CN210773284U - Drying system for manufacturing semiconductor chip - Google Patents
Drying system for manufacturing semiconductor chip Download PDFInfo
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- CN210773284U CN210773284U CN201921823640.7U CN201921823640U CN210773284U CN 210773284 U CN210773284 U CN 210773284U CN 201921823640 U CN201921823640 U CN 201921823640U CN 210773284 U CN210773284 U CN 210773284U
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- 238000001035 drying Methods 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 20
- 230000000670 limiting effect Effects 0.000 claims description 19
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 101100520231 Caenorhabditis elegans plc-3 gene Proteins 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
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- 239000003381 stabilizer Substances 0.000 description 1
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Abstract
The utility model discloses a drying system for semiconductor chip manufacture, which comprises a box body, a feeding unit, a turning unit and a drying unit, wherein the lower surface of the box body is fixedly connected with four symmetrically distributed support legs, the rear end of the left side surface of the box body is fixedly connected with a support plate, the right side of the rear side plate of the box body is fixedly connected with two transmission motors, the tail ends of the output shafts of the transmission motors are fixedly connected with driving wheels, the left side of the rear side plate of the box body is fixedly connected with driven wheels through rotating shafts, the driven wheels are arranged corresponding to the driving wheels, the driven wheels are connected with the corresponding driving wheels through transmission of conveyor belts, the running directions of the two conveyor belts are opposite, the conveyor belts are metal mesh belts, the right end of the bottom of the box body is provided with an air inlet hole, the inside of the, the uniformity of chip drying is guaranteed, and the drying effect and speed are improved.
Description
Technical Field
The utility model relates to a chip stoving technical field specifically is a drying system of semiconductor chip preparation.
Background
A semiconductor chip is a semiconductor device which is etched and wired on a semiconductor sheet to realize a certain function, the semiconductor chip is an important electronic product in the electronic industry, the final process of the semiconductor chip production is electroplating, namely a conductive layer is electroplated on the outer surface of the chip, the chip is required to be cleaned after electroplating to wash off electroplating liquid on the surface of the chip, moisture on the surface of the chip is dried after cleaning, and pins are welded on the chip after drying, wherein the drying process is particularly important because if moisture remains on the surface of the chip, the chip is short-circuited and burnt in the using process, and equipment connected with the chip is burnt, so that the equipment investment cost is not safe, the equipment investment cost is increased, the existing drying system only can dry the upper surface of the semiconductor chip, and the moisture is easy to gather because the lower surface is contacted with a bearing mechanism, the drying effect is good, potential safety hazards exist, and therefore the drying system for manufacturing the semiconductor chip is provided for solving the defects.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a drying system of semiconductor chip preparation, can overturn the stoving to the chip, avoid the lower extreme of chip moisture to appear remaining, guarantee the homogeneity of chip stoving, improved the effect and the speed of stoving, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a drying system for manufacturing semiconductor chips comprises a box body, a feeding unit, a turning unit and a drying unit;
a box body: the lower surface of the box body is fixedly connected with four symmetrically distributed support legs, the rear end of the left side surface of the box body is fixedly connected with a support plate, the right side of the rear side plate of the box body is fixedly connected with two transmission motors, the tail end of an output shaft of each transmission motor is fixedly connected with a driving wheel, the left side of the rear side plate of the box body is fixedly connected with a driven wheel through a rotating shaft, the driven wheel is arranged corresponding to the driving wheel, the driven wheel is in transmission connection with the corresponding driving wheel through a transmission belt, the running directions of the two transmission belts are opposite, the transmission belts are metal mesh belts, the right end of the bottom of the box body is provided;
a feeding unit: the feeding unit is arranged on the front side surface of the supporting plate and corresponds to the conveying belt at the upper end;
a turning unit: the overturning unit is arranged in the right side plate of the box body and corresponds to the conveying belt at the upper end;
a drying unit: the drying unit is arranged at the upper end of the box body;
wherein: the feeding device is characterized by further comprising a discharging plate and a PLC (programmable logic controller), wherein the discharging plate is fixedly connected to the front side face of the supporting plate through a pin shaft, the discharging plate penetrates through a discharging hole formed in the lower end of the left side plate of the box body, the discharging plate is arranged corresponding to a conveyor belt at the lower end, the PLC is fixedly connected to the right side face of the box body, the input end of the PLC is electrically connected with an external power supply, the output end of the PLC is electrically connected with the input end of a transmission motor, the feeding motor works to drive a cam to rotate, the cam rotates to drive the feeding plate to continuously shake, so that chips on the upper surface of the feeding plate uniformly fall onto the upper surface of a water absorption pad, the upper water absorption pad moves at a constant speed under the driving of the corresponding conveyor belt, the chips are dried under the irradiation of the infrared heating pipes, the chips fall downwards when moving to the right end of the, the chip that is dried is carried to the box outside through going out the flitch, and the air that stoving in-process draught fan work made the box outside gets into the box after the filter screen filters, and the air is outside through draught fan discharge box after the box internal recycle flows, and the drying system of this semiconductor chip preparation can overturn the stoving to the chip, avoids the lower extreme of chip moisture to appear remaining, guarantees the homogeneity of chip stoving, has improved the effect and the speed of stoving.
