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CN211045677U - Coupler - Google Patents

Coupler Download PDF

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Publication number
CN211045677U
CN211045677U CN201921639491.9U CN201921639491U CN211045677U CN 211045677 U CN211045677 U CN 211045677U CN 201921639491 U CN201921639491 U CN 201921639491U CN 211045677 U CN211045677 U CN 211045677U
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signal
coupler
ground
pads
pad
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CN201921639491.9U
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Chinese (zh)
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陈媛
罗林
叶晓菁
缪桦
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
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Priority to CN201921639491.9U priority Critical patent/CN211045677U/en
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Abstract

The utility model discloses a coupler sets up the signal hole through four angles at the coupler, four limits set up the ground hole, be provided with on the coupling line pattern layer of coupler and correspond and connect the first signal pad and the second signal pad in signal hole with the signal hole, and correspond and connect the ground connection pad in ground hole with the ground hole, wherein the both ends of the coupling stripline of coupler set up two first signal pads, the ground connection pad is close to two first signal pads, and set up the both sides at the coupling stripline, wherein the area of first signal pad is greater than the area of second signal pad and the area of ground connection pad respectively. Therefore, the system impedance of the coupler is weakened through the interaction among the larger first signal bonding pad, the larger second signal bonding pad, the larger grounding bonding pad and the coupling strip line, and the performance index of the coupler is further improved.

