CN211465964U - Polishing head device and polishing machine - Google Patents
Polishing head device and polishing machine Download PDFInfo
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- CN211465964U CN211465964U CN201922501484.9U CN201922501484U CN211465964U CN 211465964 U CN211465964 U CN 211465964U CN 201922501484 U CN201922501484 U CN 201922501484U CN 211465964 U CN211465964 U CN 211465964U
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- 238000005498 polishing Methods 0.000 title claims abstract description 160
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 53
- 239000010703 silicon Substances 0.000 claims abstract description 53
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 52
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000007517 polishing process Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 44
- 230000033001 locomotion Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to a silicon chip processing technology field discloses a rubbing head device and burnishing machine. The polishing head device comprises a base, one side of the base is detachably connected with an external power piece, and an air channel is arranged in the base; one end of the rotating shaft is connected to the other side of the base; the polishing head assembly is connected to the other end of the rotating shaft and can rotate along with the rotating shaft, and meanwhile, the polishing head assembly can reciprocate along the axial direction of the rotating shaft and can swing relative to the rotating shaft; the edge of the elastic piece is attached to one side surface of the base and can form a sealed space with the base; when the sealed space is not inflated, the polishing head assembly can be extruded by the silicon wafer to be polished to move towards the direction close to the base along the axial direction of the rotating shaft; when the air channel is used for inflating the sealed space, the elastic piece is expanded, the polishing head assembly can be driven to move in the direction far away from the base along the axial direction of the rotating shaft, pressure can be uniformly applied, the silicon wafer is stressed in a balanced manner in the polishing process, and polishing is more effective.
Description
Technical Field
The utility model relates to a silicon chip processing technology field especially relates to a rubbing head device and burnishing machine.
Background
Conventionally, a silicon wafer polishing apparatus generally includes a polishing platen to which a polishing pad is attached, and a polishing head to which a silicon wafer is adsorbed, which is pressed and held on the polishing pad, and the polishing apparatus rotates the polishing platen and the polishing head, respectively, while supplying a polishing liquid, thereby polishing one surface of the silicon wafer. In order to uniformly press the entire surface of the silicon wafer to improve the uniformity of the polished amount in the surface of the silicon wafer, a silicon wafer polishing apparatus using a polishing head having a pressurizing function is generally required.
The existing polishing head cannot swing up and down to realize fine adjustment, and uneven polishing stress on the surface of the silicon wafer is easily caused, so that the polishing quality of the silicon wafer is influenced, and even the silicon wafer is deformed and cracked.
Therefore, it is desirable to provide a polishing head device and a polishing machine to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a burnishing head device and burnishing machine, the burnishing head subassembly in this burnishing head device can be along with silicon chip adaptability ground swing in the polishing process to the silicon chip, can evenly press in the whole face of silicon chip to improve the homogeneity of the polishing volume in the silicon chip face.
To achieve the purpose, the utility model adopts the following technical proposal:
there is provided a polishing head apparatus comprising:
one side of the base is detachably connected with an external power part, and an air channel is arranged in the base;
one end of the rotating shaft is connected to the other side of the base;
the polishing head assembly is connected to the other end of the rotating shaft and can rotate along with the rotating shaft, and meanwhile, the polishing head assembly can reciprocate along the axial direction of the rotating shaft and can swing relative to the rotating shaft;
the edge of the elastic piece is attached to one side surface of the base and can form a sealed space with the base;
when the sealed space is not inflated, the polishing head assembly can be extruded by a silicon wafer to be polished to move towards the direction close to the base along the axial direction of the rotating shaft;
when the air channel inflates the sealed space, the elastic piece is expanded, and the polishing head assembly can be driven to move in the direction far away from the base along the axial direction of the rotating shaft.
Preferably, the polishing head device further comprises a first pressing stop member and a second pressing stop member, and the first pressing stop member and the second pressing stop member are both connected to the base;
the first pressing stopping piece is sleeved on the second pressing stopping piece, and the first pressing stopping piece and the second pressing stopping piece are matched to press the edge of the elastic piece to form the sealed space.
Preferably, the polishing head device further includes:
mounting flange, connect in the base, mounting flange with the pivot connect respectively in the both sides of base, mounting flange with outside power spare passes through the flange staple bolt and connects.
