CN210876006U - High-speed metal droplet/substrate collision device under the action of compound field - Google Patents

Abstract

High-speed metal droplet/substrate collision device under the action of compound field, the light source (9a) and high-speed camera (4a) are centered with the metal droplet/substrate collision area; turn on the high-frequency induction heating coil (7a), put the quartz glass tube The metal particles in (8a) are melted; the power supply of the substrate heating assembly (6) is turned on, and the first temperature sensor (5c) monitors the temperature change of the sample in real time; the molten metal is under the impact of the pulse gas to generate a single droplet; high-speed gas is generated , accelerate the metal droplet to collide with the substrate sample; turn on the high-speed camera and lighting system to observe and record the droplet morphology and the change of the contact angle on the sample; the ultrasonic vibrating rod (14a) is in contact with the substrate mounting block (5a) ; Adjust the angle between the substrate sample (5b) and the droplet incident direction; turn on the power of the ultrasonic generator to generate ultrasonic oscillation on the substrate sample (5b), analyze and process the input image, and obtain experimental data.

Description

High-speed metal droplet/substrate collision device under the action of compound field

technical field

The utility model relates to a test device in the field of thermal spraying, in particular to a high-speed metal droplet/substrate collision test technology under the action of a thermal ultrasonic compound field.

Background technique

Thermal spraying refers to heating and melting the coating material, atomizing it into extremely fine particles with a high-speed airflow, and spraying it onto the surface of the workpiece at a high speed to form a coating. Its bonding strength and compactness affect the performance of the workpiece in terms of wear resistance, corrosion resistance, oxidation resistance and heat resistance. Tin-based, zinc-based, and cobalt-based alloy powders are commonly used coating materials. The critical conditions for metal droplets to spread and splash after hitting the substrate sample, the change of the wetting angle and the interaction between atoms at the liquid/solid interface are common physical and chemical phenomena in the process of material preparation and processing, and are also important in the development of thermal spraying theory and methods. Important input for engineering research.

So far, there is no published literature about the impact test device of metal droplet/substrate under the combined action of high-speed flow field, thermal field and ultrasonic field. In the commonly used droplet impacting substrate device, the droplet obtains the impact speed through gravity, and the speed can only be changed by adjusting the droplet falling height. Patent CN105903599A discloses "a high-speed small droplet generating device with adjustable spray angle", the device uses lubricating oil, the speed of the droplets after passing through the accelerating tube is far from reaching the speed of sound, and the substrate sample cannot be applied with thermal fields and ultrasonic fields. Patent CN103940686A discloses "liquid impact test piece and test method that can generate high-speed droplets by jet", the device can generate high-speed droplets of 500m/s, and droplets are produced by jet liquid through slits or holes, and the shape and force The situation is not easy to control. Patent CN107127345A discloses "a gas-phase-assisted metal microdroplet manufacturing device and method". The device adopts pulse gas pressure drive and high-pressure gas shearing method to generate microdroplets melted by a heater, and it is difficult for the droplets to obtain high speed.

SUMMARY OF THE INVENTION

The purpose of the utility model is to provide a high-speed metal droplet/substrate collision device under the action of a compound field.

