CN210345949U - Radiation refrigeration thin slice structure - Google Patents
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- CN210345949U CN210345949U CN201920810326.9U CN201920810326U CN210345949U CN 210345949 U CN210345949 U CN 210345949U CN 201920810326 U CN201920810326 U CN 201920810326U CN 210345949 U CN210345949 U CN 210345949U
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- 230000005855 radiation Effects 0.000 title claims abstract description 47
- 238000005057 refrigeration Methods 0.000 title claims abstract description 42
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 238000002310 reflectometry Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims 2
- 238000010304 firing Methods 0.000 abstract 3
- 239000000463 material Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
The utility model discloses a radiation refrigeration thin slice structure, including the bottom, finish coat and seal structure, seal structure encircles the setting between bottom and finish coat, thereby at the bottom, form sealed chamber between finish coat and the seal structure, the bottom includes by interior firing layer and the heat-conducting layer that sets gradually outside to, the heat-conducting layer is suitable for to set up treating cooling object surface, the emissivity of firing layer at 7 mu m ~14 mu m wave band is greater than 0.8, the coefficient of heat conductivity of heat-conducting layer is greater than the coefficient of heat conductivity of firing layer and seal structure. The utility model discloses a radiation refrigeration thin slice structure is because the existence of heat-conducting layer, and it is efficient to the cooling of object, can transmit the cold volume of transmitting layer effectively to treating the cooling object.
Description
Technical Field
The utility model relates to a radiation refrigeration technology field especially relates to a radiation refrigeration thin slice structure.
Background
The atmosphere gas mainly comprises water vapor, carbon dioxide and ozone, and the three gases have low absorptivity and emissivity in a wave band of 7-14 μm, namely high transmissivity, and the wave band is called as an atmospheric window. The temperature of the outer space is close to absolute zero, so that the outer space is a huge cold source relative to the earth surface, and objects on the ground perform radiation heat exchange with the outer space with extremely low temperature through an atmospheric window wave band so as to achieve a certain refrigeration effect, namely radiation refrigeration.
The application of the radiation refrigeration technology to building energy conservation is a research hotspot in the field of radiation refrigeration at present. However, the research on the radiation refrigeration structure is still relatively small, and the applicability, the refrigeration efficiency and the like of the existing radiation refrigeration structure still need to be improved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a radiation refrigeration thin slice structure with good refrigeration effect.
Another object of the utility model is to provide a wide applicability's radiation refrigeration thin slice structure.
According to the utility model discloses an aspect provides a radiation refrigeration thin slice structure, including bottom, top facing and seal structure, seal structure encircles the setting and is in the bottom with between the top facing, thereby the bottom the top facing and form sealed chamber between the seal structure, the bottom includes the launching layer and the heat-conducting layer that set gradually from inside to outside, the heat-conducting layer is suitable for to set up and treats cooling object surface, the emissivity of launching layer at 7 mu m ~14 mu m wave band is greater than 80%, the coefficient of heat conduction of heat-conducting layer is greater than the launching layer and the coefficient of heat conduction of seal structure.
In one embodiment, a reflecting layer is arranged between the emitting layer and the heat conducting layer, and the reflectivity of the reflecting layer in visible light and near infrared bands is larger than 85%.
In one embodiment, the edges of the thermally conductive layer extend to the outside of the emissive layer and the reflective layer, and the sealing structure is disposed on the thermally conductive layer, with the emissive layer and the reflective layer being on the inside of the sealing structure.
In one embodiment, the edge of the heat conductive layer extends to the outside of the emission layer, and the sealing structure is disposed on the heat conductive layer, and the emission layer is inside the sealing structure.
In one embodiment, the outer surface of the heat conductive layer has a concave-convex structure.
In one embodiment, the height difference between the concave-convex structure and the surface of the heat conducting layer is 1 μm to 10 mm.
In one embodiment, the vacuum degree of the sealed cavity is less than 10 Pa.
In one embodiment, the distance between the bottom layer and the top layer is 1 mm-20 cm.
In one embodiment, the emission layer comprises a base material and radiation refrigeration particles dispersed in the base material, the particle size of the radiation refrigeration particles is 1-15 μm, and the radiation refrigeration particles are selected from a mixture of one or more of the following: SiC, Si3N4、SiO2、TiO2、BaSO4、CaCO3And glass beads.
