CN210867806U - Audio acquisition equipment seal structure and electronic equipment - Google Patents
Audio acquisition equipment seal structure and electronic equipment Download PDFInfo
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- CN210867806U CN210867806U CN201922008073.6U CN201922008073U CN210867806U CN 210867806 U CN210867806 U CN 210867806U CN 201922008073 U CN201922008073 U CN 201922008073U CN 210867806 U CN210867806 U CN 210867806U
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- 238000007789 sealing Methods 0.000 claims abstract description 15
- 239000006260 foam Substances 0.000 claims description 18
- 239000000428 dust Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
The utility model belongs to the technical field of audio acquisition equipment assembly, and provides a sealing structure of audio acquisition equipment, which comprises a shell with an accommodating cavity, a circuit board arranged in the accommodating cavity, a dustproof assembly pressed between the shell and the circuit board, and an audio acquisition equipment assembly arranged on the circuit board and positioned in the accommodating cavity; the circuit board is provided with a first sound picking hole, the shell is provided with a second sound picking hole communicated with the outside, the first sound picking hole is communicated with the audio acquisition equipment assembly and the dustproof assembly, and the second sound picking hole is communicated with the first sound picking hole through the dustproof assembly. The utility model discloses in, dustproof subassembly is fixed in between circuit board and the casing, fixes dustproof subassembly pressfitting on the holding surface of casing through the circuit board, forms stable seal environment, and seal structure's assembly relation is simple, the error is minimum, has more the reliability in the production process. Another aspect of the present invention provides an electronic device.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to an audio acquisition equipment assembles technical field, especially relates to an audio acquisition equipment seal structure and uses this audio acquisition equipment seal structure's electronic equipment.
[ background of the invention ]
Among the prior art, the audio acquisition equipment (for example microphone) pickup hole of electronic equipment (for example cell-phone, panel computer etc.) generally establishes at the top or the bottom of electronic equipment casing, and the audio acquisition equipment laminating then can have a 90 degrees contained angle with the pickup hole when fixing at the mainboard, usually need connect the pickup hole of audio acquisition equipment and casing through the silica gel cover, realizes switching on with the external world. However, with the silicone sleeve conductive, two seals are produced during assembly, namely: the audio acquisition equipment and the silica gel sleeve, the silica gel sleeve and the sound pickup hole are arranged; in addition, the silica gel cover needs extra support to all take place the assembled relation between a plurality of devices during leading to the assembly, in process of production, very easily cause sealed bad.
In view of this, the utility model provides an audio frequency collection equipment seal structure and electronic equipment solve above-mentioned defect.
[ Utility model ] content
The utility model aims at providing a simple and sealed good audio acquisition equipment seal structure of assembly relation aims at solving audio acquisition equipment assembly time assembly relation more among the current electronic equipment, very easily causes sealed bad technical problem.
In order to achieve the above object, a first aspect of the present invention provides a sealing structure for an audio acquisition device, including a housing having an accommodating cavity, a circuit board disposed in the accommodating cavity, a dustproof assembly pressed between the housing and the circuit board, and an audio acquisition device assembly disposed on the circuit board and located in the accommodating cavity; the circuit board is provided with a first sound pickup hole, the shell is provided with a second sound pickup hole communicated with the outside, the first sound pickup hole communicates the audio acquisition equipment assembly with the dustproof assembly, and the second sound pickup hole communicates with the first sound pickup hole through the dustproof assembly.
In a preferred embodiment, the dust-proof assembly comprises foam connected to the circuit board and a dust-proof net connected to the foam.
In a preferred embodiment, the dust screen is bonded to the foam.
In a preferred embodiment, the foam is provided with at least one through hole, and the through hole is communicated with the first sound pickup hole.
In a preferred embodiment, the second pickup hole comprises an inner hole close to the dustproof assembly and an outer hole communicated with the outside; the outer hole is obliquely arranged.