The utility model is a high-speed metal droplet/substrate collision device under the action of a composite field. The gas source system composed of a high-pressure gas cylinder 2, a gas triplet 11, and a pressure reducing valve group 12 is respectively a micro-droplet generating device through a solenoid valve assembly 13. 8 and the high-speed gas assembly 10 provide the gas with the required pressure, the high-speed camera assembly 4 is composed of a high-speed camera 4a and a camera bracket 4b, and the substrate mounting assembly 5 includes a substrate sample 5b fixed on the substrate mounting block 5a using a substrate sample pressing plate 5d. A temperature sensor 5c is used to measure the real-time temperature of the substrate sample; the substrate heating assembly 6 is composed of an electric heating plate 6a and a first adjustable temperature controller 6b, which is connected with the substrate mounting block 5a, and is used to heat the substrate sample 5b. The base 5f and the set screw 5g can adjust the angle between the substrate sample 5b and the droplet incident direction; the metal droplet heating assembly 7 includes a high-frequency induction heating coil 7a and a second adjustable temperature controller 7b, which is a microdroplet generating device 8 provides a heat source; the micro-droplet generating device 8 includes a glass tube lower sealing flange 8f, a first guide shaft 8g, a high-frequency induction heating coil mounting plate 8h, a second guide shaft 8i, and a micro-droplet generator base 8j. The installation frame, and the quartz glass tube 8a placed between the lower sealing flange of the glass tube and the upper sealing flange 8b of the glass tube and sealed by the fluorine sealing O-ring 8k; the quartz glass tube is placed with a high-frequency induction heating coil 7a The molten molten metal 81 measures the temperature of the molten metal through the second temperature sensor 8e provided on the sealing flange on the glass tube; the sealing flange on the glass tube is also provided with a pulsed air flow inlet 8c and a pulsed air flow outlet 8d. To generate pressure pulses to spray metal microdroplets at the lower end of the quartz glass tube; the backlight assembly 9 includes a light source 9a and a light source bracket 9b to provide illumination for the high-speed camera; the high-speed gas assembly 10 includes a high-speed gas pipeline installed on the pipeline fixture 10c 10b, the front end of the pipeline is connected with a Laval nozzle 10a; the pipeline clamp is placed on the vertical guide shaft 10d on the first single-axis electric moving platform 10e controlled by the first stepping motor driver 18, and can move in the vertical and horizontal directions ; High-speed camera assembly 4, substrate mounting assembly 5, substrate heating assembly 6, metal droplet heating assembly 7, micro-droplet generating device 8, backlight assembly 9, high-speed gas assembly 10 are installed in the dark box 22 to obtain high resolution The pressure reducing valve group 12 includes a pulse gas pressure reducing valve 12a and a high-speed gas pressure reducing valve 12b; the solenoid valve assembly 13 consists of a pulse gas intake solenoid valve 13b, a pulse gas exhaust solenoid valve 13b installed on the solenoid valve mounting base 13a The gas solenoid valve 13c and the high-speed gas intake solenoid valve 13d are composed; the ultrasonic component 14 includes the ultrasonic vibration rod 14a connected with the clamp 14b fixed on the second uniaxial electric moving platform 14c controlled by the second stepping motor driver 19 And the ultrasonic generator 14d.

Compared with the prior art, the utility model has the following advantages: it solves the problem of difficulty in the test of micro-droplets colliding with the substrate in the thermal spraying process, and the present invention is provided with an ultrasonic component, a high-speed gas component and a heating component, which can be applied by applying an ultrasonic field, Temperature field and high-speed flow field, to study the critical conditions of spreading and splashing of high-speed metal droplets after hitting substrate samples with different tilt angles, the change of wetting angle and the interaction between atoms at the liquid/solid interface.

Description of drawings

FIG. 1 is a schematic diagram of the overall structure provided by an embodiment of the present utility model, FIG. 2 is a front view of FIG. 1 (excluding a dark box) provided by an embodiment of the present utility model, and FIG. 3 is a schematic diagram of FIG. Figure 4 is a top view of Figure 1 (without the dark box) provided by an embodiment of the present invention, Figure 5 is a full cross-sectional view of the structure of the air source system provided by an embodiment of the present invention, and Figure 6 is a A partial enlarged schematic diagram of part I in FIG. 5 provided by an embodiment of the present invention, FIG. 7 is a schematic diagram of a cabinet layout provided by an embodiment of the present invention, FIG. 8 is a front view of FIG. 7 provided by an embodiment of the present invention, and FIG. 9 is FIG. 7 is a plan view provided by an embodiment of the present invention, and FIG. 10 is a full cross-sectional view of a quartz glass tube provided by an embodiment of the present invention.