Further, the feeding unit comprises a feeding plate, a pin shaft, a cam, a feeding motor and a limiting block, the pin shaft, the feeding motor and the limiting block are all fixedly connected to the upper end of the front side surface of the supporting plate, the left end of the feeding plate is rotationally connected with the outer cambered surface of the pin shaft, the limiting block is fixedly connected with the right end of the front side surface of the supporting plate and is positioned at the lower end of the pin shaft, the upper surface of the limiting block is contacted with the lower surface of the feeding plate, the right end of the feeding plate passes through the feeding hole of the left side plate of the box body, the right end of the feeding plate is arranged corresponding to the upper end of the conveying belt, the feeding motor is positioned at the lower end of the feeding plate, the cam is fixedly connected with the tail end of an output shaft of the feeding motor, the cam is arranged corresponding to the feeding plate, the input end of the feeding motor is electrically connected with the output end of the PLC controller, and the feeding speed is controlled, so that the chips can be uniformly scattered on the outer surface of the upper end of the water absorption pad.
Further, the upset unit includes linear bearing, dabber, spring and striker plate, linear bearing fixed connection is inside the right side inboard of box, dabber and linear bearing's inside sliding connection, the upper end fixed connection of striker plate and dabber, the one end of spring and linear bearing's last fixed surface are connected, the other end of spring and the outer cambered surface fixed connection of striker plate, the spring is located the outside of dabber, the striker plate corresponds the setting with the conveyer belt right side of upper end, the bottom of striker plate corresponds the setting with the conveyer belt upper surface of lower extreme, makes the chip reversal, improves the degree of consistency of drying.
Further, the stoving unit includes infrared heating pipe and draught fan, infrared heating pipe evenly sets up in the inside trailing flank of box, infrared heating pipe sets up respectively in the conveyer belt top that corresponds, draught fan fixed connection is in the left air outlet department of box roof, the output of PLC controller is connected to the equal electricity of input of infrared heating pipe and draught fan, adopts infrared radiation's mode to dry, avoids appearing the dead angle, has improved the comprehensiveness of drying for drying efficiency.
Furthermore, still include the pad that absorbs water, the pad that absorbs water sets up respectively in the conveyer belt lateral surface that corresponds, gets rid of the moisture on chip surface, prevents to leave the water mark after the stoving and influences chip surface quality.
Compared with the prior art, the beneficial effects of the utility model are that: this drying system of semiconductor chip preparation has following benefit:
the feed motor works to drive the cam to rotate, the cam rotates to drive the feed plate to shake continuously, chips on the upper surface of the feed plate uniformly fall on the upper surface of the water absorption pad, the upper water absorption pad moves at a constant speed under the drive of the corresponding conveyor belt, the chips are dried under the irradiation of the infrared heating pipe, the chips fall downwards when moving to the right end of the box body, overturn under the limiting action of the baffle plate, the upper surface of the water absorption pad falling below is dried again, the dried chips are conveyed to the outside of the box body through the discharge plate, the air outside the box body enters the box body after being filtered by the filter screen by the draught fan in the drying process, the air is discharged out of the box body through the draught fan after circularly flowing in the box body, the drying system for manufacturing the semiconductor chips can overturn and dry the chips, the moisture residue at the lower ends of the chips is avoided, and the drying uniformity of, the drying effect and speed are improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: the device comprises a box body 1, support legs 2, a PLC 3, a support plate 4, a transmission motor 5, a conveyor belt 6, a feeding unit 7, a feeding plate 71, a pin shaft 72, a cam 73, a feeding motor 74, a limiting block 75, a turnover unit 8, a linear bearing 81, a mandrel 82, a spring 83, a material baffle 84, a drying unit 9, an infrared heating pipe 91, an induced draft fan 92, an air inlet 10, a filter screen 11, a discharge plate 12, a water absorption pad 13, a driving wheel 14 and a driven wheel 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a drying system for manufacturing semiconductor chips comprises a box body 1, a feeding unit 7, a turnover unit 8 and a drying unit 9;
a box body 1: stabilizer blade 2 of four symmetric distributions of lower fixed surface of box 1, box 1's left surface rear end fixedly connected with backup pad 4, the fixed right side fixedly connected with drive motor 5 of box 1 posterior lateral plate, drive motor 5 has two, drive motor 5's the terminal fixedly connected with action wheel 14 of output shaft, box 1 posterior lateral plate left side is from driving wheel 15 through pivot fixedly connected with, from driving wheel 15 and action wheel 14 corresponding setting, from driving wheel 15 and the action wheel 14 transmission that corresponds pass through conveyer belt 6 and be connected, two conveyer belts 6 traffic direction are opposite, conveyer belt 6 is the metal mesh belt, box 1's bottom right-hand member is provided with fresh air inlet 10, the inside fixedly connected with filter screen 11 of fresh air inlet 10.
