CN210745827U - Electromagnetic heater power supply capable of isolating and radiating - Google Patents
Electromagnetic heater power supply capable of isolating and radiating Download PDFInfo
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- CN210745827U CN210745827U CN201921267427.2U CN201921267427U CN210745827U CN 210745827 U CN210745827 U CN 210745827U CN 201921267427 U CN201921267427 U CN 201921267427U CN 210745827 U CN210745827 U CN 210745827U
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Abstract
The utility model discloses an electromagnetic heater power supply capable of isolating and radiating, which comprises a circuit board and a radiator, wherein the circuit board is electrically connected with pins of high-heating components, the radiator is provided with a radiating part and a heat collecting part, the head of the high-heating components is fixedly connected with the heat collecting part of the radiator in a heat conducting way, and the circuit board is positioned in a sealed chamber; the head of the high-heat-generation component extends out of the sealing chamber in a sealing mode, the heat dissipation part and the heat collection part of the radiator are located outside the sealing chamber, or the head of the high-heat-generation component is located in the sealing chamber, the heat collection part of the radiator extends into the sealing chamber in a sealing mode, and the heat dissipation part of the radiator is located outside the sealing chamber. The electromagnetic heater power supply capable of isolating and radiating can normally work for a long time under the severe environment condition, the circuit board cannot fall on dust, and the circuit board cannot be burnt out due to the dust-affected short circuit.
Description
Technical Field
The invention relates to a power supply, in particular to an electromagnetic heater power supply capable of isolating and radiating.
Background
The electromagnetic heater power supply is the indispensable power supply equipment of the electromagnetic heater. Since the applicant filed a patent No. ZL201410053724.2 entitled "a handheld electromagnetic heater" with the chinese patent office on 17.02/2014, the present applicant has been dedicated to the development and research of a handheld electromagnetic heater and an electromagnetic heater power supply. As shown in fig. 1, the initial electromagnetic heater power supply includes a case 4, the case 4 integrally forms a heat dissipation chamber 5, a circuit board 1 is arranged in the heat dissipation chamber 5, a heat sink 2 is fixed on the circuit board, the heat sink 2 is an aluminum heat sink, the heat dissipation chamber 5 is provided with a vent, the circuit board 1 is designed according to the stable standard voltage of the mains supply, and the produced product is popular and popular with users. However, during use, the user also finds some problems and feeds back to the applicant. Among them, there are three main technical problems. First, after a period of use, the circuit board in the electromagnetic heater power supply is suddenly burned out at startup, which seriously affects the performance of the welding work. After a user sends a burnt-out power supply of the electromagnetic heater, the applicant opens the case of the power supply of the electromagnetic heater to find that a plurality of dry dust is accumulated on the circuit board, the dry dust is generally non-conductive theoretically, and if the circuit board is burnt out due to the conduction of the dry dust, the circuit board in the power supply of the electromagnetic heater is easier to burn out in the use process of the electromagnetic heater. The applicant cleans the dry dust of the power supply cabinet of the electromagnetic heater, and tests show that the power supply of the electromagnetic heater is intact as before after a new circuit board is replaced. The applicant determines to bring tools and accessories, even an electromagnetic heater power supply as an emergency to directly drive a vehicle to a construction site of the user to come to the construction site, the environment of the construction site is very bad, the construction site is a tunnel, dust in the tunnel is everywhere, and air in the tunnel is humid. The applicant gives the power supply of the electromagnetic heater to a user, so that the user can continue welding work, and a case of the damaged power supply of the electromagnetic heater is opened, and surprisingly discovers that a circuit board is full of a lot of dry dust, and the dust is slightly damp when the user touches the circuit board, so that the user can further know the situation, and can know that all tools and equipment are all left in a tunnel after the user receives the work at night, and the power supply of the electromagnetic heater cannot be used when the electromagnetic heater is powered on and started up in the morning. At this time, the applicant thinks suddenly and insightfully through serious thinking, and the circuit board of the original electromagnetic heater power supply is burnt just by the damp dust. At that time, no method is available for preventing dust from entering the chassis, and the dry dust in the electromagnetic heater power chassis can only be cleaned up as before, and a new circuit board is replaced for the user to continue using. The second technical problem is that the power supply of the electromagnetic heater is damaged due to the ultra-undervoltage. The electromagnetic heater power supply brought by the applicant is burnt out during the emergency use of the user on the same day. The investigation shows that the electromagnetic heater power supply is burnt out for three reasons. 1. The plug is damaged. Because the power plug of the electromagnetic heater is only 1.8 meters long, the power plug can not be plugged into a socket of a distribution box in a working position. Therefore, the power strip needs to be connected, meanwhile, as electricians make more electric equipment use the same power strip for convenience, more 30-ampere four-jack power strips are mostly used, only the wiring of the electric equipment in a plug is changed, when 220-volt electric equipment is only connected with one zero line and any one live line, if an electric welding machine plug is only connected with any two live lines, if three water pumps or other three electric equipment are connected with three live lines and one zero line as protection lines, most remote tunnel construction sites use a three-phase four-wire system, and electricians do not wish to use a three-phase five-wire system for saving trouble. Because the four-eye socket is made of bakelite, the socket is not only brittle but also heavy, and is easy to collide and damage when being taken and moved, when the socket works, the problem that a user needs to find electricians to solve the problem needs to wait for a long time without pulling wires, the wire ends are easy to pull out of the socket, or the socket is full of plugs, or the wires close to the plug are broken by collision, and the problem that the user wants to solve the problem needs to wait for a long time, and the user does not want to wait for the problem and mostly solves the problem by himself because the user does not know the common knowledge of electricity consumption, so that the user can connect the socket, and the user does not have tools, and often bites the wire ends by matching with mouths, hooks two wires on two fuses of three switch blades or plugs into two live wire holes of the four-eye socket, so that the electricity consumption is 380V, and the machine can be burnt out directly. 2. The zero point drifts. The zero drift is still unknown to the average electrician, since it is not visible in the urban environment. It is known that a combination of one live and one neutral is 220 volts, and that a combination of two sets of one live and one neutral is also 220 volts, and that the neutral is still 220 volts when the two sets are connected. When the load is the same, for example, when two lamps connected with 100 watts are connected, after the zero line is removed, the voltage is changed from 220 volts to 190 volts, the lamps are simultaneously dark, and at the moment, one lamp is connected in parallel to one side of the lamps, the two lamps connected in parallel to the side are very dark, the lamp connected to the other side which is not connected in parallel is very bright, and the zero drift is caused. The electric leakage of a water pump at a construction site causes an electric shock accident of workers at the construction site which is three kilometers away. Because the construction environment is severe at a plurality of places in the tunnel, the zero line in the midway is easily broken, and the zero drift of the equipment in front of which the construction is in progress is caused to damage the equipment. 3. Line pressure drop. The length of the electric wire of the socket is usually 10 to 25 meters. Because the power of the climbing welder and the power of the angle grinder are only hundreds of watts in the traditional process, the diameter of a wire distributed by the power socket is only 1.5 square millimeters to 2.5 square millimeters, the electromagnetic heater is a 3500 watt novel product, although a cable with the diameter of more than 4 square millimeters is emphasized in a use specification, the wire is still ignored by a plurality of workers, and because the working time of the electromagnetic heater is two to three seconds each time and is paused for one to two minutes each time, the high temperature of a line cannot be caused even if the line is overloaded, the wire cannot be noticed, but the working voltage drop of each time is particularly large, the voltage before the gun is 230 volts, the voltage after the gun is paused is 150 volts, and the large voltage drop can bring great damage to various components. Simultaneously, the transformer in tunnel is installed outside the entrance to a cave, and the tunnel is the tunnelling that does not stop, and the wire diameter that follows also can not satisfy big consumer to and the cable that removes the electronic box adapted receives often convenient removal restriction, and the line diameter is little, and when using same circuit with big consumer, especially the electric welding works at same circuit, and this electromagnetic heater will receive other consumer pressure drop influences. The above three reasons all cause damage to components in the electromagnetic heater power supply, and especially cause great damage to the insulated gate bipolar transistor (i.e. IGPT) in the electromagnetic heater power supply, and the insulated gate bipolar transistor (i.e. IGPT) is very expensive. Due to the lack of the employee on the knowledge of electricity, the 220V electromagnetic heater power supply is connected to two live wires of a 380V four-wire three-phase knife switch, so that the accident that the electromagnetic heater power supply is damaged immediately occurs. In addition, the line voltage drop also has a large influence on the electromagnetic heater power supply. The third technical problem is that the heat dissipation effect of the aluminum radiator is not ideal. The applicant has searched many patent documents, books, magazines, etc. in order to solve the first technical problem, has not searched related technical contents, and can only rely on the applicant himself without existing technologies. Such as: the circuit board and the radiator are sealed in the case, so that dust can not come in, but the radiator can not play a role in heat dissipation in the sealed case, and finally, the circuit board can be burnt out by heat generated by components. For another example: the circuit board is sealed in the case, the radiator is arranged outside the case, and the experiment proves that the radiating effect is not obvious. Subsequently, the applicant invests a lot of manpower, material resources and financial resources and repeatedly researches and practices for a long time, and finally solves the first technical problem. Likewise, in order to solve the second technical problem, the applicant has also experienced several failures. Subsequently, the applicant invested a lot of manpower, material resources and financial resources and repeatedly studied and practiced for a long time, and finally solved the second technical problem. When the applicant solves the third technical problem, the heat radiator made of pure copper materials is adopted, the heat radiation effect is ideal, however, the manufacturing cost is high, and the technical scheme is not paid. The third technical problem is finally solved through long-time repeated research and practice.
Disclosure of Invention
The invention aims to solve the technical problem of providing an electromagnetic heater power supply capable of isolating and radiating, which can normally work for a long time under the severe environment condition, and a circuit board cannot fall dust or be burnt out due to the short circuit caused by the dust when being affected with damp.
In order to solve the technical problems, the invention provides an electromagnetic heater power supply capable of isolating and radiating heat, which comprises a circuit board and a radiator, wherein the circuit board is electrically connected with pins of high-heating elements, the radiator is provided with a heat radiating part and a heat collecting part, the head of the high-heating element is fixedly connected with the heat collecting part of the radiator in a heat conducting manner, and the circuit board is positioned in a sealed chamber; the head of the high-heat-generation component extends out of the sealing chamber in a sealing mode, the heat dissipation part and the heat collection part of the radiator are located outside the sealing chamber, or the head of the high-heat-generation component is located in the sealing chamber, the heat collection part of the radiator extends into the sealing chamber in a sealing mode, and the heat dissipation part of the radiator is located outside the sealing chamber.
The high-heating component is an insulated gate bipolar transistor and/or a rectifier bridge.
A plurality of low-heat-generating components are distributed on the circuit board.
The low-heating components are capacitors, inductors, resistors and integrated circuit chips.
The sealing chamber is positioned at the upper part in the machine case.
The lower part in the case is a heat dissipation chamber. Or,
the sealing chamber is positioned at the lower part in the machine case.
The upper part in the case is a heat dissipation chamber.
The sealed chamber is composed of a plurality of panels;
at least one of the plurality of panels is a removable panel;
the detachable surface is connected with other panels connected with the detachable surface in a sealing way through sealing strips;
the plurality of panels comprises a plurality of panels of the case, one panel of the sealing partition plate and one panel of the case cover;
the removable panel is a panel of the case lid;
the number of the box covers is two;
the cross section of the sealing strip is rectangular, circular or elliptical;
the sealing strip is a solid sealing strip or a hollow sealing strip;
the whole shape of the sealing strip is in a shape like a Chinese character 'kou', a shape like a Chinese character 'ri' with at least one lower transverse part, or a shape like a Chinese character 'ri' with at least one upper transverse part;
the sealing strip is provided with screw through holes (screw assembling holes) along the length direction;
the sealing strip is made of silica gel, foamed silica gel, rubber, foamed plastic, fiber cloth, cotton cloth, green shell paper, asbestos paper or insulating paper;
the heat dissipation part of the radiator is positioned in the heat dissipation chamber.
The heat dissipation chamber and the sealing chamber are separated by a sealing partition plate.
The sealing partition plate is made of a metal plate or a plastic plate or an epoxy resin plate or an bakelite plate.
The sealing partition plate is provided with a pin perforation.
