CN210986579U - Substrate and display device - Google Patents
Substrate and display device Download PDFInfo
- Publication number
- CN210986579U CN210986579U CN201921779001.5U CN201921779001U CN210986579U CN 210986579 U CN210986579 U CN 210986579U CN 201921779001 U CN201921779001 U CN 201921779001U CN 210986579 U CN210986579 U CN 210986579U
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- metal layer
- protective layer
- display area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 77
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 72
- 239000010931 gold Substances 0.000 claims abstract description 72
- 229910052737 gold Inorganic materials 0.000 claims abstract description 72
- 239000011241 protective layer Substances 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims description 243
- 239000002184 metal Substances 0.000 claims description 99
- 229910052751 metal Inorganic materials 0.000 claims description 99
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 25
- 239000011247 coating layer Substances 0.000 claims description 15
- 238000002955 isolation Methods 0.000 claims description 12
- 239000002346 layers by function Substances 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- WABPQHHGFIMREM-RNFDNDRNSA-N lead-211 Chemical compound [211Pb] WABPQHHGFIMREM-RNFDNDRNSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides a base plate and display device belongs to and shows technical field, and it can solve the golden finger in the current base plate and contact the moisture in the air easily and corroded. The utility model discloses the base plate, include: a substrate, a plurality of gold fingers disposed on the substrate; the protective layer is arranged on one side, away from the substrate, of each golden finger, through holes are formed in at least part of the golden fingers, part of the surface of at least part of the golden fingers is exposed through the through holes in the protective layer, and the protective layer covers at least the edge of each golden finger.
Description
Technical Field
The utility model relates to a show technical field, specifically, relate to a base plate and display device.
Background
The substrate includes a display area and a binding area (binding) disposed outside the display area. The display area is provided with a driving Circuit for displaying, touch-controlling and the like, and the binding area is provided with a gold finger (binding pin) for connecting an Integrated Circuit (IC for short) chip. The signal lines (e.g., touch electrodes, i.e., the sensing electrode RX and the transmitting electrode TX) of the driving circuit are connected to the integrated circuit chip through the gold fingers to realize signal interaction.
At present, the golden finger (generally made of metal) is exposed in the air, so that the golden finger is easy to contact with moisture in the air, and the moisture permeates and invades from the edge of the golden finger to corrode the whole golden finger. In particular, in a high temperature and high humidity environment (e.g., a temperature higher than 80 ℃ and a humidity greater than 95%), the gold finger is corroded at a faster rate, thereby affecting the conductive performance of the gold finger and further affecting the normal use of the display device.
Therefore, how to reduce the corrosion of the gold finger by the moisture in the air becomes an urgent problem to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses at least part solves the golden finger among the current base plate and contacts the moisture in the air easily and corroded not enough, provides a can avoid the moisture in the air to get into the base plate and the display device of golden finger through the edge infiltration of golden finger.
Solve the utility model discloses technical scheme that technical problem adopted is a base plate, include: a substrate, a plurality of gold fingers disposed on the substrate;
the protective layer is arranged on one side, away from the substrate, of the golden finger, through holes are formed in at least part of the golden finger, part of the surface of the golden finger is exposed through the through holes in the protective layer, and the protective layer at least covers the edge of each golden finger.
Optionally, each of the gold fingers exposed by the through holes on the protective layer is exposed by one or more of the through holes on the protective layer.
Optionally, each of the gold fingers exposed by the through holes on the protection layer is exposed by a plurality of through holes which are identical in structure and arranged in an array on the protection layer.
Optionally, the substrate includes a display area for displaying an image and a non-display area disposed outside the display area, and the gold finger is located in the non-display area;
the protective layer comprises one or more sub-layers which are arranged in a laminated mode, and at least one sub-layer and the functional layer of the display area are arranged in the same layer.
Optionally, the functional layer of the display area includes a first touch electrode layer, a first coating protective layer, a second touch electrode layer, and a second coating protective layer, which are sequentially disposed in a direction away from the substrate;
the protective layer comprises a first sublayer, and the first sublayer and the second coating protective layer are arranged on the same layer.
