CN210607717U

CN210607717U - Pin assembly and high-speed backplane connector

Info

Publication number: CN210607717U
Application number: CN201922212456.5U
Authority: CN
Inventors: 不公告发明人
Original assignee: Sichuan Huafeng Enterprise Group Co
Current assignee: Sichuan Huafeng Technology Co Ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-05-22
Anticipated expiration: 2029-12-11

Abstract

The utility model discloses a contact pin subassembly, including the plastic-sealed body and the signal needle that sets up in pairs, the signal needle is including playing the arm, contact segment and in order the needle, play the arm and be connected with the one end of contact segment, it is connected with the other end of contact segment to comply with the needle, the plastic-sealed body is with the partial contact segment plastic envelope of mated signal needle, and it is located the plastic-sealed external side to comply with the needle, high-speed back panel connector has still been disclosed, including casing A and casing B, casing A pegs graft in casing B, all install the contact pin subassembly in casing A and the casing B, and the contact pin subassembly in casing A and the casing B is reverse to peg graft, and casing A's the gap intussuseption that inserts between the end top and casing B's cell body bottom is filled with electrically conductive. The utility model has the advantages that: set up electrically conductive sponge for can form complete shielding ground after casing A and casing B peg graft, thereby reduced signal crosstalk, have very strong interference killing feature, contact pin subassembly moreover, contact stability is high, has guaranteed signal transmission's stability.

Description

Pin assembly and high-speed backplane connector

Technical Field

The utility model relates to a connector technical field, especially contact pin subassembly and high-speed back plate connector.

Background

The electrical connector not only needs to meet the general performance requirements, but also needs to meet the requirements of good contact, reliable operation and convenient maintenance.

The high-speed connector is used for large-scale communication equipment, ultrahigh-performance servers, supercomputers, industrial computers, high-end storage equipment and the like, and the market scale of the high-speed connector rapidly grows along with the rapid development of the communication, electronic and internet industries.

High speed connector is mainly through the grafting of public end and female end to realize the transmission of signal, but public end and female end need very big insertion force when pegging graft, insert the back moreover, also have very big internal stress on public end and the female end, and current public end and female end have the gap after the contact between its public end and the female end, thereby make the unable complete shielding ground of formation of connector, thereby cause certain influence to the transmission of signal.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a contact pin subassembly machine stable, that signal transmission is stable and provide a signal transmission is stable, shield effectual high-speed backplane connector.

The purpose of the utility model is realized through the following technical scheme: the contact pin assembly comprises a plastic package body and signal pins arranged in pairs, wherein the signal pins comprise elastic arms, contact sections and corresponding pins, the elastic arms are connected with one ends of the contact sections, the corresponding pins are connected with the other ends of the contact sections, the plastic package body is used for plastically packaging partial contact sections of the paired signal pins, and the corresponding pins are located on the outer side of the plastic package body.

Preferably, a deformation section is arranged between the elastic arm and the contact section, the elastic arm and the contact section are not in the same plane through the deformation section, and a contact head is arranged on the elastic arm far away from the contact section.

Preferably, the deformation segment is torn with a slit extending to the end of the contact.

Preferably, the plastic package body is provided with accommodating grooves in pairs, each accommodating groove is internally provided with a signal pin, and the contact part of the contact head protrudes out of the side wall of the accommodating groove.

High-speed backplane connector, including casing A and casing B, casing A pegs graft in casing B, all installs above-mentioned contact pin subassembly in casing A and the casing B, and contact pin subassembly in casing A and the reverse grafting of contact pin subassembly in the casing B, and the gap intussuseption between casing A's the end top of inserting and casing B's cell body bottom is filled with electrically conductive sponge.

Preferably, the side wall of the plastic package body in the shell A is in contact with the side wall of the plastic package body in the shell B, and the insertion end of the plastic package body is provided with a wedge-shaped surface.

Preferably, the contact surfaces of the shell A and the shell B and the PCB are uniformly provided with conductive sponges.

