CN211349185U - An Android system industrial computer - Google Patents

Abstract

The utility model discloses an Android system industrial control computer, comprising: a casing main body, which is a hollow casing with an opening on one side, a computer main body is arranged in the cavity, and a computer main body is detachably connected to the opening of the casing main body. A heat dissipation cover plate, the heat dissipation cover plate covers the opening of the casing main body, and heat dissipation fins are provided on both sides of the heat dissipation cover plate. In the Android system industrial control computer provided by the utility model, heat dissipation fins are arranged on both sides of the heat dissipation cover plate. The chip enhances the ability to dissipate heat, and generally improves the heat dissipation capacity of the Android system industrial computer. At the same time, the cavity of the main body of the case is closed by the heat dissipation cover to prevent dust from entering the interior.

Description

An Android system industrial computer

technical field

The utility model relates to the technical field of data processing equipment, in particular to an Android system industrial control computer.

Background technique

Android system industrial computer (industrial computer) is an industry-specific computer, also known as a special computer, mainly embedded in industrial field automation equipment and life information equipment. The industrial computer has important computer attributes and characteristics, and it will generate a lot of heat during its operation. In order to discharge the heat in time into the casing where it is located, and prevent the high temperature from affecting its work efficiency, it is generally used to open the side of the casing. On the one hand, the heat dissipation effect of this solution is limited, and on the other hand, external dust or foreign objects enter the casing through the heat dissipation holes, which may cause damage to the industrial computer.

Utility model content

The technical problem to be solved by the utility model is to provide an Android system industrial control computer, which can improve the heat dissipation capability while preventing dust from entering the interior.

In order to solve the above technical problems, the present invention provides an Android system industrial control computer, comprising: a casing main body, which is a hollow casing with an opening on one side, a computer main body is arranged in the cavity, and the casing main body is provided with a computer main body. A heat dissipation cover plate is detachably connected to the opening, the heat dissipation cover plate covers the opening of the casing main body, and heat dissipation fins are provided on both sides of the heat dissipation cover plate.

Further, both sides of the heat dissipation cover plate protrude outward to form cylindrical surfaces, and a plurality of the heat dissipation fins are formed on each cylindrical surface extending outward along its radial direction.

Further, a plurality of the heat dissipation fins are evenly distributed in the circumferential direction of the cylindrical surface, and there is a height difference between two adjacent heat dissipation fins.

Further, it also includes: a heat-conducting pipe, one end of the heat-conducting pipe is in contact with the heating element on the computer main body, and the other end is in contact with the heat dissipation cover.

Further, the opening of the casing main body is surrounded by a limit step, and the outline of the heat dissipation cover plate matches the limit step and is covered on the limit step, and is connected with the casing main body. Removably connected, one end of the heat-conducting pipe is sandwiched between the heat-dissipating cover plate and the limiting step.

Further, a groove is formed on the limiting step, and one end of the heat conducting pipe is disposed in the groove and is exposed on the surface of the limiting step in contact with the heat dissipation cover plate.

Further, a locking assembly is also provided on the heat dissipation cover, and the locking assembly includes: a fixing part fixed on the heat dissipation cover; The fixing part reciprocates in the axial direction of the plug, and the main body of the casing is provided with a plug hole at a position corresponding to the plug.

Further, a limiting portion is provided on the plug, and an elastic member is sandwiched between the limiting portion and the fixing portion.

Further, the end of the plug is spherical.

Further, the elastic member is sleeved outside the plug.

Beneficial effects:

In the Android system industrial control computer provided by the utility model, heat dissipation fins are arranged on both sides of the heat dissipation cover plate, the heat dissipation fins in the cavity of the main body of the casing enhance the ability of absorbing heat, and the heat dissipation fins outside the cavity of the main body of the casing are provided with heat dissipation fins. The chip enhances the ability to dissipate heat, and generally improves the heat dissipation capacity of the Android system industrial control computer. At the same time, the cavity of the main body of the casing is closed by the heat dissipation cover to prevent dust from entering the interior.

