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CN211378109U - an electronic device - Google Patents

an electronic device Download PDF

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Publication number
CN211378109U
CN211378109U CN202020346330.7U CN202020346330U CN211378109U CN 211378109 U CN211378109 U CN 211378109U CN 202020346330 U CN202020346330 U CN 202020346330U CN 211378109 U CN211378109 U CN 211378109U
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electronic device
decorative ring
camera module
bracket
bracket body
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张显龙
丁建
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Abstract

本实用新型提供了一种电子设备,所述电子设备具体包括:主板支架、第一摄像模组和第二摄像模组;其中,所述主板支架包括支架本体以及第一装饰圈,所述支架本体和所述第一装饰圈为一体成型结构;所述第一装饰圈设置于所述支架本体的一侧,所述第一摄像模组固定于所述支架本体的第二侧;所述第二摄像模组与所述第一装饰圈固定连接。本实用新型实施例可以降低所述电子设备的厚度,提高所述电子设备的外观美观性。

Figure 202020346330

The utility model provides an electronic device, the electronic device specifically comprises: a mainboard bracket, a first camera module and a second camera module; wherein, the mainboard bracket comprises a bracket body and a first decorative ring, the bracket The body and the first decorative ring are integrally formed; the first decorative ring is arranged on one side of the bracket body, and the first camera module is fixed on the second side of the bracket body; The two camera modules are fixedly connected with the first decorative ring. The embodiment of the present invention can reduce the thickness of the electronic device and improve the appearance aesthetics of the electronic device.

Figure 202020346330

Description

一种电子设备an electronic device

技术领域technical field

本实用新型涉及通信技术领域,特别是涉及一种电子设备。The utility model relates to the technical field of communication, in particular to an electronic device.

背景技术Background technique

随着用户对于使用体验的极致追求,用户对于手机、平板电脑等电子设备的性能要求和外观要求也越来越高,电子设备的功能越来越丰富,厚度也越来越薄。With the ultimate pursuit of user experience, users have higher and higher performance requirements and appearance requirements for electronic devices such as mobile phones and tablet computers. Electronic devices have more and more functions and become thinner and thinner.

现有的电子设备中,为了提升用户的拍摄体验,通常会设置有前置摄像头和后置摄像头,而且,为了提升电子设备的美观度,通常将前置摄像头和后置摄像头都设置在电子设备上靠近边缘的位置。由于后置摄像头的镜头通常需要通过装饰圈固定在主板支架的一侧表面,而前置摄像头则固定在主板支架的另一侧表面,因此,在所述电子设备的厚度方向,该装饰圈很容易和前置摄像头重叠,导致电子设备的厚度较厚。In the existing electronic devices, in order to improve the user's shooting experience, a front camera and a rear camera are usually provided. Moreover, in order to improve the aesthetics of the electronic device, both the front camera and the rear camera are usually set on the electronic device. position near the edge. Since the lens of the rear camera usually needs to be fixed on one side surface of the motherboard bracket through a decorative ring, and the front camera is fixed on the other side surface of the motherboard bracket, the decorative ring is very important in the thickness direction of the electronic device. It is easy to overlap with the front camera, resulting in a thicker thickness of the electronic device.

而且,现有的技术中,后置摄像头的装饰圈通常需要使用泡棉、胶层等结构固定在主板支架的一侧表面,这样,很容易进一步增加电子设备的厚度,影响电子设备的外观美观性。Moreover, in the prior art, the decorative ring of the rear camera usually needs to be fixed on one side surface of the motherboard bracket using structures such as foam, adhesive layer, etc. In this way, it is easy to further increase the thickness of the electronic device and affect the appearance of the electronic device. sex.

实用新型内容Utility model content

为了解决现有的技术中,电子设备的厚度较厚,美观性较差的问题,本实用新型实施例提供了一种电子设备。In order to solve the problems in the prior art that the thickness of the electronic device is relatively thick and the aesthetics is poor, the embodiment of the present invention provides an electronic device.

为了解决上述问题,本实用新型公开了一种电子设备,包括:主板支架、第一摄像模组和第二摄像模组;其中,In order to solve the above problems, the utility model discloses an electronic device, comprising: a mainboard bracket, a first camera module and a second camera module; wherein,

所述主板支架包括支架本体以及第一装饰圈,所述支架本体和所述第一装饰圈为一体成型结构;The mainboard bracket includes a bracket body and a first decorative ring, and the bracket body and the first decorative ring are integrally formed;

所述第一装饰圈设置于所述支架本体的一侧,所述第一摄像模组固定于所述支架本体的第二侧;The first decorative ring is arranged on one side of the bracket body, and the first camera module is fixed on the second side of the bracket body;

所述第二摄像模组与所述第一装饰圈固定连接。The second camera module is fixedly connected with the first decorative ring.

