CN211376614U - Carrier for chip packaging - Google Patents

Abstract

The utility model relates to a carrier for chip packaging, which comprises a carrier plate, a pyrolytic film and a double-sided film; the pyrolytic film is pasted on the carrier plate, the double-sided film is pasted on the pyrolytic film, and the pyrolytic film is used for pasting the matrix array of the chips; the film surface of the pyrolysis film, which is adhered to the support plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity. The carrier can be used for pasting a matrix array of chips and provides support for the uniform packaging of the chips arranged in a matrix.

Description

A carrier for chip packaging

technical field

The utility model relates to the technical field of LED chip packaging, in particular to a carrier for chip packaging.

Background technique

In the manufacturing process of the LED lamp, the LED chip needs to be packaged. The traditional LED chip packaging process is to dispense glue to the LED chips one by one, which is time-consuming, has high production cost, and is difficult to control and reduce the volume and thickness of the LED chip package.

Utility model content

In view of the deficiencies of the prior art, the purpose of the present invention is to provide a carrier for chip packaging, the carrier can be used for pasting a matrix array of chips, and provides support for the unified packaging of the chips in the matrix array.

In order to achieve the purpose of the utility model, the utility model provides a carrier for chip packaging, which comprises a carrier plate, a pyrolysis film and a double-sided film; the pyrolysis film is attached to the carrier plate, and the double-sided film is attached to the pyrolysis film, The pyrolytic film is used to paste the matrix array of chips; the film surface of the pyrolytic film and the carrier plate is sticky, and the stickiness disappears after heating, and the two sides of the double-sided film are sticky.

It can be seen from the above that the carrier provided by the present invention includes a carrier plate, a pyrolysis film and a double-sided film, wherein the carrier plate can provide support, the pyrolysis film is attached to the carrier plate and is easily peeled off from the carrier plate after heating, and the double-sided film has both sides. Adhesive, one side is used to attach the pyrolysis film and the other side is used to attach the matrix array of chips. Chips arranged in a matrix are positioned on the carrier, and then uniformly coated with glue for packaging. After the glue is cured, the carrier is peeled off and then cut to obtain a single chip package. The carrier of the utility model can provide support for the batch packaging and manufacturing of chips.

A further technical solution is that a matrix array mark is provided on the board surface of the carrier plate which is pasted with the pyrolysis film, and the matrix array mark is visible through the pyrolysis film and the double-sided film.

It can be seen from the above that the utility model is provided with matrix array marks on the carrier plate, the pyrolysis film and the double-sided film have certain transparency, and the chips are arranged on the pyrolysis film according to the matrix array marks, which can improve the positioning accuracy of the chips. Since the carrier board can be reused, the matrix array marks are arranged on the carrier board to facilitate positioning by using the matrix array marks when arranging chips for many times.

A further technical solution is that the matrix array mark is arranged in the middle of the carrier plate.

It can be seen from the above that the matrix array mark of the present invention is arranged in the middle of the carrier board. During the chip packaging process, other free positions other than the matrix array can be used for clamping the carrier by the clamp, carrying the excess glue that overflows, and supporting the pressing piece of the flattening glue. etc. to use.

A further technical solution is that the carrier plate is a steel plate, and the double-face film is a silicone double-face film.

It can be seen from the above that the carrier plate of the present invention is a steel plate, which has high mechanical properties, is not easily deformed, and can provide stable support. The double-face film is a silicone double-face film with good bonding properties.

A further technical solution is that the pyrolytic film or the double-sided film is provided with cutting marks.

As can be seen from the above, the utility model provides cutting marks on the pyrolysis film or double-sided film, which is helpful for cutting the packaged chip matrix array according to the cutting marks.

A further technical solution is that the cutting marks are arranged at the edge of the pyrolytic film or the double-sided film.

It can be seen from the above that the cutting mark of the present invention can be set at the edge of the film to avoid being covered by glue.

Description of drawings

FIG. 1 is a schematic structural diagram of an embodiment of a carrier of the present invention.

FIG. 2 is a schematic exploded view of the structure of the embodiment of the carrier of the present invention.

FIG. 3 is a schematic diagram of an embodiment of the present invention using a carrier to manufacture a flip-chip LED chip CSP.

Detailed ways

As shown in FIGS. 1 to 2 , this embodiment provides a carrier for chip packaging, which includes a carrier board 10 , a pyrolysis film 11 and a double-sided film 12 ; the pyrolysis film 11 is attached to the carrier board 10 , and the double-sided membrane 12 is attached to On the pyrolytic film 11 , the pyrolytic film 11 is used to attach a matrix array of chips 20 . The carrier plate 10 is a steel plate, which has high strength and hardness, is not easily deformed, and can play a good supporting role; the first pyrolysis film 11 has adhesion at least on the film surface in contact with the carrier plate 10, The adhesiveness disappears after heating, and it is easy to peel off; the double-sided film 12 can be a silicone double-sided film, and both sides are sticky. The carrier board 10 , the pyrolysis film 11 and the double-sided film 12 together constitute the carrier of the chip 20 , and the carrier board 10 , the pyrolysis film 11 and the double-sided film 12 can be laminated by a cold laminating machine with lamination rollers.