Description of drawings

Fig. 1 is the sectional schematic diagram of the android system industrial control computer of the present invention;

Fig. 2 is the left side view in Fig. 1;

Fig. 3 is the right side view in Fig. 1;

Fig. 4 is A-A sectional view in Fig. 2;

FIG. 5 is an enlarged view of the partial view B in FIG. 1 .

In the figure, 100. the main body of the casing, 101. the mounting plate, 102. the side wall;

200. The main body of the computer;

300. Cooling cover plate, 301. Cylindrical surface, 302. Cooling fins;

400. Display screen;

500. Heat pipe;

600. Locking assembly, 601. Fixed part, 602. Latch, 603. Limiting part, 604. Elastic part.

Detailed ways

The present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and implement it, but the examples are not intended to limit the present utility model.

An Android system industrial computer, as shown in Figures 1 to 4, includes: a casing main body 100, which is a hollow casing with an opening on one side, the opening is used for taking and placing the computer main body 200, and the casing main body 100 includes: a mounting plate 101 and side wall 102. The side wall 102 is located on one side of the mounting plate 101 and is integrally formed with the mounting plate 101. The contour edge of the mounting plate 101 is provided with mounting holes for installing and fixing the Android system industrial computer. The side wall 102 is surrounded by A rectangular frame shape is formed, and the side wall 102 forms a cavity of the casing body 100. A computer body 200 is arranged in the cavity of the casing body 100. The computer body 200 includes: a computer motherboard, a CPU, a memory, etc., and the computer body 200 is fixed On the installation board 101, a display screen 400 is fixed on the other side of the installation board 101, the display screen 400 is electrically connected with the computer main body 200, and a heat dissipation cover plate 300 is detachably connected to the opening of the casing main body 100. It can be screwed, and the heat dissipation cover 300 is covered on the opening of the casing body 100, so that the cavity of the casing body 100 forms a closed cavity, and the heat dissipation cover 300 is provided with heat dissipation fins 302 on both sides. 300 can use aluminum alloy material.

In this embodiment, the heat in the casing main body 100 (the heat dissipated during the operation of the computer main body 200 ) is conducted by the heat dissipation cover plate 300 to the outside of the casing main body 100 . Both sides of the heat dissipation cover plate 300 are provided with heat dissipation fins 302. The heat dissipation fins 302 in the cavity of the casing main body 100 enhance the ability to absorb heat, and the heat dissipation fins 302 outside the cavity of the casing main body 100 enhance the heat dissipation. The heat capacity improves the heat dissipation capacity of the Android system industrial computer on the whole. At the same time, the cavity of the casing body 100 is closed by the heat dissipation cover plate 300 to prevent dust from entering the interior.

In an optional implementation of this embodiment, in order to enhance the air flow, fans may be provided on both sides of the heat dissipation cover plate 300 .

In an optional implementation of this embodiment, both sides of the heat dissipation cover plate 300 are protruded outward to form cylindrical surfaces 301 (the surfaces are similar to the surfaces of the cylinders), and each cylindrical surface 301 is radially outward on each cylindrical surface 301 . A plurality of heat dissipation fins 302 are formed by extending, and an air flow channel is formed between two adjacent heat dissipation fins 302 . Both the cylindrical surface 301 and the cooling fins 302 increase the surface area for heat exchange. Further, the plurality of heat dissipation fins 302 are evenly distributed in the circumferential direction of the cylindrical surface 301 , and there is a height difference between two adjacent heat dissipation fins 302 , which is more conducive to air flow and improves the heat dissipation effect.

In an optional implementation of this embodiment, in order to further improve the heat dissipation effect, it further includes: a heat conduction pipe 500. The heat conduction pipe 500 may be a red copper pipe. The heat-conducting material has excellent heat-conducting performance. One end of the heat-conducting pipe 500 is in contact with the heating element (CPU) on the computer body 200 , and the other end is in contact with the heat-dissipating cover plate 300 . In order to facilitate the installation of the heat pipe 500, the opening of the casing body 100 is surrounded by a limit step, and the contour of the heat dissipation cover plate 300 matches the limit step and is covered on the limit step, and is detachably connected to the casing body 100. , one end of the heat pipe 500 is sandwiched between the heat dissipation cover plate 300 and the limiting step. Specifically, a groove is formed on the limit step, and one end of the heat pipe 500 is disposed in the groove and exposed on the surface of the limit step in contact with the heat dissipation cover plate 300 , so as to ensure that the heat dissipation cover plate 300 is in contact with the heat pipe 500 .

