching power supply forms the heating device.

The cooling device and the switching power supply system provided by the utility model can completely or partially immerse the heating device in the liquid phase-change thermal working medium, and the phase-changing thermal working medium absorbs the heat of the heating device and changes into gas, and the gas phase changes. When the heat exchange working fluid is in contact with the surface of the shell or the heat sink, the condensed and exothermic phase turns into a liquid, and in this way, the cooling of the heat-generating device is realized. The structure and heat exchange process of the cooling device of the utility model are relatively simple, the system is self-circulating and does not need to consume external electric energy; and the phase-change heat working medium is directly in contact with the surface of the heating device, and there are few heat-exchange links; The latent heat of vaporization of the thermal working fluid is high, and the heat exchange efficiency of the system is high; the phase change rate of the phase change thermal working fluid will be automatically adjusted according to the degree of heating of the heating device, thereby further improving the heat dissipation efficiency of the heating device; and the phase change The heat exchange medium is non-conductive and will not affect the safety and reliability of the cooling device.

Description of drawings

The cooling device and the switching power supply system of the present invention will be described below with reference to the accompanying drawings. In the attached picture:

1 is a schematic structural diagram of a first cooling device provided in this embodiment;

FIG. 2 is a schematic structural diagram of a second cooling device provided in this embodiment;

3 is a schematic structural diagram of a third cooling device provided in this embodiment;

4 is a schematic structural diagram of a fourth cooling device provided in this embodiment;

FIG. 5 is a schematic diagram of a cooling water coil in the cooling device provided in this embodiment.

List of reference signs

1-shell; 2-heat-generating device; 3-phase change heat medium; 301-liquid level; 302-bubble; 4-radiating fins; 5-fan; 6-cooling water coil; 71-first turn joint; 72-second adapter; 8-pressure gauge; 9-pressure regulating valve; 10-gaseous phase change heat working medium space.

Detailed ways

The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention, and are not intended to limit the protection scope of the present invention. For example, although this embodiment is introduced in conjunction with a switching power supply, this is not intended to limit the scope of protection of the present invention, and those skilled in the art can apply the present invention to other application scenarios. For example, the cooling device of the present invention can also be used for heating devices such as transformers and frequency converters.

It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner" and "outer" Terms such as the directions or positional relationships indicated are based on the directions or positional relationships shown in the drawings, which are only for ease of description, and do not indicate or imply that the device or element must have a particular orientation, be configured in a particular orientation, and operation, so it cannot be construed as a limitation to the present invention. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In addition, it should also be noted that, in the description of the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, or It can be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In order to solve the problems of high manufacturing cost and operating cost, low heat dissipation efficiency, and potential safety hazards of the existing cooling device, the present embodiment provides a cooling device and a switching power supply system.

As shown in FIG. 1 , a cooling device provided in this embodiment includes a casing 1, and a closed chamber is formed inside the casing 1. The closed chamber is also filled with an insulating phase-change heat medium, which generates heat. The device 2 is fully or partially immersed in the liquid phase-change thermal medium; and a gaseous phase-change thermal medium space 10 is formed between the liquid surface 301 of the phase-change thermal medium 3 and the shell 1 .

Exemplarily, the phase-change heat working medium 3 in this embodiment refers to a liquid with properties such as high insulation, low boiling point, stable physical and chemical properties, good flow performance, high latent heat of vaporization, and environmental protection. The heating devices 2 can all be arranged in a closed chamber, so that the surrounding of the heating device 2 is filled with a liquid phase-change thermal working medium 3, so as to cool the heating device by evaporating the phase-changing thermal working medium into a gas; or, the heating device 2 All of them are placed in a closed cavity, and can be fully or partially immersed in the liquid phase-change heat medium 3 .

When the cooling device of this embodiment is in operation, the liquid phase-change thermal medium 3 in the closed chamber is in direct contact with the surface of the heating element 2, and the heat emitted by the heating element 2 during operation is directly transferred to the liquid phase-change thermal medium 3. In the early stage of the operation of the heating device 2, the heating device 2 absorbs sensible heat and natural convection with the liquid phase change heat medium 3, and the liquid phase change heat medium 3 adjacent to the heating device 2 first absorbs heat and warms up to make the liquid phase change heat. The temperature distribution in the phase-change thermal medium 3 is uneven, and the uneven temperature field causes an uneven density field, thereby generating buoyancy to make the liquid phase-change thermal medium 3 adjacent to the heating surface and the surrounding liquid phase-change thermal medium 3. Thermal convection is generated, so that the temperature of the main stream of the liquid phase-change heat working medium in the sealed cavity rises until it reaches the saturation temperature under the corresponding pressure.