Optionally, the functional layer of the display area further includes an inorganic coating layer disposed between the second coating protection layer and the second touch electrode layer;
the protective layer comprises a second sublayer which is arranged on the same layer as the inorganic coating layer.
Optionally, the through holes on the first sublayer and the second sublayer have the same structure.
Optionally, the gold finger comprises a first metal layer and a second metal layer which is arranged on one side of the first metal layer away from the substrate and is in contact with the first metal layer; the first metal layer and the first touch electrode layer are arranged on the same layer, and the second metal layer and the second touch electrode layer are arranged on the same layer.
Optionally, the projection of the second metal layer on the substrate at least covers the projection of the first metal layer on the substrate;
the protective layer covers the edge portion of the second metal layer.
Optionally, a lead wire connected with the first metal layer into a whole and extending into the display region is further disposed in the non-display region;
an isolation layer arranged on the same layer as the first coating protection layer is further arranged in the non-display area, the isolation layer directly covers the lead, and an opening is formed in the position corresponding to the first metal layer, so that the first metal layer is in contact with the second metal layer.
Solve the technical problem the utility model adopts as a technical scheme a display device, including foretell base plate.
Drawings
Fig. 1 is a schematic structural diagram (partial structure is not shown) of a non-display region of a substrate according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
fig. 3 is a schematic structural diagram of a non-display region of a substrate according to another embodiment of the present invention (a part of the structure is not shown);
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 3;
fig. 5 is a schematic structural diagram of a substrate according to an embodiment of the present invention after a first metal layer is formed in a non-display region of the substrate;
fig. 6 is a schematic structural diagram of a second metal layer formed in a non-display region of a substrate according to an embodiment of the present invention;
fig. 7a is a schematic structural diagram of a gold finger according to an embodiment of the substrate of the present invention;
fig. 7b is a schematic structural diagram of a gold finger according to another embodiment of the substrate of the present invention;
fig. 7c is a schematic structural diagram of a golden finger according to another embodiment of the substrate of the present invention;
FIG. 8a is a cross-sectional view taken along line C-C of FIG. 7 a;
FIG. 8b is a cross-sectional view taken along line D-D of FIG. 7 b;
FIG. 8c is a cross-sectional view E-E of FIG. 7 c;
wherein the reference numbers indicate: 1. a substrate; 2. a golden finger; 21. a first metal layer; 22. A second metal layer; 211. a lead wire; 3. a protective layer; 30. a through hole; 3a, a first sublayer;
3b, a second sublayer; 4. an isolation layer; 40. and (4) opening.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Noun interpretation
In the present application, unless otherwise specified, the following technical terms should be understood in accordance with the following explanations:
"layered" of structures means that the structures are formed from the same layer of material and thus are in layered relationship in the same layer, but does not mean that they are equidistant from the substrate nor that they are completely identical to the structure of other layers between the substrate.
"A is located above B" or "A is located on the side of B away from the substrate" means that the layer on which A is located is formed after the layer on which B is located, so that A is further away from the substrate than B in terms of the layer relationship, but this does not mean that B is superposed on A in all positions, for example, B may also be located where A is not present.
"C is disposed between A and B" means that the layer in which C is disposed is formed after the layer in which one of A and B is disposed and before the layer in which the other is disposed, so that C is farther from the substrate than one of A and B but closer to the substrate than the other in terms of the layer relationship, A, B and C overlap at least in part, for example, FIG. 4 where the barrier layer 4 is disposed between the first metal layer 21 and the second metal layer 22.
Example 1:
as shown in fig. 1 to 8, the present embodiment provides a substrate including: the device comprises a substrate 1 and a plurality of gold fingers 2 arranged on the substrate 1.
The protective layer 3 is arranged on one side of the golden finger 2, which is far away from the substrate 1, the protective layer 3 is provided with a through hole 30 on at least part of the golden finger 2, part of the surface of at least part of the golden finger 2 is exposed by the through hole 30 on the protective layer 3, and the protective layer 3 at least covers the edge part of each golden finger 2.
