CN211017072U

CN211017072U - Laminated packaged planar L ED light source

Info

Publication number: CN211017072U
Application number: CN201921977228.0U
Authority: CN
Inventors: 蒋金凤
Original assignee: Shenzhen Huaxin Weitian Photoelectric Co ltd
Current assignee: Shenzhen Huaxin Weitian Photoelectric Co ltd
Priority date: 2019-11-15
Filing date: 2019-11-15
Publication date: 2020-07-14
Anticipated expiration: 2029-11-15

Abstract

The utility model provides a plane L ED light source of lamination encapsulation, including the base plate, L ED bulb, the heat collection silk, the heat-conducting plate, the thermal radiation contact, below encapsulation board, the mounting panel, the light-collecting layer, the diffusion layer, top encapsulation board and protection veneer, wherein L ED bulb passes through the buckle to be installed on the surface of base plate, and the heat collection silk passes through the soldering and welds in the below of base plate, and the heat-conducting plate pressfitting is in the below of base plate, the thermal radiation contact welds in the below of heat-conducting plate, and below encapsulation board pressfitting is in the below of heat-conducting plate, and the mounting panel pressfitting is in the below of below encapsulation board, top encapsulation board pressfitting is on the surface of base plate, and the light-collecting layer pressfitting is on the surface of light-collecting layer, the protection veneer bonds on the surface of diffusion layer.

Description

Laminated packaged planar L ED light source

Technical Field

The utility model belongs to the technical field of L ED light source, especially, relate to a plane L ED light source of lamination encapsulation.

Background

A method of integrating two or more layers of the same or different materials by heating and pressing with or without an adhesive. Also known as lamination. The method is a molding method in which a plurality of layers of the same or different materials are integrally combined under heat and pressure. Is commonly used in plastic processing and also in rubber processing. In plastics processing, for thermoplastics, it is common to produce artificial leather products or composite films; for thermoset plastics, it is an important method of making reinforced plastics and articles. Various laminated products such as laminated sheets are obtained by laminating reinforcing materials such as paper, fabric, glass cloth, specialty fibers, etc. impregnated with a thermosetting resin, and heating and pressing the laminate.

L ED light source is LED light source, this kind of light source has advantages such as small, long-lived, efficient, can use for 10 ten thousand hours continuously, L ED light source is used in the illumination field and also becomes mainstream in the future, but the existing hot pressing L ED light source still has the integration poor, the luminance is low, the difficult problem that dissipates of inside heat.

Therefore, it is necessary to develop a planar L ED light source for laminate packaging.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a plane L ED light source of lamination encapsulation to solve current hot pressing L ED light source and still have the poor integration, the luminance is low, the problem that inside heat is difficult for giving off, a plane L ED light source of lamination encapsulation, including the base plate, L ED bulb, the heat collection silk, the heat-conducting plate, the radiating contact, below encapsulation board, the mounting panel, the light collecting layer, the diffusion layer, top encapsulation board and protection veneer, wherein L ED bulb passes through the buckle to be installed on the surface of base plate, and the heat collection silk passes through the soldering and welds in the below of base plate, the heat-conducting plate pressfitting is in the below of base plate, the radiating contact welds in the below of heat-conducting plate, and below encapsulation board pressfitting is in the below of heat-conducting plate, the mounting panel pressfitting is in the below encapsulation board, the top board encapsulates in the surface of base plate, and light collecting layer pressfitting is in the surface of top encapsulation board, the diffusion layer is on the surface of light collecting layer, the protection veneer bonds in the surface of diffusion layer.

The heat collection wire adopts a plurality of copper wire, and insulates between heat collection wire and the circuit, welds between this heat collection wire and forms a whole, is favorable to collecting the heat that L ED bulb produced fast, utilizes the high heat conductivity of copper quick with heat from other structural component and collect, prevent the utility model discloses other equipment are overheated.

The heat radiation contact adopts a plurality of copper metal strips, and the heat radiation contact passes square packaging board and mounting panel and spills the utility model discloses an outside is favorable to fast discharging the outside with the heat that the thermal-arrest silk was collected, prevents that inside consumer from causing the damage because of the high temperature that produces.

The light-collecting layer adopts the transparent light-passing board of glass system, and the light-collecting layer inside has a slight sunken, and the sunken align to grid in this light-collecting layer inside is favorable to compiling the light that each L ED bulb produced, improves the utility model discloses a luminance.

The diffusion layer adopts a glass plate with a plurality of parallel surfaces, patterns on the surface of the diffusion layer can be changed as required, light rays generated by a plurality of L ED bulbs with different brightness can be favorably diffused, and the light rays generated by the L ED bulbs can be more uniformly emitted to the outer side.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses the setting of heat-collecting wire is favorable to collecting the heat that L ED bulb produced fast, utilizes the high heat conductivity of copper quick with heat from other construction package and collect, prevent the utility model discloses other equipment are overheated.