In a preferred embodiment, a central axis of the inner bore coincides with a central axis of the first sound pickup hole.
In a preferred embodiment, the inner hole has the same size as the cross-section of the first sound pickup hole.
In a preferred embodiment, the side of the dust-proof assembly away from the circuit board is provided with an antistatic layer.
In a preferred embodiment, the foam is round, has a thickness of 0.3 to 0.5mm and a diameter of 3 to 5 mm.
A second aspect of the present invention is to provide an electronic device, including any one of the above embodiments of the sealing structure of the audio acquisition device.
The utility model discloses in, dustproof subassembly is fixed in between circuit board and the casing, fixes dustproof subassembly pressfitting on the holding surface of casing through the circuit board, forms stable seal environment, and seal structure's assembly relation is simple, the error is minimum, has more the reliability in the production process.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic cross-sectional structure view of a sealing structure of an audio acquisition device provided by the present invention;
fig. 2 is an enlarged cross-sectional view of circle a shown in fig. 1.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantageous technical effects of the present invention more clearly understood, the present invention is further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration only and not by way of limitation.
Referring to fig. 1, the present invention provides an audio acquisition device sealing structure 100 and an electronic device using the same 100, for solving the technical problems of the prior art that the assembly relationship is more and the sealing is poor when the audio acquisition device is assembled.
It should be noted that the utility model provides an in audio frequency collection equipment seal structure 100 locates electronic equipment for the function of sealed pickup passageway when realizing switching on the collection audio frequency with the external world. The electronic device includes, but is not limited to, a mobile terminal, such as a personal computer, a notebook computer, a smart phone, a tablet computer, a portable wearable device, and the like.
In the embodiment of the present invention, the sealing structure 100 of the audio acquisition device includes a housing 10 having an accommodating cavity 101, a circuit board 20 disposed in the accommodating cavity 101, a dustproof assembly 40 pressed between the housing 10 and the circuit board 20, and an audio acquisition device assembly 30 disposed on the circuit board 20 and located in the accommodating cavity 101; the circuit board 20 is provided with a first sound pickup hole 201, the housing 10 is provided with a second sound pickup hole 301 communicated with the outside, the first sound pickup hole 201 communicates the audio collecting device assembly 30 with the dust-proof assembly 40, and the second sound pickup hole 301 is communicated with the first sound pickup hole 201 through the dust-proof assembly 40. Through the relative pressfitting fastening of circuit board 20 and casing 10, make dustproof subassembly 40 firm be fixed in between first sound picking-up hole 201 and the second sound picking-up hole 301, form stable sealed environment, improve the design of the twice assembly relation of casing 10 and dustproof subassembly 40, dustproof subassembly 40 and circuit board 20 with the many times assembly relation among the technical scheme who uses the silica gel cover now, reduced the assembly number of times, the unreliability that greatly reduced assembly error and machining error brought.
Specifically, the circuit board 20 is fixed in the housing 10, the audio collecting device assembly 30 and the dust-proof assembly 40 are respectively disposed on opposite sides of the circuit board, and the audio collecting device assembly 30 is communicated with the dust-proof assembly 40 through a first sound collecting hole 201 formed in the circuit board 20. Further, in order to minimize the volume of the circuit board 20 occupied by the first sound-pickup hole 201, the first sound-pickup hole 201 is opened perpendicular to the printed board of the circuit board 20. One end of the first sound pickup hole 201 corresponds to the audio pickup device assembly 30, that is, the audio pickup device assembly 30 is fixed on the circuit board 20 and can pick up sound through the first sound pickup hole 201, and meanwhile, the circuit board 20 provides power for the audio pickup device assembly 30.
Further, the audio capture device assembly 30 includes a main microphone (not shown in the drawings) and a sub-microphone (not shown in the drawings), the main microphone is used for picking up conversation voice, the sub-microphone is used for picking up background sound, and noise reduction processing is performed on sound information, which is more beneficial for processing audio capture signals of the electronic device, for example: the definition of the mobile phone call is higher.