The substrate is a substrate used in a display device, such as an array substrate. The gold finger 2 is connected to signal lines (e.g., touch electrodes, i.e., the sensing electrode RX and the transmitting electrode TX) in a driving circuit of the substrate and an Integrated Circuit (IC) chip, so as to realize signal interaction between the signal lines and the IC chip.
In general, the gold finger 2 is a sheet-like structure, and the surface of the gold finger 2 is used for binding an integrated circuit chip. In this embodiment, the through hole 30 on the protection layer 3 exposes a predetermined portion (not including a boundary) of the gold finger 2 on the surface of the gold finger 2, that is, there is no overlap between the projection of the through hole 30 on the substrate 1 and the projection of the edge portion of the gold finger 2 on the substrate 1, and the predetermined portion is used for binding an integrated circuit chip, so that the area of the predetermined portion can meet the conductive requirement of the gold finger 2, and therefore, the portion between the boundary of the predetermined portion and the boundary of the gold finger 2 is the edge portion of the gold finger 2. Meanwhile, here, if the gold finger 2 includes one metal layer, the boundary of the gold finger 2 is the boundary of the one metal layer; if the gold finger 2 includes a plurality of (at least two) metal layers, the boundary of the gold finger 2 is the boundary of the gold finger as a whole, and the predetermined portion is located within the boundary of the metal layer directly bound to the integrated circuit chip (excluding the boundary). For example, as shown in fig. 7 to 8, the gold finger 2 includes two metal layers, the first metal layer 21 is closer to the substrate than the second metal layer 22, see fig. 7a and 8a, the second metal layer 22 is larger than the first metal layer 21, the second metal layer 22 covers the first metal layer 21, and the edge portion of the gold finger 2 is the portion outside the dashed line frame in fig. 7a and the portion between the two dashed lines in fig. 8 a. Referring again to fig. 7b and 8b, the first metal layer 21 is larger than the second metal layer 22, and the edge portion of the gold finger 2 is the portion outside the dashed line frame in fig. 7b and the portion between the two dashed lines in fig. 8 b. Of course, in terms of the current gold finger 2 manufacturing process, the second metal layer 22 is generally larger than the first metal layer 21, i.e. the second metal layer 22 covers the first metal layer 21. Referring to fig. 7c and 8c, the first metal layer 21 and the second metal layer 22 have the same size, the boundaries of the first metal layer 21 and the second metal layer 22 are overlapped, the edge portion of the gold finger 2 is the portion outside the dashed line frame in fig. 7c, and the portion between the two dashed lines in fig. 8 c.
In the embodiment of the present invention, the protective layer 3 contacts with the edge of the gold finger 2. For example, the gold finger 2 is a structure in fig. 7a and 8a, and the protective layer 3 and the second metal layer 22 are portions outside the dashed line frame in fig. 7a, and are portions of contact between two dashed lines in fig. 8 a. As another example, the gold finger 2 is a structure in fig. 7b and 8b, and the protective layer 3 and the second metal layer 22 are portions outside the dashed line frame in fig. 7b, and are portions of contact between two dashed lines in fig. 8 b. Therefore, the protective layer 3 prevents water oxygen from invading into the inside of the gold finger 2 through the edge of the gold finger 2, thereby reducing the risk of corrosion of the gold finger 2.
Placing the substrate in an environment with a temperature of 80-100 deg.C and a humidity of 90-98% for 240hr to corrode the gold finger not covered by the protective layer; the reliability of the golden finger 2 of this embodiment can reach over 240 hr.
As shown in fig. 1 and 2, optionally, each of the gold fingers 2 exposed by the through holes 30 on the protective layer 3 is exposed by one through hole 30 on the protective layer 3.
Of course, the through holes 30 in fig. 1 and 2 belong to a specific structure of the through holes 30 on the protective layer 3, so that the projection thereof on the substrate 1 falls within the range of the projection of the gold finger 2 on the substrate 1. Each gold finger 2 is electrically connected to an electronic device such as an Integrated Circuit (IC) chip through a via 30.
The structure of the protective layer 3 in the above scheme is relatively simple, and each gold finger 2 is exposed by one through hole 30, so that the preparation process of the protective layer 3 is relatively simple.