And the pins of the high-heat-generation components penetrate through the pin through holes of the sealing partition plate in an insulating and sealing manner to be electrically connected with the circuit board.
And the pins of the high-heating element are sleeved with insulating heat-shrinkable tubes.
And the insulating heat-shrinkable tube is hermetically connected with the pin through hole of the sealing partition plate through electronic sealant.
Or,
the sealing partition plate is provided with a heat dissipation port.
The shape of the heat dissipation opening is rectangular, circular or elliptical.
The upper edge of the heat dissipation opening is connected with the lower surface of the circuit board in a sealing mode through a sealing piece.
The seal is annular in shape.
The shape of the sealing element is a rectangular ring or a circular ring or an oval ring.
The sealing member and the lower surface of the circuit board enclose a heat collecting area.
And the heat collection part of the radiator penetrates through the heat dissipation port to enter the heat collection area.
And the heat collecting part of the radiator is fixedly connected with the circuit board in an insulating way.
Or,
the circuit board is provided with a through hole at the heat collecting area.
And the heat collecting part of the radiator penetrates through the through hole.
The side surface of the heat collecting part of the radiator is hermetically connected with the through hole through electronic glue.
And a heat-conducting insulating sheet is attached to the heat collecting area below the circuit board, or insulating paint is coated below the circuit board in a soaking mode.
The circuit board comprises a variable frequency power amplification circuit board, an ultra-undervoltage protection circuit board, a power supply and relay combined circuit board, a control circuit board and a power supply circuit board.
The frequency conversion power amplification circuit board, the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board are electrically connected through interfaces.
The frequency conversion power amplification circuit board is close to the sealing partition plate.
The ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board are positioned above the variable frequency power amplification circuit board.
The frequency conversion power amplification circuit board is fixedly connected with the ultra-undervoltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board in an insulation mode through support columns.
The upper cavities and the lower cavities of the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board form a circulating air duct.
And at least one circulating fan is arranged on the circulating air channel.
The circulating fan is provided with one.
One of the circulation fans is located at a rear upper portion of the hermetic chamber.
The high heating element is divided into a plurality of parts.
And the high-heating components are electrically connected with the variable-frequency power amplification circuit board.
And the tube heads of the high-heat-generating components are positioned on the circuit board. Or,
and the tube heads of the high-heat-generating components are positioned below the circuit board.
And the tube heads of the high-heating components are far away from the board surface of the circuit board. Or,
and the tube heads of the high-heating components are close to the board surface of the circuit board.
And a plurality of pipe heads of the high-heating components are horizontally arranged. Or,
and a plurality of high-heating element parts are vertically arranged.
And the tube head of the high-heating element is fixedly connected with the side surface of the heat collection part of the radiator in a heat conduction manner. Or,
and the tube head of the high-heating element is fixedly connected with the upper surface of the heat collecting part of the radiator in a heat conducting manner.
The radiator is made of aluminum materials and/or copper materials. Or,
the heat sink is a phase change heat sink.
The phase change radiator is an aluminum shell phase change radiator, a copper shell phase change radiator or a heat conduction silica gel shell phase change radiator.
The heat dissipation part is made of aluminum.
The heat dissipation portion includes a heat dissipation plate and a plurality of heat dissipation fins.
The plurality of radiating fins are distributed on one surface or two surfaces of the radiating plate.
The heat collecting part is made of a copper plate.
The copper plate is a copper plate.
The heat collecting part is fixedly connected with one surface or one part of one surface of the heat radiating plate through a first fixing screw.
And heat-conducting silicone grease is coated between the heat collecting part and the heat dissipation plate.
The edge or the middle part of the heat collecting part extends upwards to form an extended heat collecting part.
The radiator is provided with a plurality of radiators.
And the radiators are fixed together through a connecting plate and a second fixing screw.
An air inlet is arranged at the lower part of the back of the case.
The lower part of the front of the case is provided with an air outlet.
At least one cooling fan is arranged between the air inlet hole and the radiator.
The number of the cooling fans is two.
And a gap is reserved between the cooling fan and the air inlet hole.
The clearance between the cooling fan and the air inlet hole is larger than or equal to 5 mm.
The upper portion in the front of the machine case is provided with a power switch, a working state indicator lamp, a time relay, a voltmeter, an ammeter, a potentiometer and an ultra-low voltage state indicator lamp.
The number of the working state indicating lamps is four.
The four working state indicating lamps are a temperature protection indicating lamp, a chip power supply indicating lamp, a program locking indicating lamp and a working instruction indicating lamp.
The number of the ultra-low voltage state indicator lamps is four.
The four ultra-low voltage state indicator lamps are an input power indicator lamp, a low voltage indicator lamp, an overvoltage indicator lamp and an output power indicator lamp.
The ultra-undervoltage protection circuit board is provided with an ultra-undervoltage protection circuit board. Or,
the ultra-undervoltage protection circuit board is provided with two sub ultra-undervoltage protection circuit boards.
And one ultra-low voltage protection circuit board is provided with an ultra-low voltage protection circuit. Or,
one ultra-undervoltage protection circuit board is provided with two sub ultra-undervoltage protection circuits.
And the two sub ultra-undervoltage protection circuit boards are provided with sub ultra-undervoltage protection circuits.
One of the ultra-low voltage protection circuits is a high-voltage ultra-low voltage protection circuit or a low-voltage ultra-low voltage protection circuit or a high-voltage ultra-low voltage protection circuit.
One of the two sub-ultra-undervoltage protection circuits is a high-voltage ultra-undervoltage protection circuit, and the other one is a low-voltage ultra-undervoltage protection circuit.
The sub-ultra-undervoltage protection circuit of one of the two sub-ultra-undervoltage protection circuit boards is a high-voltage ultra-undervoltage protection circuit, and the sub-ultra-undervoltage protection circuit of the other sub-ultra-undervoltage protection circuit board is a low-voltage ultra-undervoltage protection circuit.
The ultra-low voltage protection circuit comprises a rectifying circuit.
The input end of the rectifying circuit is electrically connected with the output end of an external power supply.
The output end of the rectification circuit is electrically connected with the input end of the voltage stabilizing circuit.
The first output end of the voltage stabilizing circuit is electrically connected with the first input end of the comparison circuit.
And the second input end of the comparison circuit is electrically connected with the output end of the AC/DC sampling circuit.
And the third input end of the comparison circuit is electrically connected with the output end of the reference circuit.
The input end of the reference circuit is electrically connected with the second output end of the voltage stabilizing circuit.
The output end of the comparison circuit is electrically connected with the first input end of the driving circuit.
And the second input end of the driving circuit is electrically connected with the output end of the delay circuit.
The output end of the driving circuit is electrically connected with the input end of the execution circuit.
And the execution circuit of the high-voltage and low-voltage ultra-low-voltage protection circuit is divided into a high-voltage execution circuit and a low-voltage execution circuit.
The output end of the driving circuit is divided into a first output end and a second output end.
The first output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit.
The main circuit executive component in the high-voltage executive circuit is a small relay or an intermediate relay or a contactor.
And the second output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit.
And the control direct-current circuit execution element in the low-voltage execution circuit is a small PNP triode, a small NPN triode, a low-power thyristor, a low-power insulated gate type field effect transistor or a normally-closed micro-relay.
The normally closed micro relay is a normally closed reed switch relay or a normally closed small high-frequency relay.
The execution circuit of the high-voltage ultra-low-voltage protection circuit is a high-voltage execution circuit.
The output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit.
The main circuit executive component in the high-voltage executive circuit is an alternating current solid-state relay or an electromagnetic relay.
The alternating current solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor.
The execution circuit of the low-voltage ultra-low-voltage protection circuit is a low-voltage execution circuit.
The output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit.
And the control direct-current circuit execution element in the low-voltage execution circuit is a direct-current solid-state relay, a small PNP triode, a small NPN triode, a low-power thyristor, a low-power insulated gate field effect transistor or an optocoupler switch element.
The input end of the AC/DC sampling circuit is electrically connected with the output end of an external power supply.
The output end of the external power supply is electrically connected with the power supply input end of the binding post through the control output end of the high-voltage execution circuit.
And a leakage switch, an ammeter, a voltmeter, a fuse and a power switch are electrically connected between the control output end of the high-voltage execution circuit and the power input end of the binding post.
And the first power output end of the binding post is electrically connected with the power input end of the variable-frequency power amplification circuit board.
And the power supply output end of the variable-frequency power amplification circuit board is electrically connected with the electromagnetic heater gun head.
And the second power output end of the binding post is respectively and electrically connected with the power input end of the power supply and relay combined circuit board, the power input end of the time relay and the power input end of the power supply circuit board.
And the power supply and relay combined circuit board is electrically connected with an inner fan of the gun head of the electromagnetic heater.
And the power supply and relay combined circuit board is electrically connected with an electromagnetic heater switch.
The power supply circuit board is electrically connected with two cooling fans and a circulating fan.
And the third power output end of the binding post is electrically connected with the power input end of the ultra-low voltage protection circuit board.
And the control output end of the low-voltage execution circuit of the ultra-low-voltage protection circuit board is electrically connected with the control input end of the control circuit board.
And the power input end of the control circuit board is electrically connected with the power output end of the power circuit board.
And the frequency conversion signal output end of the control circuit board is electrically connected with the frequency conversion signal input end of the frequency conversion power amplification circuit board.
And the current feedback input end of the control circuit board is electrically connected with the current feedback output end of the variable-frequency power amplification circuit board.
The control circuit board is electrically connected with a working state indicator light and a potentiometer.
And the ultra-low voltage protection circuit board is electrically connected with an ultra-low voltage state indicator lamp.
And the control output end of a low-voltage execution circuit of the ultra-low-voltage protection circuit board is electrically connected with the control input end of the control circuit board through the time relay and the power supply and relay combined circuit board.
The ultra-low voltage protection circuit board is a naked plate-shaped structure to form a basically plate-shaped ultra-low voltage protector; or,
the ultra-low voltage protection circuit board is packaged by a shell to form an ultra-low voltage protector which is basically cuboid or cube;
the basically plate-shaped ultra-under-voltage protector is arranged in the sealing chamber;
the ultra-low voltage protector which is basically cuboid or cube is arranged on the wall of the case;
the wall of the case is the outer side or the inner side of the front wall of the case; or,
the wall of the case is the outer side or the inner side of the rear wall of the case.
Compared with the prior art, the electromagnetic heater power supply capable of isolating and radiating has the following beneficial effects.
1. In the technical scheme, the circuit board is positioned in the sealing chamber; the head of the high-heating element extends out of the sealing chamber in a sealing mode, the heat dissipation part and the heat collection part of the radiator are located outside the sealing chamber, or the head of the high-heating element is located in the sealing chamber, the heat collection part of the radiator extends into the sealing chamber in a sealing mode, and the heat dissipation part of the radiator is located outside the sealing chamber.
2. In the technical scheme, the high-heating component is an insulated gate bipolar transistor and/or a rectifier bridge; a plurality of low-heating components are distributed on the circuit board; the low-heating components are capacitors, inductors, resistors and integrated circuit chips, so that the components generating 90% of heat can be subjected to key heat dissipation, and the heat dissipation efficiency is greatly improved.
3. In the technical scheme, the sealing chamber is positioned at the upper part in the case; the lower part in the case is a heat dissipation chamber; or the sealing chamber is positioned at the lower part in the case; the upper part in the case is a heat dissipation chamber; the sealed chamber is composed of a plurality of panels; at least one of the plurality of panels is a removable panel; the detachable surface is connected with other panels connected with the detachable surface in a sealing way through sealing strips; the plurality of panels comprises a plurality of panels of the case, one panel of the sealing partition plate and one panel of the case cover; the removable panel is a panel of the case lid; the number of the box covers is two; the cross section of the sealing strip is rectangular, circular or elliptical; the sealing strip is a solid sealing strip or a hollow sealing strip; the whole shape of the sealing strip is in a shape like a Chinese character 'kou', a shape like a Chinese character 'ri' with at least one lower transverse part, or a shape like a Chinese character 'ri' with at least one upper transverse part; the sealing strip is provided with screw through holes (screw assembling holes) along the length direction; the sealing strip is made of silica gel or foamed silica gel or rubber or foamed plastic or fiber cloth or cotton cloth or blue shell paper or asbestos paper or insulating paper, so that the sealing strip is not only beneficial to sealing, but also beneficial to heat dissipation.