Preferably, the polishing head assembly includes:
the first guide piece is provided with an inner gear, the rotating shaft is provided with an outer gear which is connected with the inner gear in a matched mode, and a first gap is formed between the inner gear and the outer gear along the radial direction of the rotating shaft;
and the polishing plate is connected to the first guide piece, and the elastic piece is expanded to drive the polishing plate to move along the axial direction of the rotating shaft.
Preferably, a second guide is fixedly disposed at one end of the rotating shaft, and the external gear is disposed on the second guide.
Preferably, the polishing head assembly further comprises a retaining ring which is sleeved and can be hooked on the rotating shaft, the first guide piece is connected with the retaining ring, and a second gap is formed between the inner wall of the retaining ring and the outer wall of the rotating shaft.
Preferably, the polishing head assembly further comprises an intermediate connector connected to the polishing plate, and the elastic member swells and presses the intermediate connector and the polishing plate to synchronously move along the axial direction of the rotating shaft.
Preferably, the polishing head device further includes:
the first waterproof piece is buckled outside the base and surrounds the periphery of the middle connecting piece;
and the second waterproof part is connected with the intermediate connecting part, and a third gap is arranged between the first waterproof part and the second waterproof part along the radial direction of the rotating shaft.
Preferably, the polishing head device further comprises a controller, and the controller controls the inflation pressure of the power member to the sealed space.
The utility model discloses in still provide a burnishing machine, include burnishing head device.
The utility model has the advantages that: the utility model discloses in above-mentioned base can dismantle with outside power spare and be connected, makes things convenient for rubbing head device and outside power spare dismouting. The polishing head component can reciprocate along the axial direction of the rotating shaft to control the polishing amount of the silicon wafer, and can swing relative to the rotating shaft, so that the polishing head component can make up the error of the surface flatness of the silicon wafer when polishing, the polishing head can be attached to the surface of the silicon wafer as far as possible, the surface stress of the silicon wafer is uniform, the polishing amount of the whole surface is uniform, and the polishing precision is improved.
The base is provided with the air channel, the sealed space is inflated through the air channel, the elastic piece can swell, and the polishing head assembly is controlled to move axially along the rotating shaft under the action of the elastic piece, so that the polishing amount of the silicon wafer is controlled. The axial movement amount of the polishing head assembly is controlled in a mutual matching mode of the air channel and the elastic piece, so that the polishing amount of the silicon wafer is adjusted. And act on the polishing head subassembly through the elastic component, compare gas direct action on the polishing head subassembly, it is less to the impact of polishing head subassembly, and the accommodation process is steady.
Drawings
Fig. 1 is a schematic structural diagram of the polishing head device according to the present invention.
In the figure:
1-installing a flange; 2-a base; 3-a rotating shaft; 4-a second guide; 5-an elastic member; 6-a second press stop; 7-a first press stop; 8-baffle ring; 9-a first guide; 10-polishing plate; 11-an intermediate connector; 12-a second waterproof; 13-a first waterproof; 14-silicon wafer.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the prior art, the polishing head which adsorbs and presses the silicon wafer cannot swing up and down to realize fine adjustment, so that uneven polishing stress on the surface of the silicon wafer 14 is easily caused, the polishing quality of the silicon wafer 14 is affected, and even the silicon wafer 14 is deformed and cracked.
In the embodiment, a polishing head device is provided, the polished product is mainly a semi-finished silicon wafer 14, each semi-finished silicon wafer 14 is a qualified semi-finished product before the subsequent polishing process, and the thickness error value of the semi-finished silicon wafers 14 of the same batch is within a certain error range. Therefore, in the continuous polishing step, the dimensional displacement of the semi-finished silicon wafer 14 in the thickness direction is large due to the polishing amount, and the swing displacement of the polishing plate 10 due to the thickness flatness error itself is small.
Fig. 1 is a schematic view of the internal structure of a polishing head apparatus, and the structure of the polishing head apparatus described above will now be described in detail with reference to fig. 1.