Subsequently, the liquid phase-change thermal working medium 3 enters the large vessel saturated nucleate boiling working condition from the natural convection condition, and the heating device 2 takes the heat from the phase-change thermal working medium 3 by the phase-change absorption heat. As the superheat degree of the surface of the heating device 2 increases, bubbles 302 begin to form at the vaporization core on the surface of the heating device 2, and then the bubbles 302 are separated from the surface of the heating device 2 and grow continuously during the movement process until they escape the phase-change thermal medium. The liquid level 301 of 3 enters the gaseous phase-change thermal medium space 10 above the closed chamber. The high-temperature gaseous phase-change thermal medium 3 continuously rises, transfers heat to the shell 1 at the top of the closed chamber, and then re-condenses, and drops to the liquid phase-change thermal medium 3 area. In this way, a self-circulating closed phase change liquid cooling system is formed.

In the cooling device provided in this embodiment, all or part of the heating element is immersed in the liquid phase-change thermal medium, and the phase-change thermal medium 3 is covered on the surface of the heating element 2, and the phase-change thermal medium 3 The heat absorbed by the heating element 2 is transformed into a gas, and when the gas is in contact with the surface of the shell 1, the gas condenses and releases heat and is transformed into a liquid. Because the phase-change thermal working medium 3 is in full direct contact with the heating device 2, there is no intermediate heat transfer link, and the system uses the latent heat of vaporization of the phase-changing thermal working medium to absorb the heat of the heating device, and the cooling efficiency is high, so that the temperature rise of the heating device 2 is low. , There is no local hot spot on the surface, which is conducive to uniform heat dissipation of the heating device 2; 2 heat dissipation efficiency; the structure and heat exchange process of the cooling device in this embodiment are relatively simple, and do not need to consume external electric energy; and the phase change heat medium 3 is non-conductive, which will not affect the safety and reliability of the cooling device. cause an impact.

The cooling device provided in this embodiment has no intermediate heat transfer link, and the system utilizes the latent heat of vaporization of the phase-change heat working medium to absorb the heat of the heating device and self-regulate, so the cooling efficiency is high. The temperature rise of the heating element is low, and there is no local hot spot.

As a preferred implementation of the cooling device of this embodiment, the cooling device further includes a heat-dissipating device that performs heat exchange with the gaseous phase-change heat working medium.

Exemplarily, if the requirement is met by utilizing the natural heat dissipation of the housing, additional heat dissipation components may not be included. When the heating power of the heating device 2 is relatively large, a heat sink can be arranged on the outer surface of the casing 1, and the heat dissipation of the outer surface of the casing 1 can be accelerated to ensure that the gaseous phase-change heat medium 3 and the surface of the casing 1 are in contact with each other. heat exchange effect to further improve the cooling effect of the cooling device; alternatively, the cooling water coil is set in the gaseous phase-change heat working medium space 10, and the gaseous phase-change heat working medium is directly sent to the cooling water coil. of secondary cooling water for heat dissipation.

As a preferred implementation of the cooling device of this embodiment, the heating device 2 is arranged on the bottom of the casing 1 ; the heat dissipation device is arranged on the top surface of the casing 1 .

Exemplarily, the phase-change thermal medium 3 is located at the bottom of the closed chamber. In order to make the phase-change thermal medium 3 fully contact the surface of the heating device 2, the heating device 2 can be arranged at the bottom of the housing 1; After the phase change thermal medium 3 is changed into gas, it will rise and contact the top surface of the casing 1. Heat dissipation components such as heat dissipation fins and fans can be arranged on the top surface of the casing 1. Heat dissipation on the top surface.

As a preferred implementation of the cooling device of this embodiment, the cooling device includes at least one of cooling fins 4 , fans 5 , cooling water coils 6 and condensers.

Exemplarily, as shown in FIG. 2 , heat dissipation fins 4 may be provided on the surface of the housing 1, and the heat dissipation fins 4 may be made of steel-aluminum composite materials, which can fully utilize the high-efficiency thermal conductivity of aluminum to dissipate heat from the housing 1; In addition, the heat dissipation fins 4 increase the contact area between the casing 1 and the outside air, thereby helping to increase the heat dissipation performance of the cooling device.

Exemplarily, a fan 5 may also be provided on the surface of the housing 1, and by accelerating the air circulation on the surface of the housing 1, the heat on the surface of the housing 1 can be taken away in time, thereby helping to increase the heat dissipation performance of the cooling device.

Exemplarily, as shown in FIG. 4 , a cooling water coil 6 may also be provided inside the housing 1 , and the water inlet and outlet ends of the cooling water coil extend to the outside of the housing 1 . The water inlet end of the cooling water pump is connected to a cold water pump, and the heat of the gaseous phase change heat working medium is taken away through the circulation of the cooling water, thereby helping to increase the heat dissipation performance of the cooling device.