The reference signs and their corresponding names are: 1—bracket assembly, 2—high pressure gas cylinder, 3—electrical cabinet, 4—high-speed camera assembly, 5—substrate mounting assembly, 6—substrate heating assembly, 7—metal droplet heating assembly, 8—Micro droplet generating device, 9—Backlight source assembly, 10—High-speed gas assembly, 11—Gas triplet, 12—Relief valve group, 13—Solenoid valve assembly, 14—Ultrasonic assembly, 15—Data acquisition module, 16—PLC, 17—24V switching power supply, 18—first stepper motor driver, 19—second stepper motor driver, 20—air switch, 21—wire slot, 22—camera, 1a—gas component mounting plate, 1b - bracket, 1c - adjustable support, 4a - high-speed camera, 4b - camera bracket, 5a - substrate mounting block, 5b - substrate sample, 5c - first temperature sensor, 5d - substrate sample platen, 5e - metal micro-melting Drop, 5f—swivel base, 5g—set screw, 6a—electric heating plate, 6b—first adjustable thermostat, 7a—high frequency induction heating coil, 7b—second adjustable thermostat, 8a— Quartz glass tube, 8b-glass tube upper sealing flange, 8c-pulse airflow inlet, 8d-pulse airflow outlet, 8e-second temperature sensor, 8f-glass tube lower sealing flange, 8g-first guide shaft, 8h- High-frequency induction heating coil mounting plate, 8i—second guide shaft, 8j—micro-droplet generator base, 8k—fluorine sealing O-ring, 8l—metal melt, 9a—light source, 9b—light source bracket, 10a—pull Val nozzle, 10b—high-speed gas pipeline, 10c—pipe clamp, 10d—vertical guide shaft, 10e—first single-axis electric moving platform, 12a—pulse gas pressure reducing valve, 12b—high-speed gas pressure reducing valve, 13a— Solenoid valve mounting base, 13b—pulse gas intake solenoid valve, 13c—pulse gas exhaust solenoid valve, 13d—high-speed gas intake solenoid valve, 14a—ultrasonic vibrating rod, 14b—clamp, 14c—second uniaxial electric valve Mobile platform, 14d - ultrasonic generator.

Detailed ways

The utility model is a high-speed metal droplet/substrate collision device under the action of a compound field. As shown in Fig. 1 to Fig. 10 , a gas source system composed of a high-pressure gas cylinder 2, a gas triplet 11 and a pressure reducing valve group 12 passes through a solenoid valve. The component 13 provides the gas with the required pressure for the micro droplet generating device 8 and the high-speed gas component 10 respectively. The high-speed camera component 4 is composed of a high-speed camera 4a and a camera bracket 4b. The substrate sample 5b on the block 5a, the first temperature sensor 5c is used to measure the real-time temperature of the substrate sample; the substrate heating assembly 6 is composed of an electric heating plate 6a and a first adjustable temperature controller 6b, and is connected with the substrate mounting block 5a, Used to heat the substrate sample 5b, the angle of the substrate sample 5b and the droplet incident direction can be adjusted by rotating the base 5f and the set screw 5g; the metal droplet heating component 7 includes a high-frequency induction heating coil 7a and a second adjustable temperature control The device 7b provides a heat source for the micro-droplet generating device 8; the micro-droplet generating device 8 includes a lower sealing flange 8f of the glass tube, a first guide shaft 8g, a high-frequency induction heating coil mounting plate 8h, a second guide shaft 8i, The installation frame formed by the base 8j of the micro-droplet generator, and the quartz glass tube 8a placed between the lower sealing flange of the glass tube and the upper sealing flange 8b of the glass tube, and sealed by the fluorine sealing O-ring 8k; The molten metal 8l melted by the high-frequency induction heating coil 7a is placed, and the temperature of the molten metal is measured by a second temperature sensor 8e arranged on the sealing flange on the glass tube; the sealing flange on the glass tube is also provided with a pulsed airflow. The inlet 8c and the pulse airflow outlet 8d are used to generate pressure pulses to eject metal microdroplets at the lower end of the quartz glass tube; the backlight assembly 9 includes a light source 9a and a light source bracket 9b to provide illumination for the high-speed camera; the high-speed gas assembly 10 includes the installation The high-speed gas pipeline 10b on the pipeline fixture 10c, the front end of the pipeline is connected with the Laval nozzle 10a; the pipeline fixture is placed on the vertical guide shaft 10d on the first single-axis electric moving platform 10e controlled by the first step motor driver 18 , can move in vertical and horizontal directions; high-speed camera assembly 4, substrate mounting assembly 5, substrate heating assembly 6, metal droplet heating assembly 7, micro-droplet generating device 8, backlight source assembly 9, high-speed gas assembly 10 are all installed In the dark box 22 to obtain high-resolution image signals; the pressure reducing valve group 12 includes a pulse gas pressure reducing valve 12a and a high-speed gas pressure reducing valve 12b; the solenoid valve assembly 13 consists of the pulse gas installed on the solenoid valve mounting base 13a The intake solenoid valve 13b, the pulsed gas exhaust solenoid valve 13c, and the high-speed gas intake solenoid valve 13d are composed; The ultrasonic vibrating rod 14a and the ultrasonic generator 14d are connected to the jig 14b.