The polishing head device comprises a base 2, a rotating shaft 3, a polishing head assembly and an elastic piece 5, wherein the external power piece is detachably connected to one side of the base 2, and an air channel is arranged inside the base 2. One end of the rotating shaft 3 is connected to the other side of the base 2, and the external power member can drive the rotating shaft 3 to rotate along with the base 2. The polishing head assembly is connected to the other end of the rotating shaft 3 and can rotate along with the rotating shaft 3, and meanwhile, the polishing head assembly can also reciprocate along the axial direction of the rotating shaft 3 and can swing relative to the rotating shaft 3. The edge of the elastic piece 5 is attached to one side surface of the base 2 and can form a sealed space with the base 2. The polishing head device moves downwards integrally under the action of the external power piece, the sealed space is not inflated, and when the polishing head assembly is in contact with the silicon wafer 14 to be polished, the silicon wafer 14 extrudes the polishing head assembly to move towards the direction close to the base 2 along the axial direction of the rotating shaft 3. Preferably, in this embodiment, the polishing head assembly is moved upward up to a position of contact with the elastic member 5, which is an initial position to start the pressing down. When the air channel inflates the sealed space, the elastic piece 5 expands to drive the polishing head assembly to move from the initial position to the direction far away from the base 2 along the axial direction of the rotating shaft 3. The amount of gas flowing into the gas passage is controlled, thereby controlling the amount of downward movement of the polishing head assembly. During the polishing process, the polishing head assembly 3 adaptively swings left and right according to the error of the polished plane size of the silicon wafer 14. The above-mentioned "up", "down", "left" and "right" are the positions shown in the polishing head apparatus in FIG. 1.
The polishing head assembly is generally arranged in the manner shown in fig. 1 when in use, so that the polishing head assembly can float up and down relative to the spindle 3 and can swing left and right relative to the spindle 3 during the operation of actually polishing the silicon wafer 14.
The utility model discloses in above-mentioned base 2 can dismantle with outside power spare and be connected, makes things convenient for rubbing head device and outside power spare dismouting. The polishing head component can reciprocate along the axial direction of the rotating shaft 3 to control the polishing amount of the silicon wafer 14, and can swing relative to the rotating shaft 3, so that the error of the surface flatness of the silicon wafer 14 can be compensated when the polishing head component is used for polishing, the polishing head component can be attached to the surface of the silicon wafer 14 as far as possible, the surface of the silicon wafer 14 is stressed uniformly, the polishing amount in the whole surface is uniform, and the polishing precision is improved.
The base 2 is provided with an air channel, the air channel inflates air into the sealed space, the elastic piece 5 expands, and the polishing head assembly is controlled to move along the axial direction of the rotating shaft 3 under the action of the elastic piece 5, so that the polishing amount of the silicon wafer 14 is controlled. The axial movement amount of the polishing head assembly is controlled in a way that the air channel and the elastic piece 5 are matched with each other, so that the polishing amount of the silicon wafer 14 is adjusted, and the micro adjustment of the polishing amount can be realized due to the small inflation variation amount of the air channel to the sealed space, and the adjustment precision is high. And act on the polishing head assembly through elastic component 5, compare gas direct action polishing head assembly on, it is less to the impact of polishing head assembly, the accommodation process is steady.
Specifically, the base 2 is detachably connected to an external power member, and in general, the external power member is a polishing power device, and the polishing head device is mounted on the polishing power device through the base 2 and is powered by the polishing power device. The polishing head device further comprises a mounting flange 1, wherein the mounting flange 1 is connected to the base 2, the mounting flange 1 and the rotating shaft 3 are respectively connected to two sides of the base 2, and the mounting flange 1 is connected with the external power part through a flange hoop so as to facilitate detachment and installation of the polishing head device and maintenance and debugging. When the polishing head device is installed on the polishing equipment, the perpendicularity between the polishing head device and a polished plane of the silicon wafer 14 needs to be adjusted firstly to ensure the precision of the polished silicon wafer 14, after the adjustment is completed, the relative position between the polishing head device and the polishing equipment is locked by using the flange hoop, when the adjustment is carried out again, the adjustment can be carried out again by loosening, and the manner for adjusting the perpendicularity of the polishing head device is simple, convenient and quick. In other embodiments, the polishing head device may be connected to the external polishing apparatus by screw fastening.
The polished silicon wafer 14 in this embodiment is a disk, and with reference to fig. 1, the polishing head assembly includes a first guide 9 and a polishing plate 10, wherein an internal gear is disposed on the first guide 9, an external gear cooperatively connected with the internal gear is disposed on the rotating shaft 3, and a first gap is radially disposed between the internal gear and the external gear, and the first gap is larger than the flatness error of the silicon wafer 14. The polishing plate 10 is connected to the first guide 9, and the elastic member 5 expands to drive the polishing plate 10 to move along the axial direction of the rotating shaft 3.
