CN210604887U

CN210604887U - BGA chip rapid test fixture

Info

Publication number: CN210604887U
Application number: CN201921485161.9U
Authority: CN
Inventors: 李修录; 朱小聪; 尹善腾; 吴健全
Original assignee: Axd Anxinda Memory Technology Co ltd
Current assignee: Axd Anxinda Memory Technology Co ltd
Priority date: 2019-09-06
Filing date: 2019-09-06
Publication date: 2020-05-22
Anticipated expiration: 2029-09-06

Abstract

The utility model discloses a BGA chip quick test fixture, it is including tool body and clamp plate, be formed with the probe unit on the tool body, the probe of a plurality of vertical settings is fixed with in the probe unit, the top of probe is formed with spherical contact, spherical contact with the pin of BGA chip aligns one by one, works as the clamp plate BGA chip with when the tool body stacks in proper order, borrow by the pressure order that the clamp plate was applyed spherical contact with the pin of BGA chip supports tightly each other. The utility model discloses not only can accurately contact with the pin of BGA chip, still can improve efficiency of software testing, labour saving and time saving has better application prospect in chip testing process.

Description

BGA chip rapid test fixture

Technical Field

The utility model relates to a chip test fixture especially relates to a BGA chip quick test fixture.

Background

With the increasing refinement of chip processes, the requirements on chip size, integration level and frequency are higher and higher, and meanwhile, semiconductor production and test processes are also changing day by day, but highly complex chip designs are facing many challenges such as reliability and high quality. In the prior art, the jig for testing the BGA chip tests the chip through the probe in the needle cavity, for different types of chips, the pin positions of the chips are inconsistent, more time is needed to be spent in the testing process in order to ensure that the probe is aligned with the pin, the high-efficiency testing requirement cannot be met, the testing and production efficiency is low, moreover, some pins of the BGA chip are partially provided with solder balls, and some pins are not provided with solder balls, and the good contact between the probe and the pins of the chip cannot be ensured in the testing process.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to prior art's not enough, provide one kind can with the pin of BGA chip accurate contact, can improve efficiency of software testing, labour saving and time saving's quick test fixture of BGA chip.

In order to solve the technical problem, the utility model adopts the following technical scheme.

The utility model provides a BGA chip quick test fixture, its is including tool body and clamp plate, be formed with the probe unit on the tool body, the probe unit internal fixation has the probe of a plurality of vertical settings, the top of probe is formed with spherical contact, spherical contact with the pin of BGA chip aligns one by one, works as the clamp plate BGA chip with when the tool body stacks in proper order, borrows by the pressure order that the clamp plate was applyed spherical contact with the pin of BGA chip supports tightly each other.

Preferably, the plurality of probes are distributed in an array.

Preferably, the bottom of the jig body is provided with an adapter plate, and the adapter plate is electrically connected between the probe and an external test circuit.

Preferably, the diameter of the ball contact is larger than the diameter of the probe.

Preferably, the top of the jig body is provided with a positioning notch matched with the BGA chip, and the probe unit is located at the bottom of the positioning notch.

Preferably, the positioning notch is a square positioning notch or a rectangular positioning notch.

Preferably, the pressing plate covers the positioning notch.

Preferably, two opposite inner walls of the positioning notch are respectively provided with a clearance notch.

In the BGA chip rapid test fixture disclosed by the utility model, a plurality of probes are arranged on a fixture body made of insulating materials, when the BGA chip is placed on the fixture body, the spherical contacts are aligned with the pins of the BGA chip one by one, and the top ends of the probes are provided with the spherical contacts which can ensure that the probes are in good contact with the pins of the BGA chip, thereby improving the reliability of the electrical connection relation, when the pressing plate applies pressure to the spherical contacts, the spherical contacts can be in close contact with the pins of the BGA chip because the probes have elasticity which can generate a small amount of deformation, even if the pins of the BGA chip do not have solder balls, the spherical contacts can be tightly abutted with the corresponding pins under the action of the pressure, and the utility model can be seen based on the principle, not only can be accurately contacted with the pins of the BGA chip, the test efficiency can be improved, time and labor are saved in the chip test process, and the method has a good application prospect.

Drawings

FIG. 1 is a schematic diagram of a BGA chip rapid test fixture of the present invention;

fig. 2 is a schematic structural view of a probe unit.

Detailed Description

The present invention will be described in more detail with reference to the accompanying drawings and examples.

The utility model discloses a BGA chip quick test fixture, it is shown with fig. 2 in combination with figure 1, it is including tool body 1 and clamp plate 2, be formed with probe unit 3 on the tool body 1, probe unit 3 internal fixation has probe 4 of a plurality of vertical settings, probe 4's top is formed with spherical contact 40, spherical contact 40 with the pin of BGA chip aligns one by one, works as clamp plate 2 the BGA chip with when tool body 1 stacks in proper order, borrow by the pressure order that clamp plate 2 applyed spherical contact 40 with the pin of BGA chip supports tightly each other.