The method for using the high-speed metal droplet/substrate collision device under the action of the compound field of the present invention comprises the following steps:

(1) Adjust the light source 9a and the high-speed camera 4a to align with the metal droplet/substrate collision area in the horizontal direction;

(2) Turn on the high-frequency induction heating coil 7a, and melt the metal particles put into the quartz glass tube 8a;

(3) Turn on the power of the substrate heating assembly 6, and the first temperature sensor 5c monitors the temperature change of the sample in real time;

(4) Open the high-pressure gas cylinder 2, and control the gas flow of the pulsed gas inlet 8c connected to the pulsed gas inlet solenoid valve 13b through the pneumatic triplet 11 and the pulsed gas pressure reducing valve 12a;

(5) By controlling the on-off sequence of the pulsed gas intake solenoid valve 13b and the pulsed gas exhaust solenoid valve 13c, the gas pressure in the quartz glass tube is adjusted to obtain the pulsed gas; the molten metal in the quartz glass tube is under the impact of the pulsed gas , producing a single droplet;

(6) Open the high-speed gas inlet solenoid valve 13d connected to the high-speed gas pressure reducing valve 12b, after the gas passes through the Laval nozzle 10a, a high-speed gas is generated, and the metal droplet is accelerated to collide with the substrate sample;

(7) Turn on the high-speed camera and lighting system to observe and record the droplet shape and the change of the contact angle on the sample; (8) Adjust the second uniaxial electric moving platform 14c to drive the ultrasonic vibrating rod 14a and the substrate mounting block 5a contact;

(9) Adjust the angle between the substrate sample 5b and the droplet incident direction through the rotating base 5f and the set screw 5g;

(10) Turn on the power of the ultrasonic generator, generate ultrasonic oscillation on the substrate sample 5b, analyze and process the input image, and obtain experimental data.