In the embodiment of the present invention, the housing 10 includes an upper housing 11 and a lower housing 12 which are oppositely disposed, and a middle frame 13 which is fixedly connected to the upper housing 11 and the lower housing 12, the upper housing 11, the lower housing 12 and the middle frame 13 together enclose and form a closed accommodating cavity 101, the accommodating cavity 101 is used for mounting electronic components of electronic equipment, etc., one side of the housing 10 departing from the accommodating cavity 101 is an outer surface, and the accommodating cavity 101 is communicated with the outside through a second sound collecting hole 301 which is opened in the middle frame 13; specifically, the middle frame 13 includes a supporting surface 131, the supporting surface 131 is tiltable and can be parallel to the upper casing 11 or the lower casing 12, one side of the circuit board 20 away from the audio acquisition device assembly 30 is fixed on the supporting surface 131 through screws or bonding, and the dustproof assembly 40 is press-fit and fixed on the supporting surface 131, and the dustproof assembly 40 is press-fit in the opposite direction of the supporting surface 131 of the middle frame 13 through the circuit board 20, so that the dustproof assembly 40 can simultaneously realize the effect of sealing the audio acquisition device under the premise of dustproof effect. The thickness of the middle frame 13 can be increased by adding a high polymer resin material, so that the structural strength of the middle frame 13 is enhanced, the middle frame 13 can bear more pressure, and better support is provided.
The embodiment of the present invention provides a dustproof assembly 40 for preventing dust particles in the air from entering the audio acquisition device assembly 30, wherein the dustproof assembly 40 may be, for example, a dustproof net 41, a dustproof plate or a dustproof silica gel, or a combination of one or more of the above structures. Further, in one embodiment, the dust-proof assembly 40 includes a dust-proof net 41 and a foam 42 connected to the circuit board 20, specifically, the foam is circular, has a thickness of 0.3-0.5mm and a diameter of 3-5mm, and since the foam 42 has a series of characteristics of elasticity, light weight, quick pressure-sensitive fixation, electrochemical corrosion resistance, low surface contact resistance, high fire resistance, etc., the direct contact between the circuit board 20 and the dust-proof net 41 can be avoided, thereby avoiding the adverse consequences of corrosion, short circuit and heating of the circuit board 20.
Still further, in a specific embodiment, the foam 42 is provided with a plurality of through holes 402, which may also be a larger through hole 402, the through hole 402 is communicated with the first sound pickup hole 201 and the second sound pickup hole 301, so that sound entering from the second sound pickup hole 301 to the first sound pickup hole 201 does not generate large loss, further, the dust screen 41 is bonded to the foam 42 without affecting the permeability of the dust-proof component 40 to the first sound pickup hole 201, specifically, in order to make the connection between the dust screen 41 and the foam 42 more firm, mutual dislocation caused by long-time pressing of the circuit board 20 and the housing 10 is prevented, the dust screen 41 and the foam 42 may be bonded by bonding materials such as double faced adhesive tape, and of course, other connection manners may also be adopted; optionally, the dust-proof component 40 is bonded at a position where the first sound-collecting hole 201 and the second sound-collecting hole 301 do not intersect, so that the dust-proof mesh 41 and the foam 42 are not blocked, and the permeability of the dust-proof component 40 is not affected.
Optionally, an anti-static layer (not shown in the figure) made of an anti-static material is arranged on the surface of the dustproof assembly 40, so that the dustproof assembly 40 is prevented from generating static electricity, dust particles in the air are adsorbed, active adsorption is generated, and the sound guide channel or the audio acquisition equipment assembly 30 is blocked, wherein the anti-static layer can be connected with the dustproof assembly 40 in an integrated forming or bonding mode.
