CN210984936U - Printed circuit board for base station antenna - Google Patents
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- CN210984936U CN210984936U CN202020143945.XU CN202020143945U CN210984936U CN 210984936 U CN210984936 U CN 210984936U CN 202020143945 U CN202020143945 U CN 202020143945U CN 210984936 U CN210984936 U CN 210984936U
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- 238000001465 metallisation Methods 0.000 description 3
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Abstract
Description
技术领域technical field
本实用新型涉及基站天线的技术领域,更具体地涉及一种用于基站天线的印制电路板,例如该印制电路板可以用作为馈电板或校准板。The utility model relates to the technical field of base station antennas, and more particularly to a printed circuit board for base station antennas. For example, the printed circuit board can be used as a feeding board or a calibration board.
背景技术Background technique
移动通信网络包括大量的基站,各基站可以包括一个或多个基站天线,所述基站天线用于接收和发送射频(RF)信号。单个的基站天线可以包括许多辐射元件,它们也可以称为辐射器、天线振子或者天线元件等等。这些辐射元件可以安装在基板上,所述基板可以包括馈电板和反射板,并且可以可选地包括校准板。馈电板和校准板可以分别利用印制电路板来实现。A mobile communication network includes a large number of base stations, each of which may include one or more base station antennas for receiving and transmitting radio frequency (RF) signals. A single base station antenna may include many radiating elements, which may also be referred to as radiators, antenna elements, or antenna elements, among others. These radiating elements may be mounted on a substrate, which may include a feeder plate and a reflector plate, and may optionally include a collimation plate. The feed board and the calibration board can be implemented using printed circuit boards, respectively.
尤其是在5G时代,在基板上在每单位面积上设置的辐射元件的数量不断提高。与之相应,在馈电板上的用于辐射元件的导电迹线的密度也不断提高,这使得导电迹线在馈电板上的布线变得越来越困难。Especially in the 5G era, the number of radiating elements provided per unit area on a substrate is constantly increasing. Correspondingly, the density of the conductive traces for the radiating elements on the feeding board is also increasing, which makes the routing of the conductive traces on the feeding board more and more difficult.
实用新型内容Utility model content
本实用新型的目的是,提供一种用于基站天线的印制电路板,借此可以实现在印制电路板上的灵活的布线。The purpose of the present invention is to provide a printed circuit board for a base station antenna, whereby flexible wiring on the printed circuit board can be realized.
为了实现所述目的,建议一种用于基站天线的印制电路板,所述印制电路板具有介质层和印制在该介质层上的彼此交叉的第一导电迹线和第二导电迹线,所述第一导电迹线具有被第二导电迹线隔开的两个迹线区段,所述两个迹线区段的被第二导电迹线隔开的相邻的端部通过跳线电连接,所述跳线具有电导体、与第二导电迹线电隔离并且固定在印制电路板上,其中,所述电导体与所述两个迹线区段在所述相邻的端部处电连接。In order to achieve said object, a printed circuit board for a base station antenna is proposed, the printed circuit board having a dielectric layer and first and second conductive traces printed on the dielectric layer crossing each other line, the first conductive trace has two trace sections separated by a second conductive trace, the adjacent ends of the two trace sections separated by the second conductive trace passing through A jumper wire is electrically connected, the jumper wire has an electrical conductor, is electrically isolated from a second conductive trace, and is secured to a printed circuit board, wherein the electrical conductor is adjacent to the two trace segments are electrically connected at the ends.
本实用新型的有益技术效果在于,在这种配置中可以允许导电迹线的交叉,并且彼此交叉的导电迹线可以是相互电隔离的。A beneficial technical effect of the present invention is that, in this configuration, the crossing of conductive traces can be allowed, and the conductive traces crossing each other can be electrically isolated from each other.
所述印制电路板可以称为大板、大印制电路板或者主印制电路板。The printed circuit board may be referred to as a large board, a large printed circuit board or a main printed circuit board.