The utility model is further developed below in conjunction with the accompanying drawings. As shown in Figures 1 to 10, the high-speed metal droplet/substrate collision test device under the action of the compound field includes a bracket assembly 1, a high-pressure gas cylinder 2, an electrical cabinet 3, a high-speed camera assembly 4, a substrate mounting assembly 5, and a substrate heating assembly 6. , metal droplet heating assembly 7, micro droplet generating device 8, backlight assembly 9, high-speed gas assembly 10, gas triplet 11, pressure reducing valve group 12, solenoid valve assembly 13, ultrasonic assembly 14, data acquisition module 15, PLC16, 24V switching power supply 17, first stepper motor driver 18, second stepper motor driver 19, air switch 20, wire slot 21, and dark box 22. The gas source system composed of the high-pressure gas cylinder 2 , the gas triplet 11 , and the pressure-reducing valve group 12 respectively provides the micro-droplet generating device 8 and the high-speed gas component 10 with gas of the required pressure through the solenoid valve assembly 13 . The high-speed camera assembly 4 is composed of a high-speed camera 4a and a camera bracket 4b. The substrate mounting assembly 5 includes a substrate sample 5b fixed on the substrate mounting block 5a by a substrate sample pressing plate 5d, and the first temperature sensor 5c is used to measure the real-time temperature of the substrate sample. The substrate heating assembly 6 is composed of an electric heating plate 6a and a first adjustable temperature controller 6b, and is used for heating the substrate sample 5b. The metal droplet heating assembly 7 includes a high-frequency induction heating coil 7a and a second adjustable temperature controller 7b to provide a heat source for the microdroplet generating device 8 . The micro-droplet generating device 8 includes a glass tube lower sealing flange 8f, a first guide shaft 8g, a high-frequency induction heating coil mounting plate 8h, a second guide shaft 8i, and a micro-droplet generator base 8j. The installation frame, and the quartz glass tube 8a placed between the lower sealing flange of the glass tube and the upper sealing flange 8b of the glass tube and sealed by the fluorine sealing O-ring 8k. The molten metal 8l melted by the high-frequency induction heating coil 7a is placed in the quartz glass tube, and the temperature of the molten metal is measured by a second temperature sensor 8e disposed on the glass tube to seal the flange. The upper sealing flange of the glass tube is also provided with a pulse gas flow inlet 8c and a pulse gas flow outlet 8d. The backlight assembly 9 includes a light source 9a and a light source bracket 9b to provide illumination for the high-speed camera. The high-speed gas assembly 10 includes a high-speed gas pipeline 10b mounted on a pipeline fixture 10c, and a Laval nozzle 10a is connected to the front end of the pipeline. The pipe clamp is placed on the vertical guide shaft 10d on the first single-axis electric moving platform 10e controlled by the first step motor driver 18, and can move in vertical and horizontal directions. The high-speed camera assembly 4, the substrate mounting assembly 5, the substrate heating assembly 6, the metal droplet heating assembly 7, the microdroplet generating device 8, the backlight assembly 9, and the high-speed gas assembly 10 are all placed in the dark box 22 to obtain high resolution image signal. The pressure reducing valve group 12 includes a pulse gas pressure reducing valve 12a and a high-speed gas pressure reducing valve 12b. The solenoid valve assembly 13 is composed of a pulsed gas intake solenoid valve 13b, a pulsed gas exhaust solenoid valve 13c, and a high-speed gas intake solenoid valve 13d mounted on the solenoid valve mounting base 13a. The ultrasonic assembly 14 includes an ultrasonic vibrating rod 14a connected to a fixture 14b fixed on a second uniaxial electric moving platform 14c controlled by a second stepping motor driver 19, and an ultrasonic generator 14d.

Among them, as shown in FIG. 1 , FIG. 3 , and FIG. 10 , the quartz glass tube has a conical structure, which reduces the flow resistance of the melt. The tapered end of the glass tube has a straight conduit with a diameter of 1mm, so that the melt does not drip under the action of surface tension. The lower half of the quartz glass tube is surrounded by a high-frequency induction heating coil 7a for heating solid metal particles, and the temperature adjustment range is 0-1000°C.

As shown in FIG. 1 , FIG. 6 , FIG. 7 , and FIG. 9 , the metal microdroplets 5e are generated by the pressure pulse driving the metal melt injection in the quartz glass tube. The pressure pulse is obtained by controlling the gas flow of the pulse gas inlet 8c and the pulse gas outlet 8d through the on-off sequence of the pulse gas inlet solenoid valve 13b and the pulse gas exhaust solenoid valve 13c, and adjusting the gas pressure change in the quartz glass tube.

As shown in FIG. 1 , FIG. 6 and FIG. 8 , the base plate mounting block 5 a is made of brass alloy, which is convenient for heat conduction. The temperature adjustment range of the base plate heating assembly 6 is 0~500°C. Driven by the second uniaxial electric moving platform 14c, the ultrasonic vibrating rod 14a is in contact with the substrate mounting block 5a to generate ultrasonic oscillation on the substrate sample 5b.