Continuing to refer to fig. 1, one end of the second sound-collecting hole 301 penetrates through the outer surface of the housing 10, and the other end of the second sound-collecting hole 301 continuously extends into the housing 10 to be communicated with the first sound-collecting hole 201 to form a sound-guiding channel, so as to facilitate the transmission of sound, the inner wall of the sound-guiding channel is a smooth inner wall, it should be noted that the second sound-collecting hole 301 extends from the end penetrating through the outer surface to the first sound-collecting hole 201 continuously, that is, the middle part of the channel is not dislocated to cause only partial communication, and the external sound can be directly transmitted to the audio collecting device assembly 30 from the sound-guiding channel without being transmitted through. Generally speaking, based on the consideration of lightness and thinness of the electronic device, the printed board of the circuit board 20 is attached to the supporting surface 131 of the middle frame 13, so that the extending direction of the end, close to the outer surface, of the second sound pickup hole 301 is almost perpendicular to the extending direction of the end, close to the first sound pickup hole 201, of the second sound pickup hole 301, when the second sound pickup hole 301 extends continuously into the casing 10, the second sound pickup hole 301 is inevitably bent or turned at least once, the bending times of the second sound pickup hole 301 are less, the sound propagation is facilitated, and the dissipation of sound energy in the multiple collision processes is avoided.
In addition, the cross-sections of the first sound-collecting hole 201 and the second sound-collecting hole 301 may be any one or two of a circle, a square, an ellipse, and a polygon, which is not limited to this, and in this embodiment, the cross-sections of the two sound-collecting holes are circular.
For convenience of illustration, referring to fig. 1, the second sound pickup hole 301 includes an inner hole 3011 close to the first sound pickup hole 201 and an outer hole 3012 communicating with the outside, it is easily understood that the inner hole 3011 and the outer hole 3012 have an included angle or arc transition, in this embodiment, the inner hole 3011 and the outer hole 3012 are both through holes whose central axes are straight lines, and further, the outer hole 3012 is disposed obliquely, so that one end of the outer hole 3012 penetrating through the outer surface of the casing 10 is located at the center of the middle frame 13 along the thickness direction; optionally, the inclination angle of the outer hole 3012 and the upper casing 11 or the lower casing 12 is about 10 degrees, so that the outer hole 3012 has a sound conduction function, and meanwhile, the requirement that the second sound pickup hole 301 passes through the middle frame 13 and is centered in appearance is considered, so that the external sound pickup device is more aesthetic.
Further, in one embodiment, the central axis of the inner hole 3011 coincides with the central axis of the first sound pickup hole 201; the inner hole 3011 and the first sound pickup hole 201 may be perpendicular to the printed board of the circuit board 20, or may have an angle with the printed board of the circuit board 20, so that when external sound enters the first sound pickup hole 201 through the inner hole 3011, energy loss due to excessive collision with the inner wall of the sound guide channel during sound conduction is avoided.
Still further, in an embodiment, the shape and size of the cross section of the inner hole 3011 and the first sound pickup hole 201 are the same, for example, when the area of the cross section of the inner hole 3011 is larger than the area of the cross section of the first sound pickup hole 201, the sound signal is partially absorbed by the inner hole 3011 beyond the inner wall of the first sound pickup hole 201, which causes energy loss; when the cross section of the inner hole 3011 is smaller than the cross section area of the first sound pickup hole 201, the volume of the first sound pickup hole 201 in the sound guide channel is left, which occupies too large volume of the circuit board 20, and is not favorable for circuit layout; therefore, when the shape and size of the cross section of the inner hole 3011 and the first sound pickup hole 201 are the same, the circuit layout is optimized on the premise of minimizing the signal slowing-down amplitude.
In conclusion, can understand, the utility model discloses an in the embodiment, dustproof subassembly 40 is fixed in between the holding surface of circuit board 20 and casing 10, carries out the pressfitting fastening to dustproof subassembly 40 through the holding surface of circuit board 20 and casing 10, forms stable sealed environment, and seal structure's fitting relation is simple, the error is minimum, has more the reliability in the production process.