在一些实施方式中,所述跳线可以是单独的构件,并且可以通过钎焊固定在所述印制电路板上,其中,所述电导体可以与所述两个迹线区段在所述相邻的端部处通过钎焊电连接。In some embodiments, the jumper may be a separate component and may be fixed to the printed circuit board by soldering, wherein the electrical conductor may be connected to the two trace segments at the The adjacent ends are electrically connected by soldering.
在一些实施方式中,所述跳线可以具有插接元件,所述插接元件可以插入到印制电路板的孔中。In some embodiments, the jumper can have plug-in elements that can be inserted into holes in the printed circuit board.
在一些实施方式中,所述跳线可以仅由所述电导体组成,所述电导体可以构造成桥形元件,所述电导体可以具有至少一个针脚作为所述插接元件。In some embodiments, the jumper can consist only of the electrical conductor, which can be configured as a bridge-shaped element, and which can have at least one pin as the plug-in element.
在一些实施方式中,所述电导体可以具有两对针脚,所述印制电路板在所述两个迹线区段的所述相邻的端部的区域中可以具有接纳这些针脚的相应的两对孔。In some embodiments, the electrical conductor may have two pairs of pins, and the printed circuit board may have corresponding pins receiving these pins in the region of the adjacent ends of the two trace segments Two pairs of holes.
在一些实施方式中,所述印制电路板可以具有接地层,所述接地层可以具有围绕用于接纳针脚的孔的、用于电隔离的开口。In some embodiments, the printed circuit board can have a ground plane that can have openings for electrical isolation around holes for receiving pins.
在一些实施方式中,所述跳线可以构成为印制电路板元件,所述印制电路板元件可以具有介质层和作为所述电导体的导电迹线。In some embodiments, the jumper may be constructed as a printed circuit board element, which may have a dielectric layer and conductive traces as the electrical conductors.
在一些实施方式中,所述印制电路板元件可以是单独的构件,并且可以通过钎焊固定在所述印制电路板上,其中,所述印制电路板元件的导电迹线可以与所述两个迹线区段在所述相邻的端部处通过钎焊电连接。In some embodiments, the printed circuit board element can be a separate component and can be fixed to the printed circuit board by soldering, wherein the conductive traces of the printed circuit board element can be connected to all The two trace segments are electrically connected at the adjacent ends by soldering.
在一些实施方式中,所述印制电路板元件可以与所述印制电路板一体地制成。In some embodiments, the printed circuit board element may be made integrally with the printed circuit board.
在一些实施方式中,所述印制电路板元件可以立式地设置在所述印制电路板上。In some embodiments, the printed circuit board element may be arranged vertically on the printed circuit board.
在一些实施方式中,所述印制电路板元件可以构造成桥形元件,所述桥形元件具有两个腿,所述印制电路板在所述相邻的端部的区域中具有被所述两个腿插入的两个孔,所述印制电路板元件的导电迹线在所述两个腿的区域中与所述两个迹线区段的所述相邻的端部钎焊。In some embodiments, the printed circuit board element can be configured as a bridge-shaped element having two legs, the printed circuit board in the region of the adjacent ends having the The two holes into which the two legs are inserted, the conductive traces of the printed circuit board element are soldered to the adjacent ends of the two trace sections in the region of the two legs.
在一些实施方式中,所述印制电路板可以具有接地层,并且所述印制电路板元件可以具有接地层,所述两个孔之中的至少一个可以构成为金属化过孔,通过在所述金属化过孔中的钎焊,所述印制电路板元件的接地层与所述印制电路板的接地层电连接。In some embodiments, the printed circuit board may have a ground plane, and the printed circuit board component may have a ground plane, and at least one of the two holes may be configured as a metallized via by Soldering in the metallized vias, the ground plane of the printed circuit board element is electrically connected to the ground plane of the printed circuit board.
在一些实施方式中,所述印制电路板元件可以平放地设置在所述印制电路板上。In some embodiments, the printed circuit board element may be arranged flat on the printed circuit board.