In an optional implementation manner of this embodiment, as shown in FIG. 5 , in order to facilitate the pre-fixing of the heat dissipation cover 300 , the heat dissipation cover 300 is further provided with a locking assembly 600 , and the locking assembly 600 includes: The fixed part 601 on the board 300 penetrates the plug 602 of the fixed part 301 , the plug 602 can reciprocate relative to the fixed part 601 in the axial direction of the plug 602 . When installing the heat dissipation cover plate, the heat dissipation cover plate 300 is pre-fixed by the locking assembly 600 first, and then the fastening screws are fastened, which is especially suitable for the case where the heat dissipation cover plate 300 is located directly under the casing main body 100 .

To ensure that the plug 602 can be kept in the plug hole, a limiting portion 603 is provided on the plug 602, and an elastic member 604 is sandwiched between the limiting portion 603 and the fixing portion 601, and the elastic member 604 can be a spring. The elastic member 604 is sleeved outside the plug 602 .

To enhance guidance during insertion, the end of the pin 602 is spherical.

The above-mentioned embodiments are only preferred embodiments for fully explaining the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present utility model is subject to the claims.

Claims (10)

1. An android system industrial control computer, characterized in that, comprising: a casing main body, a hollow casing with an opening on one side, a computer main body is provided in its cavity, and the opening of the casing main body is detachably connected There is a heat dissipation cover plate, the heat dissipation cover plate covers the opening of the casing body, and heat dissipation fins are arranged on both sides of the heat dissipation cover plate, wherein the heat dissipation fins in the cavity of the casing body can absorb Heat, the heat dissipation fins outside the cavity of the main body of the casing can dissipate heat. 2 . The Android system industrial computer according to claim 1 , wherein both sides of the heat dissipation cover plate protrude outward to form a cylindrical surface, and each cylindrical surface extends outward along its radial direction. 3 . A plurality of the heat dissipation fins are formed. 3 . The Android system industrial computer according to claim 2 , wherein a plurality of the heat dissipation fins are evenly distributed in the circumferential direction of the cylindrical surface, and there is a height difference between two adjacent heat dissipation fins. 4 . 4 . The Android system industrial computer according to claim 1 , further comprising: a heat pipe, one end of the heat pipe is in contact with the heating element on the computer body, and the other end is in contact with the heat dissipation cover. 5 . 5 . The Android system industrial computer according to claim 4 , wherein a limit step is surrounded by the opening of the main body of the casing, and the outline of the heat dissipation cover matches the limit step and is covered on the limit step. 6 . on the limiting step, and is detachably connected with the main body of the casing, and one end of the heat-conducting pipe is sandwiched between the heat dissipation cover plate and the limiting step. 6. The Android system industrial computer according to claim 5, wherein a groove is formed on the limit step, and one end of the heat conducting pipe is set in the groove and exposed to the limit step and the limit step. the surface of the heat dissipation cover plate in contact. 7 . The Android system industrial computer according to claim 5 , wherein a locking assembly is further provided on the heat dissipation cover, and the locking assembly comprises: a fixing part fixed on the heat dissipation cover, 8 . The bolt penetrates through the fixing part, and the bolt can reciprocate relative to the fixing part in the axial direction of the bolt, and a bolt hole is provided on the casing main body at a position corresponding to the bolt. 8 . The Android system industrial computer according to claim 7 , wherein a limiting portion is provided on the latch, and an elastic member is sandwiched between the limiting portion and the fixing portion. 9 . 9 . The Android system industrial computer according to claim 8 , wherein the end of the plug is spherical. 10 . 10 . The Android system industrial computer according to claim 8 , wherein the elastic member is sleeved outside the latch. 11 .

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