A feeding unit 7: the feeding unit 7 comprises a feeding plate 71, a pin shaft 72, a cam 73, a feeding motor 74 and a limiting block 75, wherein the pin shaft 72, the feeding motor 74 and the limiting block 75 are fixedly connected to the upper end of the front side surface of the supporting plate 4, the left end of the feeding plate 71 is rotatably connected with the outer arc surface of the pin shaft 72, the limiting block 75 is fixedly connected to the right end of the front side surface of the supporting plate 4, the limiting block 75 is positioned at the lower end of the pin shaft 72, the upper surface of the limiting block 75 is contacted with the lower surface of the feeding plate 71, the limiting block 75 plays a supporting role on the feeding plate 71 to prevent the right end of the feeding plate 71 from being contacted with the water absorption pad 13 at the upper end, the right end of the feeding plate 71 passes through a feeding hole in the left side plate of the box body 1, the right end of the feeding plate 71 is arranged corresponding to the conveyor, the input end of the feeding motor 74 is electrically connected with the output end of the PLC 3, the feeding motor 74 works to drive the cam 73 to rotate, the cam 73 rotates to drive the feeding plate 71 to shake continuously, so that chips on the upper surface of the feeding plate 71 uniformly fall onto the upper surface of the water absorption pad 13, and the chips can be uniformly scattered on the outer surface of the upper end of the water absorption pad 13.
The overturning unit 8: the overturning unit 8 comprises a linear bearing 81, a mandrel 82, a spring 83 and a baffle plate 84, the linear bearing 81 is fixedly connected to the inside of the right side plate of the box body 1, the mandrel 82 is connected with the linear bearing 81 in a sliding mode, the baffle plate 84 is fixedly connected with the upper end of the mandrel 82, one end of the spring 83 is fixedly connected with the upper surface of the linear bearing 81, the other end of the spring 83 is fixedly connected with the outer arc surface of the baffle plate 84, the spring 83 is located outside the mandrel 82, the baffle plate 84 is correspondingly arranged on the right side of the conveying belt 6 at the upper end, the bottom of the baffle plate 84 is correspondingly arranged on the upper surface of the conveying belt 6 at the lower end, a chip drops downwards when moving to the right end of the box body 1, the chip overturns under the limiting effect of the baffle plate 84, the upper.
The drying unit 9: drying unit 9 includes infrared heating pipe 91 and draught fan 92, infrared heating pipe 91 evenly sets up in the inside trailing flank of box 1, infrared heating pipe 91 sets up respectively in the 6 tops of conveyer belt that correspond, draught fan 92 fixed connection is in the left air outlet department of box 1 roof, the output of PLC controller 3 is connected to the equal electricity of input of infrared heating pipe 91 and draught fan 92, adopt infrared radiation's mode to dry, avoid appearing the dead angle, the comprehensiveness of drying has been improved, drying efficiency has been accelerated.
Wherein: still including the pad 13 that absorbs water, the pad 13 that absorbs water sets up respectively in the conveyer belt 6 lateral surface that corresponds, gets rid of the moisture on chip surface, prevents to leave the water mark after the stoving and influences chip surface quality.
Wherein: still include ejection of compact board 12 and PLC controller 3, ejection of compact board 12 is through round pin axle fixed connection in the leading flank of backup pad 4, ejection of compact board 12 passes the discharge opening that 1 left side board lower extreme of box set up, ejection of compact board 12 corresponds the setting with conveyer belt 6 of lower extreme, 3 fixed connection of PLC controller is in the right flank of box 1, external power source is connected to PLC controller 3's input electricity, the input of driving motor 5 is connected to PLC controller 3's output electricity.