4. In the technical scheme, the heat dissipation part of the radiator is positioned in the heat dissipation chamber; the heat dissipation chamber and the sealing chamber are separated by a sealing partition plate; the sealing partition plate is made of a metal plate or a plastic plate or an epoxy resin plate or an bakelite plate; the sealing partition plate is provided with a pin through hole; the pin of the high-heat-generation component penetrates through the pin through hole of the sealing partition plate in an insulating and sealing manner to be electrically connected with the circuit board; an insulating heat-shrinkable tube is sleeved on the pin of the high-heating element; the insulating heat shrinkable tube is connected with the pin through hole of the sealing partition plate in a sealing manner through electronic sealant (the sealing performance is further improved); or the sealing clapboard is provided with a heat dissipation port; the shape of the heat dissipation opening is rectangular, circular or elliptical; the upper edge of the heat dissipation opening is connected with the lower surface of the circuit board in a sealing mode through a sealing piece; the seal is annular in shape; the shape of the sealing element is a rectangular ring, a circular ring or an elliptical ring; the sealing element and the lower surface of the circuit board enclose a heat collecting area; the heat collecting part of the radiator penetrates through the heat radiating port to enter the heat collecting area; the heat collecting part of the radiator is fixedly connected with the circuit board in an insulating way (the heat in the sealing chamber is favorably discharged out of the sealing chamber); or the circuit board is provided with a through hole at the heat collecting area; the heat collecting part of the radiator penetrates through the through hole; the side surface of the heat collecting part of the radiator is hermetically connected with the through hole through electronic glue; a heat-conducting insulating sheet is attached to the position, located at the heat collecting area, below the circuit board, or insulating paint is coated below the circuit board in an immersing mode (the technical means is favorable for further discharging heat in the sealing chamber out of the sealing chamber), so that various electromagnetic heater power supplies capable of isolating and radiating can be produced according to the requirements of different users.
5. The technical scheme adopts the circuit board to comprise a variable frequency power amplification circuit board, an ultra-low voltage protection circuit board, a power supply and relay combined circuit board, a control circuit board and a power supply circuit board; the frequency conversion power amplification circuit board, the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board are electrically connected through interfaces; the variable frequency power amplification circuit board is close to the sealing partition plate; the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board are positioned above the variable frequency power amplification circuit board; the variable-frequency power amplification circuit board is fixedly connected with the ultra-low-voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board in an insulation manner through support columns; the upper cavities and the lower cavities of the four circuit boards, namely the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board form a circulating air duct; the circulating air duct is provided with at least one circulating fan; one of the circulating fans; and one circulating fan is positioned at the rear upper part of the sealed chamber, so that the heat dissipation of the sealed chamber is facilitated.
6. The technical proposal adopts a plurality of high-heating components; the high-heating components are electrically connected with the variable-frequency power amplification circuit board; the tube heads of the high-heating components are positioned on the circuit board; or the tube heads of the high-heat-generating components are positioned below the circuit board; the tube heads of the high-heating components are far away from the board surface of the circuit board; or the tube heads of the high-heat-generation components are close to the board surface of the circuit board; the tube heads of the high-heating components are arranged horizontally; or the tube heads of the high-heating components are vertically arranged; the tube head of the high-heating element is fixedly connected with the side surface of the heat collecting part of the radiator in a heat conducting manner; or the tube head of the high-heating component is fixedly connected with the upper surface of the heat collecting part of the radiator in a heat conducting way, so that various electromagnetic heater power supplies capable of isolating and radiating heat can be produced according to actual conditions.
7. The technical proposal adopts the radiator made of aluminum material and/or copper material (which is beneficial to producing the radiator with high-efficiency heat radiation with lower cost); alternatively, the heat sink is a phase change heat sink; the phase change radiator is an aluminum shell phase change radiator, a copper shell phase change radiator or a heat conduction silica gel shell phase change radiator, so that heat can be radiated in various modes.
8. The technical proposal adopts the heat dissipation part made of aluminum material; the heat dissipation part comprises a heat dissipation plate and a plurality of heat dissipation plates; the plurality of radiating fins are distributed on one surface or two surfaces of the radiating plate; the heat collecting part is made of a copper plate; the copper plate is a red copper plate; the heat collection part is fixedly connected with one surface or one part of one surface of the heat dissipation plate through a first fixing screw; heat-conducting silicone grease is coated between the heat collecting part and the heat dissipation plate; the edge or the middle part of the heat collecting part extends upwards to form an extended heat collecting part; the number of the radiators is multiple; the plurality of radiators are fixed together by the connecting plate and the second fixing screws, so that the high-heat-generating components can be radiated.
9. In the technical scheme, the lower part of the back of the case is provided with an air inlet; the lower part of the front of the case is provided with an air outlet; at least one cooling fan is arranged between the air inlet and the radiator; the number of the cooling fans is two; a gap is reserved between the cooling fan and the air inlet; the technical means that the clearance between the cooling fan and the air inlet hole is larger than or equal to 5mm, so that the heat dissipation efficiency can be greatly improved.
10. According to the technical scheme, the technical means that the power switch, the working state indicator lamp, the time relay, the voltmeter, the ammeter, the potentiometer and the ultra-low voltage state indicator lamp are arranged on the upper front part of the case are adopted, so that the observation and the operation of the electromagnetic heater power supply are facilitated.
11. The technical scheme is that the ultra-undervoltage protection circuit board is provided with an ultra-undervoltage protection circuit board; or the ultra-undervoltage protection circuit board is provided with two sub ultra-undervoltage protection circuit boards; one ultra-undervoltage protection circuit board is provided with an ultra-undervoltage protection circuit; or, one of the ultra-low voltage protection circuit boards is provided with two sub ultra-low voltage protection circuits; the two sub ultra-undervoltage protection circuit boards are respectively provided with a sub ultra-undervoltage protection circuit; one ultra-low voltage protection circuit is a high-voltage ultra-low voltage protection circuit or a low-voltage ultra-low voltage protection circuit or a high-voltage ultra-low voltage protection circuit; one of the two sub-ultra-undervoltage protection circuits is a high-voltage ultra-undervoltage protection circuit, and the other one is a low-voltage ultra-undervoltage protection circuit; the sub-ultra-undervoltage protection circuit of one of the two sub-ultra-undervoltage protection circuit boards is a high-voltage ultra-undervoltage protection circuit, and the sub-ultra-undervoltage protection circuit of the other sub-ultra-undervoltage protection circuit board is a technical means of a low-voltage ultra-undervoltage protection circuit, so that when the power supply voltage of the electromagnetic heater power supply is too high or too low, the power supply can be quickly cut off, and an insulated gate bipolar transistor (namely IGPT) is prevented from being burnt out.
12. The technical scheme adopts the technical scheme that the ultra-low voltage protection circuit comprises a rectification circuit; the input end of the rectifying circuit is electrically connected with the output end of an external power supply; the output end of the rectification circuit is electrically connected with the input end of the voltage stabilizing circuit; the first output end of the voltage stabilizing circuit is electrically connected with the first input end of the comparison circuit; the second input end of the comparison circuit is electrically connected with the output end of the AC/DC sampling circuit; the third input end of the comparison circuit is electrically connected with the output end of the reference circuit; the input end of the reference circuit is electrically connected with the second output end of the voltage stabilizing circuit; the output end of the comparison circuit is electrically connected with the first input end of the driving circuit; the second input end of the driving circuit is electrically connected with the output end of the delay circuit; the output end of the driving circuit is electrically connected with the input end of the execution circuit, so that the insulated gate bipolar transistor (i.e. IGPT) can be prevented from being burnt out, and the power supply of the electromagnetic heater can be automatically supplied when the voltage is normal.
13. In the technical scheme, the execution circuit adopting the high-low voltage ultra-low voltage protection circuit is divided into a high-voltage execution circuit and a low-voltage execution circuit; the output end of the driving circuit is divided into a first output end and a second output end; the first output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit; the main circuit executive component in the high-voltage executive circuit is a miniature relay or an intermediate relay or a contactor; the second output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit; the control direct current circuit execution element in the low-voltage execution circuit is a small PNP triode or a small NPN triode or a small power thyristor or a small power insulated gate type field effect transistor or a normally closed micro-relay; the normally closed micro relay is a normally closed reed switch relay or a normally closed small high-frequency relay; therefore, the transistor output can be used for controlling the control circuit, and the electromagnetic relay is used for controlling the main circuit. The control circuit has fast response time and belongs to nanosecond or microsecond level. The control circuit has no contact, no noise and no interference. The transistor element and device for the control circuit has low circuit power and low manufacturing cost. The electromagnetic relay is used for controlling the main circuit to be in a millisecond level. The electromagnetic relay is used for controlling the main circuit to be difficult to malfunction and has strong stability. The electromagnetic relay is used for controlling the main circuit to be in an off state without leakage current and temperature. The electromagnetic relay is used for controlling the main circuit to be in an on state and have no pressure drop, the heating value is small, heat dissipation is not needed, and the continuity is good. The control circuit cuts off the working signal to make the equipment in standby state, the electromagnetic relay has no current or very small current when the main circuit is cut off, the contact has no spark, and the contact of the electromagnetic relay is not easy to damage. The equipment is in a standby state firstly, and the equipment is not easy to damage when the electromagnetic relay disconnects the main circuit afterwards. The electromagnetic relay is used for controlling the main circuit load to be not divided into withstand voltage and alternating current and direct current. The electromagnetic relay is used for controlling a main circuit and belongs to an isolated component.
14. In the technical scheme, the execution circuit adopting the high-voltage ultra-low-voltage protection circuit is a high-voltage execution circuit; the output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit; the main circuit executive component in the high-voltage executive circuit is an alternating current solid-state relay or an electromagnetic relay; the alternating current solid state relay is a technical means of a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor, so that the response time is fast, and the response time of a commonly used silicon controlled rectifier (also called a thyristor) is 10 milliseconds. If an execution element composed of high-speed MOS or IGBT tubes is used, the nanosecond level to the microsecond level can be achieved. No contact, no noise and no interference. Belongs to an isolated component. However, solid-state relays are bulky and expensive. The on-state pressure drop is large, the heat generation amount is large, the load capacity is rapidly reduced, the pressure drop is large, and the continuity is poor. The temperature is raised by the off-state leakage current, and heat dissipation is required by a radiator. The load is divided into withstand voltage and alternating current and direct current. The output of the electromagnetic relay has no voltage drop. The continuity is good, the temperature rise is small, and heat dissipation is not needed. The price is low. Belongs to an isolated component. The load is not influenced by voltage, voltage and alternating current and direct current. No leakage current and no temperature in the off state. The on-state non-voltage drop heating value is small, heat dissipation is not needed, and the continuity is good. However, electromagnetic relays are slow in response time, normally 2 ms to 20 ms, in the order of ms, with larger heads being slower in response time. The contact is easy to spark, the contact is easy to spark when the working current of the contact is larger, and the service life of the contact is short. The contact is easy to spark when the working current of the contact is larger, and the contact is easy to adhere to the contact at high temperature to cause misoperation. The larger the working current of the contact is, the more easy the contact is to spark, the high temperature of the contact is easy to oxidize, and poor contact is caused. The larger the noise of the head.
15. In the technical scheme, the execution circuit adopting the low-voltage ultra-low-voltage protection circuit is a low-voltage execution circuit; the output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit; the control direct-current circuit execution element in the low-voltage execution circuit is a technical means of a direct-current solid-state relay, a small PNP triode, a small NPN triode, a small-power thyristor, a small-power insulated gate type field effect transistor or an optical coupling switch element, so that the response time of an amplification output type (also called as simplified solid-state relay output) such as an optical coupling isolation transistor or a field effect transistor is short, and the amplification output type (also called as simplified solid-state relay output) belongs to the nanosecond level and the microsecond level and depends on the element. No contact, no noise and no interference. The current can reach several amperes to ten amperes depending on the element, and compared with solid-state relay, the circuit is simple and cost is low. However, an amplified output load such as an opto-isolator transistor or a field effect transistor has a voltage division resistance and an alternating current and direct current division type. Compared with a solid-state relay, the circuit has poor stability and low output power and is limited to be used in occasions with low requirements and/or low power.