A first gap is formed between the inner gear and the outer gear along the radial direction, so that the polishing head can swing left and right during polishing, and the silicon wafer 14 can be attached to the maximum degree. And the value of the first gap is greater than the maximum value of the error value of the flatness of the silicon wafer 14 to be polished, so that the requirement of the polishing plate 10 on the flatness error of the silicon wafer 14 and the accumulated error of the errors generated by all structures can be met in the polishing process. The first guide 9 is capable of floating up and down with respect to the rotary shaft 3, and controls the amount of up and down movement of the polishing plate 10 to control the polishing amount of the silicon wafer 14. In the process of up-and-down movement of the polishing plate 10, the first guide 9 and the rotating shaft 3 slide relatively by the inner gear and the outer gear, and the guidance performance is good. The gear form is used for transmission connection, so that the centering precision is high, and the transmitted torque is large.
In this embodiment, one end of the rotating shaft 3 is provided with a second guiding member 4, and the second guiding member 4 is provided with an external gear to which the internal gear is connected in a matching manner.
The external gear can be arranged on the rotating shaft 3 to form a structural form of a gear shaft with the rotating shaft 3, and the external gear and the rotating shaft 3 can also be arranged in a split structure as in the embodiment, the external gear is arranged on the second guide piece 4, and the second guide piece 4 is detachably connected with the rotating shaft 3.
Further specifically, the polishing head assembly further comprises a retaining ring 8 which is sleeved on the rotating shaft 3 and can be hooked on the rotating shaft 3, the second gear 9 is connected to the retaining ring 8, and a second gap is formed between the inner wall of the retaining ring 8 and the outer wall of the rotating shaft 3. Through setting up the second clearance, guarantee that second gear 9 is at the in-process of horizontal hunting, do not produce the interference between backing ring 8 and the pivot 3, can the horizontal hunting, and can smoothly follow the up-and-down motion.
The polishing head assembly further comprises an intermediate connecting piece 11 connected to the polishing plate 10, and the elastic piece 5 expands to press the intermediate connecting piece 11 and the polishing plate 10 to move along the axial direction of the rotating shaft 3 synchronously. The elastic piece 5 is used for indirectly exerting force on the intermediate connecting piece 11, so that the phenomenon that gas in the gas channel directly acts on the intermediate connecting piece 11 to cause impact on the intermediate connecting piece 11 and cause instability of the polishing plate 10 is avoided.
With regard to the above-mentioned sealed space structure, referring to fig. 1, specifically, the polishing head device further includes a first press-stopping member 7 and a second press-stopping member 6, and both the first press-stopping member 7 and the second press-stopping member 6 are connected to the base 2. The first pressing stop member 7 is sleeved on the second pressing stop member 6, and the first pressing stop member 7 and the second pressing stop member 6 are matched to press the edge of the elastic member 5 to form a sealed space.
Specifically, since the silicon wafer 14 has a disk shape and the polishing plate 10 has a disk shape, the intermediate connecting member 11 has a ring shape. In this embodiment, the elastic member 5 is made of rubber, which has good elasticity, and in order to adapt to the intermediate connecting member 11, the elastic member 5 is also circular ring-shaped, and the elastic member 5 in this embodiment is made of rubber, which has low processing cost. The first press-stopping member 7 and the second press-stopping member 6 are both annular, the outer edge of the elastic member 5 is sealed by the first press-stopping member 7, and the inner edge of the elastic member 5 is sealed by the second press-stopping member 6, so that a sealed space is formed.
In order to inflate the sealed space, the polishing head device further comprises a power member connected to the air passage through a pipeline to control inflation into the sealed space, and the downward movement amount of the polishing plate 10 is controlled through the degree of swelling of the elastic member 5.
The polishing head device also comprises a controller, and the controller controls the inflation pressure of the power piece to the sealed space. The controller stores the air pressure value in the sealed space corresponding to the polishing amount, so as to control the air filling amount in the sealed space.
In order to prevent the polishing solution from splashing during the polishing process, the liquid drops enter the polishing head device, the polishing head device further comprises a first waterproof piece 13 and a second waterproof piece 12, and the first waterproof piece 13 is buckled outside the base 2 and surrounds the periphery of the middle connecting piece 11. The second waterproof member 12 is connected to the intermediate connecting member 11, and a third gap is provided between the first waterproof member 13 and the second waterproof member 12 in the radial direction of the rotating shaft 3.