The carrier board 10 is provided with the matrix positioning marks 13 of the flip-chip LED chips 20 , the pyrolysis film 11 and the double-sided film 12 have certain transparency, and the matrix positioning marks 13 can be seen through the pyrolysis film 11 and the double-sided film 12 . When arranging the matrix array of the chips 20 , the chips 20 can be arranged on the double-sided film 12 according to the matrix positioning marks 13 . In this embodiment, the matrix array marks 13 are arranged in the middle of the carrier board 10 .

A cutting mark 14 is provided at the edge of the pyrolytic film 11 or the double-sided film 12 . After the chips 20 are packaged, the matrix array can be diced according to the dicing marks 14 .

As an example of the specific application of the above-mentioned carrier embodiment, the carrier can be applied to a flip-chip LED chip CSP manufacturing method, and the method specifically includes the following steps:

Step 1: As shown in Figure 3(a) and Figures 1 to 2, a carrier is provided.

Step 2: As shown in FIG. 3( b ), a matrix array of flip-chip LED chips 20 is arranged on the first double-sided film 12 . Specifically, flip-chip LEDs are arranged on the first double-sided film 12 according to the matrix positioning marks 13 The matrix array of the chips 20 can be positioned, for example, by a visual inspection instrument, and the arrangement can be performed by a device such as a chip arranging machine. There are gaps 21 between adjacent flip-chip LED chips 20 . The first double-sided film 12 includes a gluing area and a first spare area outside the gluing area, and the matrix array is arranged in the gluing area. In this embodiment, the first spare area is arranged around the gluing area.

Step 3: Apply light-shielding glue 30 on the matrix array. In the coating process of the light-shielding glue 30 , the carrier with the flip-chip LED chip 20 can be fixed with a clamp, and a glue coating machine is used for film coating. The light-shielding glue includes the following components: 90 to 110 parts by mass of silica gel, 1 to 5 parts by mass of silicon dioxide powder, 1 to 5 parts by mass of alumina powder, and 50 to 80 parts by mass of titanium dioxide powder. The silica gel is composed of A glue and B glue in a mass ratio of 1:5, and the mass percentage relative to the silica gel is 100% by weight. Vinyltetramethyldisiloxane solution composition, B glue is composed of 63.5wt% of phenyl silicone resin, 19.77wt% of phenyl hydrogen-containing polysiloxane and 0.06wt% of ethynyl cyclohexanol. When the light-shielding glue including the above components is used, the voids can be effectively filled, while the light-shielding effect is achieved, the adhesiveness of the glue is not affected, the heat dissipation effect is enhanced, and the excessive precipitation of the powdery material is prevented.

Step 4: As shown in FIG. 3( c ), the first pressing piece is pressed on the light-shielding glue 30 , so that the light-shielding glue 30 fills the gap 21 and the light-shielding glue 30 does not exceed the glue application area. The first pressing member includes a first pressing plate 40 and a protective film 41 , the protective film 41 is in contact with the light shielding glue 30 , the first pressing plate 40 is disposed on the protective film 41 , and the first pressing plate 40 is parallel to the carrier plate 10 . The protective film 41 can keep the cured surface of the light-shielding glue 30 smooth and clean, and the first pressing plate 40 can be a glass plate to provide a certain pressure. The first pressing plate 40 is pressed down so that the protective film 41 is close to the upper surface of the flip-chip LED chip 20 to reduce the residual light shielding glue 30 on the upper surface of the flip-chip LED chip 20 .

Step 5: Curing the light-shielding glue 30 . The curing conditions may be curing at 75°C to 90°C for 45min to 80min, and curing at 115°C to 125°C for 15min to 45min. Specifically, in this embodiment, the curing process can be carried out in an oven, which is baked at 80° C. for 1 hour and at 120° C. for 0.5 hours.

Step 6 : as shown in FIG. 3( d ), peel off the first pressing member, and remove the light-shielding glue 30 on the upper surface of the flip-chip LED chip 20 . Specifically, a film remover can be used to remove the light-shielding glue 30 on the upper surface of the flip-chip LED chip 20 , the film remover can be dipped on the non-woven fabric, and the upper surface of the flip-chip LED chip 20 can be wiped by manually clamping the non-woven fabric with tweezers. The film removing agent includes the following components by mass: diluent: 50 to 70 parts by mass; industrial alcohol: 30 to 40 parts by mass; acetone: 10 to 30 parts by mass; wherein the diluent includes 60 to 90 wt % of methyl acetate and 10wt% to 40wt% denatured alcohol. The use of the above-mentioned film removing agent can effectively remove the excess residual film on the surface of the chip, and after the residual film is removed, subsequent baking will not foam, which strengthens the adhesion between the chip and the fluorescent film.