在一些实施方式中,所述印制电路板元件的导电迹线可以处于所述印制电路板元件的介质层的背离所述印制电路板的一侧上,所述印制电路板元件具有与所述印制电路板元件的导电迹线接触导通的两个金属化过孔,所述印制电路板元件通过其中的第一金属化过孔与所述两个迹线区段的所述相邻的端部之一电连接,并且通过其中的第二金属化过孔与所述两个迹线区段的所述相邻的端部之中的另一个电连接。In some embodiments, the conductive traces of the printed circuit board element may be on a side of the dielectric layer of the printed circuit board element facing away from the printed circuit board, the printed circuit board element having Two metallized vias in contact with conductive traces of the printed circuit board element through which the first metallized via and all of the two trace sections pass. One of the adjacent ends is electrically connected and is electrically connected to the other of the adjacent ends of the two trace segments through a second metallized via therein.
在一些实施方式中,所述印制电路板元件可以通过第一金属化过孔与所述两个迹线区段的所述相邻的端部之一钎焊,并且可以通过第二金属化过孔与所述两个迹线区段的所述相邻的端部之中的另一个钎焊。In some embodiments, the printed circuit board element may be soldered to one of the adjacent ends of the two trace segments through a first metallization via, and may be soldered through a second metallization A via is soldered to the other of the adjacent ends of the two trace segments.
在一些实施方式中,所述印制电路板可以具有接地层,并且所述印制电路板元件可以具有接地层,所述印制电路板元件的接地层与所述印制电路板的接地层可以通过在所述印制电路板和所述印制电路板元件中延伸的第三金属化过孔电连接。In some embodiments, the printed circuit board may have a ground plane, and the printed circuit board component may have a ground plane, the ground plane of the printed circuit board component being connected to the ground plane of the printed circuit board Electrical connections may be made through third metallized vias extending in the printed circuit board and the printed circuit board components.
在一些实施方式中,所述印制电路板元件可以在其接地层的与所述印制电路板元件的所述介质层相反的一侧上具有另外的介质层。In some embodiments, the printed circuit board element may have an additional dielectric layer on the side of its ground plane opposite the dielectric layer of the printed circuit board element.
在一些实施方式中,所述印制电路板可以具有三个相邻地并排地延伸的第一导电迹线,所述三个第一导电迹线可以构成为共面波导结构,其中一个中央的第一导电迹线构成为信号迹线,另外的两个第一导电迹线构成为接地迹线,所述三个第一导电迹线分别被第二导电迹线中断为两个迹线区段,各第一导电迹线的相应的两个迹线区段通过共同的跳线电连接。替选地,各第一导电迹线可以通过各自的跳线电连接。In some embodiments, the printed circuit board may have three adjacent first conductive traces extending side-by-side, the three first conductive traces may be configured as a coplanar waveguide structure, with one central The first conductive traces are formed as signal traces, the other two first conductive traces are formed as ground traces, the three first conductive traces are respectively interrupted by the second conductive traces into two trace sections , the corresponding two trace sections of each first conductive trace are electrically connected by a common jumper. Alternatively, each of the first conductive traces may be electrically connected by respective jumpers.
在一些实施方式中,所述印制电路板元件可以具有三个相邻地并排地延伸的作为所述电导体的导电迹线,所述印制电路板元件的每个导电迹线通过相应的金属化过孔与所述三个第一导电迹线之一的所述两个相邻的端部电连接。In some embodiments, the printed circuit board element may have three conductive traces extending adjacently side by side as the electrical conductors, each conductive trace of the printed circuit board element passing through a corresponding A metallized via is electrically connected to the two adjacent ends of one of the three first conductive traces.
在一些实施方式中,所述第一导电迹线和第二导电迹线可以分别是微带线。In some embodiments, the first and second conductive traces may each be microstrip lines.
在一些实施方式中,所述印制电路板可以是用于基站天线的辐射元件的馈电板。替选地,所述印制电路板可以是用于基站天线的校准板。In some embodiments, the printed circuit board may be a feeder board for a radiating element of a base station antenna. Alternatively, the printed circuit board may be a calibration board for base station antennas.