本实用新型包括以下优点:The utility model includes the following advantages:

本实用新型实施例中,由于所述主板支架包括支架本体以及第一装饰圈,所述支架本体和所述第一装饰圈为一体成型结构,所述第一装饰圈可以用于固定所述第二摄像模组,这样,就可以避免在所述第一装饰圈和所述支架本体之间设置泡棉、胶层来实现二者的连接,降低所述电子设备的厚度,提高所述电子设备的外观美观性。In the embodiment of the present invention, since the motherboard bracket includes a bracket body and a first decorative ring, the bracket body and the first decorative ring are integrally formed, and the first decorative ring can be used to fix the first decorative ring. Two camera modules, in this way, it is possible to avoid arranging foam and adhesive layers between the first decorative ring and the bracket body to realize the connection between the two, reduce the thickness of the electronic equipment, and improve the electronic equipment. aesthetic appearance.

附图说明Description of drawings

图1是本实用新型的一种电子设备的结构示意图;Fig. 1 is the structural representation of a kind of electronic equipment of the present utility model;

图2是图1所述的电子设备的分解结构示意图。FIG. 2 is a schematic diagram of an exploded structure of the electronic device shown in FIG. 1 .

具体实施方式Detailed ways

为使本实用新型的上述目的、特征和优点能够更加明显易懂,下面结合附图和具体实施方式对本实用新型作进一步详细的说明。In order to make the above objects, features and advantages of the present utility model more clearly understood, the present utility model will be described in further detail below with reference to the accompanying drawings and specific embodiments.

本实用新型实施例提供了一种电子设备,所述电子设备可以包括但不局限于手机、平板电脑以及可穿戴式设备中的任意一种,本实用新型实施例仅以手机为例进行说明,其他类型的电子设备参照执行即可。The embodiment of the present invention provides an electronic device, and the electronic device may include but is not limited to any one of a mobile phone, a tablet computer, and a wearable device. The embodiment of the present invention only takes a mobile phone as an example for description. Other types of electronic equipment can be implemented by reference.

参照图1,示出了本实用新型的一种电子设备的结构示意图,参照图2,示出了图1所述的电子设备的分解结构示意图,所述电子设备具体可以包括:主板支架10、第一摄像模组11和第二摄像模组12;其中,主板支架10可以包括支架本体101以及第一装饰圈102,支架本体101和第一装饰圈102为一体成型结构;第一装饰圈102设置于支架本体101的第一侧,第一摄像模组11固定于支架本体101的第二侧;第二摄像模组12与第一装饰圈102固定连接。Referring to FIG. 1 , a schematic structural diagram of an electronic device of the present invention is shown. Referring to FIG. 2 , an exploded structural schematic diagram of the electronic device described in FIG. 1 is shown. The first camera module 11 and the second camera module 12; wherein, the motherboard bracket 10 may include a bracket body 101 and a first decorative ring 102, and the bracket body 101 and the first decorative ring 102 are integrally formed; the first decorative ring 102 The first camera module 11 is fixed on the second side of the bracket body 101 , and the second camera module 12 is fixedly connected to the first decorative ring 102 .

本实用新型实施例中,由于主板支架10可以包括支架本体101以及第一装饰圈102,支架本体101和第一装饰圈102为一体成型结构,第一装饰圈102可以用于固定第二摄像模组12,这样,就可以避免在第一装饰圈102和支架本体101之间设置泡棉、胶层来实现二者的连接,从而降低由于泡棉、胶层对于电子设备的厚度,进而提高电子设备的外观美观性。In the embodiment of the present invention, since the mainboard bracket 10 may include a bracket body 101 and a first decorative ring 102, the bracket body 101 and the first decorative ring 102 are integrally formed, and the first decorative ring 102 can be used to fix the second camera module Group 12, in this way, it is possible to avoid setting the foam and the adhesive layer between the first decorative ring 102 and the bracket body 101 to realize the connection between the two, thereby reducing the thickness of the electronic equipment due to the foam and the adhesive layer, thereby improving the electronic equipment. The aesthetics of the device.