The invention is not limited solely to that described in the specification and the embodiments, and additional advantages and modifications will readily occur to those skilled in the art, and it is not intended to be limited to the specific details, representative apparatus, and illustrative examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.
Claims (10)
1. A sealing structure of audio acquisition equipment is characterized by comprising a shell with an accommodating cavity, a circuit board arranged in the accommodating cavity, a dustproof assembly pressed between the shell and the circuit board and an audio acquisition equipment assembly arranged on the circuit board and positioned in the accommodating cavity; the circuit board is provided with a first sound pickup hole, the shell is provided with a second sound pickup hole communicated with the outside, the first sound pickup hole communicates the audio acquisition equipment assembly with the dustproof assembly, and the second sound pickup hole communicates with the first sound pickup hole through the dustproof assembly.
2. The audio capture device seal structure of claim 1, wherein the dust-proof assembly comprises a foam connected to the circuit board and a dust screen connected to the foam.
3. The audio capture device seal of claim 2, wherein the dust screen is bonded to the foam.
4. The sealing structure of audio acquisition device according to claim 2, wherein said foam has at least one through hole, said through hole communicating with said first sound pickup hole.
5. The sealing structure of audio acquisition equipment according to claim 1, wherein said second sound-pickup hole includes an inner hole close to said dust-proof member and an outer hole communicating with the outside; the outer hole is obliquely arranged.
6. The audio capture device sealing structure of claim 5, wherein the central axis of the internal bore coincides with the central axis of the first sound pickup aperture.
7. The audio capture device sealing arrangement of claim 6, wherein the internal bore is the same size as the cross-sectional shape of the first pick-up hole.
8. The audio pickup device sealing structure according to claim 1, wherein a side of said dust-proof member remote from said circuit board is provided with an antistatic layer.
9. The audio capture device seal of claim 2, wherein the foam is circular, 0.3-0.5mm thick and 3-5mm in diameter.
10. An electronic device characterized by comprising the audio capturing device sealing structure of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922008073.6U CN210867806U (en) | 2019-11-19 | 2019-11-19 | Audio acquisition equipment seal structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922008073.6U CN210867806U (en) | 2019-11-19 | 2019-11-19 | Audio acquisition equipment seal structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210867806U true CN210867806U (en) | 2020-06-26 |
Family
ID=71285287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922008073.6U Active CN210867806U (en) | 2019-11-19 | 2019-11-19 | Audio acquisition equipment seal structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210867806U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036735A1 (en) * | 2020-08-19 | 2022-02-24 | 深圳市大十科技有限公司 | Wind noise prevention earphone device |
| CN114125098A (en) * | 2021-09-13 | 2022-03-01 | 荣耀终端有限公司 | Electronic equipment |
| CN114125611A (en) * | 2020-08-28 | 2022-03-01 | 阿里巴巴集团控股有限公司 | an electronic device |
| CN114268683A (en) * | 2021-12-29 | 2022-04-01 | 上海创功通讯技术有限公司 | Electronic equipment |
| CN115706745A (en) * | 2021-08-10 | 2023-02-17 | 北京小米移动软件有限公司 | Housing and electronic device |
-
2019
- 2019-11-19 CN CN201922008073.6U patent/CN210867806U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036735A1 (en) * | 2020-08-19 | 2022-02-24 | 深圳市大十科技有限公司 | Wind noise prevention earphone device |
| CN114125611A (en) * | 2020-08-28 | 2022-03-01 | 阿里巴巴集团控股有限公司 | an electronic device |
| CN115706745A (en) * | 2021-08-10 | 2023-02-17 | 北京小米移动软件有限公司 | Housing and electronic device |
| CN114125098A (en) * | 2021-09-13 | 2022-03-01 | 荣耀终端有限公司 | Electronic equipment |
| CN114268683A (en) * | 2021-12-29 | 2022-04-01 | 上海创功通讯技术有限公司 | Electronic equipment |
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