前述的技术特征、后面将要说明的技术特征和在附图中显示的技术特征可以任意地相互组合,即使它们在不同段落中被提及或者在不同实施方式中被提及,只要它们不是相互矛盾的。所有的在技术上可行的特征组合都包含在本申请中。The aforementioned technical features, the technical features to be described later, and the technical features shown in the accompanying drawings can be arbitrarily combined with each other, even if they are mentioned in different paragraphs or in different embodiments, as long as they are not contradictory to each other of. All technically feasible feature combinations are included in this application.
附图说明Description of drawings
下面借助于具体实施方式参照附图进一步地说明本实用新型。在附图中:The present invention will be further described below with reference to the accompanying drawings by means of specific embodiments. In the attached image:
图1和图2是按第一实施方式的用于基站天线的印制电路板的示意的透视图和分解图;1 and 2 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a first embodiment;
图3和图4是按第二实施方式的用于基站天线的印制电路板的示意的透视图和分解图;3 and 4 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a second embodiment;
图5和图6是按第三实施方式的用于基站天线的印制电路板的示意的透视图和分解图;5 and 6 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a third embodiment;
图7和图8是按第四实施方式的用于基站天线的印制电路板的示意的透视图和局部剖视图;并且7 and 8 are schematic perspective views and partial cross-sectional views of a printed circuit board for a base station antenna according to a fourth embodiment; and
图9和图10是按第五实施方式的用于基站天线的印制电路板的示意的透视图和分解图。9 and 10 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a fifth embodiment.
具体实施方式Detailed ways
图1和图2是按第一实施方式的用于基站天线的印制电路板的示意的透视图和分解图。在图1和图2中,用于基站天线的印制电路板被局部地描述。该印制电路板例如可以是用于基站天线的馈电板,所述馈电板可以与未示出的反射板构成板组件,同样未示出的多个辐射元件可以分布在所述板组件上,这些辐射元件可以发射和/或接收射频信号。在馈电板上可以设置许多导电迹线,它们与相应的辐射元件电连接。也可以考虑,该印制电路板可以是用于基站天线的校准板,所述校准板可以构造成用于校准基站天线的各辐射元件的幅值和相位。在印制电路板上的各导电迹线可以分别是微带线、带状线或者其他的施加在印制电路板的介质层上的导体。1 and 2 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a first embodiment. In Figures 1 and 2, a printed circuit board for a base station antenna is partially depicted. The printed circuit board can be, for example, a feeding board for a base station antenna, the feeding board can form a board assembly with a reflector not shown, and a plurality of radiating elements not shown can also be distributed on the board assembly Above, these radiating elements can transmit and/or receive radio frequency signals. A number of conductive traces can be provided on the feeder board, which are electrically connected to the corresponding radiating elements. It is also conceivable that the printed circuit board may be a calibration board for the base station antenna, which calibration board may be configured to calibrate the amplitude and phase of the individual radiating elements of the base station antenna. The conductive traces on the printed circuit board may be microstrip lines, strip lines, or other conductors applied to the dielectric layer of the printed circuit board, respectively.
在第一实施方式中,所述印制电路板具有介质层4、设置在介质层4的一侧上的阻焊层5和设置在介质层4的另一侧上的接地层6。各层可以一体地构成。阻焊层5典型地是施加在介质层上的漆层。接地层6典型地是施加在介质层上的导性材料。所述印制电路板具有印制在介质层4上的彼此交叉的第一导电迹线1和第二导电迹线2,如图1所示。在图1和图2中可见一个单个的第一导电迹线1和一个单个的第二导电迹线2。然而可以想到,一个单个的第一导电迹线1可以和多个并排地延伸的第二导电迹线2彼此交叉,或者多个并排地延伸的第一导电迹线1可以和多个并排地延伸的第二导电迹线2彼此交叉。所述第一导电迹线1具有被第二导电迹线2隔开的两个迹线区段11,所述两个迹线区段11的被第二导电迹线2隔开的相邻的端部12通过跳线3电连接。In the first embodiment, the printed circuit board has a