在本实用新型的一些实施例中,主板支架10可以为塑胶支架,例如,主板支架10可以采用热塑性塑胶或者热固性塑胶等塑胶材料制成,支架本体101和第一装饰圈102可以采用一体注塑成型的方式加工而成,加工效率较高。In some embodiments of the present invention, the mainboard bracket 10 may be a plastic bracket. For example, the mainboard bracket 10 may be made of plastic materials such as thermoplastic plastic or thermosetting plastic, and the bracket body 101 and the first decorative ring 102 may be integrally injection molded It is processed by the method, and the processing efficiency is high.

当然,主板支架10还可以为金属等其他材质制成的支架,本实用新型实施例对于主板支架10的具体材质可以不做限定。但由于塑胶支架价格低廉,且相对于金属等材质的支架轻,所以在主板支架的材质选取上,优选塑胶材质。Of course, the mainboard bracket 10 may also be a bracket made of other materials such as metal, and the specific material of the mainboard bracket 10 may not be limited in the embodiment of the present invention. However, since the plastic bracket is cheap and lighter than the bracket made of metal and other materials, the material of the motherboard bracket is preferably made of plastic.

本实用新型实施例中,主板支架101的第一侧和第二侧可以相对。例如,主板支架101的第一侧可以为支架本体101的正面侧,所述第二侧可以为支架本体101的背面侧,或者,所述第一侧可以为支架本体101的正面侧,所述第二侧可以为支架本体101的背面侧。当然,主板支架101的第一侧与第二侧还可以相邻。例如,主板支架10的第一侧可以为正面侧,所述第二侧可以为与第一侧相连的侧面。本实用新型实施例对于所述第一侧、所述第二侧的方向可以不做限定。In the embodiment of the present invention, the first side and the second side of the motherboard bracket 101 may be opposite to each other. For example, the first side of the motherboard bracket 101 may be the front side of the bracket body 101, the second side may be the back side of the bracket body 101, or the first side may be the front side of the bracket body 101, the The second side may be the back side of the bracket body 101 . Of course, the first side and the second side of the motherboard bracket 101 may also be adjacent to each other. For example, the first side of the motherboard bracket 10 may be a front side, and the second side may be a side surface connected to the first side. The embodiments of the present invention may not limit the directions of the first side and the second side.

需要说明的是,由于在主板支架101的第一侧和第二侧相对的情况下,且主板支架的第一侧和第二侧分别朝向电子设备的前壳和背壳,在第一摄像头和第二摄像头分别设置在主板支架上时,电子设备的厚度可以等于摄像头在光轴方向上的尺寸大小;而在主板支架101的第一侧和第二侧相邻的情况下,在第一摄像头和第二摄像头分别设置在主板支架的第一侧和第二侧时,由于摄像头需要设置在电子设备内部,所以,电子设备的厚度至少等于一个摄像头在垂直于光轴方向上的尺寸大小。摄像头在光轴方向上的尺寸普遍小于摄像头在垂直于光轴方向上的尺寸,因此,在主板支架101的第一侧和第二侧相邻的情况下,对于电子设备的厚度减薄的贡献会低于当主板支架的第一侧和第二侧相对的情况下,对于电子设备的厚度减薄的贡献。在本实用新型实施例中,选择所述第一侧与所述第二侧相对的方案举例。It should be noted that, since the first side and the second side of the motherboard bracket 101 are opposite to each other, and the first side and the second side of the motherboard bracket face the front shell and the back shell of the electronic device, respectively, the first camera and the When the second cameras are respectively arranged on the motherboard bracket, the thickness of the electronic device can be equal to the size of the camera in the direction of the optical axis; and when the first side and the second side of the motherboard bracket 101 are adjacent, the first camera When the camera and the second camera are respectively arranged on the first side and the second side of the motherboard bracket, since the camera needs to be arranged inside the electronic device, the thickness of the electronic device is at least equal to the size of one camera in the direction perpendicular to the optical axis. The size of the camera in the direction of the optical axis is generally smaller than the size of the camera in the direction perpendicular to the optical axis. Therefore, when the first side and the second side of the motherboard bracket 101 are adjacent to each other, the contribution to the thinning of the thickness of the electronic device It will be lower than the contribution to the thinning of the thickness of the electronic device when the first side and the second side of the motherboard bracket are opposite. In the embodiment of the present invention, an example is selected in which the first side is opposite to the second side.