As shown in FIGS. 1 and 2 , the Laval nozzle 10a is composed of two conical tubes, one of which is a shrinking tube and the other is an expanding tube. The inert gas with a pressure of 0.1-0.7MPa flows into the first half of the nozzle, and escapes from the second half after passing through the narrow part.

As shown in FIG. 4 , the angle between the substrate sample 5b and the droplet incident direction can be adjusted by the rotating base 5f and the fixing screw 5g, and the adjustable range is 60°~120°.

As shown in FIG. 6 , a high-speed camera and an illumination system are respectively set in the collision area of the metal microdroplet 5e and the substrate sample 5b to observe the droplet shape and the change of the contact angle on the sample.

The method of using the high-speed metal droplet/substrate collision test device under the action of the compound field, the steps are: as shown in Figures 1 to 10, adjust the He-Ne laser light source 9a and the high-speed camera 4a in the horizontal direction with the metal droplet/substrate. The collision area is centered. The high-frequency induction heating coil 7a is turned on, and the metal particles put into the quartz glass tube 8a are melted. Turn on the power supply of the substrate heating assembly 6, and its temperature adjustment range is 0-500 °C, which is used to heat the substrate sample, and the temperature sensor I monitors the temperature change of the sample in real time. Open the high-pressure gas cylinder 2, and control the gas flow from the pulse gas inlet 8c connected to the pulse gas inlet solenoid valve 13b through the pneumatic triplet 11 and the pulse gas pressure reducing valve 12a. By controlling the on-off sequence of the pulsed gas intake solenoid valve 13b and the pulsed gas exhaust solenoid valve 13c, the gas pressure in the quartz glass tube is adjusted to obtain the pulsed gas. The molten metal in the quartz glass tube produces a single droplet under the impact of the pulsed gas. The high-speed gas inlet solenoid valve 13d connected to the high-speed gas pressure reducing valve 12b is opened, and after the gas passes through the Laval nozzle 10a, high-speed gas is generated, and the metal droplets are accelerated to collide with the substrate sample. By adjusting the distance between the Laval nozzle and the droplet, the wind speed of 0-400m/s can be obtained. The high-speed camera and illumination system were turned on to observe and record the droplet morphology and its contact angle changes on the sample. Adjust the uniaxial electric moving platform II 14c to drive the ultrasonic vibrating rod 14a to contact the base plate mounting block 5a. The angle of the substrate sample 5b and the droplet incident direction is adjusted by the rotating base 5f and the set screw 5g. Turn on the power of the ultrasonic generator, generate ultrasonic oscillation on the substrate sample 5b, analyze and process the input image, and obtain experimental data.

Taking the above-mentioned ideal embodiment according to the utility model as inspiration, through the above-mentioned description content, relevant staff can make various changes and modifications within the scope of not departing from the technical idea of the present utility model, and the technical scope of the present utility model does not It is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims (6)