When in use: the work of feeding motor 74 drives the cam 73 rotatory, the rotation of cam 73 drives the continuous shake of feed plate 71, make the even chip that drops on the upper surface of feed plate 71 absorb water and fill up 13 upper surface above, the pad 13 that absorbs water of top is at the uniform motion under the drive of corresponding conveyer belt 6, make the chip dry under infrared heating pipe 91's irradiation, the chip drops downwards when removing the box 1 right-hand member, the upset is down under striker plate 84's limiting action, the pad 13 upper surface that absorbs water that drops below dries once more, the chip that is dried is carried to the box 1 outside through ejection of compact board 12, the work of stoving in-process draught fan 92 makes the outside air of box 1 get into box 1 after filter screen 11 filters, the air is outside box 1 through draught fan 92 discharge after box 1 internal circulation flows, the homogeneity of the inside temperature of box 1 has been guaranteed.
It should be noted that the specific model of the PLC controller 3 disclosed in this embodiment is siemens S7-200, the transmission motor 5, the feeding motor 74, the infrared heating pipe 91, and the induced draft fan 92 may be freely configured according to practical application scenarios, the transmission motor 5 is proposed to use a B2 coaxial deceleration brushless motor manufactured by guangdong-dongyang intelligent equipment manufacturing limited, the infrared heating pipe 91 is proposed to use a short-wave single-hole half-plated white heating pipe manufactured by shanghai gedon lighting appliances limited, and the PLC controller 3 controls the transmission motor 5, the feeding motor 74, the infrared heating pipe 91, and the induced draft fan 92 to work by a method commonly used in the prior art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a drying system of semiconductor chip preparation which characterized in that: comprises a box body (1), a feeding unit (7), a turning unit (8) and a drying unit (9);
case (1): the lower surface of the box body (1) is fixedly connected with four symmetrically distributed support legs (2), the rear end of the left side surface of the box body (1) is fixedly connected with a supporting plate (4), the right side of the rear side plate of the box body (1) is fixedly connected with a transmission motor (5), the number of the transmission motors (5) is two, the tail end of an output shaft of each transmission motor (5) is fixedly connected with a driving wheel (14), a driven wheel (15) is fixedly connected with the left side of the rear side plate of the box body (1) through a rotating shaft, the driven wheels (15) are arranged corresponding to the driving wheels (14), the driven wheels (15) are in transmission connection with the corresponding driving wheels (14) through the conveyor belts (6), the running directions of the two conveyor belts (6) are opposite, the conveying belt (6) is a metal mesh belt, an air inlet hole (10) is formed in the right end of the bottom of the box body (1), and a filter screen (11) is fixedly connected inside the air inlet hole (10);
a feeding unit (7): the feeding unit (7) is arranged on the front side surface of the supporting plate (4), and the feeding unit (7) is arranged corresponding to the conveying belt (6) at the upper end;
a flipping unit (8): the overturning unit (8) is arranged inside a right side plate of the box body (1), and the overturning unit (8) is arranged corresponding to the conveyor belt (6) at the upper end;
drying unit (9): the drying unit (9) is arranged at the upper end of the box body (1);
wherein: still include ejection of compact board (12) and PLC controller (3), ejection of compact board (12) are through round pin axle fixed connection in the leading flank of backup pad (4), ejection of compact board (12) pass the discharge opening that box (1) left side board lower extreme set up, ejection of compact board (12) correspond the setting with conveyer belt (6) of lower extreme, PLC controller (3) fixed connection is in the right flank of box (1), external power source is connected to the input electricity of PLC controller (3), the input of driving motor (5) is connected to the output electricity of PLC controller (3).
2. The drying system for manufacturing semiconductor chips according to claim 1, wherein: the feeding unit (7) comprises a feeding plate (71), a pin shaft (72), a cam (73), a feeding motor (74) and a limiting block (75), the pin shaft (72), the feeding motor (74) and the limiting block (75) are fixedly connected to the upper end of the front side face of the supporting plate (4), the left end of the feeding plate (71) is rotatably connected with the outer arc face of the pin shaft (72), the limiting block (75) is fixedly connected to the right end of the front side face of the supporting plate (4), the limiting block (75) is located at the lower end of the pin shaft (72), the upper surface of the limiting block (75) is in contact with the lower surface of the feeding plate (71), the right end of the feeding plate (71) penetrates through a feeding hole in the left side plate of the box body (1), the right end of the feeding plate (71) is arranged corresponding to the conveyor belt (6) at the upper end, the feeding motor (74) is located at the lower end of the feeding plate (71), the cam (73, the cam (73) is arranged corresponding to the feeding plate (71), and the input end of the feeding motor (74) is electrically connected with the output end of the PLC (3).