本实用新型实施例中,所述电子设备还可以包括:壳体13;其中,壳体13设置在支架本体101的第一侧且与支架本体101固定连接;壳体13具有第一通孔,所述第一通孔与第一装饰圈102相对设置,第一装饰圈102嵌设于所述第一通孔内。In the embodiment of the present invention, the electronic device may further include: a casing 13; wherein, the casing 13 is disposed on the first side of the bracket body 101 and is fixedly connected to the bracket body 101; the casing 13 has a first through hole, The first through hole is disposed opposite to the first decorative ring 102 , and the first decorative ring 102 is embedded in the first through hole.

具体地,第一装饰圈102可以嵌设在所述第一通孔内,并与所述第一通孔贴合,第二摄像模组12可以固定于第一装饰圈102内。本领域技术人员可以理解的是,第一装饰圈102不仅可以用于固定第二摄像模组12,还可以用于填充第二摄像模组12与所述第一通孔之间的间隙,以提高所述电子设备的外观美观性。Specifically, the first decorative ring 102 can be embedded in the first through hole and fit with the first through hole, and the second camera module 12 can be fixed in the first decorative ring 102 . Those skilled in the art can understand that the first decorative ring 102 can not only be used to fix the second camera module 12, but also can be used to fill the gap between the second camera module 12 and the first through hole, so as to The appearance aesthetics of the electronic device is improved.

在本实用新型的一种可选的实施例中,所述电子设备还可以包括:第二装饰圈14;其中,第二装饰圈14套设于第一装饰圈102外且与壳体13的外表面连接。In an optional embodiment of the present invention, the electronic device may further include: a second decorative ring 14 ; wherein the second decorative ring 14 is sleeved outside the first decorative ring 102 and is in contact with the housing 13 . External surface connection.

在一些实施例中,第二装饰圈14可以用于遮挡第一装饰圈102与壳体13之间的缝隙,避免第一装饰圈102与壳体13之间的缝隙外露,避免外界的水、灰尘等进入还缝隙,提高所述电子设备的防水防尘性能。而且,由于第二装饰圈102套接在第一装饰圈102外且与壳体13的外表面连接,还能在视觉上起到减薄第一装饰圈102凸出高度的优点,进一步提升所述电子设备的外观效果。In some embodiments, the second decorative ring 14 can be used to cover the gap between the first decorative ring 102 and the housing 13 to prevent the gap between the first decorative ring 102 and the housing 13 from being exposed, and to avoid external water, Dust and the like enter into the gap, thereby improving the waterproof and dustproof performance of the electronic device. Moreover, since the second decorative ring 102 is sleeved outside the first decorative ring 102 and connected to the outer surface of the housing 13, it can also visually reduce the protruding height of the first decorative ring 102, and further improve the Describe the appearance of electronic equipment.

具体地,为了保持第二装饰圈14与壳体13的外观一致性,提升所述电子设备的外观效果,第二装饰圈14的材质可以与壳体13保持一致,例如,在壳体13为金属壳体的情况下,第二装饰圈14相应可以为金属装饰圈,又如,在壳体13为塑胶壳体的情况下,第二装饰圈14相应可以为塑胶装饰圈。Specifically, in order to maintain the consistency of the appearance of the second decorative ring 14 and the casing 13 and improve the appearance of the electronic device, the material of the second decorative ring 14 can be consistent with the casing 13 , for example, the casing 13 is In the case of a metal casing, the second decorative ring 14 can be a metal decorative ring, for another example, when the casing 13 is a plastic casing, the second decorative ring 14 can be a plastic decorative ring.

可选地,所述电子设备还可以包括:第一粘接层141,第二装饰圈14可以通过第一粘接层141与分别与第一装饰圈102及壳体13连接,以实现第二装饰圈14与第一装饰圈102、壳体13之间的可靠连接。Optionally, the electronic device may further include: a first adhesive layer 141 , and the second decorative ring 14 may be connected to the first decorative ring 102 and the housing 13 respectively through the first adhesive layer 141 , so as to realize the second decorative ring 14 . Reliable connection between the decorative ring 14 , the first decorative ring 102 and the casing 13 .

具体地,第一粘接层141可以是胶带、胶水等具有粘接性质的材料,本实用新型实施例对第一粘接层141的具体材质可以不做限定。Specifically, the first adhesive layer 141 may be a material with adhesive properties such as adhesive tape, glue, etc. The specific material of the first adhesive layer 141 may not be limited in the embodiment of the present invention.