As shown in fig. 3 and 4, optionally, each of the gold fingers 2 exposed by the through holes 30 on the protection layer 3 is exposed by a plurality of through holes 30 with the same structure and arranged in an array on the protection layer 3.
One gold finger 2 is exposed by the plurality of through holes 30 on the protection layer 3, that is, the gold finger 2 corresponds to the plurality of through holes 30, and the plurality of through holes 30 corresponding to each gold finger 2 have the same shape and the same inner diameter. Meanwhile, the through holes 30 corresponding to different gold fingers 2 have the same structure (the through holes 30 have the same shape and the same inner diameter), and the through holes 30 corresponding to different gold fingers 2 have the same array arrangement.
Of course, the through holes 30 in fig. 3 and 4 belong to another specific structure of the through holes 30 on the protective layer 3, so that the projection thereof on the substrate 1 falls within the range of the projection of the gold finger 2 on the substrate 1. In addition to the edge portion of the gold finger 2 being covered by the protective layer 3, the partial region other than the edge portion is also covered by the protective layer 3 between the through holes 30 in fig. 3 and 4, so that the through hole 30 in the protective layer 3 is better protected from water and oxygen than the through hole 30 in the protective layer 3 is the through hole 30 in fig. 1 and 2, and the through hole 30 in the protective layer 3 is the through hole 30 in fig. 3 and 4.
Meanwhile, each gold finger 2 is electrically connected to an electronic device such as an Integrated Circuit (IC) chip by the exposed portion of the via 30 in fig. 3 and 4. Preferably, the plurality of through holes 30 corresponding to each gold finger 2 in fig. 3 and 4 have the same structure and are arranged in an array, so that the gold finger 2 is convenient to be electrically connected with electronic devices such as Integrated Circuit (IC) chips.
Optionally, the substrate includes a display area for displaying images and a non-display area disposed outside the display area, and the gold finger 2 is located in the non-display area.
The protective layer 3 comprises one or more sub-layers arranged in a stacked manner, and at least one of the sub-layers is arranged in the same layer as the functional layer of the display area.
In the above scheme, a driving circuit for performing display, touch control, and the like is disposed in the display region, and an Integrated Circuit (IC) chip for performing signal interaction with the driving circuit of the display region is disposed in the non-display region (e.g., the bonding region) to avoid affecting the normal operation of the driving circuit of the display region. The protective layer 3 is disposed in the same layer as the functional layers (e.g., the structural layers in the driving circuit) in the display region, i.e., the number of functional layers in the substrate is not increased, so that the thickness of the substrate is not increased.
Alternatively, the functional layers of the display region include a first touch electrode layer, a first coating protective layer (OC layer), a second touch electrode layer, and a second coating protective layer, which are sequentially disposed in a direction away from the substrate 1.
The protective layer 3 comprises a first sub-layer 3a, the first sub-layer 3a and a second coating protective layer being arranged in the same layer.
In the above solution, the first touch electrode layer and the second touch electrode layer are structures for implementing a touch function of the display area, for example, the first touch electrode layer may be a transmitting electrode (TX), the second touch electrode layer may be a sensing electrode (RX), and functions of the two touch electrode layers may be interchanged. A first coating protection layer is inevitably arranged between the first touch electrode layer and the second touch electrode layer to insulate the first touch electrode layer and the second touch electrode layer and ensure that the first touch electrode layer and the second touch electrode layer can form different patterns, and a second coating protection layer is arranged above the second touch electrode layer to protect the second touch electrode layer, so that the first sub-layer 3a and the first coating protection layer can be arranged on the same layer.
The preparation process of the substrate may include:
a first touch electrode layer (e.g., a transmission electrode TX) is formed.
A first overcoat protection layer (first OC layer) is formed over the first touch electrode layer.
A second touch electrode layer (e.g., a sensing electrode RX) is formed over the first coating protection layer.
A second overcoat protection layer (second OC layer) is formed over the second touch electrode layer.
After the second protective layer-coated material layer is formed on the second touch electrode layer, the through holes 30 are formed on the second protective layer-coated material layer and the portions corresponding to the gold fingers 2, so that the first sub-layer 3a of the protective layer 3 is formed.
