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CN210537155U - Housing for protecting a controller - Google Patents

Housing for protecting a controller Download PDF

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Publication number
CN210537155U
CN210537155U CN201920586653.0U CN201920586653U CN210537155U CN 210537155 U CN210537155 U CN 210537155U CN 201920586653 U CN201920586653 U CN 201920586653U CN 210537155 U CN210537155 U CN 210537155U
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CN
China
Prior art keywords
controller
casing
housing
upper shell
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920586653.0U
Other languages
Chinese (zh)
Inventor
周自成
章健勇
王庆锋
李凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIO Co Ltd
Original Assignee
NIO Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIO Co Ltd filed Critical NIO Co Ltd
Priority to CN201920586653.0U priority Critical patent/CN210537155U/en
Application granted granted Critical
Publication of CN210537155U publication Critical patent/CN210537155U/en
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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application provides an outer shell for protecting controller, the shell includes casing and lower casing, and the interior border department of going up the casing is equipped with step portion, step portion extends along the circumference of last casing, and step portion with the outer fringe electricity of the PCB board of controller is connected to and the outer fringe department of the internal surface of casing is equipped with the arch down to the casing orientation, go up the casing orientation down the external edge department of the internal surface of casing be equipped with protruding complex recess, when last casing and casing zonulae occludens down, be equipped with the clearance between arch and the recess, the clearance is filled by sealed glue.