本实用新型实施例中,所述电子设备还可以包括:密封层15,密封层15环绕第一装饰圈102设置,且分别与壳体14、支架本体101连接。在实际应用中,密封层15可以用于实现壳体14与支架本体101之间的密封连接,使壳体内与外界形成相对封闭环境,可有效防止外界的液体或者潮湿气体通过壳体14与支架本体101之间的缝隙进入所述电子设备的内部。In the embodiment of the present invention, the electronic device may further include: a sealing layer 15 . The sealing layer 15 is arranged around the first decorative ring 102 and is connected to the housing 14 and the bracket body 101 respectively. In practical applications, the sealing layer 15 can be used to realize the sealed connection between the casing 14 and the bracket body 101 , so that a relatively closed environment is formed between the casing and the outside world, which can effectively prevent the external liquid or humid gas from passing through the casing 14 and the bracket. The gaps between the bodies 101 enter into the interior of the electronic device.

具体地,密封层15可以由密封泡棉、柔性硅胶等具有密封效果的材料制成。密封层常使用泡棉,因为其原料的获取较为方便,相对于柔性硅胶等材料的价格也更低廉。Specifically, the sealing layer 15 may be made of a material having a sealing effect, such as sealing foam, flexible silicone, or the like. Foam is often used for the sealing layer, because its raw materials are more convenient to obtain and the price is lower than that of flexible silicone and other materials.

本实用新型实施例中,第二摄像模组12可以包括镜片121以及摄像模组122;第一装饰圈102内靠近支架本体101的一侧设置有第一容纳槽,摄像模组122至少部分设置于所述第一容纳槽内;第一装饰圈102内远离支架本体101的一侧设置有第二容纳槽,镜片121设置于所述第二容纳槽内;所述第二容纳槽和所述第一容纳槽之间设置有第二通孔,所述第二通孔与摄像模组122相对设置。In the embodiment of the present invention, the second camera module 12 may include a lens 121 and a camera module 122; a first accommodating groove is provided on the side of the first decorative ring 102 close to the bracket body 101, and the camera module 122 is at least partially arranged in the first accommodating groove; the side of the first decorative ring 102 away from the bracket body 101 is provided with a second accommodating groove, and the lens 121 is disposed in the second accommodating groove; the second accommodating groove and the A second through hole is disposed between the first accommodating grooves, and the second through hole is disposed opposite to the camera module 122 .

在一些实施例中,第一装饰圈中可通过凸起结构,形成第一容纳槽、第二容纳槽。第一容纳槽可以用于容纳摄像模组122,第二容纳槽可以用于容纳镜片121,由于第二容纳槽和第一容纳槽之间设置有第二通孔,所述第二通孔与摄像模组122相对设置,所述第二通孔可以用于避让摄像模组122,方便摄像模组122进行拍摄。In some embodiments, a first accommodating groove and a second accommodating groove may be formed by a protruding structure in the first decorative ring. The first accommodating groove can be used for accommodating the camera module 122, and the second accommodating groove can be used for accommodating the lens 121. Since a second through hole is provided between the second accommodating groove and the first accommodating groove, the second through hole is The camera modules 122 are disposed opposite to each other, and the second through hole can be used to avoid the camera module 122 to facilitate the camera module 122 to shoot.

可选地,镜片121的类型可以根据需要进行设定。例如,在对拍摄角度没有特殊要求的情况下,镜片121可以是平面镜片。又如,在需要获得较大的拍摄角度的情况下,镜片121可以采用广角镜片,以使得镜片121在为摄像模组122提供防摔保护的同时,还可以增大镜头的拍摄角度。Optionally, the type of the lens 121 can be set as required. For example, the lens 121 may be a flat lens without special requirements on the shooting angle. For another example, when a larger shooting angle needs to be obtained, the lens 121 can use a wide-angle lens, so that the lens 121 can provide anti-drop protection for the camera module 122 while increasing the shooting angle of the lens.

可选地,所述电子设备还包括:第二粘接层123;其中,镜片121可以通过第二粘接层123连接在所述第二容纳槽内,以实现镜片121与所述第二容纳槽之间的可靠连接。Optionally, the electronic device further includes: a second adhesive layer 123; wherein, the lens 121 can be connected in the second accommodating groove through the second adhesive layer 123, so as to realize the lens 121 and the second accommodating Reliable connection between slots.