Therefore, according to the scheme, the protective layer 3 is arranged on the edge portion of the golden finger 2, so that the anticorrosion protection of the golden finger 2 is realized, and the complexity of the preparation process of the substrate is not increased.
Optionally, the functional layer of the display area further includes an inorganic coating layer disposed between the second coating protection layer and the second touch electrode layer.
As shown in fig. 2 and 4, the protective layer 3 further includes a second sub-layer 3b disposed in the same layer as the inorganic coating layer.
Since the first coating protection layer and the second coating protection layer are usually the same or similar organic materials, an inorganic coating layer can be formed between the second touch electrode layer and the second coating protection layer to avoid affecting the first coating protection layer when the second coating protection layer is formed; for this reason, the second sub-layer 3b of the protective layer 3 may be formed at the same time as the formation of the inorganic coating layer.
After the material layer of the inorganic coating layer is formed on the second touch electrode layer, the second sub-layer 3b of the protection layer 3 can be formed by forming the through hole 30 on the part of the material layer of the inorganic coating layer corresponding to the gold finger 2. Of course, in order to expose the portion of the surface of the gold finger 2 used for electrical connection with an electronic device such as an Integrated Circuit (IC) chip, the through hole 30 on the first sub-layer 3a and the through hole 30 on the second sub-layer 3b are at least partially overlapped, for example, the through hole 30 on the first sub-layer 3a and the through hole 30 on the second sub-layer 3b are the same, and the through hole 30 on the first sub-layer 3a and the through hole 30 on the second sub-layer 3b are through (i.e., the through hole 30 on the first sub-layer 3a and the through hole 30 on the second sub-layer 3b are completely overlapped.
In the above scheme, the second sub-layer 3b can more effectively reduce the risk that the metal functional layer located in the display area and the gold finger 2 located in the non-display area are corroded by moisture.
Alternatively, the through holes 30 on the first sublayer 3a and the second sublayer 3b have the same structure, that is, the through holes 30 on the first sublayer 3a and the through holes 30 on the second sublayer 3b correspond in position (the through holes 30 on the first sublayer 3a and the through holes 30 on the second sublayer 3b penetrate), and the through holes 30 on the first sublayer 3a and the second sublayer 3b have the same shape and size, see fig. 2 and 4.
The through hole 30 is formed by etching the part of the material layer of the inorganic coating layer corresponding to the gold finger 2 with an etchant (paste or liquid), because the material layer of the inorganic coating layer is an inorganic material and the first sublayer 3a is an organic material, the property difference between the inorganic material and the organic material is large, the etchant of the inorganic coating layer has no influence (no etching effect) on the first sublayer 3a, and therefore, after the first sublayer 3a is formed, the first sublayer 3a can be used as a mask for forming the second sublayer 3b, so that the etchant of the inorganic coating layer etches the part of the material layer of the inorganic coating layer corresponding to the through hole 30 on the first sublayer 3a, and the second sublayer 3b is formed.
As can be seen, the through holes 30 of the first sublayer 3a and the second sublayer 3b have the same structure, which simplifies the formation process of the through holes 30 on the second sublayer 3 b.
As shown in fig. 2 and 4, the gold finger 2 optionally includes a first metal layer 21, and a second metal layer 22 disposed on a side of the first metal layer 21 away from the substrate 1 and in contact with the first metal layer 21. The first metal layer 21 and the first touch electrode layer are disposed on the same layer, and the second metal layer 22 and the second touch electrode layer are disposed on the same layer.
The gold finger 2 may be formed by two stacked metal layers, so that when the second metal layer 22 is damaged (e.g., scratched or burned), the first metal layer 21 may be used to conduct signals, thereby avoiding the problem that the signals cannot be conducted due to the damage of the second metal layer 22, and thus improving the production yield of the substrate and the display quality of the display device using the substrate.
Of course, the edge of the gold finger 2 at this time is an edge of the entire structure of the first metal layer 21 and the second metal layer 22 of the gold finger 2. For example, as shown in fig. 7a and 8a, the first metal layer 21 is smaller than the second metal layer 22, that is, the first metal layer 21 is completely covered under the second metal layer 22, and at this time, the edge portion of the gold finger 2 is a portion outside the dashed line frame in fig. 7a, and is a portion between two dashed lines in fig. 8 a.