在第一实施方式中,所述跳线3可以包括电导体,所述电导体可以由金属片制成,并且可以构造成桥形元件。所述桥形元件具有拱曲部分和两个端部区域13。第二导电迹线2从下方穿过拱曲部分并且与跳线3电隔离。每个端部区域13具有两个针脚14。这些针脚14可以插入到印制电路板的相应的孔中。所述印制电路板在所述两个迹线区段11的所述相邻的端部12的区域中具有接纳这些针脚14的相应的两对孔。所述孔可以在印制电路板的整个厚度上、或者也可以不在印制电路板的整个厚度上延伸,例如所述孔可以仅穿过阻焊层5延伸并且部分地进入到介质层4中,或者所述孔可以穿过阻焊层5和穿过介质层4延伸。In the first embodiment, the
在第一实施方式中,所述桥形元件的每个端部区域13可以通过钎焊与第一导电迹线1的所述两个相邻的端部12之一电连接。为了实现钎焊,阻焊层5可以具有两个开口15。此外,为了改进的电性能,印制电路板的接地层6可以具有围绕用于接纳针脚14的孔的、用于使针脚6与接地层6电隔离的开口16(在一些实施方式中,针脚14完全穿过介质层4)。In a first embodiment, each
所述桥形元件的各个针脚14可以用于改进桥形元件与印制电路板的阻抗匹配,因此可以改进印制电路板的回波损耗性能。The respective pins 14 of the bridge element can be used to improve the impedance matching between the bridge element and the printed circuit board, thus improving the return loss performance of the printed circuit board.
图3和图4是按第二实施方式的用于基站天线的印制电路板的示意的透视图和分解图。在图3和图4中,印制电路板同样被局部地描述。该印制电路板例如可以是用于基站天线的馈电板。3 and 4 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a second embodiment. In Figures 3 and 4, the printed circuit board is also partially depicted. The printed circuit board can be, for example, a feeder board for a base station antenna.
在第二实施方式中,所述印制电路板具有介质层4、设置在介质层4的一侧上的阻焊层5和设置在介质层4的另一侧上的接地层6。各层可以一体地构成。所述印制电路板具有印制在介质层4上的彼此交叉的第一导电迹线1和第二导电迹线2。所述第一导电迹线1具有被第二导电迹线2隔开的两个迹线区段11,所述两个迹线区段11的被第二导电迹线2隔开的相邻的端部12通过跳线3电连接。In the second embodiment, the printed circuit board has a
在第二实施方式中,所述跳线3也是单独的构件,并且通过钎焊固定在所述印制电路板上。所述跳线3构成为印制电路板元件,所述印制电路板元件具有介质层22和作为所述电导体的设置在介质层22的一侧上的导电迹线21以及设置在介质层22的另一侧上的接地层23。用于形成跳线3的所述印制电路板元件典型地一体地制成。所述印制电路板元件可以称为小板或小印制电路板。In the second embodiment, the
在第二实施方式中,所述印制电路板元件立式地设置在所述印制电路板上,换言之,通过印制电路板元件的介质层22的主表面定义的平面基本上垂直于通过印制电路板的介质层4的主表面定义的平面。所述印制电路板元件构造成桥形元件,所述桥形元件具有两个腿25,所述印制电路板在所述相邻的端部12的区域中具有被所述两个腿25插入的两个孔20,所述两个孔与第一导电迹线1的两个迹线区段11的相应的端部12相邻。所述印制电路板元件的所述两个腿25插入到相应的孔20中,以便将所述印制电路板元件安装至所述印制电路板。阻焊层5包括:第一对开口15,其露出迹线区段11的相应的端部12;并且包括第二对开口15a,其处于所述印制电路板中的孔20上方。所述印制电路板元件的导电迹线21的端部与所述第一导电迹线1的两个迹线区段11的相应的端部12(其通过阻焊层5中的开口15露出)钎焊。在一些实施方式中,穿过所述印制电路板的所述两个孔20可以构成为金属化过孔,通过钎焊,所述印制电路板元件的接地层23可以与所述印制电路板的接地层6电连接。为此,介质层4的包括第一和第二导电迹线1、2的那一侧可以还包括:在迹线区段11的端部12处的导电的焊盘(即扩宽的区域),该焊盘便于导电迹线21与第一导电迹线1的钎焊和电连接;并且可以还包括两个另外的导电的焊盘,其局部地或全面地包围孔20,所述孔便于接地层23与接地层6的钎焊和电连接。所述两个孔20可以是印制电路板中的通孔,因此在图4中可见接地层6中的两个缝隙16a,其使得接地层6与导电迹线21电隔离(以如此程度:当所述印制电路板元件插入到所述印制电路板中的孔20中时,导电迹线21延伸至接地层6)。In the second embodiment, the printed circuit board element is arranged vertically on the printed circuit board, in other words, the plane defined by the main surface of the
在第二实施方式中,跳线3的作为可选项的接地层23可以用于所述印制电路板元件上的微带传输线与所述印制电路板的更好的阻抗匹配,因此可以改进印制电路板的回波损耗性能。In the second embodiment, the
图5和图6是按第三实施方式的用于基站天线的印制电路板的示意的透视图和分解图。在图5和图6中,用于基站天线的印制电路板被局部地描述。该印制电路板例如可以是用于基站天线的馈电板。5 and 6 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a third embodiment. In Figures 5 and 6, printed circuit boards for base station antennas are partially depicted. The printed circuit board can be, for example, a feeder board for a base station antenna.