16. The technical scheme adopts the technical scheme that the input end of the AC/DC sampling circuit is electrically connected with the output end of an external power supply; the output end of the external power supply is electrically connected with the power supply input end of the binding post through the control output end of the high-voltage execution circuit; a leakage switch, an ammeter, a voltmeter, a fuse and a power switch are electrically connected between the control output end of the high-voltage execution circuit and the power input end of the binding post; the first power output end of the binding post is electrically connected with the power input end of the variable-frequency power amplification circuit board; the power supply output end of the variable-frequency power amplification circuit board is electrically connected with the gun head of the electromagnetic heater; the second power output end of the binding post is respectively and electrically connected with the power input end of the power supply and relay combined circuit board, the power input end of the time relay and the power input end of the power supply circuit board; the power supply and relay combined circuit board is electrically connected with an inner fan of the gun head of the electromagnetic heater; the power supply and relay combined circuit board is electrically connected with an electromagnetic heater switch; the power circuit board is electrically connected with two cooling fans and a circulating fan; the third power output end of the binding post is electrically connected with the power input end of the ultra-low voltage protection circuit board; the control output end of the low-voltage execution circuit of the ultra-low-voltage protection circuit board is electrically connected with the control input end of the control circuit board; the power supply input end of the control circuit board is electrically connected with the power supply output end of the power supply circuit board; the frequency conversion signal output end of the control circuit board is electrically connected with the frequency conversion signal input end of the frequency conversion power amplification circuit board; the current feedback input end of the control circuit board is electrically connected with the current feedback output end of the variable-frequency power amplification circuit board; the control circuit board is electrically connected with a working state indicator lamp and a potentiometer; the ultra-low voltage protection circuit board is electrically connected with an ultra-low voltage state indicator lamp; the control output end of the low-voltage execution circuit of the ultra-low-voltage protection circuit board is electrically connected with the control input end of the control circuit board through the time relay and the power supply and relay combination circuit board, so that the whole circuit of the electromagnetic heater power supply can be optimized, and the function of the electromagnetic heater power supply can be fully exerted.
17. According to the technical scheme, the ultra-low voltage protection circuit board is of a naked plate-shaped structure to form a basically plate-shaped ultra-low voltage protector (the manufacturing cost is favorably reduced, and the heat dissipation is favorably realized); or the ultra-low voltage protection circuit board is packaged by a shell to form a substantially cuboid or cubic ultra-low voltage protector (which is beneficial to flexible installation and convenient use); the basically plate-shaped ultra-under-voltage protector is arranged in the sealing chamber; the ultra-low voltage protector which is basically cuboid or cube is arranged on the wall of the case; the wall of the case is the outer side or the inner side of the front wall of the case; or the wall of the case is a technical means of the outer side surface or the inner side surface of the rear wall of the case, so that various electromagnetic heater power supplies can be manufactured according to the requirements and actual conditions of different customers.
Drawings
The invention provides an electromagnetic heater power supply capable of isolating heat dissipation, which is described in detail in the following with reference to the accompanying drawings and the detailed description.
Fig. 1 is a schematic front view of a power supply of an electromagnetic heater in the prior art.
Fig. 2 is a schematic perspective view of a first electromagnetic heater power supply according to the present invention.
Fig. 3 is a schematic front view of a power supply of a first electromagnetic heater according to the present invention.
Fig. 3A is a schematic diagram of a front view of a power supply of a second electromagnetic heater according to the present invention.
Fig. 3B is a schematic diagram of a third electromagnetic heater power supply according to the present invention.
Fig. 4 is a schematic front view of a first efficient heat-conducting heat sink in the power supply of the electromagnetic heater of the present invention.
Fig. 5 is a schematic right-view structural diagram of a first efficient heat-conducting heat sink in the power supply of the electromagnetic heater of the present invention.
Fig. 6 is a schematic bottom view of a first efficient heat-conducting heat sink in the power supply of the electromagnetic heater of the present invention.
Fig. 7 is a schematic structural diagram of a first arrangement of a second high-efficiency heat-conducting radiator IGBT in the electromagnetic heater power supply of the present invention.
Fig. 8 is a schematic structural diagram of a second arrangement of a second high-efficiency heat-conducting radiator IGBT in the electromagnetic heater power supply of the present invention.
Fig. 9 is a schematic structural diagram of a third arrangement of a second high-efficiency heat-conducting radiator IGBT in the electromagnetic heater power supply of the present invention.
Fig. 10 is a schematic structural diagram of a third efficient heat-conducting heat sink in the power supply of the electromagnetic heater of the present invention.
Fig. 11 is a schematic structural diagram of a fourth efficient heat-conducting heat sink in the power supply of the electromagnetic heater of the present invention.
Fig. 12 is a schematic view of a first connection structure among a heat sink, an IGBT, and a circuit board in the electromagnetic heater power supply of the present invention.
Fig. 13 is a schematic diagram of a second connection structure among the heat sink, the IGBT, and the circuit board in the electromagnetic heater power supply of the present invention.
FIG. 14 is a schematic diagram of a third connection structure among the heat sink, the IGBT, and the circuit board in the electromagnetic heater power supply of the present invention.
FIG. 15 is a schematic diagram of a fourth connection structure among the heat sink, the IGBT, and the circuit board in the electromagnetic heater power supply of the present invention.
Fig. 16 is a schematic diagram of a fifth connection structure among the heat sink, the IGBT, and the circuit board in the electromagnetic heater power supply of the present invention.
Fig. 17 is a schematic diagram of a sixth connection structure among the heat sink, the IGBT, and the circuit board in the electromagnetic heater power supply of the present invention.
FIG. 18 is a schematic diagram of a seventh connection structure among the heat sink, the IGBT, and the circuit board in the electromagnetic heater power supply of the present invention.
Fig. 19 is a schematic view of the electrical connection structure of the power supply of the electromagnetic heater of the present invention.
Fig. 20 is a schematic diagram of a first ultra-low voltage protection circuit in the electromagnetic heater power supply of the present invention.
Fig. 21 is a schematic diagram of a connection structure of a first ultra-low voltage protection circuit in the electromagnetic heater power supply of the invention.
Fig. 22 is a schematic diagram of a second ultra-low voltage protection circuit in the electromagnetic heater power supply of the present invention.
Fig. 23 is a schematic diagram of a second ultra-low voltage protection circuit in the electromagnetic heater power supply of the present invention.
FIG. 24 is a schematic diagram of a third ultra-low voltage protection circuit in the power supply of the electromagnetic heater of the present invention.
Fig. 25 is a schematic diagram of a connection structure of a third ultra-low voltage protection circuit in the power supply of the electromagnetic heater of the invention.
Fig. 26 is a schematic diagram of a fourth ultra-undervoltage protection circuit in the electromagnetic heater power supply of the present invention.
Fig. 27 is a schematic diagram of a connection structure of a fourth ultra-low voltage protection circuit in the power supply of the electromagnetic heater of the invention.
Fig. 28 is a schematic diagram of a fifth ultra-low voltage protection circuit in the electromagnetic heater power supply of the present invention.
Fig. 29 is a schematic diagram of a connection structure of a fifth ultra-low voltage protection circuit in the power supply of the electromagnetic heater of the invention.
The reference numerals are explained below.
1-a circuit board;
1-frequency conversion power amplification circuit board;
1-2-ultra under-voltage protection circuit board;
1-2-1-high voltage execution circuit;
1-2-low voltage execution circuit;
1-2-3 to AC/DC sampling circuit;
1-3. power supply and relay combined circuit board;
1-4-control circuit board;
1-5-power circuit board;
1-6 to high heating element;
1-7 to low-heating components;
1-8 to support columns;
2-a radiator;
2-1 to the heat dissipation part;
2-1-heat dissipation plate;
2-1-2-radiating fins;
2-2 to a heat collecting part;
2-3 to a first fixing screw;
2-4-connecting plate;
2-5 to a second fixing screw;
3-cooling fan;
4, a case;
4-1 to an air inlet;
4-2 to air outlet holes;
5-heat dissipation chamber;
6-sealing the chamber;
7-sealing the partition plate;
8, sealing elements;
9-circulating fan;
10-power switch;
11-a working state indicator light;
12-time relay;
13-voltmeter;
14-ammeter;
15-potentiometer;
16-sealing strips;
17-leakage switch;
18-binding post;
19-a protective tube;
20-electromagnetic heater gun head;
21-an inner fan of the gun head of the electromagnetic heater;
22-electromagnetic heater switch;
23-ultra-undervoltage state indicator lamp.
Detailed Description
As shown in fig. 2, 3 and 3A, the present embodiment provides an electromagnetic heater power supply capable of isolating and dissipating heat, including a circuit board 1 and a heat sink 2, where the circuit board 1 is electrically connected to pins of high heat-generating components 1-6, the heat sink 2 has a heat dissipating portion 2-1 and a heat collecting portion 2-2, a head of the high heat-generating components 1-6 is fixedly connected to the heat collecting portion 2-2 of the heat sink 2 in a heat conducting manner, and the circuit board 1 is located in a sealed chamber 6. The head of the high-heat-generation component 1-6 hermetically extends out of the sealed chamber 6, and the heat dissipation part 2-1 and the heat collection part 2-2 of the radiator 2 are positioned outside the sealed chamber 6. Of course, as shown in fig. 3B, the head of the high heat generating component 1-6 may be located in the sealed chamber 6, the heat collecting part 2-2 of the heat sink 2 hermetically extends into the sealed chamber 6, and the heat dissipating part 2-1 of the heat sink 2 is located outside the sealed chamber 6.
In the embodiment, the circuit board is positioned in the sealing chamber; the head of the high-heating element extends out of the sealing chamber in a sealing mode, the heat dissipation part and the heat collection part of the radiator are located outside the sealing chamber, or the head of the high-heating element is located in the sealing chamber, the heat collection part of the radiator extends into the sealing chamber in a sealing mode, and the heat dissipation part of the radiator is located outside the sealing chamber.
It is particularly emphasized here that, based on the long-term accumulated experience of the applicant in combination with careful and careful observation of the operating state of the electromagnetic heater power supply, theoretical studies and repeated practices have finally found that the ratio of the heat generated by the high heat-generating components (such as the igbt and the rectifier bridge) to the heat generated by the low heat-generating components (such as the capacitor, the resistor, the inductor and the integrated circuit chip) on the circuit board in the electromagnetic heater power supply is 9: 1. the number of high-heat-generating components is only a few, and the number of low-heat-generating components is dozens or even hundreds. The applicant believes that there is no better way to dissipate heat for all components on a circuit board other than by prior art heat dissipation methods. This has been proven by the practice described above if it is almost impossible to effectively isolate all components on the board from heat. Further, even if effective heat dissipation of all components on the circuit board can be achieved (e.g., based on the principle of air conditioning and refrigeration), the manufacturing cost is greatly increased, which is not paid. Further experiments and observations show that the circuit board is not burnt by the heat generated by low-heat-generating components (capacitors, inductors, resistors and integrated circuit chips) of the circuit board in the electromagnetic heater power supply, which is proved by repeated experiments. The electromagnetic heater power supply of the embodiment mainly carries out heat dissipation treatment on high-heating components and mainly carries out isolation treatment on the circuit board and low-heating components, so that the technical problem that the circuit board is burnt out due to power-on short circuit caused by accumulated dust on the circuit board after being damped in the prior art is solved, and the manufacturing cost is rarely increased.
As shown in fig. 2, 3A, and 3B, the high heat generating components 1 to 6 are insulated gate bipolar transistors and/or rectifier bridges.
A plurality of low-heat-generation components 1-7 are distributed on the circuit board 1.
The low-heat-generating components 1 to 7 are capacitors, inductors, resistors and integrated circuit chips.
In the embodiment, the high-heating component is an insulated gate bipolar transistor and/or a rectifier bridge; a plurality of low-heating components are distributed on the circuit board; the low-heating components are capacitors, inductors, resistors and integrated circuit chips, so that the components generating 90% of heat can be subjected to key heat dissipation, and the heat dissipation efficiency is greatly improved.
As shown in fig. 2 to 3, the sealed chamber 6 is located at an upper portion in the cabinet 4.
The lower part in the case 4 is a heat dissipation chamber 5. Or,
the sealing chamber is positioned at the lower part in the machine case.
The upper part in the case is a heat dissipation chamber.