3. The drying system for manufacturing semiconductor chips according to claim 1, wherein: upset unit (8) include linear bearing (81), dabber (82), spring (83) and striker plate (84), linear bearing (81) fixed connection is inside the right side inboard of box (1), the inside sliding connection of dabber (82) and linear bearing (81), striker plate (84) and the upper end fixed connection of dabber (82), the one end of spring (83) and the last fixed surface of linear bearing (81) are connected, the other end of spring (83) and the extrados fixed connection of striker plate (84), spring (83) are located the outside of dabber (82), striker plate (84) correspond the setting with conveyer belt (6) right side of upper end, the bottom of striker plate (84) corresponds the setting with conveyer belt (6) upper surface of lower extreme.
4. The drying system for manufacturing semiconductor chips according to claim 1, wherein: drying unit (9) include infrared heating pipe (91) and draught fan (92), infrared heating pipe (91) evenly set up in the inside trailing flank of box (1), infrared heating pipe (91) set up respectively in conveyer belt (6) top that corresponds, draught fan (92) fixed connection is in the left air outlet department of box (1) roof, the output of PLC controller (3) is connected to the equal electricity of input of infrared heating pipe (91) and draught fan (92).
5. The drying system for manufacturing semiconductor chips according to claim 1, wherein: the conveying belt is characterized by further comprising water absorption pads (13), wherein the water absorption pads (13) are arranged on the outer side faces of the corresponding conveying belts (6) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921823640.7U CN210773284U (en) | 2019-10-28 | 2019-10-28 | Drying system for manufacturing semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921823640.7U CN210773284U (en) | 2019-10-28 | 2019-10-28 | Drying system for manufacturing semiconductor chip |
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| Publication Number | Publication Date |
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| CN210773284U true CN210773284U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921823640.7U Expired - Fee Related CN210773284U (en) | 2019-10-28 | 2019-10-28 | Drying system for manufacturing semiconductor chip |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111755364A (en) * | 2020-08-13 | 2020-10-09 | 抚州华成半导体科技有限公司 | Semiconductor diode production equipment |
| CN112495851A (en) * | 2020-10-28 | 2021-03-16 | 蒙城县佰世达木业有限公司 | Processing equipment of fiberboard |
| CN112820674A (en) * | 2021-02-26 | 2021-05-18 | 昆山基侑电子科技有限公司 | Semiconductor chip washs drying machine |
| CN113349265A (en) * | 2020-09-29 | 2021-09-07 | 湖南省沅陵碣滩茶业有限公司 | Drying and shrink-proof device for formed tea leaves with multiple shapes |
| CN114289453A (en) * | 2022-01-12 | 2022-04-08 | 安徽省锦荣新材料科技有限公司 | Solid renewable resource processing equipment |
| CN116850693A (en) * | 2023-07-17 | 2023-10-10 | 鼎信阳光环境技术有限公司 | Sewage treatment pool and sewage treatment system |
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2019
- 2019-10-28 CN CN201921823640.7U patent/CN210773284U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111755364A (en) * | 2020-08-13 | 2020-10-09 | 抚州华成半导体科技有限公司 | Semiconductor diode production equipment |
| CN113349265A (en) * | 2020-09-29 | 2021-09-07 | 湖南省沅陵碣滩茶业有限公司 | Drying and shrink-proof device for formed tea leaves with multiple shapes |
| CN112495851A (en) * | 2020-10-28 | 2021-03-16 | 蒙城县佰世达木业有限公司 | Processing equipment of fiberboard |
| CN112495851B (en) * | 2020-10-28 | 2023-10-20 | 蒙城县佰世达木业有限公司 | Fiberboard processing equipment |
| CN112820674A (en) * | 2021-02-26 | 2021-05-18 | 昆山基侑电子科技有限公司 | Semiconductor chip washs drying machine |
| CN112820674B (en) * | 2021-02-26 | 2024-08-06 | 昆山基侑电子科技有限公司 | Semiconductor chip washs stoving all-in-one |
| CN114289453A (en) * | 2022-01-12 | 2022-04-08 | 安徽省锦荣新材料科技有限公司 | Solid renewable resource processing equipment |
| CN114289453B (en) * | 2022-01-12 | 2023-09-01 | 安徽省锦荣新材料科技有限公司 | Solid renewable resource processing equipment |
| CN116850693A (en) * | 2023-07-17 | 2023-10-10 | 鼎信阳光环境技术有限公司 | Sewage treatment pool and sewage treatment system |
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Granted publication date: 20200616 |