It can be understood by those skilled in the art that, in the above embodiment, the surface of the housing 1 is provided with heat dissipation fins 4 and fans 5 as an example to dissipate heat from the surface of the housing 1 , and cooling water is arranged inside the housing 1 . The way in which the coil 6 directly exchanges heat with the gaseous phase-change heat working medium is described. However, the scope of protection of the present invention is not limited to the content disclosed in the above embodiments, without departing from the premise of improving the heat dissipation performance of the refrigeration device by dissipating heat from the surface of the casing 1, those skilled in the art can perform the above setting methods. Various adjustments and combinations are available so that the present invention can be applied to more specific application scenarios.

For example, as shown in FIG. 3 , as a preferred implementation of the cooling device of this embodiment, the heat dissipation device includes a heat dissipation fin 4 and a fan 5 at the same time. A fan 5 is mounted on the sheet 4 .

Exemplarily, on the basis of increasing the heat dissipation area of the casing 1 by disposing the heat dissipation fins 4 on the outer surface of the casing 1, the fan 5 can be further installed on the heat dissipation fins 4 to further improve the cooling efficiency of the cooling device. cooling efficiency.

As shown in FIGS. 1 to 4 , as a preferred implementation of the cooling device of this embodiment, the cooling device further includes a first adapter 71 , the first adapter 71 is penetrated on the casing 1 , and the first adapter The joint 71 is sealed with the casing 1 ; the first adapter 71 is used for electrical connection between the heating device 2 and the external power supply and/or load of the casing 1 .

Exemplarily, when the heating devices 2 are all arranged in the closed chamber, the heating devices 2 can be electrically connected to the first adapter 71 provided on the housing 1, and then connected to an external power supply through the first adapter 71. or load electrical connection. A seal may be provided between the first adapter 71 and the casing 1 to prevent the phase-change heat working medium 3 in the closed chamber from leaking in the form of gas or liquid.

As shown in FIG. 1 to FIG. 4 , as a preferred implementation of the cooling device of this embodiment, the cooling device further includes a temperature sensor and a second adapter 72; the temperature sensor is arranged inside the closed chamber; the second adapter The temperature sensor is electrically connected to the external temperature monitoring system of the casing 1 through the second adapter 72 .

Exemplarily, the temperature sensor may be a thermocouple or other temperature measuring element. The temperature sensor is arranged at one end of the closed chamber close to the heating element 2 , and is used to monitor the temperature of the heating element 2 or the temperature of the phase-change thermal medium 3 around the heating element 2 .

A second adapter 72 can be provided on the casing 1, and the temperature sensor is electrically connected to the temperature monitoring system outside the casing 1 through the second adapter 72, so as to let people know the temperature rise of the heating device 2 and the cooling effect of the cooling system .

As shown in FIG. 2 to FIG. 4 , as a preferred implementation of the cooling device of this embodiment, the cooling device further includes a pressure gauge 8 , the pressure gauge 8 is arranged on the casing 1 , and the pressure gauge 8 is used to monitor the casing 1 and/or, the cooling device further includes a pressure regulating valve 9 , which is arranged on the casing 1 and is used to adjust the internal pressure of the casing 1 .

Exemplarily, the higher the pressure in the closed chamber, the higher the boiling point of the insulating refrigerant liquid, which has a certain influence on the cooling effect of the heating device 2. Therefore, the air pressure in the closed chamber can be used as an indicator to measure the actual cooling effect. When When the pressure in the airtight chamber is high, the housing 1 can be radiated by adjusting the radiating components on the surface of the housing 1 to control the pressure in the airtight chamber within a certain range, thereby ensuring the heat dissipation effect of the refrigeration device.

When the refrigeration device is first used, the temperature rise of the air in the airtight chamber will increase the pressure inside the airtight chamber. At this time, the pressure regulating valve 9 can be opened to discharge all or part of the air in the airtight chamber. , after the air in the closed chamber is discharged, it is beneficial to reduce the internal pressure of the closed chamber, and is conducive to the phase change of the thermal working medium 3 into a gas. Therefore, it is favorable for the phase-change heat working medium 3 to evaporate in time to cool the heating device 2 .

As a preferred implementation of the cooling device in this embodiment, the phase-change thermal working medium 3 includes at least one or more combinations of hydrofluoroethers, hydrofluorocarbons and alcohol compounds; The boiling point of mass 3 is between 30 and 70 degrees Celsius.