Description

Coupler
Technical Field
The utility model relates to a coupler design technical field, more specifically say, especially relate to a coupler.
Background
As a commonly used passive device in communication systems, couplers, particularly 3dB couplers, are widely used in radio frequency, microwave circuits and communication systems. The coupler is a general microwave/millimeter wave component, and can be used for separating and synthesizing signals. The 3dB coupler can continuously sample transmission power along a certain determined direction of a transmission line, can divide an input signal into two signals which are mutually equal in amplitude and have a phase difference of 90 degrees, can also be used for multi-signal synthesis, and improves the utilization rate of an output signal. The 3dB couplers may also be used in power amplifiers, low noise amplifiers, adjustable phase shifters and adjustable attenuators. In practical applications, in order to ensure the design length and the winding size of the coupling line, the 3dB coupler is limited by the model of the coupling line, and the coupling line width needs to be slightly reduced during design, which causes the system impedance of the coupler to be higher, and these factors all affect the performance index of the coupler.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a coupler to reach the effect that the solution weakens coupler system impedance.
In order to solve the above technical problem, the utility model provides a coupler, include:
the four signal holes are respectively arranged at four corners of the coupler and penetrate through the coupler;
a plurality of ground holes which are respectively arranged on four sides of the coupler and penetrate through the coupler;
at least one pair of coupled line pattern layers, wherein each coupled line pattern layer comprises a coupled strip line and two first signal pads, the two first signal pads are correspondingly connected with two signal holes on one diagonal line of the coupler, and the coupled strip line is arranged in a region between the two first signal pads and is connected between the two first signal pads;
each coupling line pattern layer further comprises two second signal pads, wherein the two second signal pads are connected with the other two signal holes on the other diagonal line of the coupler, and the two second signal pads are not connected with the coupling strip line;
wherein two grounding bonding pads are respectively arranged between the two first signal bonding pads and the two second signal bonding pads, the grounding bonding pads are connected with the ground holes, and the areas of the first signal bonding pads are respectively larger than the areas of the second signal bonding pads and the areas of the grounding bonding pads.
Further, the two first signal pads have the same size and shape, the two second signal pads have the same size and shape, and the two ground pads have the same size and shape.
Further, a distance between the ground pad and the first signal pad is smaller than a distance between the ground pad and the second signal pad.
Further, the at least one pair of coupled line pattern layers comprises a first coupled line pattern layer and a second coupled line pattern layer, wherein two first signal pads in the first coupled line pattern layer are correspondingly connected with two signal holes on a first diagonal line of the coupler, and two first signal pads in the second coupled line pattern layer are correspondingly connected with two signal holes on a second diagonal line of the coupler;
the two second signal pads in the first coupled line pattern layer are correspondingly connected with the two signal holes on the second diagonal line of the coupler, and the two second signal pads in the second coupled line pattern layer are correspondingly connected with the two signal holes on the first diagonal line of the coupler.
Furthermore, the ground pads are respectively correspondingly disposed near the two first signal pads and located at two ends of the coupling strip line, wherein the two ground pads are respectively connected with ground holes at two ends of the coupling strip line in the plurality of ground holes.
Further, the first signal pad, the second signal pad and the ground pad are respectively polygonal and respectively have an arc-shaped edge contacting with the signal hole or the ground hole and a plurality of linear edges, wherein the first signal pad and the ground pad respectively have at least one linear edge parallel to each other, so that the ground pad is arranged close to the ground pad.
Further, the two first signal pads, the two second signal pads and the two ground pads in the first coupled line pattern layer are centrosymmetric to the two first signal pads, the two second signal pads and the two ground pads in the second coupled line pattern layer.
Further, the coupler further includes: the signal holes and the ground holes respectively penetrate through the first core plate, the second core plate and the third core plate;
the first coupling line pattern layer and the second coupling line pattern layer are respectively positioned on two opposite surfaces of the second core plate.
Furthermore, a top graphic layer and a bottom graphic layer are respectively arranged on the outward surfaces of the first core board and the third core board, wherein the top graphic layer and the bottom graphic layer are respectively provided with four signal pads and at least one grounding pad, the four signal pads are respectively and correspondingly connected with four signal holes, and the grounding pad is sequentially connected with a plurality of ground holes;
wherein the four signal pads in the bottom graphics layer and the bottom graphics layer have the same shape and size.
Further, the signal hole and the ground hole inner wall are provided with metal walls, and the average thickness of the metal walls is 20 micrometers.
The utility model has the advantages that: the signal holes are arranged at four corners of the coupler, the ground holes are arranged at four sides of the coupler, the first signal pad and the second signal pad which correspond to the signal holes and are connected with the signal holes and the ground pad which corresponds to the ground holes and is connected with the ground holes are arranged on the coupling line graph layer of the coupler, the two first signal pads are arranged at two ends of the coupling strip line of the coupler, the ground pads are close to the two first signal pads and are arranged at two sides of the coupling strip line, and the areas of the first signal pads are respectively larger than the areas of the second signal pads and the ground pads. Therefore, the system impedance of the coupler is weakened through the interaction among the larger first signal bonding pad, the larger second signal bonding pad, the larger grounding bonding pad and the coupling strip line, and the performance index of the coupler is further improved.
Drawings
Fig. 1 is a block diagram of a cross-sectional structure of a coupler according to the present invention;
fig. 2 is a schematic diagram of the coupler structure of the present invention;
fig. 3 is a schematic diagram of a top pattern layer structure of the coupler of the present invention;
fig. 4a is a schematic structural diagram of a first coupled line pattern layer according to the present invention;