具体地,第二粘接层123可以由胶带、胶水等粘接介质制成,在一些实施例中,第二粘接层优先使用胶带,可防止胶水等材料在使用过程中出现溢胶等情况,影响设备的使用。Specifically, the second adhesive layer 123 can be made of adhesive media such as tape and glue. In some embodiments, tape is preferentially used for the second adhesive layer, which can prevent glue and other materials from overflowing during use. , affecting the use of the device.

可选地,所述电子设备还可以包括:第一缓冲层111;其中,第一摄像模组11可以通过第一缓冲层111与支架本体101的第二侧固定连接。Optionally, the electronic device may further include: a first buffer layer 111 ; wherein, the first camera module 11 may be fixedly connected to the second side of the bracket body 101 through the first buffer layer 111 .

在一些实施例中,第一缓冲层111可以用于缓冲第一摄像模组11与支架本体101之间的连接,减小第一摄像模组11与支架本体101之间的冲击力,提高第一摄像模组11的抗跌落性能。In some embodiments, the first buffer layer 111 can be used to buffer the connection between the first camera module 11 and the bracket body 101, reduce the impact force between the first camera module 11 and the bracket body 101, and improve the first camera module 11 and the bracket body 101. Drop resistance of a camera module 11 .

本实用新型实施例中,所述电子设备还可以包括:主板16,第一摄像模组11、第二摄像模组12分别与主板16电连接。In the embodiment of the present invention, the electronic device may further include: a main board 16 , the first camera module 11 and the second camera module 12 are electrically connected to the main board 16 respectively.

具体地,主板16上可以设置有控制模块、电源模块等,由于第一摄像模组11、第二摄像模组12与主板16之间的电连接,第一摄像模组11、第二摄像模组12可以与所述控制模块、所述电源模块配合使用,实现拍摄的功能。具体地,主板16可以与主板支架10的第二侧连接。Specifically, the main board 16 may be provided with a control module, a power supply module, etc. Due to the electrical connection between the first camera module 11, the second camera module 12 and the main board 16, the first camera module 11, the second camera module 12 and the main board 16 are electrically connected. The group 12 can be used in cooperation with the control module and the power module to realize the function of shooting. Specifically, the mainboard 16 may be connected with the second side of the mainboard bracket 10 .

本实用新型实施例中,所述电子设备还可以包括:依次设置的主上结构件17、显示模组18以及盖板19,其中,主上结构件17与主板16固定连接,显示模组18与主上结构件17之间通过第二缓冲层171连接,盖板19与显示模组18之间通过第三粘接层181连接。主板支架10、主板16、主上结构件17之间可以通过紧固件161连接。In the embodiment of the present invention, the electronic device may further include: a main upper structural member 17, a display module 18 and a cover plate 19 arranged in sequence, wherein the main upper structural member 17 is fixedly connected with the main board 16, and the display module 18 The second buffer layer 171 is used for connection with the main upper structure member 17 , and the third adhesive layer 181 is used for connection between the cover plate 19 and the display module 18 . The mainboard bracket 10 , the mainboard 16 , and the main upper structural member 17 can be connected by fasteners 161 .

具体地,第二缓冲层171可以由泡棉、柔性硅胶等柔性材料制成,本实用新型实施例对于第二缓冲层171的具体材质可以不做限定。第三粘接层181可以由光学胶等透明的粘接介质制成,本实用新型实施例对第三粘接层181的具体材质可以不做限定。Specifically, the second buffer layer 171 may be made of flexible materials such as foam, flexible silicone, and the like, and the specific material of the second buffer layer 171 may not be limited in the embodiment of the present invention. The third adhesive layer 181 may be made of a transparent adhesive medium such as optical glue, and the specific material of the third adhesive layer 181 may not be limited in the embodiment of the present invention.

可选地,所述电子设备还可以包括:第三缓冲层124;其中,摄像模组122可以通过第三缓冲层124与主上结构件17固定连接。Optionally, the electronic device may further include: a third buffer layer 124 ; wherein, the camera module 122 may be fixedly connected to the main upper structure member 17 through the third buffer layer 124 .

在实际应用中,第三缓冲层124可以用于缓冲摄像模组122与主上结构件17之间的连接,减小摄像模组122与主上结构件17之间的冲击力,提高摄像模组122的抗跌落性能。In practical applications, the third buffer layer 124 can be used to buffer the connection between the camera module 122 and the main upper structure member 17 , reduce the impact force between the camera module 122 and the main upper structure member 17 , and improve the camera module Drop resistance of group 122.