In the above-mentioned jig, set up a plurality of probes 4 on the jig body 1 of the insulating material, when the said BGA chip is placed on the said jig body 1, the said ball contact 40 aligns with pin of the said BGA chip one by one, and the top of the probe 4 has ball contact 40, this ball contact 40 can make the probe 4 contact well with pin of the said BGA chip, and then improve the reliability of the electric connection relation, when the said pressing plate 2 exerts pressure to the said ball contact 40, because the said probe 4 has elasticity that can take place a small amount of deformations, can make the said ball contact 40 contact closely with pin of the said BGA chip, even the pin of the said BGA chip does not have tin balls, can make the said ball contact 40 support closely with corresponding pin under the pressure, it is visible based on the above-mentioned principle, the utility model not only can contact with pin of BGA chip accurately, the test efficiency can be improved, time and labor are saved in the chip test process, and the method has a good application prospect.

As a preferred structure, the plurality of probes 4 are arranged in an array.

In order to connect the probe 4 with a predetermined test circuit, in this embodiment, an adapter plate (not labeled) is disposed at the bottom of the fixture body 1, and the adapter plate is electrically connected between the probe 4 and an external test circuit.

In this embodiment, on the basis of ensuring that the probe 4 has a certain elasticity, it is also considered that the ball-shaped contact 40 has a sufficient size to make good contact with the chip pin, for this reason, in this embodiment, the diameter of the ball-shaped contact 40 is larger than that of the probe 4.

In order to play a role of bearing a chip, in this embodiment, the top of the jig body 1 is provided with a positioning notch 5 matched with the BGA chip, and the probe unit 3 is located at the bottom of the positioning notch 5. Under the effect of above-mentioned location notch 5, help putting into the chip fast, and then improve efficiency of software testing.

As a preferred structure, the positioning notch 5 is a square positioning notch or a rectangular positioning notch.

For better pressure application, in the present embodiment, the pressure plate 2 covers the positioning notch 5.

In order to facilitate taking and placing the chip, in this embodiment, two opposite inner walls of the positioning notch 5 are respectively provided with clearance notches 6. The two clearance notches 6 help to extend into a fixture or the like for handling when picking and placing chips.

The utility model discloses a BGA chip tests tool fast, its beneficial effect who compares prior art lies in, the utility model discloses the preferred probe that adopts and to have the button head, in practical application, this type of probe can be changed, and the maintenance is got up convenient and fast to reduce the cost. And simultaneously, the utility model discloses test BGA chip that can high frequency owing to adopted the structure that the kickboard compressed tightly to reduced the operation difficulty degree of testing process, no matter there is the tin ball at the bottom of BGA chip and can all test. Secondly, the utility model discloses a high accuracy's positioning groove hole can guarantee chip accurate positioning, has adopted the clamp plate formula structure moreover, can keep firm, even pressure when pushing down, can avoid taking place activity, skew etc. in the testing process to measurement accuracy and efficiency of software testing have been improved.

The above is only the embodiment of the present invention, and is not intended to limit the present invention, and all modifications, equivalent replacements or improvements made within the technical scope of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a BGA chip fast test tool, its characterized in that, including tool body and clamp plate, be formed with the probe unit on the tool body, the probe unit internal fixation has the probe of a plurality of vertical settings, the top of probe is formed with spherical contact, spherical contact with the pin of BGA chip aligns one by one, works as the clamp plate BGA chip with when the tool body stacks in proper order, borrows by the pressure order that the clamp plate was applyed spherical contact with the pin of BGA chip supports tightly each other.

2. The BGA chip rapid test fixture of claim 1, wherein the plurality of probes are distributed in an array.

3. The BGA chip rapid test fixture of claim 1, wherein an adapter plate is disposed at a bottom of the fixture body, and the adapter plate is electrically connected between the probe and an external test circuit.

4. The BGA chip rapid test fixture of claim 1, wherein said ball contacts have a diameter greater than a diameter of said probes.

5. The BGA chip rapid test fixture of claim 1, wherein the fixture body has a top portion defining a positioning notch for mating with the BGA chip, and the probe unit is located at a bottom portion of the positioning notch.

6. The BGA chip rapid test fixture of claim 5, wherein the positioning notch is a square positioning notch or a rectangular positioning notch.

7. The BGA chip rapid test fixture of claim 6, wherein the pressure plate covers the positioning notch.

8. The BGA chip rapid test fixture of claim 6, wherein two opposite inner walls of the positioning notch are respectively provided with a clearance notch.