Description

Housing for protecting a controller
Technical Field
The present application relates to a controller for a vehicle, and in particular to a housing for protecting the controller.
Background
The vehicle control unit is used as an important electronic control unit of the vehicle, and plays an important role in normal and safe running of the vehicle. Therefore, the stability of the entire vehicle controller is highly required. The design of the housing of the vehicle control unit ensures a good environment for the stable operation of the electronic unit of the controller. Reasonable sealing, anti-interference and heat dissipation design are the key points for ensuring the good working environment.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem of the heat dissipation of the vehicle control unit of arranging in the vehicle front cabin, sealed, preventing the high frequency radiation interference better, the application provides a shell for protecting the controller, the shell includes casing and lower casing, and the inner margin department of going up the casing is equipped with step portion, step portion extends and at least partially surrounds the casing along the circumference of last casing, wherein step portion with the outer fringe electricity of the PCB board of controller is connected to and the outer border department of the internal surface of casing is equipped with the arch down to the casing orientation down, go up the casing orientation down the internal surface of casing the outer border department be equipped with protruding complex recess, when last casing and lower casing zonulae occludens, be equipped with the clearance between arch and the recess, the clearance is filled by sealed glue.
Preferably, according to an embodiment of the present application, a heat dissipation material layer is disposed between the inner surface of the upper housing and the chip of the controller, and the chip is in thermal communication with the upper housing through the heat dissipation material layer.
Preferably, the heat dissipation material layer is heat dissipation silica gel.
Preferably, according to an embodiment of the present application, a conductive material layer is disposed between the stepped portion and an outer edge of the PCB board of the controller, and a minimum current path is formed between the upper case and the PCB board when the upper case and the lower case are closely coupled.
Preferably, the layer of conductive material is a conductive sponge.
Preferably, according to an embodiment of the present application, the outer surface of the upper shell is provided with a heat dissipation structure, and the heat dissipation structure is a fin.
Preferably, according to an embodiment of the present application, the sealant is a polymer sealant material.
Preferably, according to an embodiment of the present application, the housing is metallic.
According to another aspect of the present application, there is also provided a vehicle comprising a controller and a controller housing as described above.
Through the multi-point conductive contact design between the upper shell and the lower shell made of metal and the PCB, a cage-shaped shielding cover is formed, so that the probability that the controller is interfered by radio frequency signals is greatly reduced. In addition, the sealing effect of the controller under severe working conditions of severe vibration, strong external force and the like is not easy to lose effectiveness due to the matching design of the sealing glue filling type shell bulge and the groove. In addition, the reasonable chip-shell contact and fin design ensures good heat dissipation of the controller, thereby further ensuring that the working temperature of the controller is in a normal range and the controller stably operates.
Drawings
The above and other objects and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which like or similar elements are designated by like reference numerals.
Fig. 1 schematically shows a housing according to an embodiment of the present application.
List of reference numerals
1 upper shell
2 lower casing
3 controller electronic unit
5 Heat sink Material layer
6 chip
7 step part
8 layer of conductive material
9 PCB board
10 projection
11 groove
Detailed Description
The following is a description of exemplary embodiments of the present application, examples of which are illustrated in the accompanying drawings.
For the purposes of brevity and explanation, the principles of the present application are described herein with reference primarily to exemplary embodiments thereof. However, those skilled in the art will readily recognize that the same principles are equally applicable to all types of controller housings and that these same principles can be implemented therein, with any such variations not departing from the true spirit and scope of the present patent application. Moreover, in the following description, reference is made to the accompanying drawings that illustrate certain exemplary embodiments. Electrical, mechanical, logical, and structural changes may be made to these embodiments without departing from the spirit and scope of the application. In addition, while a feature of the present application may have been disclosed with respect to only one of several implementations/embodiments, such feature may be combined with one or more other features of the other implementations/embodiments as may be desired and/or advantageous for any given or identified function. The following description is, therefore, not to be taken in a limiting sense, and the scope of the present application is defined by the appended claims and their equivalents.
It should be noted that, in the present application, the terms "upper" and "lower" refer to the upper and lower directions relative to the controller housing in the normal use state, without any limitation to the contrary. Further, the inner surface refers to a surface of the controller case facing the controller in actual use, and the outer surface refers to a surface of the controller case facing the external environment in actual use.
As shown in fig. 1, the housing of the controller for a vehicle includes an upper case 1 and a lower case 2, wherein the upper case 1 and the lower case 2 are respectively disposed above and below a controller electronic unit 3, and are fitted with the shapes of the upper surface and the lower surface of the controller electronic unit 3. According to one embodiment of the present application, the upper case 1 and the lower case 2 may be made of metal, particularly, aluminum alloy.
The upper case 1 includes an inner edge and an outer edge, a step portion 7 is provided at the inner edge, and the step portion 7 extends in the circumferential direction of the upper case 1. In one embodiment, the step 7 may be provided around part of the inner edge of the upper case 7 or around the entire inner edge of the upper case. The inner surface of the stepped portion 7 is electrically connected to the periphery of the outer edge of a PCB board 9 (Printed circuit board) of the controller.
In one embodiment, a layer of conductive material 8 is provided between the inner surface of the step 7 and the outer edge of the PCB board of the controller. The inner surface of the step portion 7 is connected to the conductive material layer 8 and further closely connected to a copper leakage ground region around the outer edge of the PCB board 9, so that a minimum current path is formed between the case and the PCB board when the upper case 1 and the lower case 2 are closely connected. Therefore, the shell and the PCB of the controller form multi-point contact, and the high-frequency radiation interference resistance of the shell is improved.
The conductive material layer 8 may be a flexible material having an electrical conductivity, such as a conductive sponge.
Referring to fig. 1 again, the outer edge of the inner surface of the lower casing 2 facing the upper casing 1 is provided with a protrusion 10, and the outer edge of the inner surface of the upper casing 1 facing the lower casing 2 is provided with a groove 11 which is matched with the protrusion 10 in shape. The protrusion 10 and the groove 11 may have a semicircular, square, triangular, trapezoidal, wedge-like shape, etc. The protrusion 10 and the groove 11 may be provided around a part of the outer edge of the housing or around the entire outer edge of the housing.
Furthermore, according to another embodiment of the present application, the projection and the groove may be provided in an opposite manner, i.e., the projection is provided on the upper case and the groove is provided on the lower case.
When the upper case 1 and the lower case 2 are tightly coupled, as shown in fig. 1, a gap is provided between the protrusion 10 and the groove 11, and the gap is filled with a sealant. According to one embodiment of the application, during the assembly process, a proper amount of sealant is firstly injected into the groove 11, then the protrusion 10 is assembled with the groove 11, the sealant is squeezed to fill the gap, and good sealing is obtained after curing.
The sealant can be a high-molecular sealing material and other materials with good toughness. Because the upper shell and the lower shell are not in rigid contact, and the sealant has good toughness, in the later use process of the controller, even the fit deviation caused by strong vibration or the fit size deviation of the upper shell and the lower shell caused by uneven heating can be eliminated through the sealant gap, thereby ensuring the stable sealing performance in the life cycle of the controller shell.
As shown in fig. 1, a heat dissipation material layer 5 is disposed between an inner surface of the upper case 1 and a chip 6 of the controller, and the chip 6 is thermally conducted with the upper case 1 through the heat dissipation material layer 5. The heat dissipation material layer 5 may be a material having a heat conduction capability, such as heat dissipation silicone.
According to an embodiment of the present application, the outer surface of the upper casing 1 is further provided with a heat dissipation structure, which may be a fin. Chip 6 is through high performance heat dissipation silica gel and last casing intercommunication, goes up the casing and passes through the fin that sets up at the surface to the external environment natural convection heat dissipation to guarantee that the operating temperature of chip is in normal range.
The foregoing description is exemplary rather than defined as being limited thereto. Various non-limiting embodiments are disclosed herein, however, one of ordinary skill in the art would recognize that, based on the teachings above, various modifications and alterations would come within the scope of the appended claims. It is, therefore, to be understood that within the scope of the appended claims, disclosure other than the specific disclosure may be practiced. For that reason the following claims should be studied to determine true scope and content.