具体地,第三缓冲层124可以由泡棉、柔性硅胶等柔性材料制成,本实用新型实施例对于第三缓冲层124的具体材质可以不做限定。Specifically, the third buffer layer 124 may be made of flexible materials such as foam, flexible silicone, and the like, and the specific material of the third buffer layer 124 may not be limited in the embodiment of the present invention.

综上,本实用新型实施例所述的电子设备至少可以包括以下优点:To sum up, the electronic device described in the embodiments of the present invention may at least include the following advantages:

本实用新型实施例中,由于所述主板支架包括支架本体以及第一装饰圈,所述支架本体和所述第一装饰圈为一体成型结构,所述第一装饰圈可以用于固定所述第二摄像模组,这样,就可以避免在所述第一装饰圈和所述支架本体之间设置泡棉、胶层来实现二者的连接,降低所述电子设备的厚度,提高所述电子设备的外观美观性。In the embodiment of the present invention, since the motherboard bracket includes a bracket body and a first decorative ring, the bracket body and the first decorative ring are integrally formed, and the first decorative ring can be used to fix the first decorative ring. Two camera modules, in this way, it is possible to avoid arranging foam and adhesive layers between the first decorative ring and the bracket body to realize the connection between the two, reduce the thickness of the electronic equipment, and improve the electronic equipment. aesthetic appearance.

最后,还需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的相同要素。Finally, it should also be noted that in this document, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply these entities or that there is any such actual relationship or sequence between operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or terminal device comprising a list of elements includes not only those elements, but also a non-exclusive list of elements. other elements, or also include elements inherent to such a process, method, article or terminal equipment. Without further limitation, an element defined by the phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, article or terminal device comprising said element.

以上对本实用新型所提供的一种电子设备,进行了详细介绍,本文中应用了具体个例对本实用新型的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本实用新型的方法及其核心思想;同时,对于本领域的一般技术人员,依据本实用新型的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本实用新型的限制。The electronic equipment provided by the present invention has been introduced in detail above. The principles and implementations of the present invention are described with specific examples in this paper. method and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. To sum up, the contents of this specification should not be interpreted as Limitations of the present invention.

Claims (10)