1. A high-speed metal molten drop/substrate collision device under the action of a composite field is characterized in that a gas source system consisting of a high-pressure gas cylinder (2), a gas triple piece (11) and a pressure reducing valve group (12) respectively provides gas with required pressure for a micro-drop generating device (8) and a high-speed gas component (10) through a solenoid valve component (13), and a high-speed camera component (4) consists of a high-speed camera (4 a) and a camera support (4 b), wherein a substrate mounting component (5) comprises a substrate sample (5 b) fixed on a substrate mounting block (5 a) through a substrate sample pressing plate (5 d), and a first temperature sensor (5 c) is used for measuring the real-time temperature of the substrate sample; the substrate heating assembly (6) consists of an electric heating plate (6 a) and a first adjustable temperature controller (6 b), is connected with the substrate mounting block (5 a) and is used for heating the substrate sample wafer (5 b), and the angle between the substrate sample wafer (5 b) and the incidence direction of liquid drops can be adjusted through a rotary base (5 f) and a set screw (5 g); the metal molten drop heating assembly (7) comprises a high-frequency induction heating coil (7 a) and a second adjustable temperature controller (7 b) and provides a heat source for the micro-droplet generating device (8); the micro-droplet generating device (8) comprises a mounting frame consisting of a glass tube lower sealing flange (8 f), a first guide shaft (8 g), a high-frequency induction heating coil mounting plate (8 h), a second guide shaft (8 i) and a micro-droplet generator base (8 j), and a quartz glass tube (8 a) which is arranged between the glass tube lower sealing flange and the glass tube upper sealing flange (8 b) and is sealed by a fluorine sealing O ring (8 k); a molten metal (8 l) melted by a high-frequency induction heating coil (7 a) is placed in the quartz glass tube, and the temperature of the molten metal is measured by a second temperature sensor (8 e) arranged on a sealing flange on the glass tube; the upper sealing flange of the glass tube is also provided with a pulse airflow inlet (8 c) and a pulse airflow outlet (8 d) which are used for generating pressure pulse so as to spray metal micro-droplets at the lower end of the quartz glass tube; the backlight source assembly (9) comprises a light source (9 a) and a light source bracket (9 b) for providing illumination for the high-speed camera; the high-speed gas assembly (10) comprises a high-speed gas pipeline (10 b) arranged on a pipeline clamp (10 c), and the front end of the pipeline is connected with a Laval nozzle (10 a); the pipe clamp is placed on a vertical guide shaft (10 d) on a first single-shaft electric moving platform (10 e) controlled by a first stepping motor driver (18) and can move along the vertical and horizontal directions; the high-speed camera shooting assembly (4), the substrate mounting assembly (5), the substrate heating assembly (6), the metal molten drop heating assembly (7), the micro-droplet generating device (8), the backlight source assembly (9) and the high-speed gas assembly (10) are all mounted in a dark box (22) to obtain high-resolution image signals; the pressure reducing valve group (12) comprises a pulse gas pressure reducing valve (12 a) and a high-speed gas pressure reducing valve (12 b); the electromagnetic valve component (13) consists of a pulse gas inlet electromagnetic valve (13 b), a pulse gas outlet electromagnetic valve (13 c) and a high-speed gas inlet electromagnetic valve (13 d) which are arranged on an electromagnetic valve mounting base (13 a); the ultrasonic assembly (14) includes an ultrasonic vibrator rod (14 a) connected to a jig (14 b) fixed to a second uniaxial electric moving stage (14 c) controlled by a second stepping motor driver (19), and an ultrasonic generator (14 d).

2. A high speed metal droplet/substrate collision device under combined field action according to claim 1, wherein: the pressure pulse is obtained by controlling the gas flow of a pulse gas flow inlet (8 c) and a pulse gas flow outlet (8 d) through the on-off time sequence of a pulse gas inlet electromagnetic valve (13 b) and a pulse gas exhaust electromagnetic valve (13 c) and adjusting the gas pressure change in the quartz glass tube.

3. A high speed metal droplet/substrate collision device under combined field action according to claim 1, wherein: the lower half part of the quartz glass tube is surrounded by a high-frequency induction heating coil (7 a) and used for heating solid metal particles, and the temperature adjusting range is 0-1000 ℃.

4. A high speed metal droplet/substrate collision device under combined field action according to claim 1, wherein: the base plate mounting block (5 a) is made of brass alloy and is connected with the electric heating plate (6 a), so that heat conduction is facilitated, and the temperature regulation range of the base plate heating assembly (6) is 0-500 ℃.

5. A high speed metal droplet/substrate collision device under combined field action according to claim 1, wherein: the Laval nozzle (10 a) is composed of two conical tubes, wherein one is a contraction tube, and the other is an expansion tube; inert gas with pressure of 0.1-0.7MPa flows into the front half part of the nozzle, passes through the narrow part and escapes from the rear half part, and the gas flow velocity reaches 400m/s at most.

6. A high speed metal droplet/substrate collision device under combined field action according to claim 1, wherein: the ultrasonic vibrating rod (14 a) is driven by the second uniaxial electric moving platform (14 c) to contact with the substrate mounting block (5 a) to generate ultrasonic oscillation action on the substrate sample wafer (5 b).

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