fig. 4b is a schematic structural diagram of a second coupling line pattern layer according to the present invention;
fig. 5 is a schematic diagram of a bottom pattern layer structure of the coupler of the present invention;
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
Fig. 1 is a block diagram of a cross-sectional structure of a coupler according to the present invention. Please refer to fig. 2, a schematic diagram of a coupler according to the present invention. The utility model provides a coupler 1, it is specific, coupler 1 includes first core plate 3, second core plate 30 and third core plate 31 of top-down with this range upon range of setting. The first core board 3, the second core board 30 and the third core board 31 are bonded through dielectric layers. In one embodiment, the dielectric layer is a prepreg 4. The first core board 3, the second core board 30 and the third core board 31 are all copper clad boards, in a specific embodiment, the upper and lower surfaces of the second core board 30 are both provided with metal layers, and one uniform surface of the first core board 3 and the third core board 31 is provided with a metal layer, and the metal layer is a copper foil. The metal layers on the surfaces of the first core board 3 and the third core board 31 are both far away from the second core board 30.
Wherein, four corners of the coupler 1 are provided with signal holes 8, and the signal holes 8 penetrate through the first core plate 3, the second core plate 30 and the third core plate 31 of the coupler 1. A plurality of ground holes 9 are provided on four sides of the coupler 1, and the ground holes 9 penetrate through the first core plate 3, the second core plate 30 and the third core plate 31 of the coupler 1. In one embodiment, there may be a plurality of ground holes 9 on one edge, or there may be one ground hole 9, and in this embodiment, the inner walls of the signal hole 8 and the ground hole 9 are plated with copper, and the thickness of the copper is 20 μm.
The first core board 3 of the coupler 1 includes a top graphic layer 2 far from the second core board 30, please refer to fig. 1, and the top graphic layer 2 is located on a metal layer of a surface of the first core board 3 far from the second core board 30.
In one embodiment, the top pattern layer 2 includes four signal pads 10 connected to four signal holes 8 at four corners of the coupler 1 and at least one ground pad 11 connected to a plurality of ground holes 9 at four sides of the coupler 1, the ground pad 11 is a one-piece metal layer, i.e., a copper layer, and corresponds to the ground hole 9 at the side. The four signal pads 10 are identical in shape and size.
Wherein the second core board 30 of the coupler 1 comprises at least one pair of coupled line pattern layers (as shown in fig. 4a and 4 b). In an embodiment, the at least one pair of coupled line pattern layers comprises a first coupled line pattern layer 51 (fig. 4a) and a second coupled line pattern layer 52 (fig. 4 b).
As shown in fig. 4a, the first coupled line pattern layer 51 includes two first signal pads 101 located on a first diagonal line at two ends of the coupled stripline, and two second signal pads 102 located on a second diagonal line. Wherein, the two first signal pads 101 have a coupling strip line 7 connected to them. The first coupled line pattern layer 51 further includes two ground pads 111 located between the adjacent first signal pads 101 and second signal pads 102. In one embodiment, two ground pads 111 are located on the short sides of the coupler 1. The first signal pads 101 have the same shape and size, the second signal pads 102 have the same shape and size, and the ground pads 111 have the same shape and size. The two first signal pads 101 and the second signal pads 102 have different shapes and sizes, and the areas of the first signal pads 101 are larger than the areas of the second signal pads 102 and the areas of the ground pads 111, respectively.
In one embodiment, the first signal pad 101, the second signal pad 102 and the ground pad 111 are all polygonal, and the positions where the first signal pad contacts the signal hole 8 or the ground hole 9 are arc-shaped edges matching the signal hole 8 or the ground hole 9, and the rest are straight edges.
The position of the ground pad 111 adjacent to the first signal pad 101 has a straight edge parallel to one edge of the first signal pad 101, and the position of the ground pad 111 adjacent to the second signal pad 102 has a straight edge parallel to one edge of the second signal pad 102, so that the area of the ground pad 111 is increased as much as possible, the impedance of the coupler 1 system is reduced through the interaction between the ground pad 111 and the signal pads, and the performance index of the coupler 1 is further improved.
As shown in fig. 4b, the second coupled line pattern layer 52 includes two first signal pads 101 located on the second diagonal line at two ends of the coupled stripline, and two second signal pads 102 located on the first diagonal line. Wherein, the two first signal pads 101 have a coupling strip line 7 connected to them. The second coupled line pattern layer 52 further includes two ground pads 111 located between the adjacent first signal pads 101 and second signal pads 102. In one embodiment, two ground pads 111 are located on the short sides of the coupler 1. The first signal pads 101 have the same shape and size, the second signal pads 102 have the same shape and size, and the ground pads 111 have the same shape and size. The two first signal pads 101 and the second signal pads 102 have different shapes and sizes, and the areas of the first signal pads 101 are larger than the areas of the second signal pads 102 and the areas of the ground pads 111, respectively.
In one embodiment, the first signal pad 101, the second signal pad 102 and the ground pad 111 are all polygonal, and the positions where the first signal pad contacts the signal hole 8 or the ground hole 9 are arc-shaped edges matching the signal hole 8 or the ground hole 9, and the rest are straight edges.
The position of the ground pad 111 adjacent to the first signal pad 101 has a straight edge parallel to one edge of the first signal pad 101, and the position of the ground pad 111 adjacent to the second signal pad 102 has a straight edge parallel to one edge of the second signal pad 102, so that the area of the ground pad 111 is increased as much as possible, the impedance of the coupler 1 system is reduced through the interaction between the ground pad 111 and the signal pads, and the performance index of the coupler 1 is further improved.
In an embodiment, the first coupled line pattern layer 51 is symmetrical to the second coupled line pattern layer 52, and specifically, as shown in fig. 3 and 4, the first coupled line pattern layer 51 is rotated 180 degrees along a center point to coincide with the second coupled line pattern layer 52.
Referring to fig. 5, the third core board 31 of the coupler 1 includes a bottom graphic layer 6 far from the second core board 30, and the bottom graphic layer 6 is located on a metal layer of a surface of the third core board 31 far from the second core board 30.
In one embodiment, the bottom pattern layer 6 includes four signal pads 10 connected to the four signal holes 8 at the four corners of the coupler 1 and at least one ground pad 11 connected to the ground holes 9 at the four sides of the coupler 1, and the ground pad 11 is a whole metal layer, i.e., a copper layer, and corresponds to the ground hole 9 at the side. The four signal pads 10 are identical in shape and size.