Meanwhile, the first touch electrode layer and the second touch electrode layer are both made of metal materials, the first metal layer 21 and the second metal layer 22 of the golden finger 2 are also made of metal materials, and the golden finger 2 needs to be connected with the first touch electrode and the second touch electrode, so that the first metal layer 21 and the first touch electrode layer are arranged on the same layer, and the second metal layer 22 and the second touch electrode layer are arranged on the same layer, so that the connection of the golden finger 2 and the first touch electrode layer and the second touch electrode layer is facilitated, and the layer structure of the substrate and the complexity of the preparation process are not increased.
As shown in fig. 3 and 4, optionally, the projection of the second metal layer 22 on the substrate 1 at least covers the projection of the first metal layer 21 on the substrate 1.
The protective layer 3 covers an edge portion of the second metal layer 22, wherein the protective layer 3 is in contact with the edge portion of the second metal layer 22.
In the above-described embodiment, the upper metal layer (second metal layer 22) is not smaller than the lower metal layer (first metal layer 21), and only the edge of the upper metal layer is exposed, so that the edge of the gold finger 2 is the edge of the upper metal layer, and the protective layer 3 only needs to cover the edge of the upper metal layer.
As shown in fig. 2, 5, and 6, optionally, a lead 211 (a portion located in a dashed line frame in fig. 5) integrally connected to the first metal layer 21 and extending into the display region is further provided in the non-display region.
The non-display region is further provided with an isolation layer 4 disposed on the same layer as the first coating protection layer, the isolation layer 4 directly covers the lead 211, and an opening 40 is disposed at a position corresponding to the first metal layer 21, so that the first metal layer 21 is in contact with the second metal layer 22.
In order to realize information transmission between signal lines (e.g., the sensing electrode RX and the transmitting electrode TX) of the display region and an Integrated Circuit (IC) chip, signals of the gold finger 2 must be introduced into the display region, which is usually realized by the lead 211 disposed in the same layer as the lower metal layer (the first metal layer 21), and in order to avoid damage to the lead 211 when etching the upper metal layer (the second metal layer 22) and the second touch electrode, the lead 211 needs to be covered with an isolation layer 4, and the isolation layer is in contact with the lead 211, and the isolation layer 4 may be in the same layer as the first coating protection layer to simplify the process. In addition, the isolation layer 4 should obviously be absent in a partial region of the gold finger 2 (i.e. the isolation layer 4 has an opening 40 corresponding to the first metal layer 21) to ensure that the first metal layer 21 and the second metal layer 22 are electrically connected.
Example 2:
the present embodiment provides a display device including the substrate described in the above embodiments.
The embodiment of the utility model provides an in the edge part of display device's golden finger covers there is the protective layer, so avoided moisture to pass through inside the golden finger edge invasion golden finger to, promoted display device's reliance, thereby, make display device (like on-vehicle display device) can satisfy the reliance requirement of high temperature, high humid environment (like, car internal environment).
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (11)
1. A substrate, comprising: a substrate, a plurality of gold fingers disposed on the substrate; it is characterized in that the preparation method is characterized in that,
the protective layer is arranged on one side, away from the substrate, of the golden finger, through holes are formed in at least part of the golden finger, part of the surface of the golden finger is exposed through the through holes in the protective layer, and the protective layer at least covers the edge of each golden finger.
2. The substrate of claim 1, wherein each of the gold fingers exposed by a via in the protective layer is exposed by one or more of the vias in the protective layer.
3. The substrate of claim 2, wherein each of the gold fingers exposed by the through holes on the protective layer is exposed by a plurality of through holes arranged in the same structure and array on the protective layer.
4. The substrate according to claim 1, wherein the substrate comprises a display area for displaying images and a non-display area arranged outside the display area, and the golden finger is positioned in the non-display area;
the protective layer comprises one or more sub-layers which are arranged in a laminated mode, and at least one sub-layer and the functional layer of the display area are arranged in the same layer.