Exemplarily, the phase-change heat working medium 3 in the refrigeration device in this embodiment may be hydrofluoroether, hydrofluorocarbon, alcohol compound, etc. It can be understood by those skilled in the art that the above embodiment is based on hydrofluoroether. , hydrofluorocarbons and alcohol compounds are taken as examples to illustrate the phase change heat working medium 3 in this embodiment. However, the protection scope of the present invention is not limited to the contents disclosed in the above-mentioned embodiments, without deviating from the insulation, low boiling point, stable physical and chemical properties, and good flow properties of the phase-change thermal working medium 3 required by this embodiment. Under the premise of properties such as performance and higher latent heat of vaporization, those skilled in the art can choose other types of phase-change thermal media 3, or mixtures of multiple phase-change thermal media 3, so that the present invention can be applied to more many specific application scenarios.

In addition, the boiling point temperature of the heat-transforming working fluid can be selected according to the optimal working temperature of the heating device. In order to ensure the cooling effect of the heat-transforming working fluid 3 on the heating device 2, the boiling point of the phase-changing fluid is preferably 30-70 degrees Celsius. between.

In addition, the present invention also provides a switching power supply system, including the switching power supply and any of the above cooling devices; the switching power supply forms the heating device 2 .

Exemplarily, the refrigeration device provided in this embodiment is particularly suitable for switching power supplies for LED drive power supplies, data center power supplies, servers, workstations, and PCs. The switching power supply can be set in the refrigeration device of this embodiment, Form a switching power supply system. The switching power supply system ensures that the temperature of the switching power supply in the switching power supply system is not too high and the temperature rise is uniform due to the cooling effect of the phase change thermal medium 3, thereby further improving the working reliability of the switching power supply system . The cooling device provided in this embodiment is not only applicable to various switching power supplies, but also applicable to power electronic devices/equipment such as transformers and frequency converters, and power electronic devices such as IGBTs and MOSFETs.

Furthermore, it will be understood by those skilled in the art that although some of the embodiments described herein include certain features included in other embodiments and not others, combinations of features of different embodiments are meant to be within the scope of the present invention. range and form different embodiments. For example, in the claims of the present invention, any one of the claimed embodiments may be used in any combination.

So far, the technical solutions of the present invention have been described with reference to the preferred embodiments shown in the accompanying drawings, but those skilled in the art can easily understand that the protection scope of the present invention is obviously not limited to these specific embodiments. On the premise of not departing from the principle of the present invention, those skilled in the art can make equivalent changes or replacements to the relevant technical features, and the technical solutions after these changes or replacements will fall within the protection scope of the present invention.

Claims (10)

1. A cooling device, characterized in that: Including a shell, the interior of the shell is formed with a closed chamber, the closed chamber is also filled with an insulating phase-change thermal medium, and the heating device is fully or partially immersed in the liquid phase-change thermal medium and a gaseous phase-change thermal working medium space is formed between the liquid surface of the phase-change thermal working medium and the shell. 2. The cooling device according to claim 1, characterized in that: It also includes a heat-dissipating device for heat exchange with the gaseous phase-change thermal medium. 3. The cooling device according to claim 2, wherein: The heating device is arranged at the bottom of the casing; The heat dissipation device is provided on the top surface of the housing. 4. The cooling device according to claim 2, wherein: The heat dissipation device includes at least one of heat dissipation fins, fans, cooling water coils and condensers. 5. The cooling device according to claim 4, wherein: The heat dissipation device includes heat dissipation fins, and the heat dissipation fins are arranged on the outer surface of the housing; Alternatively, the heat dissipation device includes a heat dissipation fin and a fan, the heat dissipation fin is arranged on the outer surface of the casing, and the fan is mounted on the heat dissipation fin; Or, the cooling device includes a cooling water coil, and the cooling water coil is arranged inside the casing; Alternatively, the heat dissipation device includes a condenser disposed on the outer surface of the housing. 6. The cooling device according to claim 1, wherein: Also includes a first adapter, the first adapter is penetrated on the casing, and the first adapter and the casing are sealed; The first adapter is used to electrically connect the heating device with an external power supply and/or a load of the housing. 7. The cooling device according to claim 1, wherein: Also includes a temperature sensor and a second adapter; the temperature sensor is arranged inside the closed chamber; the second adapter is passed through the casing, and the second adapter and the casing are sealed; The temperature sensor is electrically connected to a temperature monitoring system outside the housing through the second adapter. 8. The cooling device according to claim 1, wherein: Also includes a pressure gauge, the pressure gauge is arranged on the casing, and the pressure gauge is used to monitor the internal pressure of the casing; And/or, it also includes a pressure regulating valve, the pressure regulating valve is arranged on the casing, and is used to adjust the internal pressure of the casing. 9. The cooling device according to claim 1, wherein: The boiling point of the phase-change heat working fluid is between 30 and 70 degrees Celsius. 10. A switching power supply system, characterized in that: comprising a switching power supply and the cooling device according to any one of claims 1 to 9; The switching power supply forms the heating device.

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