在第三实施方式中,所述印制电路板具有介质层4、设置在介质层4的一侧上的阻焊层5和设置在介质层4的另一侧上的接地层6。各层可以一体地构成。所述印制电路板具有印制在介质层4上的彼此交叉的第一导电迹线1和第二导电迹线2。所述第一导电迹线1具有被第二导电迹线2隔开的两个迹线区段11,所述两个迹线区段11的被第二导电迹线2隔开的相邻的端部12通过跳线3电连接。In the third embodiment, the printed circuit board has a
在第三实施方式中,所述跳线3构成为印制电路板元件,所述印制电路板元件具有介质层和作为所述电导体的导电迹线21,并且没有接地层。所述印制电路板元件的介质层平放地贴靠在所述印制电路板上,使得所述印制电路板的介质层的主表面和所述印制电路板元件的介质层的主表面彼此平行。所述印制电路板元件具有两个金属化过孔10,它们与导电迹线21电连接。所述印制电路板元件通过其中的第一金属化过孔借助钎焊与所述两个迹线区段11的所述相邻的端部12之一电连接,并且通过其中的第二金属化过孔借助钎焊与所述两个迹线区段11的所述相邻的端12之中的另一个电连接。为了实现钎焊,阻焊层5可以具有两个开口15。In a third embodiment, the
图7是按第四实施方式的用于基站天线的印制电路板的示意的透视图,其中,所述印制电路板仅局部地描述。该印制电路板例如可以是用于基站天线的馈电板。图8是按第四实施方式的用于基站天线的印制电路板的沿着跳线3的纵向中心线的局部剖视图,其中,跳线3在一半长度上被描述,并且在另外一半长度上可以具有类似的配置。FIG. 7 is a schematic perspective view of a printed circuit board for a base station antenna according to a fourth embodiment, wherein the printed circuit board is only partially depicted. The printed circuit board can be, for example, a feeder board for a base station antenna. 8 is a partial cross-sectional view of a printed circuit board for a base station antenna according to a fourth embodiment along the longitudinal centerline of the
在第四实施方式中,所述印制电路板具有介质层4和设置在介质层4的底侧上的接地层6。所述印制电路板具有印制在介质层4的顶侧上的彼此交叉的第一导电迹线1和第二导电迹线2。与在前述的实施例中的情况类似地,所述第一导电迹线1具有被第二导电迹线2隔开的两个迹线区段11,所述两个迹线区段11的被第二导电迹线2隔开的相邻的端部12通过跳线3电连接。In the fourth embodiment, the printed circuit board has a
在第四实施方式中,所述跳线3构成为印制电路板元件,并且所述印制电路板元件可以与所述印制电路板一体地制成,因此可以省去钎焊。替选地,所述印制电路板元件可以作为单独的构件并且通过钎焊与所述印制电路板连接。In the fourth embodiment, the
所述印制电路板元件具有:介质层22、设置在介质层22的顶侧上的导电迹线21、设置在介质层22的底侧上的接地层23以及另外的介质层24。所述印制电路板元件具有两个金属化过孔10(仅其中一个在图8中可见),它们与导电迹线21电连接。所述印制电路板元件通过其中的第一金属化过孔与所述两个迹线区段11的所述相邻的端部12之一电连接,并且通过其中的第二金属化过孔与所述两个迹线区段11的所述相邻的端12之中的另一个电连接。在图8中可见两个金属化过孔10之一,其将导电迹线21与第一导电迹线1的两个迹线区段11之一的端部12电连接。所述印制电路板元件的接地层23与所述印制电路板的接地层6通过在所述印制电路板和所述印制电路板元件中延伸的第三金属化过孔30电连接。The printed circuit board element has a
在第四实施方式中,跳线3的接地层23可以用于印制电路板的阻抗匹配,因此可以改进印制电路板的回波损耗性能。In the fourth embodiment, the
图9和图10是按第五实施方式的用于基站天线的印制电路板的示意的透视图和分解图。在图9和图10中,用于基站天线的印制电路板被仅局部地描述。该印制电路板例如可以是用于基站天线的馈电板。9 and 10 are schematic perspective and exploded views of a printed circuit board for a base station antenna according to a fifth embodiment. In Figures 9 and 10, printed circuit boards for base station antennas are only partially depicted. The printed circuit board can be, for example, a feeder board for a base station antenna.