2. The utility model discloses heat radiation contact's setting is favorable to discharging the outside with the heat that the thermal-arrest silk was collected fast, prevents that inside consumer from causing the damage because of the high temperature that produces.

3. The utility model discloses the setting of diffusion layer is favorable to carrying out the scattering with the light that a plurality of L ED bulbs that the luminance differs produced, makes the more even directive outside of light that L ED bulb produced.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural diagram of the heat conducting plate and the heat dissipating contact according to the present invention.

Fig. 3 is an enlarged schematic view of fig. 1 a according to the present invention.

In the figure:

1-substrate, 2-L ED bulb, 3-heat collecting filament, 4-heat conducting plate, 5-heat radiating contact, 6-lower packaging plate, 7-mounting plate, 8-light collecting layer, 9-light dispersing layer, 10-upper packaging plate and 11-protective adhesive layer.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

As shown in figures 1 to 3.

The utility model provides a plane L ED light source of lamination encapsulation includes base plate 1, L ED bulb 2, thermal-arrest silk 3, heat-conducting plate 4, radiating contact 5, below encapsulation board 6, mounting panel 7, light-collecting layer 8, light-dispersing layer 9, top encapsulation board 10 and protection adhesive layer 11, wherein, base plate 1 adopts the PVC plastic slab, is used for fixing L ED bulb 2, makes L ED bulb 2 can even arrange, L ED bulb 2 adopts a plurality ofly, and even arrangement becomes the utility model discloses a light source, the heat that the thermal-arrest silk 3 can be produced with L ED bulb 2 fast is collected, utilize the high heat conductivity of copper fast from other structure subassemblies and collect, prevent the utility model discloses other equipment is overheated, heat-conducting plate 4 adopts the copper metal sheet, is favorable to collecting the concentrated heat of a plurality of thermal-arrest silk 3 once more, radiating contact 5 can discharge the heat that the thermal-arrest silk 3 collected to the outside fast, prevent that interior consumer from causing the damage because of the high temperature that produces;

the mounting panel 7 adopts the PVC plastic slab, conveniently fixes essence with novel on other objects, and the setting of light-collecting layer 8 can collect the light that each L ED bulb 2 produced, improves the utility model discloses a luminance, light-dispersing layer 9 can scatter the light that a plurality of L ED bulbs 2 that differ in luminance produced, makes the more even directive outside of light that L ED bulb 2 produced, and the setting of protection veneer 11 prevents that outside edge tool from scraping flowers the utility model discloses a light-collecting layer 8.

Utilize technical scheme, or technical personnel in the field are in the utility model discloses under technical scheme's the inspiration, design similar technical scheme, and reach above-mentioned technological effect, all fall into the utility model discloses a protection scope.

Claims

1. A laminated and packaged planar L ED light source is characterized by comprising a substrate (1), a L ED bulb (2), a heat collecting wire (3), a heat conducting plate (4), a radiating contact (5), a lower packaging plate (6), a mounting plate (7), a light collecting layer (8), a light scattering layer (9), an upper packaging plate (10) and a protective adhesive layer (11), wherein the L ED bulb (2) is installed on the surface of the substrate (1) through clamping, the heat collecting wire (3) is welded below the substrate (1) through tin soldering, the heat conducting plate (4) is laminated below the substrate (1), the radiating contact (5) is welded below the heat conducting plate (4), the lower packaging plate (6) is laminated below the heat conducting plate (4), the mounting plate (7) is laminated below the lower packaging plate (6), the upper packaging plate (10) is arranged on the surface of the substrate (1), the light collecting layer (8) is laminated on the surface of the lower packaging plate (10), and the light scattering layer (9) is laminated on the surface of the light collecting layer (9) and the protective adhesive layer (11).

2. The laminated and packaged planar L ED light source as claimed in claim 1, wherein the heat collecting wires (3) are copper wires, and the heat collecting wires (3) are insulated from the circuit and welded together to form a whole body between the heat collecting wires (3).

3. A laminated, encapsulated, planar L ED light source as claimed in claim 1, wherein the heat dissipating contacts (5) are made of several metal strips of copper.

4. A laminate packaged planar L ED light source as claimed in claim 1, wherein the light-collecting layer (8) is a transparent, light-transmitting plate made of glass, and the light-collecting layer (8) has a slight depression in its interior, and the depressions in the light-collecting layer (8) are uniformly arranged.

5. A laminated planar L ED light source as claimed in claim 1, wherein the light-diffusing layer (9) is a glass plate with a plurality of parallel surfaces, and the pattern of the surface of the light-diffusing layer (9) can be changed as required.