The sealed chamber 6 is formed by a plurality of panels.
At least one of the plurality of panels is a removable panel.
The removable surface is connected with other panels connected with the removable surface in a sealing way through a sealing strip 16.
The plurality of panels includes a plurality of panels of the housing 4, a panel of the bulkhead 7, and a panel of a lid (not shown).
The removable panel is a panel of the lid (not shown).
There are two of the covers (not shown).
The cross-section of the sealing strip 16 is rectangular or circular or oval.
The sealing strip 16 is a solid core sealing strip or an air core sealing strip.
The overall shape of the sealing strip 16 is in a shape like a Chinese character 'kou', a shape like a Chinese character 'ri' with at least one lower transverse part, or a shape like a Chinese character 'ri' with at least one upper transverse part.
The seal strip 16 is provided with screw through holes (screw fitting holes) along the length direction.
The sealing strip 16 is made of silica gel or foamed silica gel or rubber or foamed plastic or fiber cloth or cotton cloth or blue shell paper or asbestos paper or insulating paper.
In the embodiment, the sealing chamber is positioned at the upper part in the case; the lower part in the case is a heat dissipation chamber; or the sealing chamber is positioned at the lower part in the case; the upper part in the case is a heat dissipation chamber; the sealed chamber is composed of a plurality of panels; at least one of the plurality of panels is a removable panel; the detachable surface is connected with other panels connected with the detachable surface in a sealing way through sealing strips; the plurality of panels comprises a plurality of panels of the case, one panel of the sealing partition plate and one panel of the case cover; the removable panel is a panel of the case lid; the number of the box covers is two; the cross section of the sealing strip is rectangular, circular or elliptical; the sealing strip is a solid sealing strip or a hollow sealing strip; the whole shape of the sealing strip is in a shape like a Chinese character 'kou', a shape like a Chinese character 'ri' with at least one lower transverse part or a shape like a Chinese character 'ri' with at least one upper transverse part; the sealing strip is provided with screw through holes (screw assembling holes) along the length direction; the sealing strip is made of silica gel, or foamed silica gel, or rubber, or foamed plastic, or fiber cloth, or cotton cloth, or blue shell paper, or asbestos paper, or insulating paper, so that the sealing strip is not only beneficial to sealing, but also beneficial to heat dissipation.
As shown in fig. 2, 3, and 3A, the heat dissipation portion 2-1 of the heat sink 2 is located in the heat dissipation chamber 5.
The heat dissipation chamber 5 and the sealing chamber 6 are separated by a sealing partition 7.
The sealing partition 7 is made of a metal plate or a plastic plate or an epoxy resin plate or an bakelite plate.
The sealing diaphragm 7 is provided with pin perforations.
As shown in fig. 3A, the leads of the high heat generating components 1 to 6 are electrically connected to the circuit board 1 through the lead through holes of the sealing partition 7 in an insulating and sealing manner.
And the pins of the high-heat-generation components 1 to 6 are sleeved with insulating heat-shrinkable tubes.
And the insulating heat-shrinkable tube is hermetically connected with the pin through hole of the sealing partition plate 7 through electronic sealant.
Of course, it is also possible that, as shown in figures 2 and 3,
the sealing clapboard 7 is provided with a heat dissipation port.
The shape of the heat dissipation opening is rectangular, circular or elliptical.
The upper edge of the heat sink is sealingly connected to the underside of the circuit board 1 by means of a seal 8.
The seal 8 is annular in shape.
The shape of the sealing member 8 is a rectangular ring or a circular ring or an elliptical ring.
The seal 8 encloses a heat collecting zone with the underside of the circuit board 1.
And the heat collection part 2-2 of the radiator 2 penetrates through the heat dissipation port to enter the heat collection area.
And the heat collecting part 2-2 of the radiator 2 is fixedly connected with the circuit board 1 in an insulating way.
It is also possible that as shown in figure 3B,
the circuit board 1 is provided with a through hole at the heat collecting area.
The heat collecting part 2-2 of the radiator 2 penetrates through the through hole.
The side surface of the heat collection part 2-2 of the radiator 2 is hermetically connected with the through hole through electronic glue.
A heat conducting insulation sheet (not shown in the figure) is attached to the heat collecting area under the circuit board 1, or insulation paint (not shown in the figure) is soaked under the circuit board 1.
In the embodiment, the heat dissipation part adopting the radiator is positioned in the heat dissipation chamber; the heat dissipation chamber and the sealing chamber are separated by a sealing partition plate; the sealing partition plate is made of a metal plate or a plastic plate or an epoxy resin plate or an bakelite plate; the sealing partition plate is provided with a pin through hole; the pin of the high-heat-generation component penetrates through the pin through hole of the sealing partition plate in an insulating and sealing manner to be electrically connected with the circuit board; an insulating heat-shrinkable tube is sleeved on the pin of the high-heating element; the insulating heat shrinkable tube is connected with the pin through hole of the sealing partition plate in a sealing manner through electronic sealant (the sealing performance is further improved); or the sealing clapboard is provided with a heat dissipation port; the shape of the heat dissipation opening is rectangular, circular or elliptical; the upper edge of the heat dissipation opening is connected with the lower surface of the circuit board in a sealing mode through a sealing piece; the seal is annular in shape; the shape of the sealing element is a rectangular ring, a circular ring or an elliptical ring; the sealing element and the lower surface of the circuit board enclose a heat collecting area; the heat collecting part of the radiator penetrates through the heat radiating port to enter the heat collecting area; the heat collecting part of the radiator is fixedly connected with the circuit board in an insulating way (the heat in the sealing chamber is favorably discharged out of the sealing chamber); or the circuit board is provided with a through hole at the heat collecting area; the heat collecting part of the radiator penetrates through the through hole; the side surface of the heat collecting part of the radiator is hermetically connected with the through hole through electronic glue; a heat-conducting insulating sheet is attached to the position, located at the heat collecting area, below the circuit board, or insulating paint is coated below the circuit board in an immersing mode (the technical means is favorable for further discharging heat in the sealing chamber out of the sealing chamber), so that various electromagnetic heater power supplies capable of isolating and radiating can be produced according to the requirements of different users.
As shown in fig. 2 to fig. 3, the circuit board 1 includes a frequency conversion power amplification circuit board 1-1, an ultra-undervoltage protection circuit board 1-2, a power supply and relay combination circuit board 1-3, a control circuit board 1-4, and a power supply circuit board 1-5.
The frequency conversion power amplification circuit board 1-1, the ultra-undervoltage protection circuit board 1-2, the power supply and relay combined circuit board 1-3, the control circuit board 1-4 and the power supply circuit board 1-5 are electrically connected through interfaces.
The frequency conversion power amplification circuit board 1-1 is close to the sealing partition plate 7.
The ultra-low voltage protection circuit board 1-2, the power supply and relay combined circuit board 1-3, the control circuit board 1-4 and the power supply circuit board 1-5 are positioned above the variable frequency power amplification circuit board 1-1.
The variable frequency power amplification circuit board 1-1 is fixedly connected with the ultra-undervoltage protection circuit board 1-2, the power supply and relay combined circuit board 1-3, the control circuit board 1-4 and the power supply circuit board 1-5 in an insulating mode through support columns 1-8.
The upper cavities and the lower cavities of the four circuit boards, namely the ultra-low voltage protection circuit board 1-2, the power supply and relay combined circuit board 1-3, the control circuit board 1-4 and the power supply circuit board 1-5, form a circulating air duct.
The circulating air duct is provided with at least one circulating fan 9.
One of the circulation fans 9 is provided.
One of the circulation fans 9 is located at the rear upper portion of the hermetic chamber 6.
In the embodiment, the circuit board comprises a variable frequency power amplification circuit board, an ultra-low voltage protection circuit board, a power supply and relay combined circuit board, a control circuit board and a power supply circuit board; the frequency conversion power amplification circuit board, the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board are electrically connected through interfaces; the variable frequency power amplification circuit board is close to the sealing partition plate; the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board are positioned above the variable frequency power amplification circuit board; the variable-frequency power amplification circuit board is fixedly connected with the ultra-low-voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board in an insulation manner through support columns; the upper cavities and the lower cavities of the four circuit boards, namely the ultra-low voltage protection circuit board, the power supply and relay combined circuit board, the control circuit board and the power supply circuit board form a circulating air duct; the circulating air duct is provided with at least one circulating fan; one of the circulating fans; and one circulating fan is positioned at the rear upper part of the sealed chamber, so that the heat dissipation of the sealed chamber is facilitated.
As shown in fig. 2 to 6, there are a plurality of high heat generating components 1 to 6.
The high-heating components 1-6 are electrically connected with the variable-frequency power amplification circuit board 1-1.
As shown in fig. 16 to 18, the heads of the plurality of high heat generating components 1 to 6 are located above the circuit board 1. Or,
as shown in fig. 12 to 15, the headers of the plurality of high heat generating components 1 to 6 are located below the circuit board 1.
As shown in fig. 12 and fig. 17 to 18, the heads of the high heat generating components 1 to 6 are away from the board surface of the circuit board 1. Or,
as shown in fig. 15 to 16, the headers of the plurality of high heat generating components 1 to 6 are close to the board surface of the circuit board 1.
As shown in fig. 7 to 9, the tubes of the high heat generating components 1 to 6 are arranged in a flat manner. Or,
as shown in fig. 10 to 12, the tubes of the high heat generating components 1 to 6 are arranged vertically.
As shown in fig. 10 to 12, the header of the high heat generating component 1-6 is fixedly connected to the side surface of the heat collecting portion 2-2 of the heat sink 2 in a heat conducting manner. Or,
as shown in fig. 7 to 9, the header of the high heat generating component 1-6 is fixedly connected to the upper surface of the heat collecting portion 2-2 of the heat sink 2 in a heat conducting manner.
In the embodiment, a plurality of high-heat-generation components are adopted; the high-heating components are electrically connected with the variable-frequency power amplification circuit board; the tube heads of the high-heating components are positioned on the circuit board; or the tube heads of the high-heat-generating components are positioned below the circuit board; the tube heads of the high-heating components are far away from the board surface of the circuit board; or the tube heads of the high-heat-generation components are close to the board surface of the circuit board; the tube heads of the high-heating components are arranged horizontally; or the tube heads of the high-heating components are vertically arranged; the tube head of the high-heating element is fixedly connected with the side surface of the heat collecting part of the radiator in a heat conducting manner; or the tube head of the high-heating component is fixedly connected with the upper surface of the heat collecting part of the radiator in a heat conducting way, so that various electromagnetic heater power supplies capable of isolating and radiating heat can be produced according to actual conditions.
As shown in fig. 4 to 6, the heat sink 2 is made of aluminum material and/or copper material. Or,
the heat sink 2 is a phase change heat sink.
The phase change radiator is an aluminum shell phase change radiator, a copper shell phase change radiator or a heat conduction silica gel shell phase change radiator.
In the embodiment, the radiator is made of aluminum materials and/or copper materials (the radiator with high-efficiency heat dissipation is produced at lower cost); alternatively, the heat sink is a phase change heat sink; the phase change radiator is an aluminum shell phase change radiator, a copper shell phase change radiator or a heat conduction silica gel shell phase change radiator, so that heat can be radiated in various modes.
As shown in fig. 4 to 6, the heat dissipation part 2-1 is made of an aluminum material.
The heat dissipation part 2-1 comprises a heat dissipation plate 2-1-1 and a plurality of heat dissipation fins 2-1-2.
The plurality of radiating fins 2-1-2 are distributed on one side or two sides of the radiating plate 2-1-1.
The heat collecting part 2-2 is made of a copper plate.
The copper plate is a copper plate.
The heat collecting part 2-2 is fixedly connected with one surface or a part of one surface of the heat radiating plate 2-1-1 through a first fixing screw 2-3.
And heat-conducting silicone grease is coated between the heat collecting part 2-2 and the heat dissipation plate 2-1-1.
The edge or the middle of the heat collecting part 2-2 extends upwards to form an extended heat collecting part.
The heat sink 2 is plural.
A plurality of said radiators 2 are fixed together by means of connection plates 2-4 and second fixing screws 2-5.