1.一种电子设备,其特征在于,包括:主板支架、第一摄像模组和第二摄像模组;其中,1. An electronic device, characterized in that, comprising: a mainboard bracket, a first camera module and a second camera module; wherein, 所述主板支架包括支架本体以及第一装饰圈,所述支架本体和所述第一装饰圈为一体成型结构;The mainboard bracket includes a bracket body and a first decorative ring, and the bracket body and the first decorative ring are integrally formed; 所述第一装饰圈设置于所述支架本体的一侧,所述第一摄像模组固定于所述支架本体的第二侧;The first decorative ring is arranged on one side of the bracket body, and the first camera module is fixed on the second side of the bracket body; 所述第二摄像模组与所述第一装饰圈固定连接。The second camera module is fixedly connected with the first decorative ring. 2.根据权利要求1所述的电子设备,其特征在于,所述电子设备还包括:壳体;其中,2. The electronic device according to claim 1, wherein the electronic device further comprises: a housing; wherein, 所述壳体设置在所述支架本体的第一侧且与所述支架本体固定连接;the shell is disposed on the first side of the bracket body and is fixedly connected with the bracket body; 所述壳体具有第一通孔,所述第一通孔与所述第一装饰圈相对设置,所述第一装饰圈嵌设于所述第一通孔内。The casing has a first through hole, the first through hole is arranged opposite to the first decorative ring, and the first decorative ring is embedded in the first through hole. 3.根据权利要求2所述的电子设备,其特征在于,所述电子设备还包括:第二装饰圈;其中,3. The electronic device according to claim 2, wherein the electronic device further comprises: a second decorative ring; wherein, 所述第二装饰圈套设于所述第一装饰圈外且与所述壳体的外表面连接。The second decorative ring is sleeved outside the first decorative ring and is connected with the outer surface of the casing. 4.根据权利要求3所述的电子设备,其特征在于,所述电子设备还包括:第一粘接层,所述第二装饰圈通过所述第一粘接层分别与所述第一装置圈及所述壳体连接。4 . The electronic device according to claim 3 , wherein the electronic device further comprises: a first adhesive layer, and the second decorative ring is respectively connected to the first device through the first adhesive layer. 5 . The ring is connected to the housing. 5.根据权利要求2所述的电子设备,其特征在于,所述电子设备还包括:密封层,所述密封层环绕所述第一装饰圈设置,且分别与所述壳体、所述支架本体连接。5 . The electronic device according to claim 2 , wherein the electronic device further comprises: a sealing layer, the sealing layer is arranged around the first decorative ring, and is respectively connected with the casing and the bracket. 6 . Body connection. 6.根据权利要求1所述的电子设备,其特征在于,所述第二摄像模组包括镜片以及摄像模组;6. The electronic device according to claim 1, wherein the second camera module comprises a lens and a camera module; 所述第一装饰圈内靠近所述支架本体的一侧设置有第一容纳槽,所述摄像模组至少部分设置于所述第一容纳槽内;A first accommodating groove is disposed on the side of the first decorative ring close to the bracket body, and the camera module is at least partially disposed in the first accommodating groove; 所述第一装饰圈内远离所述支架本体的一侧设置有第二容纳槽,所述镜片设置于所述第二容纳槽内;A second accommodating groove is disposed on the side of the first decorative ring away from the bracket body, and the lens is disposed in the second accommodating groove; 所述第二容纳槽和所述第一容纳槽之间设置有第二通孔,所述第二通孔与所述摄像模组相对设置。A second through hole is disposed between the second accommodating groove and the first accommodating groove, and the second through hole is disposed opposite to the camera module. 7.根据权利要求6所述的电子设备,其特征在于,所述电子设备还包括:第二粘接层;其中,7. The electronic device according to claim 6, wherein the electronic device further comprises: a second adhesive layer; wherein, 所述镜片通过所述第二粘接层连接在所述第二容纳槽内。The lens is connected in the second accommodating groove through the second adhesive layer. 8.根据权利要求1所述的电子设备,其特征在于,所述电子设备还包括:第一缓冲层;其中,8. The electronic device according to claim 1, wherein the electronic device further comprises: a first buffer layer; wherein, 所述第一摄像模组通过所述第一缓冲层与所述支架本体的第二侧固定连接。The first camera module is fixedly connected to the second side of the bracket body through the first buffer layer. 9.根据权利要求1所述的电子设备,其特征在于,所述电子设备还包括:主板,所述第一摄像模组、所述第二摄像模组分别与所述主板电连接。9 . The electronic device according to claim 1 , wherein the electronic device further comprises: a mainboard, the first camera module and the second camera module are respectively electrically connected to the mainboard. 10 . 10.根据权利要求1所述的电子设备,其特征在于,所述主板支架为塑胶支架。10 . The electronic device according to claim 1 , wherein the motherboard bracket is a plastic bracket. 11 .
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Cited By (4)

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CN113242341A (en) * 2021-06-16 2021-08-10 维沃移动通信有限公司 Electronic device
CN113489875A (en) * 2021-07-23 2021-10-08 维沃移动通信有限公司 Electronic equipment
CN113923282A (en) * 2021-10-09 2022-01-11 维沃移动通信有限公司 Electronic equipment
US12348844B2 (en) 2022-09-29 2025-07-01 Samsung Electronics Co., Ltd. Electronic device including structure for supporting camera module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113242341A (en) * 2021-06-16 2021-08-10 维沃移动通信有限公司 Electronic device
WO2022262677A1 (en) * 2021-06-16 2022-12-22 维沃移动通信有限公司 Electronic device
CN113242341B (en) * 2021-06-16 2023-12-22 维沃移动通信有限公司 Electronic equipment
CN113489875A (en) * 2021-07-23 2021-10-08 维沃移动通信有限公司 Electronic equipment
WO2023001181A1 (en) * 2021-07-23 2023-01-26 维沃移动通信有限公司 Electronic device
CN113923282A (en) * 2021-10-09 2022-01-11 维沃移动通信有限公司 Electronic equipment
WO2023056959A1 (en) * 2021-10-09 2023-04-13 维沃移动通信有限公司 Electronic device
CN113923282B (en) * 2021-10-09 2024-03-01 维沃移动通信有限公司 Electronic equipment
US12348844B2 (en) 2022-09-29 2025-07-01 Samsung Electronics Co., Ltd. Electronic device including structure for supporting camera module

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