Step 7: Coating fluorescent glue 50 on the matrix array. In the coating process of the fluorescent glue 50, the carrier with the flip-chip LED chip 20 can be fixed with a clamp, and a glue coating machine is used for film coating. The fluorescent glue 50 includes the following components in parts by mass: silica gel: 90 parts by mass to 110 parts by mass; fluorescent powder: 40 parts by mass to 60 parts by mass; silicon dioxide powder: 1 part by mass to 5 parts by mass; DP glue: 1 part by mass parts to 3 parts by mass. The silica gel is composed of A glue and B glue in a mass ratio of 1:5, and the mass percentage relative to the silica gel is 100% by weight. Vinyltetramethyldisiloxane solution composition, B glue is composed of 63.5wt% of phenyl silicone resin, 19.77wt% of phenyl hydrogen-containing polysiloxane and 0.06wt% of ethynyl cyclohexanol. The fluorescent glue can improve the light efficiency, strengthen the cohesive force, better control the thickness of the fluorescent film, and improve the subsequent cutting efficiency.

Step 8: As shown in FIG. 3( e ), a support block 60 is placed in the first spare area, and the height of the support block 60 is greater than the height of the flip-chip LED chip 20 . In this embodiment, the number of the support blocks 60 is four, and the height of each support block 60 is the same, and the four support blocks are respectively arranged on the first spare area around the gluing area. Step 8 is performed before or after step 7.

Step 9: As shown in FIG. 3( e ), the second pressing piece is placed on the support block 60 , and the second pressing piece flattens the fluorescent glue 50 above the matrix array. The second pressing piece includes a second pressing plate 70, a second pyrolysis film 71, a second double-sided film 72 and a high temperature film 73. The second pyrolysis film 71 is attached to the second pressing plate 70, and the second double-sided membrane 72 is attached to the second pressure plate 70. On the pyrolysis film 71, the second double-sided film 72 includes a lamination area and a second spare area outside the lamination area, the lamination area is set corresponding to the gluing area, and the second spare area is set corresponding to the first spare area, The high temperature film 73 is attached to the bonding area. The second pressing piece is placed on the support block 60 with the second pressing plate 70 facing up and the high temperature film 73 facing down. Among them, the second pyrolysis film 71 has adhesiveness, which disappears after heating and is easy to peel off; the second double-sided film 72 can be a silicone double-sided film, and its two sides are sticky; the high-temperature film 73 has no stickiness and has a smooth surface. Avoid sticking to the fluorescent layer or causing the surface of the fluorescent layer to be rough. The second pressing plate 70 , the second pyrolysis film 71 , the second double-sided film 72 and the high temperature film 73 can be laminated by a cold laminating machine with a laminating roller. The support block 60 is supported between the first double-sided membrane 12 and the second double-sided membrane 72, and the first double-sided membrane 12 and the second double-sided membrane 72 have a certain bonding effect on the support block 60 to avoid the second pressing during the curing process. Variation in package thickness due to displacement relative to the carrier. According to the thickness requirements of the CSP package, the present invention can select an appropriate height of the support block 60 and the thickness of the high temperature film 73 . The thickness of the CSP package is equal to the height of the support block 60 minus the thickness of the high temperature film 73 . Specifically, in this embodiment, the height of the support block 60 is 0.55 mm, the thickness of the high temperature film is 0.15 mm, and a packaged chip with a thickness of 0.4 mm can be obtained.

Step 10: curing the fluorescent glue 50; curing conditions are: curing at 75°C to 90°C for 45min to 80min, and curing at 115°C to 125°C for 15min to 45min; specifically in this embodiment, curing can be performed in an oven The curing conditions are 80℃ for 1h and 120℃ for 0.5h.

Step 11 : peel off the second pressing member, peel off the carrier board 10 , and cut the matrix array to obtain a CSP package of flip-chip LED chips 20 . The first pyrolysis film 11 or the first double-sided film 12 may be provided with cutting marks, and the matrix array is cut according to the cutting marks.

Finally, it should be emphasized that the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims (2)

1. A carrier for chip packaging, comprising:

comprises a support plate, a pyrolytic film and a double-sided film;

the pyrolysis film is attached to the support plate, the double-sided film is attached to the pyrolysis film, and the pyrolysis film is used for adhering a matrix array of chips;

the film surface of the pyrolysis film, which is pasted with the carrier plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity.

2. The carrier for chip packaging according to claim 1, wherein:

the support plate is a steel plate, and the double-sided film is a silica gel double-sided film.

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