In the embodiment, the heat dissipation part is made of aluminum; the heat dissipation part comprises a heat dissipation plate and a plurality of heat dissipation plates; the plurality of radiating fins are distributed on one surface or two surfaces of the radiating plate; the heat collecting part is made of a copper plate; the copper plate is a red copper plate; the heat collection part is fixedly connected with one surface or one part of one surface of the heat dissipation plate through a first fixing screw; heat-conducting silicone grease is coated between the heat collecting part and the heat dissipation plate; the edge or the middle part of the heat collecting part extends upwards to form an extended heat collecting part; the number of the radiators is multiple; the plurality of radiators are fixed together by the connecting plate and the second fixing screws, so that the high-heat-generating components can be radiated.
As shown in fig. 2, an air inlet 4-1 is provided at the lower rear part of the cabinet 4.
The lower part of the front of the case 4 is provided with an air outlet 4-2.
At least one cooling fan 3 is arranged between the air inlet 4-1 and the radiator 2.
The number of the cooling fans 3 is two.
A gap is reserved between the cooling fan 3 and the air inlet hole 4-1.
The clearance between the cooling fan 3 and the air inlet hole 4-1 is greater than or equal to 5 mm.
The clearance between the cooling fan 3 and the air inlet hole 4-1 is 5mm, 10mm, 15mm, 20mm, 50mm or 100 mm.
In the embodiment, the lower part of the back of the case is provided with the air inlet; the lower part of the front of the case is provided with an air outlet; at least one cooling fan is arranged between the air inlet and the radiator; the number of the cooling fans is two; and a 5mm gap is reserved between the cooling fan and the air inlet hole, so that the heat dissipation efficiency can be greatly improved.
As shown in fig. 2, a power switch 10, a working state indicator lamp 11, a time relay 12, a voltmeter 13, an ammeter 14, a potentiometer 15, and an overvoltage/undervoltage state indicator lamp 23 are arranged on the upper front part of the case 4;
four working state indicator lamps 11 are provided;
the four working state indicator lamps 11 are a temperature protection indicator lamp, a chip power indicator lamp, a program locking indicator lamp and a working instruction indicator lamp;
four ultra-undervoltage status indicator lamps 23 are provided;
the four ultra-low voltage status indicator lamps 23 are an input power indicator lamp, a low voltage indicator lamp, an overvoltage indicator lamp and an output power indicator lamp.
The technical means that the power switch, the working state indicator light, the time relay, the voltmeter, the ammeter, the potentiometer and the ultra-low voltage state indicator light are arranged on the upper part of the front surface of the case is adopted, so that the electromagnetic heater power supply can be observed and operated conveniently.
As shown in fig. 2, the ultra-low voltage protection circuit board 1-2 has an ultra-low voltage protection circuit board. Or,
the ultra-undervoltage protection circuit board 1-2 is provided with two sub ultra-undervoltage protection circuit boards.
And one ultra-low voltage protection circuit board is provided with an ultra-low voltage protection circuit. Or,
one ultra-undervoltage protection circuit board is provided with two sub ultra-undervoltage protection circuits.
And the two sub ultra-undervoltage protection circuit boards are provided with sub ultra-undervoltage protection circuits.
One of the ultra-low voltage protection circuits is a high-voltage ultra-low voltage protection circuit or a low-voltage ultra-low voltage protection circuit or a high-voltage ultra-low voltage protection circuit.
One of the two sub-ultra-undervoltage protection circuits is a high-voltage ultra-undervoltage protection circuit, and the other one is a low-voltage ultra-undervoltage protection circuit.
The sub-ultra-undervoltage protection circuit of one of the two sub-ultra-undervoltage protection circuit boards is a high-voltage ultra-undervoltage protection circuit, and the sub-ultra-undervoltage protection circuit of the other sub-ultra-undervoltage protection circuit board is a low-voltage ultra-undervoltage protection circuit.
In the embodiment, the ultra-undervoltage protection circuit board is provided with the ultra-undervoltage protection circuit board; or the ultra-undervoltage protection circuit board is provided with two sub ultra-undervoltage protection circuit boards; one ultra-undervoltage protection circuit board is provided with an ultra-undervoltage protection circuit; or, one of the ultra-low voltage protection circuit boards is provided with two sub ultra-low voltage protection circuits; the two sub ultra-undervoltage protection circuit boards are respectively provided with a sub ultra-undervoltage protection circuit; one ultra-low voltage protection circuit is a high-voltage ultra-low voltage protection circuit or a low-voltage ultra-low voltage protection circuit or a high-voltage ultra-low voltage protection circuit; one of the two sub-ultra-undervoltage protection circuits is a high-voltage ultra-undervoltage protection circuit, and the other one is a low-voltage ultra-undervoltage protection circuit; the sub-ultra-undervoltage protection circuit of one of the two sub-ultra-undervoltage protection circuit boards is a high-voltage ultra-undervoltage protection circuit, and the sub-ultra-undervoltage protection circuit of the other sub-ultra-undervoltage protection circuit board is a technical means of a low-voltage ultra-undervoltage protection circuit, so that when the power supply voltage of the electromagnetic heater power supply is too high or too low, the power supply can be quickly cut off, and an insulated gate bipolar transistor (namely IGPT) is prevented from being burnt out.
As shown in fig. 20 to 29, the overvoltage/undervoltage protection circuit includes a rectifier circuit.
The input end of the rectifying circuit is electrically connected with the output end of an external power supply.
The output end of the rectification circuit is electrically connected with the input end of the voltage stabilizing circuit.
The first output end of the voltage stabilizing circuit is electrically connected with the first input end of the comparison circuit.
And the second input end of the comparison circuit is electrically connected with the output end of the AC/DC sampling circuit 1-2-3.
And the third input end of the comparison circuit is electrically connected with the output end of the reference circuit.
The input end of the reference circuit is electrically connected with the second output end of the voltage stabilizing circuit.
The output end of the comparison circuit is electrically connected with the first input end of the driving circuit.
And the second input end of the driving circuit is electrically connected with the output end of the delay circuit.
The output end of the driving circuit is electrically connected with the input end of the execution circuit.
In the embodiment, the ultra-low voltage protection circuit comprises a rectification circuit; the input end of the rectifying circuit is electrically connected with the output end of an external power supply; the output end of the rectification circuit is electrically connected with the input end of the voltage stabilizing circuit; the first output end of the voltage stabilizing circuit is electrically connected with the first input end of the comparison circuit; the second input end of the comparison circuit is electrically connected with the output end of the AC/DC sampling circuit; the third input end of the comparison circuit is electrically connected with the output end of the reference circuit; the input end of the reference circuit is electrically connected with the second output end of the voltage stabilizing circuit; the output end of the comparison circuit is electrically connected with the first input end of the driving circuit; the second input end of the driving circuit is electrically connected with the output end of the delay circuit; the output end of the driving circuit is electrically connected with the input end of the execution circuit, so that the insulated gate bipolar transistor (i.e. IGPT) can be prevented from being burnt out, and the power supply of the electromagnetic heater can be automatically supplied when the voltage is normal.
As shown in fig. 20 to 21, the execution circuit of the high-low voltage ultra-low voltage protection circuit is divided into a high-voltage execution circuit 1-2-1 and a low-voltage execution circuit 1-2-2.
The output end of the driving circuit is divided into a first output end and a second output end.
The first output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit 1-2-1.
The main circuit executive component in the high-voltage executive circuit 1-2-1 is a small relay or an intermediate relay or a contactor.
And the second output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit 1-2-2.
And the control direct current circuit execution element in the low-voltage execution circuit 1-2-2 is a small PNP triode, a small NPN triode, a low-power thyristor or a low-power insulated gate field effect transistor.
Of course, the control direct current circuit executive component in the low voltage executive circuit 1-2-2 can be a normally closed micro-relay.
The normally closed micro relay is a normally closed reed switch relay or a normally closed small high-frequency relay.
In the embodiment, the execution circuit adopting the high-low voltage ultra-low voltage protection circuit is divided into a high-voltage execution circuit and a low-voltage execution circuit; the output end of the driving circuit is divided into a first output end and a second output end; the first output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit; the main circuit executive component in the high-voltage executive circuit is a miniature relay or an intermediate relay or a contactor; the second output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit; the control direct current circuit execution element in the low-voltage execution circuit is a small PNP triode or a small NPN triode or a small power thyristor or a small power insulated gate type field effect transistor or a normally closed micro-relay; the normally closed micro relay is a technical means of a normally closed reed switch relay or a normally closed small high-frequency relay, so that the transistor output can be realized to control a control circuit, and the electromagnetic relay is used for controlling a main circuit. The control circuit has fast response time and belongs to nanosecond or microsecond level. The control circuit has no contact, no noise and no interference. The transistor element and device for the control circuit has low circuit power and low manufacturing cost. The electromagnetic relay is used for controlling the main circuit to be in a millisecond level. The electromagnetic relay is used for controlling the main circuit to be difficult to malfunction and has strong stability. The electromagnetic relay is used for controlling the main circuit to be in an off state without leakage current and temperature. The electromagnetic relay is used for controlling the main circuit to be in an on state and have no pressure drop, the heating value is small, heat dissipation is not needed, and the continuity is good. The control circuit cuts off the working signal to make the equipment in standby state, the electromagnetic relay has no current or very small current when the main circuit is cut off, the contact has no spark, and the contact of the electromagnetic relay is not easy to damage. The equipment is in a standby state firstly, and the equipment is not easy to damage when the electromagnetic relay disconnects the main circuit afterwards. The electromagnetic relay is used for controlling the main circuit load to be not divided into withstand voltage and alternating current and direct current. The electromagnetic relay is used for controlling a main circuit and belongs to an isolated component.
As shown in fig. 22 to 25, the execution circuit of the high-voltage ultra-low-voltage protection circuit is a high-voltage execution circuit 1-2-1.
The output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit 1-2-1.
The main circuit executive component in the high-voltage executive circuit 1-2-1 is an alternating current solid-state relay or an electromagnetic relay.
The alternating current solid-state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor.
In the embodiment, the execution circuit adopting the high-voltage ultra-low-voltage protection circuit is a high-voltage execution circuit; the output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit; the main circuit executive component in the high-voltage executive circuit is an alternating current solid-state relay or an electromagnetic relay; the alternating current solid state relay is a technical means of a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor, so that the response time is fast, and the response time of a commonly used silicon controlled rectifier (also called a thyristor) is 10 milliseconds. If an execution element composed of high-speed MOS or IGBT tubes is used, the nanosecond level to the microsecond level can be achieved. No contact, no noise and no interference. Belongs to an isolated component. However, solid-state relays are bulky and expensive. The on-state pressure drop is large, the heat generation amount is large, the load capacity is rapidly reduced, the pressure drop is large, and the continuity is poor. The temperature is raised by the off-state leakage current, and heat dissipation is required by a radiator. The load is divided into withstand voltage and alternating current and direct current. The output of the electromagnetic relay has no voltage drop. The continuity is good, the temperature rise is small, and heat dissipation is not needed. The price is low. Belongs to an isolated component. The load is not influenced by voltage, voltage and alternating current and direct current. No leakage current and no temperature in the off state. The on-state non-voltage drop heating value is small, heat dissipation is not needed, and the continuity is good. However, electromagnetic relays are slow in response time, normally 2 ms to 20 ms, in the order of ms, with larger heads being slower in response time. The contact is easy to spark, the contact is easy to spark when the working current of the contact is larger, and the service life of the contact is short. The contact is easy to spark when the working current of the contact is larger, and the contact is easy to adhere to the contact at high temperature to cause misoperation. The larger the working current of the contact is, the more easy the contact is to spark, the high temperature of the contact is easy to oxidize, and poor contact is caused. The larger the noise of the head.
As shown in fig. 26 to 29, the execution circuit of the low-voltage ultra-low-voltage protection circuit is a low-voltage execution circuit 1-2-2.
The output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit 1-2-2.
And the control direct-current circuit execution element in the low-voltage execution circuit 1-2-2 is a direct-current solid-state relay, a small PNP triode, a small NPN triode, a low-power thyristor, a low-power insulated gate type field effect transistor or an optical coupling switch element.