在第五实施方式中,所述印制电路板具有介质层4、设置在介质层4的一侧上的阻焊层5和设置在介质层4的另一侧上的接地层6。各层可以一体地构成。所述印制电路板具有印制在介质层4上的三个并排地延伸的第一导电迹线1和一个第二导电迹线2。所述第一导电迹线1分别具有被第二导电迹线2隔开的两个迹线区段11,所述两个迹线区段11的被第二导电迹线2隔开的相邻的端部12通过相应的跳线3电连接。所述三个第一导电迹线1可以构成为共面波导结构,其中一个中央的第一导电迹线1构成为信号迹线,另外的两个第一导电迹线1构成为接地迹线。In the fifth embodiment, the printed circuit board has a
在第五实施方式中,所述跳线3构成为印制电路板元件,所述印制电路板元件具有介质层和设置在该介质层上的三个相邻地并排地延伸的导电迹线21,所述印制电路板元件的每个导电迹线21通过两个相应的金属化过孔10借助钎焊与所述三个第一导电迹线1之一的所述两个相邻的端部12电连接。为了实现钎焊,阻焊层5可以具有两组开口15,每一组包括三个并排地设置的开口15。在图10中,仅其中一个开口设有附图标记15。替选地,所述印制电路板元件可以与所述印制电路板一体地制成,并且从而可以省去钎焊。In a fifth embodiment, the
在各实施方式中,对于每一个电连接部位,可以采用一个单个的金属化过孔,也可以采用多个金属化过孔。如在图9和图10中可见的,对于在两侧的接地迹线(两侧的第一导电迹线1)上的每一个电连接部位,可以采用三个金属化过孔10,而对于在中央的信号迹线(中央的第一导电迹线1)上的每一个电连接部位,可以采用一个单个的金属化过孔10。在各实施方式中,金属化过孔的数量都是示例性的。原则上,对于每一个电连接部位,可以采用任意数量的金属化过孔。In various embodiments, for each electrical connection portion, a single metallized via may be used, or a plurality of metallized vias may be used. As can be seen in Figures 9 and 10, three metallized vias 10 may be employed for each electrical connection on the ground traces on both sides (first
需要注意的是,在此使用的术语是仅用于说明具体方面的目的,而不用于限制公开内容。如在此使用的单数形式“一个”和“所述一个”应包括复数形式,除非上下文明确地另有表述。可以理解到,术语“包括”和“包含”以及其他类似术语,在申请文件中使用时,具体说明所陈述的操作、元件和/或部件的存在,而不排除一个或多个其他操作、元件、部件和/或它们的组合的存在或添加。如在此使用的术语“和/或”包括一个或多个相关的列举的项目的所有的任意的组合。在对附图的说明中,类似的附图标记总是表示类似的元件。It should be noted that the terminology used herein is for the purpose of describing particular aspects only and not for limiting the disclosure. As used herein, the singular forms "a" and "the an" shall include the plural forms unless the context clearly dictates otherwise. It is to be understood that the terms "comprising" and "comprising" and other similar terms, when used in the application documents, specify the presence of stated operations, elements and/or components without excluding one or more other operations, elements The presence or addition of , components and/or combinations thereof. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items. In the description of the drawings, like reference numerals refer to like elements throughout.