The utility model has the advantages of it is following:

the contact pin assembly of the utility model has convenient splicing and high contact stability, and ensures the stability of signal transmission;

the high-speed backplane connector of the utility model is provided with the conductive sponge, so that the shell A and the shell B can be connected through the conductive sponge, and the shell A and the shell B can form a complete shielding ground after being spliced, thereby reducing signal crosstalk, having strong anti-interference capability, and the conductive sponge can be completely rebounded after bearing a great deformation amount, and can be deformed only by a small force, thereby effectively reducing the insertion force of the connector and the internal stress after being spliced;

the utility model discloses a high-speed backplane connector, the equipartition is equipped with electrically conductive sponge on the contact surface of casing A and casing B and PCB board to make casing A and casing B through electrically conductive sponge can with the seamless contact of the ground connection wiring of PCB board, form 360 omnidirectional shielding ground planes, effectively protect the signal needle not disturbed by other signals or magnetic field.

Drawings

FIG. 1 is a schematic diagram of a high speed backplane connector;

FIG. 2 is a schematic structural view of a pin assembly;

FIG. 3 is a schematic structural diagram of a signal pin

FIG. 4 is a schematic view of the distribution of the conductive sponge;

in the figure, 1-shell A, shell B, 3-pin assembly, 4-conductive sponge, 31-plastic package body, 32-signal pin, 33-accommodating groove, 34-compliant pin, 35-contact section, 36-elastic arm, 37-contact head, 38-crack and 39-deformation section.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present invention, the embodiments and the features of the embodiments may be combined with each other without conflict.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which the products of the present invention are conventionally placed in use, or the position or positional relationship which the skilled person conventionally understand, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the reference is made must have a specific position, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, the high-speed backplane connector includes a housing a1 and a housing B2, wherein a1 is inserted into a housing B2, pin assemblies 3 are installed in both a housing a1 and a housing B2, and the pin assembly 3 in the housing a1 and the pin assembly 3 in the housing B2 are inserted in opposite directions, so that the pin assembly 3 in the housing a1 and the pin assembly 3 in the housing B2 are in contact with each other to realize signal transmission, further, a conductive sponge 4 is filled in a gap between the top of an insertion end of the housing a1 and the bottom of a slot body of the housing B2, the conductive sponge 4 can bear a great deformation amount, and can completely rebound after being deformed, and can be deformed with a very small force during deformation, so as to effectively reduce an insertion force of the connector and an internal stress after insertion, the conductive sponge 4 has excellent conductivity and gap filling capability, and can form a very complete shielding ground when used in this position, the gap between the insertion surface shielding grounds of the shell A1 and the shell B2, namely the gap between the male end and the female end of the high-speed connector is filled.

In this embodiment, as shown in fig. 2 and 3, the pin assembly 3 includes a plastic package body 31 and signal pins 32 arranged in pairs, each signal pin 32 includes a spring arm 36, a contact section 35 and a compliant pin 34, the spring arm 36 is connected to one end of the contact section 35, the compliant pin 34 is connected to the other end of the contact section 35, the plastic package body 31 plastic packages part of the contact section 35 of the signal pin 32 in pairs, and the compliant pin 34 is located outside the plastic package body 31, further, a deformation section 39 is arranged between the spring arm 36 and the contact section 35, the deformation section 39 separates the spring arm 36 and the contact section 35 in the same plane, the spring arm 36 far from the contact section 35 is higher than the contact section 35, the spring arm 36 close to the contact section 35 is lower than the contact section 35, so that the spring arm 36 is in a raised state, further, the spring arm 36 far from the contact section 35 is provided with a contact head 37, when two signal pins 32 are inserted in pairs, the contact heads 37 contact first, the elastic arm 36 is elastically deformed, the elastic restoring force of the elastic arm 36 is that when the signal pin 32 is inserted in place, the contact 37 is respectively contacted with the contact section 35 on the other signal pin 32, and the contact 37 is always contacted with the contact section 35 under the action of the elastic restoring force of the elastic arm 36, so that the transmission of signals is ensured, and after the signal pin 32 is inserted in place, the signal pin 32 has two contact points, as long as any one contact is provided, the transmission of signals can be ensured, further, the crack 38 is torn on the deformation section 39, and the crack 38 extends to the end part of the contact 37, so that the elastic arm 36 and the contact 37 are divided into two parts, so that when the two signal pins 32 are inserted in place, the four contact points are provided, as long as any one contact is provided, the transmission of signals can be ensured, so that the stability of high-speed backplane connector signal transmission is improved, and after the elastic arm 36 is divided into two parts, contact points are increased, and contact reliability is improved.