Claims (8)

1. The shell for protecting the controller is characterized by comprising an upper shell and a lower shell, wherein a step part is arranged at the inner edge of the upper shell, the step part extends along the circumferential direction of the upper shell and at least partially surrounds the upper shell, the step part is electrically connected with the outer edge of a PCB (printed circuit board) of the controller, and
lower casing orientation the outward flange department of the internal surface of epitheca is equipped with the arch, the epitheca orientation the outward flange department of the internal surface of epitheca is equipped with down with protruding complex recess, work as the epitheca with during casing zonulae occludens, protruding with be equipped with the clearance between the recess, the clearance is filled by sealed glue.
2. The housing of claim 1, wherein a layer of heat sink material is disposed between the inner surface of the upper shell and the chip of the controller, the chip being in thermal communication with the upper shell through the layer of heat sink material.
3. The housing of claim 2, wherein the layer of heat dissipating material is a heat dissipating silicone.
4. The housing of claim 1, wherein a layer of conductive material is provided between the stepped portion and an outer edge of a PCB board of the controller, and a minimum current path is formed between the upper case and the PCB board when the upper case and the lower case are closely coupled.
5. The enclosure of claim 4, wherein the layer of conductive material is a conductive sponge.
6. The enclosure of claim 1, wherein the outer surface of the upper shell is provided with heat dissipating structures, the heat dissipating structures being fins.
7. The housing of claim 1, wherein the sealant is a polymeric sealant material.
8. The housing of claim 1, wherein the housing is metallic.
CN201920586653.0U 2019-04-26 2019-04-26 Housing for protecting a controller Active CN210537155U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920586653.0U CN210537155U (en) 2019-04-26 2019-04-26 Housing for protecting a controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920586653.0U CN210537155U (en) 2019-04-26 2019-04-26 Housing for protecting a controller

Publications (1)

Publication Number Publication Date
CN210537155U true CN210537155U (en) 2020-05-15

Family

ID=70592704

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920586653.0U Active CN210537155U (en) 2019-04-26 2019-04-26 Housing for protecting a controller

Country Status (1)

Country Link
CN (1) CN210537155U (en)

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