In one embodiment, the top graphics layer 2 is symmetrical to the bottom graphics layer 6. In particular, as shown in fig. 3 and 5, the top graphics layer 2 completely coincides with the bottom graphics layer 6.
The coupler also includes other devices, which are the same as other devices and functions of the coupler in the prior art, and are not described in detail herein.
The coupler in this embodiment has a pair of coupled line pattern layers, and in other embodiments, there may be more pairs of coupled line pattern layers, which are not described herein again.
The utility model provides a coupler, set up the signal hole through four angles at the coupler, four limits set up the ground hole, be provided with on the coupling line pattern layer of coupler and correspond and connect the first signal pad and the second signal pad in signal hole with the signal hole, and correspond and connect the ground connection pad in ground hole with the ground hole, wherein the both ends of the coupling stripline of coupler set up two first signal pads, the ground connection pad is close to two first signal pads, and set up the both sides at the coupling stripline, wherein the area of first signal pad is greater than the area of second signal pad and the area of ground connection pad respectively. Therefore, the system impedance of the coupler is weakened through the interaction among the larger first signal bonding pad, the larger second signal bonding pad, the larger grounding bonding pad and the coupling strip line, and the performance index of the coupler is further improved.
The above is only the embodiment of the present invention, not the limitation of the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. A coupler, comprising:
the four signal holes are respectively arranged at four corners of the coupler and penetrate through the coupler;
a plurality of ground holes respectively arranged on four sides of the coupler and penetrating through the coupler;
at least one pair of coupled line pattern layers, wherein each coupled line pattern layer comprises a coupled strip line and two first signal pads, the two first signal pads are correspondingly connected with the two signal holes on one diagonal of the coupler, and the coupled strip line is arranged in the area between the two first signal pads and is connected between the two first signal pads;
each of the coupled line pattern layers further includes two second signal pads, wherein the two second signal pads are connected with the other two signal holes located on the other diagonal line of the coupler, and the two second signal pads are not connected with the coupled striplines;
wherein two ground pads are respectively arranged between the two first signal pads and the two second signal pads, the ground pads are connected with the ground holes, and the areas of the first signal pads are respectively larger than the areas of the second signal pads and the areas of the ground pads.
2. The coupler of claim 1, wherein the two first signal pads have the same size and shape, the two second signal pads have the same size and shape, and the two ground pads have the same size and shape.
3. The coupler of claim 2, wherein a distance between the ground pad and the first signal pad is less than a distance between the ground pad and the second signal pad.
4. The coupler of claim 3, wherein the at least one pair of coupled line pattern layers comprises a first coupled line pattern layer and a second coupled line pattern layer, wherein two of the first signal pads in the first coupled line pattern layer are connected to two of the signal holes on a first diagonal of the coupler, and two of the first signal pads in the second coupled line pattern layer are connected to two of the signal holes on a second diagonal of the coupler;
two second signal pads in the first coupled line pattern layer are correspondingly connected with two signal holes on a second diagonal line of the coupler, and two second signal pads in the second coupled line pattern layer are correspondingly connected with two signal holes on a first diagonal line of the coupler.
5. The coupler of claim 4, wherein the ground pads are respectively disposed adjacent to the two first signal pads and at two ends of the coupling strip line, and wherein the two ground pads are respectively connected to the ground holes at two ends of the coupling strip line in the plurality of ground holes.
6. The coupler of claim 5, wherein the first signal pad, the second signal pad, and the ground pad are each polygonal having an arcuate side contacting the signal aperture or the ground aperture and a plurality of linear sides, wherein the first signal pad and the ground pad each have at least one linear side parallel to each other such that the ground pad is disposed proximate to the ground pad.
7. The coupler of claim 5, wherein two of the first signal pads, two of the second signal pads, and two of the ground pads in the first coupled line pattern layer are centrosymmetric to two of the first signal pads, two of the second signal pads, and two of the ground pads in the second coupled line pattern layer.
8. The coupler of claim 5, wherein the coupler further comprises: the signal hole and the ground hole respectively penetrate through the first core plate, the second core plate and the third core plate;
the first coupling line pattern layer and the second coupling line pattern layer are respectively positioned on two opposite surfaces of the second core board.
9. The coupler of claim 8, wherein the first core board and the third core board are respectively provided with a top graphic layer and a bottom graphic layer on outward surfaces thereof, wherein the top graphic layer and the bottom graphic layer are respectively provided with four signal pads and at least one ground pad, the four signal pads are respectively correspondingly connected with the four signal holes, and the ground pad is sequentially connected with the plurality of ground holes;
wherein the four signal pads in the top graphics layer and the bottom graphics layer have the same shape and size.
10. The coupler of claim 1, wherein the signal aperture and the ground aperture inner wall are provided with metal walls, and wherein the average thickness of the metal walls is 20 microns.
CN201921639491.9U 2019-09-27 2019-09-27 Coupler Active CN211045677U (en)

Priority Applications (1)

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CN201921639491.9U CN211045677U (en) 2019-09-27 2019-09-27 Coupler

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Application Number Priority Date Filing Date Title
CN201921639491.9U CN211045677U (en) 2019-09-27 2019-09-27 Coupler

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CN211045677U true CN211045677U (en) 2020-07-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114614228A (en) * 2020-12-09 2022-06-10 深南电路股份有限公司 Couplers and Electronics
CN115036667A (en) * 2022-06-24 2022-09-09 安徽蓝讯通信科技有限公司 A broadband directional coupler for 5G communication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114614228A (en) * 2020-12-09 2022-06-10 深南电路股份有限公司 Couplers and Electronics
CN115036667A (en) * 2022-06-24 2022-09-09 安徽蓝讯通信科技有限公司 A broadband directional coupler for 5G communication

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