In this embodiment, the accommodating grooves 33 are formed in pairs on the plastic package body 31, each accommodating groove 33 has a signal pin 32 therein, and the contact portion of the contact 37 protrudes out of the side wall of the accommodating groove 33, further, the side wall of the plastic package body 31 in the housing a1 contacts with the side wall of the plastic package body 31 in the housing B2, and the insertion end of the plastic package body 31 is provided with a wedge surface, through which the two plastic package bodies 31 can be inserted into each other, in the process of inserting the plastic package bodies 31 into each other, the signal pins 32 in the plastic package bodies 31 are also aligned to realize signal transmission, and the side walls of the two inserted plastic package bodies 31 are in contact with each other, so that the aligned signal pins 32 can be coated, and further, the plastic package bodies 31 are made of an insulating material, so that the signal pins 32 are coated by the insulating material, thereby reducing signal crosstalk and ensuring stability of signal transmission.

In this embodiment, as shown in fig. 4, the conductive sponges 4 are uniformly disposed on the contact surfaces of the casing a1 and the casing B2 with the PCB, so that the casing a1 and the casing B2 can make seamless contact with the ground wiring of the PCB through the conductive sponges 4 to form a 360 ° omni-directional shielding ground layer, thereby effectively protecting the signal pins 32 from interference of other signals or magnetic fields.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. Contact pin subassembly, its characterized in that: including the plastic-sealed body and the signal needle that sets up in pairs, the signal needle includes bullet arm, contact segment and in pairs the needle, the bullet arm with the one end of contact segment is connected, it with the other end of contact segment is connected to comply with the needle, the plastic-sealed body will be in pairs the partial contact segment plastic envelope of signal needle, just it is located to comply with the needle the plastic-sealed body outside.

2. A pin assembly as recited in claim 1, wherein: and a deformation section is arranged between the elastic arm and the contact section, the elastic arm and the contact section are not in the same plane by the deformation section, and a contact head is arranged on the elastic arm far away from the contact section.

3. A pin assembly as recited in claim 2, wherein: the deformation section is torn with a slit, and the slit extends to the end of the contact head.

4. A pin assembly as recited in claim 3, wherein: the plastic package body is provided with accommodating grooves in pairs, each accommodating groove is internally provided with one signal pin, and the contact part of the contact head protrudes out of the side wall of the accommodating groove.

5. High-speed backplane connector, its characterized in that: the contact pin assembly comprises a shell A and a shell B, wherein the shell A is inserted into the shell B, the contact pin assemblies of any one of claims 1-4 are installed in the shell A and the shell B, the contact pin assemblies in the shell A and the contact pin assemblies in the shell B are inserted in opposite directions, and a gap between the top of an insertion end of the shell A and the bottom of a groove body of the shell B is filled with conductive sponge.

6. The high-speed backplane connector of claim 5, wherein: the plastic package body side wall in the shell A is in contact with the plastic package body side wall in the shell B, and a wedge-shaped surface is arranged at an insertion end of the plastic package body.

7. The high-speed backplane connector of claim 5 or 6, wherein: and conductive sponges are uniformly distributed on the contact surfaces of the shell A and the shell B and the PCB.