In the embodiment, the execution circuit adopting the low-voltage ultra-low-voltage protection circuit is a low-voltage execution circuit; the output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit; the control direct-current circuit execution element in the low-voltage execution circuit is a technical means of a direct-current solid-state relay, a small PNP triode, a small NPN triode, a small-power thyristor, a small-power insulated gate type field effect transistor or an optical coupling switch element, so that the response time of an amplification output type (also called as simplified solid-state relay output) such as an optical coupling isolation transistor or a field effect transistor is short, and the amplification output type (also called as simplified solid-state relay output) belongs to the nanosecond level and the microsecond level and depends on the element. No contact, no noise and no interference. The current can reach several amperes to ten amperes depending on the element, and compared with solid-state relay, the circuit is simple and cost is low. However, an amplified output load such as an opto-isolator transistor or a field effect transistor has a voltage division resistance and an alternating current and direct current division type. Compared with a solid-state relay, the circuit has poor stability and low output power and is limited to be used in occasions with low requirements and/or low power.
As shown in FIG. 19, the input terminal of the AC/DC sampling circuit 1-2-3 is electrically connected to the output terminal of the external power source.
The output end of the external power supply is electrically connected with the power supply input end of the binding post 18 through the control output end of the high-voltage execution circuit 1-2-1.
And a leakage switch 17, an ammeter 14, a voltmeter 13, a fuse 19 and a power switch 10 are electrically connected between the control output end of the high-voltage execution circuit 1-2-1 and the power input end of the binding post 18.
And a first power output end of the binding post 18 is electrically connected with a power input end of the variable-frequency power amplification circuit board 1-1.
And the power supply output end of the variable-frequency power amplification circuit board 1-1 is electrically connected with the electromagnetic heater gun head 20.
And a second power output end of the binding post 18 is respectively and electrically connected with a power input end of the power and relay combined circuit board 1-3, a power input end of the time relay 12 and a power input end of the power circuit board 1-5.
And the power supply and relay combined circuit board 1-3 is electrically connected with an electromagnetic heater gun head inner fan 21.
The power supply and relay combined circuit board 1-3 is electrically connected with an electromagnetic heater switch 22.
The power circuit boards 1-5 are electrically connected with two cooling fans 3 and a circulating fan 9.
And a third power output end of the binding post 18 is electrically connected with a power input end of the ultra-low voltage protection circuit board 1-2.
The control output end of the low-voltage execution circuit 1-2-2 of the ultra-low-voltage protection circuit board 1-2 is electrically connected with the control input end of the control circuit board 1-4.
And the power input end of the control circuit board 1-4 is electrically connected with the power output end of the power circuit board 1-5.
The frequency conversion signal output end of the control circuit board 1-4 is electrically connected with the frequency conversion signal input end of the frequency conversion power amplification circuit board 1-1.
And the current feedback input end of the control circuit board 1-4 is electrically connected with the current feedback output end of the variable-frequency power amplification circuit board 1-1.
The control circuit board 1-4 is electrically connected with a working state indicator lamp 11 and a potentiometer 15.
The ultra-low voltage protection circuit board 1-2 is electrically connected with an ultra-low voltage state indicator lamp 23.
The control output end of the low-voltage execution circuit 1-2-2 of the ultra-undervoltage protection circuit board 1-2 is electrically connected with the control input end of the control circuit board 1-4 through the time relay 12 and the power supply and relay combined circuit board 1-3.
In the embodiment, the input end of the AC/DC sampling circuit is electrically connected with the output end of an external power supply; the output end of the external power supply is electrically connected with the power supply input end of the binding post through the control output end of the high-voltage execution circuit; a leakage switch, an ammeter, a voltmeter, a fuse and a power switch are electrically connected between the control output end of the high-voltage execution circuit and the power input end of the binding post; the first power output end of the binding post is electrically connected with the power input end of the variable-frequency power amplification circuit board; the power supply output end of the variable-frequency power amplification circuit board is electrically connected with the gun head of the electromagnetic heater; the second power output end of the binding post is respectively and electrically connected with the power input end of the power supply and relay combined circuit board, the power input end of the time relay and the power input end of the power supply circuit board; the power supply and relay combined circuit board is electrically connected with an inner fan of the gun head of the electromagnetic heater; the power supply and relay combined circuit board is electrically connected with an electromagnetic heater switch; the power circuit board is electrically connected with two cooling fans and a circulating fan; the third power output end of the binding post is electrically connected with the power input end of the ultra-low voltage protection circuit board; the control output end of the low-voltage execution circuit of the ultra-low-voltage protection circuit board is electrically connected with the control input end of the control circuit board; the power supply input end of the control circuit board is electrically connected with the power supply output end of the power supply circuit board; the frequency conversion signal output end of the control circuit board is electrically connected with the frequency conversion signal input end of the frequency conversion power amplification circuit board; the current feedback input end of the control circuit board is electrically connected with the current feedback output end of the variable-frequency power amplification circuit board; the control circuit board is electrically connected with a working state indicator lamp and a potentiometer; the control output end of the low-voltage execution circuit of the ultra-low-voltage protection circuit board is electrically connected with the control input end of the control circuit board through the time relay and the power supply and relay combination circuit board, so that the whole circuit of the electromagnetic heater power supply can be optimized, and the function of the electromagnetic heater power supply can be fully exerted.
The voltage and current withstand capability of IGBTs is related to a number of factors, and is summarized below based on the experience of the applicant operating over the years. Taking an IGBT model IRGP50B60PD1 as an example, it works in a direct current voltage DC305V circuit, an alternating current voltage AC220V is DC305V after being rectified, and the safety ranges of the IGBT model IRGP50B60PD1 to voltage and current are as follows:
1. the safe voltages are DC291V to DC 318V.
2. The safer low voltage is DC277V plus or minus 5V, and the safer high voltage is DC332V plus or minus 5V.
3. The less safe low voltage is DC263V plus or minus 5V, and the less safe high voltage is DC346V plus or minus 5V.
4. The unsafe low voltage is DC249V plus or minus 5V, and the unsafe high voltage is DC360V plus or minus 5V.
5. The vulnerable low voltage is DC235V plus or minus 5V, and the vulnerable high voltage is DC374V plus or minus 5V.
Temperature and current effects on the IGBT:
when the temperature is below 25 degrees, the IGBT model IRGP50B60PD1 can operate at a current of 75A.
When the temperature is below 100 degrees and above 25 degrees, the IGBT model IRGP50B60PD1 can work under the current of 45A.
As shown in fig. 2 and 19 to 29, the ultra-undervoltage protection circuit board 1-2 is a bare plate-shaped structure to form a substantially plate-shaped ultra-undervoltage protector.
Of course, the ultra-low voltage protection circuit board (1-2) can be packaged by a shell to form a substantially cuboid or cubic ultra-low voltage protector.
The substantially plate-shaped ultra-under-voltage protector is arranged in the sealed chamber 6.
The ultra-low voltage protector which is basically cuboid or cube is arranged on the wall of the case (4).
The wall of the chassis 4 is an outer or inner side of the front wall of the chassis 4.
However, the wall of the chassis 4 may be an outer side or an inner side of the rear wall of the chassis 4.
In the embodiment, the ultra-low voltage protection circuit board is a naked plate-shaped structure to form the basically plate-shaped ultra-low voltage protector (which is beneficial to reducing the manufacturing cost and radiating); or the ultra-low voltage protection circuit board is packaged by a shell to form a substantially cuboid or cubic ultra-low voltage protector (which is beneficial to flexible installation and convenient use); the basically plate-shaped ultra-under-voltage protector is arranged in the sealing chamber; the ultra-low voltage protector which is basically cuboid or cube is arranged on the wall of the case; the wall of the case is the outer side or the inner side of the front wall of the case; or the wall of the case is a technical means of the outer side surface or the inner side surface of the rear wall of the case, so that various electromagnetic heater power supplies can be manufactured according to the requirements and actual conditions of different customers.
Claims (10)
1. The utility model provides a can keep apart radiating electromagnetic heater power, includes circuit board (1) and radiator (2), circuit board (1) is connected with the pin electricity of high heating element and part (1-6), radiator (2) have radiating part (2-1) and heat collection portion (2-2), the head of high heating element and part (1-6) with heat collection portion (2-2) heat conduction fixed connection of radiator (2), its characterized in that: the circuit board (1) is positioned in the sealed chamber (6); the heat dissipation device is characterized in that the head of the high-heat-generation component (1-6) hermetically extends out of the sealing chamber (6), the heat dissipation part (2-1) and the heat collection part (2-2) of the radiator (2) are located outside the sealing chamber (6), or the head of the high-heat-generation component (1-6) is located inside the sealing chamber (6), the heat collection part (2-2) of the radiator (2) hermetically extends into the sealing chamber (6), and the heat dissipation part (2-1) of the radiator (2) is located outside the sealing chamber (6).
2. An electromagnetic heater power supply capable of isolating heat dissipation as defined in claim 1, wherein:
the high-heating components (1-6) are insulated gate bipolar transistors and/or rectifier bridges;
a plurality of low-heat-generation components (1-7) are distributed on the circuit board (1);
the low-heat-generating components (1-7) are capacitors, inductors, resistors and integrated circuit chips;
the sealing chamber (6) is positioned at the upper part in the case (4);
the lower part in the case (4) is a heat dissipation chamber (5); or,
the sealing chamber is positioned at the lower part in the case;
the upper part in the case is a heat dissipation chamber;
the sealed chamber (6) is composed of a plurality of panels;
at least one of the plurality of panels is a removable panel;
the detachable surface is connected with other panels connected with the detachable surface in a sealing way through a sealing strip (16);
the plurality of panels comprises a plurality of panels of the case (4), one panel of the sealing partition (7) and one panel of the case cover;
the removable panel is a panel of the case lid;
the number of the box covers is two;
the cross section of the sealing strip (16) is rectangular or circular or oval;
the sealing strip (16) is a solid sealing strip or a hollow sealing strip;
the whole shape of the sealing strip (16) is in a shape like a Chinese character 'kou', a shape like a Chinese character 'ri', at least one lower transverse shape like a Chinese character 'ri', or at least one upper transverse shape like a Chinese character 'ri';
screw through holes are distributed in the sealing strip (16) along the length direction;
the sealing strip (16) is made of silica gel or foamed silica gel or rubber or foamed plastic or fiber cloth or cotton cloth or green shell paper or asbestos paper or insulating paper;
the heat dissipation part (2-1) of the heat radiator (2) is positioned in the heat dissipation chamber (5);
the heat dissipation chamber (5) and the sealing chamber (6) are separated by the sealing partition plate (7);
the sealing partition plate (7) is made of a metal plate or a plastic plate or an epoxy resin plate or an bakelite plate;
the sealing partition plate (7) is provided with a pin through hole;
pins of the high-heat-generation components (1-6) penetrate through pin through holes of the sealing partition plate (7) in an insulating and sealing manner to be electrically connected with the circuit board (1);
the pins of the high-heating components (1-6) are sleeved with insulating heat-shrinkable tubes;
the insulating heat-shrinkable tube is connected with the pin through hole of the sealing partition plate (7) in a sealing manner through electronic sealant;
or,
the sealing partition plate (7) is provided with a heat dissipation port;
the shape of the heat dissipation opening is rectangular, circular or elliptical;
the upper edge of the heat dissipation opening is hermetically connected with the lower surface of the circuit board (1) through a sealing piece (8);
the seal (8) is annular in shape;
the seal (8)) is shaped as a rectangular ring or as a circular ring or as an elliptical ring;
the sealing member (8) and the lower surface of the circuit board (1) enclose a heat collecting area;
a heat collection part (2-2) of the radiator (2) penetrates through the heat dissipation port to enter the heat collection area;
the heat collecting part (2-2) of the radiator (2) is fixedly connected with the circuit board (1) in an insulating way;
or,
the circuit board (1) is provided with a through hole at the heat collecting area;
the heat collecting part (2-2) of the radiator (2) penetrates through the through hole;
the side surface of the heat collection part (2-2) of the radiator (2) is hermetically connected with the through hole through electronic glue;
and a heat-conducting insulating sheet is attached to the heat collecting area below the circuit board (1), or insulating paint is coated below the circuit board (1) in a soaking mode.
3. An electromagnetic heater power supply capable of isolating heat dissipation as defined in claim 2, wherein:
the circuit board (1) comprises a variable frequency power amplification circuit board (1-1), an ultra-undervoltage protection circuit board (1-2), a power supply and relay combined circuit board (1-3), a control circuit board (1-4) and a power supply circuit board (1-5);
the variable frequency power amplification circuit board (1-1), the ultra-low voltage protection circuit board (1-2), the power supply and relay combined circuit board (1-3), the control circuit board (1-4) and the power supply circuit board (1-5) are electrically connected through interfaces;
the variable frequency power amplification circuit board (1-1) is close to the sealing partition plate (7);
the ultra-low voltage protection circuit board (1-2), the power supply and relay combined circuit board (1-3), the control circuit board (1-4) and the power supply circuit board (1-5) are positioned above the variable frequency power amplification circuit board (1-1);
the variable-frequency power amplification circuit board (1-1) is fixedly connected with the ultra-undervoltage protection circuit board (1-2), the power supply and relay combined circuit board (1-3), the control circuit board (1-4) and the power supply circuit board (1-5) in an insulated manner through support columns (1-8);
the upper cavities and the lower cavities of the four circuit boards, namely the ultra-low voltage protection circuit board (1-2), the power supply and relay combined circuit board (1-3), the control circuit board (1-4) and the power supply circuit board (1-5), form a circulating air duct;
the circulating air duct is provided with at least one circulating fan (9);
a plurality of high-heat-generation components (1-6) are arranged;
the high-heating components (1-6) are electrically connected with the variable-frequency power amplification circuit board (1-1);
the tube heads of the high-heat-generation components (1-6) are positioned on the circuit board (1); or,
the tube heads of the high-heat-generation components (1-6) are positioned below the circuit board (1);
the tube heads of the high-heat-generation components (1-6) are far away from the board surface of the circuit board (1); or,
the tube heads of the high-heat-generation components (1-6) are close to the board surface of the circuit board (1);
the tube heads of the high-heating components (1-6) are arranged horizontally; or,
the tube heads of the high-heating components (1-6) are vertically arranged;
the tube head of the high-heating element (1-6) is fixedly connected with the side surface of the heat collection part (2-2) of the radiator (2) in a heat conducting manner; or,
the tube head of the high-heating element (1-6) is fixedly connected with the upper surface of the heat collection part (2-2) of the radiator (2) in a heat conducting manner.
4. An electromagnetic heater power supply capable of isolating heat dissipation according to claim 3, wherein:
the radiator (2) is made of aluminum materials and/or copper materials; or,
the heat sink (2) is a phase change heat sink;
the phase-change radiator is an aluminum shell phase-change radiator, a copper shell phase-change radiator or a heat-conducting silica gel shell phase-change radiator;
the heat dissipation part (2-1) is made of aluminum;
the heat dissipation part (2-1) comprises a heat dissipation plate (2-1-1) and a plurality of heat dissipation fins (2-1-2);
the plurality of radiating fins (2-1-2) are distributed on one surface or two surfaces of the radiating plate (2-1-1);
the heat collecting part (2-2) is made of a copper plate;
the heat collecting part (2-2) is fixedly connected with one surface or one part of one surface of the heat dissipation plate (2-1-1) through a first fixing screw (2-3);
heat-conducting silicone grease is coated between the heat collecting part (2-2) and the heat dissipation plate (2-1-1);
the edge or the middle part of the heat collecting part (2-2) extends upwards to form an extended heat collecting part;
a plurality of radiators (2) are provided;
the radiators (2) are fixed together through connecting plates (2-4) and second fixing screws (2-5).
5. An electromagnetic heater power supply capable of isolating heat dissipation according to claim 4, wherein:
an air inlet (4-1) is formed in the lower part of the rear surface of the case (4);
the lower part of the front of the case (4) is provided with an air outlet (4-2);
at least one cooling fan (3) is arranged between the air inlet (4-1) and the radiator (2);
a gap is reserved between the cooling fan (3) and the air inlet hole (4-1);
the clearance between the cooling fan (3) and the air inlet hole (4-1) is more than or equal to 5 mm;
the upper part of the front of the case (4) is provided with a power switch (10), a working state indicator lamp (11), a time relay (12), a voltmeter (13), an ammeter (14), a potentiometer (15) and an ultra-low voltage state indicator lamp (23);
four working state indicating lamps (11) are arranged;
the four working state indicator lamps (11) are a temperature protection indicator lamp, a chip power indicator lamp, a program locking indicator lamp and a working instruction indicator lamp;
four ultra-undervoltage status indicator lamps (23) are arranged;
the four ultra-low voltage state indicator lamps (23) are an input power indicator lamp, a low voltage indicator lamp, an overvoltage indicator lamp and an output power indicator lamp.
6. An electromagnetic heater power supply capable of isolating heat dissipation according to claim 5, wherein:
the ultra-undervoltage protection circuit board (1-2) is provided with an ultra-undervoltage protection circuit board; or,
the ultra-undervoltage protection circuit board (1-2) is provided with two sub ultra-undervoltage protection circuit boards;
one ultra-undervoltage protection circuit board is provided with an ultra-undervoltage protection circuit; or,
one ultra-undervoltage protection circuit board is provided with two sub ultra-undervoltage protection circuits;
the two sub ultra-undervoltage protection circuit boards are respectively provided with a sub ultra-undervoltage protection circuit;
one ultra-low voltage protection circuit is a high-voltage ultra-low voltage protection circuit or a low-voltage ultra-low voltage protection circuit or a high-voltage ultra-low voltage protection circuit;
one of the two sub-ultra-undervoltage protection circuits is a high-voltage ultra-undervoltage protection circuit, and the other one is a low-voltage ultra-undervoltage protection circuit;
the sub-ultra-undervoltage protection circuit of one of the two sub-ultra-undervoltage protection circuit boards is a high-voltage ultra-undervoltage protection circuit, and the sub-ultra-undervoltage protection circuit of the other sub-ultra-undervoltage protection circuit board is a low-voltage ultra-undervoltage protection circuit.
7. An electromagnetic heater power supply capable of isolating heat dissipation according to claim 6, wherein:
the ultra-low voltage protection circuit comprises a rectifying circuit;
the input end of the rectifying circuit is electrically connected with the output end of an external power supply;
the output end of the rectification circuit is electrically connected with the input end of the voltage stabilizing circuit;
the first output end of the voltage stabilizing circuit is electrically connected with the first input end of the comparison circuit;
the second input end of the comparison circuit is electrically connected with the output end of the AC/DC sampling circuit (1-2-3);
the third input end of the comparison circuit is electrically connected with the output end of the reference circuit;
the input end of the reference circuit is electrically connected with the second output end of the voltage stabilizing circuit;
the output end of the comparison circuit is electrically connected with the first input end of the driving circuit;
the second input end of the driving circuit is electrically connected with the output end of the delay circuit;
the output end of the driving circuit is electrically connected with the input end of the execution circuit.
8. An electromagnetic heater power supply capable of isolating heat dissipation according to claim 7, wherein:
the execution circuit of the high-voltage and low-voltage ultra-low-voltage protection circuit is divided into a high-voltage execution circuit (1-2-1) and a low-voltage execution circuit (1-2-2);
the output end of the driving circuit is divided into a first output end and a second output end;
the first output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit (1-2-1);
the main circuit executive component in the high-voltage executive circuit (1-2-1) is a miniature relay or an intermediate relay or a contactor;
the second output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit (1-2-2);
the control direct-current circuit execution element in the low-voltage execution circuit (1-2-2) is a small PNP triode or a small NPN triode or a low-power thyristor or a low-power insulated gate type field effect transistor or a normally closed micro-relay;
the normally closed micro relay is a normally closed reed switch relay or a normally closed small high-frequency relay;
the execution circuit of the high-voltage ultra-low-voltage protection circuit is a high-voltage execution circuit (1-2-1);
the output end of the driving circuit is electrically connected with the input end of the high-voltage execution circuit (1-2-1);
the main circuit executive component in the high-voltage executive circuit (1-2-1) is an alternating current solid-state relay or an electromagnetic relay;
the alternating current solid state relay is a high-speed high-power thyristor or a high-speed high-power insulated gate field effect transistor or a high-power insulated gate bipolar transistor;
the execution circuit of the low-voltage ultra-low-voltage protection circuit is a low-voltage execution circuit (1-2-2);
the output end of the driving circuit is electrically connected with the input end of the low-voltage execution circuit (1-2-2);
and the control direct-current circuit execution element in the low-voltage execution circuit (1-2-2) is a direct-current solid-state relay, a small PNP triode, a small NPN triode, a small-power thyristor, a small-power insulated gate field effect transistor or an optical coupling switch element.
9. An electromagnetic heater power supply capable of isolating heat dissipation according to claim 8, wherein:
the input end of the AC/DC sampling circuit (1-2-3) is electrically connected with the output end of an external power supply;
the output end of the external power supply is electrically connected with the power supply input end of the binding post (18) through the control output end of the high-voltage execution circuit (1-2-1);
a leakage switch (17), an ammeter (14), a voltmeter (13), a protective tube (19) and a power switch (10) are electrically connected between the control output end of the high-voltage execution circuit (1-2-1) and the power input end of the binding post (18);
a first power supply output end of the binding post (18) is electrically connected with a power supply input end of the variable-frequency power amplification circuit board (1-1);
the power supply output end of the variable frequency power amplification circuit board (1-1) is electrically connected with the electromagnetic heater gun head (20);
a second power supply output end of the binding post (18) is respectively and electrically connected with a power supply and a power supply input end of the relay combined circuit board (1-3), a power supply input end of the time relay (12) and a power supply input end of the power supply circuit board (1-5);
the power supply and relay combined circuit board (1-3) is electrically connected with an inner fan (21) of the electromagnetic heater gun head;
the power supply and relay combined circuit board (1-3) is electrically connected with an electromagnetic heater switch (22);
the power circuit boards (1-5) are electrically connected with two cooling fans (3) and a circulating fan (9);
the third power output end of the binding post (18) is electrically connected with the power input end of the ultra-low voltage protection circuit board (1-2);
the control output end of a low-voltage execution circuit (1-2-2) of the ultra-low-voltage protection circuit board (1-2) is electrically connected with the control input end of the control circuit board (1-4);
the power input end of the control circuit board (1-4) is electrically connected with the power output end of the power circuit board (1-5);
the frequency conversion signal output end of the control circuit board (1-4) is electrically connected with the frequency conversion signal input end of the frequency conversion power amplification circuit board (1-1);
the current feedback input end of the control circuit board (1-4) is electrically connected with the current feedback output end of the variable frequency power amplification circuit board (1-1);
the control circuit board (1-4) is electrically connected with a working state indicator lamp (11) and a potentiometer (15);
and the ultra-low voltage protection circuit board (1-2) is electrically connected with an ultra-low voltage state indicator lamp (23).
10. An electromagnetic heater power supply capable of isolating heat dissipation as defined in claim 9, wherein:
the ultra-low voltage protection circuit board (1-2) is a plate-shaped ultra-low voltage protector formed by a naked plate-shaped structure; or,
the ultra-low voltage protection circuit board (1-2) is packaged by a shell to form a cuboid or cubic ultra-low voltage protector;
the plate-shaped ultra-under-voltage protector is arranged in the sealing chamber (6);
the ultra-low voltage protector in a cuboid or cube shape is arranged on the wall of the case (4);
the wall of the case (4) is the outer side or the inner side of the front wall of the case (4); or,
the wall of the case (4) is the outer side surface or the inner side surface of the rear wall of the case (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921267427.2U CN210745827U (en) | 2019-08-07 | 2019-08-07 | Electromagnetic heater power supply capable of isolating and radiating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921267427.2U CN210745827U (en) | 2019-08-07 | 2019-08-07 | Electromagnetic heater power supply capable of isolating and radiating |
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| CN210745827U true CN210745827U (en) | 2020-06-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337226A (en) * | 2019-08-07 | 2019-10-15 | 佛山闽雄机电科技有限公司 | It is a kind of can isolation radiating electromagnetic heater power supply |
| CN113162200A (en) * | 2021-05-21 | 2021-07-23 | 苏州市新方纬电子有限公司 | DC-DC buck-boost charging current control system |
-
2019
- 2019-08-07 CN CN201921267427.2U patent/CN210745827U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337226A (en) * | 2019-08-07 | 2019-10-15 | 佛山闽雄机电科技有限公司 | It is a kind of can isolation radiating electromagnetic heater power supply |
| CN113162200A (en) * | 2021-05-21 | 2021-07-23 | 苏州市新方纬电子有限公司 | DC-DC buck-boost charging current control system |
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