在附图中的元件的厚度可以为了清楚性起见而被夸张。另外可以理解到,如果一个元件被称为在另一个元件上、与另一个元件耦合或者与另一个元件连接,那么所述一个元件可以直接地在所述另一个元件上形成、与之耦合或者与之连接,或者在它们之间可以有一个或多个介于中间的元件。相反,如果在此使用表述“直接在……上”、“直接与……耦合”和“直接与……连接”,那么表示没有介于中间的元件。用来说明元件之间的关系的其他词语应该被类似地解释,例如“在……之间”和“直接在……之间”、“附着”和“直接附着”、“相邻”和“直接相邻”等等。The thickness of elements in the drawings may be exaggerated for clarity. It will also be understood that if an element is referred to as being on, coupled, or connected to another element, then the one element can be directly formed on, coupled to, or otherwise connected to the other element. Connected thereto, or there may be one or more intervening elements therebetween. In contrast, if the expressions "directly on," "directly coupled to," and "directly connected to" are used herein, it is meant that there are no intervening elements. Other words used to describe the relationship between elements should be similarly interpreted, such as "between" and "directly between", "attached" and "directly attached," "adjacent" and " directly adjacent" and so on.
在此术语例如“顶”、“底”、“上方”、“下方”、“上面”、“下面”等等用来描述如在附图中所示的一个元件、层或区域相对于另一个元件、层或区域的关系。可以理解到,除了在附图中描述的取向之外,这些术语应该也包含装置的其他取向。Terms such as "top", "bottom", "over", "under", "over", "under", etc. are used herein to describe one element, layer or region relative to another as illustrated in the figures The relationship of elements, layers, or regions. It is to be understood that these terms are intended to encompass other orientations of the device in addition to the orientation depicted in the figures.
可以理解到,尽管术语“第一”、“第二”等等可以在此用来说明不同的元件,但是这些元件不应被这些术语限制。这些术语仅仅用来将一个元件与另一个元件区分开。因此,第一元件可以被称为第二元件,而不背离本实用新型构思的教导。It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element could be termed a second element without departing from the teachings of the present inventive concept.
也可以考虑到,在此公开的所有示例性的实施方式可以任意地相互组合。It is also conceivable that all the exemplary embodiments disclosed here can be combined with one another at will.
最后要指出的是,上述实施例仅仅用于理解本实用新型,而不对本实用新型的保护范围构成限制。对于本领域技术人员来说,在上述实施例的基础上可以做出修改,这些修改都不脱离本实用新型的保护范围。Finally, it should be pointed out that the above-mentioned embodiments are only used for understanding the present invention, and do not limit the protection scope of the present invention. For those skilled in the art, modifications can be made on the basis of the above embodiments, and these modifications do not depart from the protection scope of the present invention.
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CN113161719A (en) * | 2020-01-22 | 2021-07-23 | 康普技术有限责任公司 | Printed circuit board for base station antenna |
CN116648825A (en) * | 2020-12-29 | 2023-08-25 | 华为技术有限公司 | Feed stripline, phase shifter, array antenna and base station |
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CN113161719A (en) * | 2020-01-22 | 2021-07-23 | 康普技术有限责任公司 | Printed circuit board for base station antenna |
CN116648825A (en) * | 2020-12-29 | 2023-08-25 | 华为技术有限公司 | Feed stripline, phase shifter, array antenna and base station |
EP4258482A4 (en) * | 2020-12-29 | 2024-02-21 | Huawei Technologies Co., Ltd. | Feed strip line, phase shifter, array antenna, and base station |
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