The utility model discloses in still provide a burnishing machine, rubbing head device of including.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A polishing head apparatus, comprising:
the air conditioner comprises a base (2), wherein one side of the base (2) is detachably connected with an external power part, and an air channel is arranged in the base (2);
a rotating shaft (3) one end of which is connected to the other side of the base (2);
the polishing head component is connected to the other end of the rotating shaft (3) and can rotate along with the rotating shaft (3), and meanwhile, the polishing head component can reciprocate along the axial direction of the rotating shaft (3) and can swing relative to the rotating shaft (3);
the edge of the elastic piece (5) is attached to one side surface of the base (2), and a sealed space can be enclosed by the elastic piece and the base (2);
when the sealed space is not inflated, the polishing head assembly can be extruded by a silicon wafer (14) to be polished to move towards the direction close to the base (2) along the axial direction of the rotating shaft (3);
when the air channel inflates the sealed space, the elastic piece (5) is expanded, and the polishing head assembly can be driven to move in the direction far away from the base (2) along the axial direction of the rotating shaft (3).
2. Polishing head arrangement according to claim 1, characterized in that the polishing head arrangement further comprises a first press-stop (7) and a second press-stop (6), the first press-stop (7) and the second press-stop (6) both being connected to the base (2);
the first pressing and stopping piece (7) is sleeved on the second pressing and stopping piece (6), and the first pressing and stopping piece (7) and the second pressing and stopping piece (6) are matched to press the edge of the elastic piece (5) to form the sealed space.
3. The polishing head device according to claim 1, further comprising:
mounting flange (1), connect in base (2), mounting flange (1) with pivot (3) connect respectively in the both sides of base (2), mounting flange (1) with outside power spare passes through the flange staple bolt and connects.
4. The polishing head apparatus according to claim 1, wherein the polishing head assembly comprises:
the first guide piece (9) is provided with an internal gear, the rotating shaft (3) is provided with an external gear which is matched and connected with the internal gear, and a first gap is formed between the internal gear and the external gear along the radial direction of the rotating shaft (3);
and the polishing plate (10) is connected to the first guide piece (9), and the elastic piece (5) expands to drive the polishing plate (10) to move along the axial direction of the rotating shaft (3).
5. Polishing head arrangement according to claim 4, characterized in that a second guide (4) is fixedly arranged at one end of the shaft (3), said second guide (4) being provided with said external gear.
6. The polishing head device according to claim 4, wherein the polishing head assembly further comprises a retaining ring (8) sleeved on the rotating shaft (3) and capable of being hooked on, the first guide member (9) is connected to the retaining ring (8), and a second gap is arranged between the inner wall of the retaining ring (8) and the outer wall of the rotating shaft (3).
7. The polishing head device according to claim 5, wherein the polishing head assembly further comprises an intermediate coupling member (11) coupled to the polishing plate (10), and the elastic member (5) swells and presses the intermediate coupling member (11) and the polishing plate (10) to move synchronously in the axial direction of the rotating shaft (3).
8. The polishing head device according to claim 7, further comprising:
the first waterproof piece (13) is buckled outside the base (2) and surrounds the periphery of the middle connecting piece (11);
the second waterproof piece (12) is connected to the middle connecting piece (11), and a third gap is formed between the first waterproof piece (13) and the second waterproof piece (12) along the radial direction of the rotating shaft (3).
9. The polishing head apparatus according to claim 8, further comprising a controller that controls a pressure of the gas charged into the sealed space by the power member.
10. A polishing machine comprising a polishing head device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922501484.9U CN211465964U (en) | 2019-12-31 | 2019-12-31 | Polishing head device and polishing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922501484.9U CN211465964U (en) | 2019-12-31 | 2019-12-31 | Polishing head device and polishing machine |
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| CN211465964U true CN211465964U (en) | 2020-09-11 |
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| CN201922501484.9U Active CN211465964U (en) | 2019-12-31 | 2019-12-31 | Polishing head device and polishing machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115383622A (en) * | 2022-04-20 | 2022-11-25 | 北京烁科精微电子装备有限公司 | Split type universal joint for polishing head and polishing device |
-
2019
- 2019-12-31 CN CN201922501484.9U patent/CN211465964U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115383622A (en) * | 2022-04-20 | 2022-11-25 | 北京烁科精微电子装备有限公司 | Split type universal joint for polishing head and polishing device |
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