5. The substrate according to claim 4, wherein the functional layers of the display area comprise a first touch electrode layer, a first coating protective layer, a second touch electrode layer and a second coating protective layer which are sequentially arranged in a direction away from the substrate;
the protective layer comprises a first sublayer, and the first sublayer and the second coating protective layer are arranged on the same layer.
6. The substrate according to claim 5, wherein the functional layer of the display region further comprises an inorganic coating layer disposed between a second coating protective layer and the second touch electrode layer;
the protective layer comprises a second sublayer which is arranged on the same layer as the inorganic coating layer.
7. The substrate of claim 6,
the through holes on the first sublayer and the second sublayer have the same structure.
8. The substrate of claim 6,
the golden finger comprises a first metal layer and a second metal layer which is arranged on one side of the first metal layer far away from the substrate and is in contact with the first metal layer; the first metal layer and the first touch electrode layer are arranged on the same layer, and the second metal layer and the second touch electrode layer are arranged on the same layer.
9. The substrate of claim 8,
the projection of the second metal layer on the substrate at least covers the projection of the first metal layer on the substrate;
the protective layer covers the edge portion of the second metal layer.
10. The substrate of claim 8,
the non-display area is also provided with a lead which is connected with the first metal layer into a whole and extends into the display area;
an isolation layer arranged on the same layer as the first coating protection layer is further arranged in the non-display area, the isolation layer directly covers the lead, and an opening is formed in the position corresponding to the first metal layer, so that the first metal layer is in contact with the second metal layer.
11. A display device comprising the substrate according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921779001.5U CN210986579U (en) | 2019-10-22 | 2019-10-22 | Substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921779001.5U CN210986579U (en) | 2019-10-22 | 2019-10-22 | Substrate and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986579U true CN210986579U (en) | 2020-07-10 |
Family
ID=71415527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921779001.5U Active CN210986579U (en) | 2019-10-22 | 2019-10-22 | Substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360371A (en) * | 2021-11-30 | 2022-04-15 | 昆山国显光电有限公司 | Display screen assembly and display device |
-
2019
- 2019-10-22 CN CN201921779001.5U patent/CN210986579U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360371A (en) * | 2021-11-30 | 2022-04-15 | 昆山国显光电有限公司 | Display screen assembly and display device |
| CN114360371B (en) * | 2021-11-30 | 2023-11-07 | 昆山国显光电有限公司 | Display screen assembly and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11374068B2 (en) | Display panel and display apparatus | |
| CN107706156B (en) | A flexible display substrate and a method for preparing the same, and a flexible display device | |
| CN112416178B (en) | Touch module and touch display screen | |
| TWM434985U (en) | Structure of touch control device | |
| CN111326540B (en) | Display panel, preparation method of display panel and display device | |
| US20140159255A1 (en) | Contact pad structure | |
| KR20180107613A (en) | Electrode connection structure and touch sensor | |
| CN210986579U (en) | Substrate and display device | |
| CN112310181B (en) | Display substrate, preparation method thereof and display device | |
| US20230195267A1 (en) | Touch panel, display panel and display apparatus | |
| CN102446018B (en) | Method for manufacturing touch panel | |
| CN112768498B (en) | Display substrate and display device | |
| US20210405810A1 (en) | Electronic Substrate and Manufacture Method Thereof, and Electronic Device | |
| US20100065956A1 (en) | Packaging structure, packaging method and photosensitive device | |
| JPS636829Y2 (en) | ||
| US11954295B2 (en) | Touch panel, display panel, and display device | |
| JP4219876B2 (en) | Capacitive humidity sensor and manufacturing method thereof | |
| KR20170079956A (en) | Liquid crystal display device | |
| US20240334776A1 (en) | Display panel and display apparatus | |
| US10304855B2 (en) | Display panel, touch display device and wire structure | |
| CN112906442B (en) | Wafer-level ultrasonic device and method for manufacturing same | |
| KR100908225B1 (en) | Resistive Touch Panel | |
| EP4095920B1 (en) | Display panel and display apparatus | |
| CN210573720U (en) | Display panel and display device | |
| JP2024528357A (en) | Driving substrate and manufacturing method thereof, and light emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |