CN210817949U

CN210817949U - Laser processing apparatus

Info

Publication number: CN210817949U
Application number: CN201921286802.8U
Authority: CN
Inventors: 岳国汉
Original assignee: Shenzhen Muji Technology Co ltd
Current assignee: Shenzhen Muji Technology Co ltd
Priority date: 2019-08-08
Filing date: 2019-08-08
Publication date: 2020-06-23
Anticipated expiration: 2029-08-08

Abstract

The utility model discloses a laser processing device, which comprises a frame, a first horizontal moving mechanism, a rotating mechanism, a second horizontal moving mechanism, a lifting mechanism and a laser head; the first horizontal moving mechanism is arranged on the rack; the rotating mechanism is arranged on the first horizontal moving mechanism, and a clamp for clamping a workpiece is arranged on the rotating mechanism; the second horizontal moving mechanism is arranged on the rack, and the moving direction of the second horizontal moving mechanism and the moving direction of the first horizontal moving mechanism form an included angle; the lifting mechanism is arranged on the second horizontal moving mechanism; the laser head is arranged on the lifting mechanism, and laser is emitted by the laser head and contacts with a workpiece so as to process the workpiece. The utility model discloses technical scheme has just realized adjusting respectively of work piece and laser head through two modules for the mechanism of laser beam machining equipment is compact, has reduced first horizontal migration mechanism's removal stroke and second horizontal migration mechanism's removal stroke, has improved machining precision and machining efficiency.

Description

Laser processing apparatus

Technical Field

The utility model relates to a laser beam machining technical field, in particular to laser beam machining equipment.

Background

At present, in the machining and manufacturing industry, the laser processing technology is more and more widely applied. However, the X axis, the Y axis, the Z axis, the rotation axis, and the like of the conventional laser processing apparatus are all independently arranged, the structural volume of the whole machine is large, when a workpiece is processed, the whole machine needs to be operated, and the movement distance of each corresponding moving mechanism is large, which results in the problems of low processing precision and low processing efficiency of the workpiece.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a laser beam machining equipment aims at improving compact structure nature, reduces the machining precision and the low problem of machining efficiency that lead to because of the structure dispersion.

In order to achieve the above object, the present invention provides a laser processing apparatus, which comprises a frame, a first horizontal moving mechanism, a rotating mechanism, a second horizontal moving mechanism, a lifting mechanism and a laser head; the first horizontal moving mechanism is arranged on the rack; the rotating mechanism is arranged on the first horizontal moving mechanism, and a clamp for clamping a workpiece is arranged on the rotating mechanism; the second horizontal moving mechanism is arranged on the rack, and the moving direction of the second horizontal moving mechanism and the moving direction of the first horizontal moving mechanism form an included angle; the lifting mechanism is arranged on the second horizontal moving mechanism; the laser head is arranged on the lifting mechanism, and a laser emergent port of the laser head is arranged downwards and is higher than the rotating axis of the rotating mechanism; under a overlooking angle, the laser emitting port is positioned on one side of the rotation axis of the clamp; the laser is emitted by the laser head and contacts with the workpiece to process the workpiece.

In an embodiment of the present invention, the first horizontal moving mechanism includes a first fixed seat and a first moving member, and the first fixed seat is fixedly mounted on the frame; the first moving piece is slidably mounted on the first fixed seat; the rotating mechanism is mounted on the first moving part; the first fixed seat extends along a first direction, and the moving direction of the first moving part is consistent with the first direction.

In an embodiment of the present invention, the rotating mechanism is installed on the side wall of the first moving member, and the extending direction of the rotation axis of the rotating mechanism is perpendicular to the first direction.

In an embodiment of the present invention, the second horizontal moving mechanism includes a second fixed seat and a second moving member, and the second fixed seat is fixedly mounted on the frame; the second moving part is slidably mounted on the second fixed seat; the lifting mechanism is arranged on the second moving piece; the second fixed seat extends along a second direction, the moving direction of the second moving piece is consistent with the second direction, and the second direction and the first direction are arranged at an included angle.

In an embodiment of the present invention, the first direction is perpendicular to the second direction.

The utility model relates to an embodiment, elevating system installs on the lateral wall of second moving member, elevating system drives the laser head up-and-down motion.

The utility model discloses an in the embodiment, laser beam machining equipment is still including setting up last measuring transducer of elevating system, elevating system drives measuring transducer up-and-down motion.

The utility model discloses an in the embodiment, laser beam machining equipment is still including setting up last photoelectric sensor of elevating system, elevating system drives photoelectric sensor up-and-down motion.

The utility model discloses an in the embodiment, laser beam machining equipment is still including setting up image sensor on the elevating system, elevating system drives image sensor up-and-down motion.

The utility model discloses an in the embodiment, laser beam machining equipment still includes gaseous protection device, gaseous protection device includes air supply and gas-supply pipe, the one end intercommunication of gas-supply pipe the air supply, the other end is located the laser head, the gas outlet of gas-supply pipe is close to the setting of laser exit port.

In an embodiment of the present invention, the laser processing apparatus further includes a dust extraction assembly, the dust extraction assembly includes a material receiving box and a dust extraction channel, the material receiving box and the dust extraction channel are disposed on the frame, one end of the dust extraction channel is communicated with the material receiving box, and the other end of the dust extraction channel is connected with an external dust collector; the material receiving box is arranged below the corresponding workpiece.

In an embodiment of the present invention, the material receiving box is in a funnel-shaped configuration, and the opening of the material receiving box corresponds to the workpiece facing upward.

The utility model discloses technical scheme is through setting up rotary mechanism on first horizontal migration mechanism, set up elevating system on second horizontal migration mechanism, and be equipped with the anchor clamps that are used for the centre gripping work piece on this rotary mechanism, the last laser head that is equipped with of elevating system, make and just can drive the anchor clamps motion through first horizontal migration mechanism removal, and then can adjust the position and the operating condition of work piece, just can drive the elevating system motion through second horizontal migration mechanism, drive the laser head motion simultaneously, and then the operating position of adjustment laser head, just realize adjusting respectively to work piece and laser head through two modules in other words, make the mechanism of laser processing equipment compact, the removal stroke of first horizontal migration mechanism and the removal stroke of second horizontal migration mechanism have been reduced, machining precision and machining efficiency have been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the laser processing apparatus of the present invention;

fig. 2 is a schematic view of an assembly structure of the second horizontal moving mechanism, the lifting mechanism and the laser head in the embodiment of the present invention;

fig. 3 is an external view of an embodiment of the laser processing apparatus of the present invention;

fig. 4 is another external view of the embodiment of the laser processing apparatus of the present invention.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a laser processing equipment.

In the embodiment of the present invention, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the laser processing apparatus includes a frame 100, a first horizontal moving mechanism 200, a rotating mechanism 300, a second horizontal moving mechanism 400, a lifting mechanism 500 and a laser head 600; wherein, the first horizontal moving mechanism 200 is arranged on the frame 100, the rotating mechanism 300 is arranged on the first horizontal moving mechanism 200, and the rotating mechanism is provided with a clamp 310 for clamping a workpiece; the second horizontal moving mechanism 400 is disposed on the rack 100, and a moving direction of the second horizontal moving mechanism 400 forms an included angle with a moving direction of the first horizontal moving mechanism 200; the elevating mechanism 500 is provided on the second horizontal moving mechanism 400, and the laser head 600 is provided on the elevating mechanism 500; the laser emitting port (not shown) of the laser head 600 is disposed downward and higher than the rotation axis of the rotation mechanism 300; the laser exit port is located on one side of the rotational axis of the jig 310 in a top view; the laser light is emitted from the laser head 600 and contacts the workpiece to process the workpiece.

The first horizontal moving mechanism 200 is disposed on the rack 100, and the rotating mechanism 300 is disposed on the first horizontal moving mechanism 200, so that the first horizontal moving mechanism 200 can drive the rotating mechanism 300 to move together in the moving process, and the rotating mechanism 300 is provided with a clamp 310 for clamping a workpiece, so that the first horizontal moving mechanism 200 can drive the workpiece to move together until the position required by the workpiece processing. Second horizontal migration mechanism 400 sets up in frame 100, and elevating system 500 sets up on second horizontal migration mechanism 400, and laser head 600 sets up on elevating system 500 for second horizontal migration mechanism 400 can drive laser head 600 horizontal migration at the removal in-process, and elevating system 500 can drive laser head 600 up-and-down motion simultaneously, makes laser head 600 can adjust the position of laser emission according to actual need, and then carries out laser machining to the work piece on anchor clamps 310.

It can be understood that the first horizontal moving mechanism 200 is used for adjusting the processing position of the workpiece, the rotating mechanism 300 is used for adjusting the state of the workpiece during processing, and the rotating mechanism 300 is directly arranged on the first horizontal moving mechanism 200, so that the space for the movement of the workpiece is saved; the second horizontal moving mechanism 400 is used for adjusting the horizontal position of the laser head 600, the lifting mechanism 500 adjusts the upper position and the lower position of the laser head 600, meanwhile, because the lifting mechanism 500 is arranged on the second horizontal moving mechanism 400, the movement space of the laser head 600 is saved, in other words, the workpiece and the laser head 600 are respectively adjusted through two modules, the moving stroke of the first horizontal moving mechanism 200 and the moving stroke of the second horizontal moving mechanism 200 are reduced, and the processing precision and the processing efficiency are improved.

The laser processing equipment has compact structure, and can be specially used for processing workpieces with small volume or high hardness, such as polymeric diamond, high-hardness steel and other materials.

In practical applications, the material of the frame 100 may be a steel structure with high strength to have sufficient supporting strength for each component. The rack 100 preferably has a frame structure having three directions of a longitudinal direction, a width direction, and a height direction perpendicular to each other, and the three directions corresponding to the longitudinal direction, the width direction, and the height direction of the rack 100 are defined as an X-axis direction, a Y-axis direction, and a Z-axis direction, respectively. The moving direction of the first horizontal moving mechanism 200 and the moving direction of the second horizontal moving mechanism 400 are set to form an included angle, and the size of the included angle can be determined according to the actual situation, in this embodiment, the included angle can be set to correspond to the Y-axis direction and the X-axis direction, and the lifting mechanism 500 is set to correspond to the Z-axis direction. The bottom of the frame 100 is provided with casters 800 to facilitate movement of the entire machine.

The technical proposal of the utility model is that the rotating mechanism 300 is arranged on the first horizontal moving mechanism 200, the lifting mechanism 500 is arranged on the second horizontal moving mechanism 400, and the rotating mechanism 300 is provided with a clamp 310 for clamping a workpiece, the elevating mechanism 500 is provided with a laser head 600, so that the clamp 310 can be moved by the movement of the first horizontal moving mechanism 200, thereby being capable of adjusting the position and the working state of the workpiece, driving the lifting mechanism 500 to move and driving the laser head 600 to move through the second horizontal moving mechanism 400, further adjusting the working position of the laser head 600, namely realizing the respective adjustment of the workpiece and the laser head 600 through two modules, the mechanism of the laser processing equipment is compact, the moving stroke of the first horizontal moving mechanism 200 and the moving stroke of the second horizontal moving mechanism 200 are reduced, and the processing precision and the processing efficiency are improved.

Further, referring to fig. 1 and 2, the first horizontal moving mechanism 200 includes a first fixed seat 210 and a first moving member 220, the first fixed seat 210 is mounted on the frame 100; the first moving member 220 is slidably mounted on the first fixed base 210; the rotating mechanism 300 is mounted on the first moving member 220; the first fixed base 210 extends along a first direction, and the moving direction of the first moving member 220 is the same as the first direction. The first fixed seat 210 is installed on the frame 100 and extends along the first direction, and the moving direction of the first moving member 220 is consistent with the first direction, so that the first moving member 200 is more stable in the moving process, the rotating mechanism 300 is more stable in movement, and further the movement of the workpiece on the clamp 310 is more stable. It is understood that the first direction is actually a Y-axis direction, and the first moving member 200 moves in the Y-axis direction.

In practical applications, the first horizontal moving mechanism 200 may adopt a motor-driven screw combination. The fixture 310 in the rotating mechanism 300 can be an automatic fixture or a manual fixture, and during the process of processing the workpiece, the rotating mechanism 300 can drive the workpiece to be in a 360-degree continuous rotation state or in an overturning processing state, so that the front side can be processed first and the back side can be processed after overturning, and the processing efficiency can be improved.

In an embodiment of the present invention, please refer to fig. 1 and fig. 2, the rotating mechanism 300 is installed on a side wall of the first moving member 220, and an extending direction of a rotation axis of the rotating mechanism 300 is perpendicular to the first direction. The rotating mechanism 300 is installed on the sidewall of the first moving part 220, so that the rotating mechanism 300 does not interfere with the first moving part 220 in the process of driving the workpiece to rotate. The extending direction of the rotation axis of the rotating mechanism 300 is perpendicular to the first direction, which is the Y-axis direction, and the axial direction of the rotating mechanism 300 is parallel to the X-axis, so that the rotation axis of the workpiece clamped by the clamp 310 is parallel to the X-axis.

Further, referring to fig. 1 and fig. 2, the second horizontal moving mechanism 400 includes a second fixed seat 410 and a second moving member 420, wherein the second fixed seat 410 is fixedly mounted on the frame 100; the second moving part 420 is slidably mounted on the second fixed base 410; the lifting mechanism 500 is installed on the second moving member 420; the second fixed base 410 extends along a second direction, and a moving direction of the second moving member 420 is the same as the second direction, and the second direction forms an included angle with the first direction. The second fixing seat 410 is disposed on the machine frame 100, the second fixing seat 410 extends along the second direction, and the second moving member 420 moves along the second direction, so that the second moving member 420 is more stable in the moving process, the lifting mechanism 500 moves more stably in the horizontal direction, and the laser head 600 moves more stably in the horizontal direction. The second direction is the contained angle setting with the first direction for the motion of work piece on the horizontal direction can have the nodical with the motion of laser head 600 on the horizontal direction, makes laser head 600 can process the work piece smoothly.

In an embodiment of the present invention, the first direction is perpendicular to the second direction. At this time, the moving direction of the second moving member 420 moves in the X-axis direction, and the first moving member 220 moves in the Y-axis direction, so as to realize the movement on the water surface.

Further, referring to fig. 1 and 2, the lifting mechanism 500 is mounted on a sidewall of the second moving member 420, and the lifting mechanism 500 drives the laser head 600 to move up and down. Elevating system 500 sets up on the lateral wall of second moving member 420, and laser head 600 sets up on elevating system 500, and laser head 600 can not take place to interfere with second moving member 420 in the motion process, and this laser head 600 sets up in one side of second moving member 420 towards the work piece for laser head 600 can process the work piece smoothly. The movement direction of the lifting mechanism 500 is the Z-axis direction, and the laser head 600 is driven to move up and down according to actual needs so as to be adjusted to a corresponding position.

In an embodiment of the present invention, please refer to fig. 2, the laser processing apparatus further includes a measuring sensor a00 disposed on the lifting mechanism 500, and the lifting mechanism 500 drives the measuring sensor a00 to move up and down. The measuring sensor A00 moves together with the laser head 600, and the measuring sensor A00 automatically measures the thickness of the workpiece or the surface flatness of the workpiece and other parameters when the laser head 600 processes the workpiece, so as to reduce the probability of manual error.

In an embodiment of the present invention, referring to fig. 2, the laser processing apparatus further includes a photo sensor B00 disposed on the lifting mechanism 500, and the lifting mechanism 500 drives the photo sensor B00 to move up and down. The photoelectric sensor B00 moves together with the laser head 600, and when the laser head 600 processes the workpiece, the photoelectric sensor B00 automatically identifies the material composition of the surface layer of the workpiece, so that the front and back of the workpiece are automatically detected, the workpiece is prevented from being placed backwards, the loss is reduced, and the processing efficiency is improved.

In an embodiment of the present invention, referring to fig. 2, the laser processing apparatus further includes an image sensor C00 disposed on the lifting mechanism 500, and the lifting mechanism 500 drives the image sensor C00 to move up and down. The main function of the image sensor C00 is to implement an automatic positioning cutting function.

Further, this laser processing equipment still includes gas protection device (not marked in the figure), and this gas protection device includes air supply and gas-supply pipe, and the one end intercommunication air supply of this gas-supply pipe, laser head 600 are located to the other end, and the gas outlet of this gas-supply pipe is close to the laser exit port and sets up. The laser head 600 and the workpiece are protected by arranging the gas protection device in the laser processing equipment, inert gases such as nitrogen and argon can be used in the gas protection device, the inert gases can be used for cooling a lens in laser, and the condition that the surface of the workpiece is oxidized due to high temperature in laser processing can be prevented. Simultaneously, the work piece can produce a lot of sweeps and dust at the in-process of being processed, blows to the work piece through the gas-supply pipe to blow away sweeps and dust on the work piece, prevent that sweeps and dust from hiding the grooving.

Further, referring to fig. 1, the laser processing apparatus further includes a dust extraction assembly 700, the dust extraction assembly 700 includes a material receiving box 710 and a dust extraction channel 720, which are disposed on the frame 100, one end of the dust extraction channel 720 is communicated with the material receiving box 710, and the other end is connected with an external dust collector; the material receiving box 710 is disposed below the workpiece. In the process of processing the workpiece, the air pipe blows air to the workpiece, scraps and dust on the workpiece are blown down into the material receiving box 710, then dust is pumped out through an external dust collector, and the scraps and dust falling into the material receiving box 710 are sucked into the dust collector through the dust pumping channel 720.

In an embodiment of the present application, referring to fig. 1, the material receiving box 710 is disposed in a funnel shape, an upper opening of the material receiving box 710 is disposed upward corresponding to a workpiece, and a filter screen 711 is disposed at a lower opening of the material receiving box 710. The funnel-shaped material receiving box 710 has a large upper opening, so that waste chips and dust can be collected in a larger range; the filter screen 711 is arranged at the lower opening to prevent the workpiece from falling into the dust extraction channel 720 in the dust extraction process. Meanwhile, when the workpiece is machined, the clamp 310 can be directly opened, so that the workpiece falls onto the filter screen 711 of the material receiving box 710, and the workpiece is convenient for a worker to take.

In an embodiment of the present application, referring to fig. 3 and fig. 4, the laser processing apparatus further includes a housing 900, and the housing 900 is disposed outside the rack 100 and the first horizontal moving mechanism 200, the rotating mechanism 300, the second horizontal moving mechanism 400, the lifting mechanism 500, the laser head 600, and the dust extraction assembly 700 disposed on the rack 100, so as to protect components in the laser processing apparatus.

In the practical application process, since the dust pumping assembly 700 pumps dust by pumping air outwards for the waste dust and the dust, in order to prevent the inside of the casing 900 from being vacuumized, the air inlet mesh 910 is disposed on the sidewall of the casing 900, so that air can enter and external impurities can be prevented from entering the casing of the machine.

In an embodiment of the present application, referring to fig. 3 and fig. 4, the laser processing apparatus further includes a console 920, and the console 920 is disposed outside the housing 900 and electrically connected to each component in the housing 900, so that a worker can control each component in the machine through the console 920, and further can control the operation of processing the workpiece by using the laser.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A laser machining apparatus, characterized by comprising:

a frame;

the first horizontal moving mechanism is arranged on the rack;

the rotating mechanism is arranged on the first horizontal moving mechanism, and a clamp used for clamping a workpiece is arranged on the rotating mechanism;

the second horizontal moving mechanism is arranged on the rack, and the moving direction of the second horizontal moving mechanism and the moving direction of the first horizontal moving mechanism form an included angle;

the lifting mechanism is arranged on the second horizontal moving mechanism; and

the laser head is arranged on the lifting mechanism, and a laser emergent port of the laser head is arranged downwards and is higher than the rotation axis of the rotating mechanism; under a overlooking angle, the laser emitting port is positioned on one side of the rotation axis of the clamp; the laser is emitted by the laser head and contacts with the workpiece to process the workpiece.

2. The laser processing apparatus according to claim 1, wherein the first horizontal movement mechanism includes a first fixed base and a first moving member, the first fixed base being fixedly mounted on the frame; the first moving piece is slidably mounted on the first fixed seat; the rotating mechanism is mounted on the first moving part; the first fixed seat extends along a first direction, and the moving direction of the first moving part is consistent with the first direction.

3. The laser processing apparatus according to claim 2, wherein the rotating mechanism is mounted on a side wall of the first moving member, and an axis of rotation of the rotating mechanism extends in a direction perpendicular to the first direction.

4. The laser processing apparatus according to claim 2, wherein the second horizontal movement mechanism includes a second fixed base and a second moving member, the second fixed base being fixedly mounted on the machine frame; the second moving part is slidably mounted on the second fixed seat; the lifting mechanism is arranged on the second moving piece; the second fixed seat extends along a second direction, the moving direction of the second moving piece is consistent with the second direction, and the second direction and the first direction are arranged at an included angle.

5. The laser machining apparatus according to claim 4, wherein the first direction is arranged perpendicular to the second direction.

6. The laser processing apparatus of claim 4, wherein the elevating mechanism is mounted on a side wall of the second moving member, and the elevating mechanism moves the laser head up and down.

7. The laser processing apparatus according to any one of claims 1 to 6, further comprising a measuring sensor provided on the elevating mechanism, the elevating mechanism driving the measuring sensor to move up and down;

and/or the laser processing equipment further comprises a photoelectric sensor arranged on the lifting mechanism, and the lifting mechanism drives the photoelectric sensor to move up and down;

and/or the laser processing equipment further comprises an image sensor arranged on the lifting mechanism, and the lifting mechanism drives the image sensor to move up and down.

8. The laser processing equipment as claimed in any one of claims 1 to 6, further comprising a gas protection device, wherein the gas protection device comprises a gas source and a gas pipe, one end of the gas pipe is communicated with the gas source, the other end of the gas pipe is arranged at the laser head, and a gas outlet of the gas pipe is arranged adjacent to the laser exit port.

9. The laser processing device as claimed in claim 7, wherein the laser processing device further comprises a dust extraction assembly, the dust extraction assembly comprises a material receiving box arranged on the frame and a dust extraction channel, one end of the dust extraction channel is communicated with the material receiving box, and the other end of the dust extraction channel is connected with an external dust collector; the material receiving box is arranged below the corresponding workpiece.

10. The laser processing apparatus of claim 9, wherein the material receiving box is arranged in a funnel shape, and an opening of the material receiving box is arranged upward corresponding to the workpiece.