In one embodiment, the emission layer comprises a base material and radiation refrigeration particles dispersed in the base material, the base material is transparent resin, and the haze of the emission layer is adjustable within the range of 1% -90%.
In one embodiment, the bottom layer is flexible, the heat conduction layer is a flexible heat conduction material, the heat conduction layer comprises a resin base material and high heat conduction fillers dispersed in the resin base material, or the heat conduction layer is a graphene composite film.
In one embodiment, the top layer is flexible, a support structure is further arranged between the bottom layer and the top layer, the support structure is located in the sealing cavity, and the upper end and the lower end of the support structure are respectively in contact with the top layer and the bottom layer.
In one embodiment, the covering layer is flexible transparent resin, and the transmittance of the covering layer in a wave band of 7-14 microns is not lower than 85%.
Compared with the prior art, the beneficial effects of the utility model reside in that: the radiation refrigeration thin slice structure of the utility model has high cooling efficiency to the object due to the existence of the heat conduction layer, and can effectively transmit the cooling capacity of the emission layer to the object to be cooled; by arranging the reflecting layer, the reflecting and isolating capacity of the radiation refrigeration sheet structure can be further improved, and the cooling effect is improved; each layer of the bottom layer can be made of flexible materials, so that the radiation refrigeration sheet structure can be well attached to the surfaces of various shapes, and the application range of the radiation refrigeration sheet structure can be expanded.
The above and other advantages of the present invention will be further clarified in the following description.
Drawings
FIG. 1 is a longitudinal cross-sectional view of a first embodiment of a radiation-cooled sheet structure;
FIG. 2 is a longitudinal cross-sectional view of a second embodiment of a radiation-cooled sheet structure;
FIG. 3 is a longitudinal cross-sectional view of a third embodiment of a radiation-cooled sheet structure;
FIG. 4 is a cross-sectional view of one embodiment of a radiation-cooled sheet structure;
FIG. 5 is a cross-sectional view of another embodiment of a radiation-cooled sheet structure;
FIG. 6 illustrates an embodiment of a radiation-cooled sheet structure disposed on an arcuate outer surface of an object;
in the figure: 1. a bottom layer; 2. a top coat layer; 3. a sealing structure; 4. sealing the cavity; 5. a support structure; 6. an object to be cooled;
11. an emission layer; 12. a reflective layer; 13. a thermally conductive layer.
Detailed Description
The present invention will be further described with reference to the following detailed description, and it should be noted that, in the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
In the description of the present invention, it should be noted that, for the orientation words, if there are terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and positional relationship indicated are based on the orientation or positional relationship shown in the drawings, and only for the convenience of describing the present invention and simplifying the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and not be construed as limiting the specific scope of the present invention.
The utility model provides a radiation refrigeration thin slice structure, including bottom 1, finish coat 2 and seal structure 3, bottom 1 and finish coat 2 set up with spacing each other, and seal structure 3 encircles the setting between bottom 1 and finish coat 2 to form sealed chamber 4 between bottom 1, finish coat 2 and seal structure 3.
Fig. 1, 2, 3, 6 show longitudinal sectional views of several embodiments of a radiation-cooled sheet structure, wherein a bottom layer 1 is adapted to be arranged on the surface of an object 6 to be cooled, and a sealing structure 3 serves to support the top layer 2 on the one hand and to seal the gap between the bottom layer 1 and the top layer 2 on the other hand, thereby ensuring good sealing properties of the sealed cavity 4.
Fig. 4 and 5 show cross-sectional views of several embodiments of the radiation-cooling sheet structure, in which the bottom layer 1 and the top layer 2, not shown in the figures, are located on the inside and outside of the paper, respectively, and the sealing structure 3 is formed in a closed loop so as to surround, so that the sealing structure 3 forms the side wall of the sealed chamber 4, and the bottom layer 1 and the top layer 2 form the bottom and top surfaces of the sealed chamber 4, respectively. It should be noted that the shape surrounded by the sealing structure 3 in fig. 4 and 5 is only an illustration, and the surrounding shape of the sealing structure 3 is not limited to the shape shown in the drawings, and may be a rectangle, a circle, an irregular shape, etc., which is not limited by the present invention.
The bottom layer 1 comprises an emitting layer 11 and a heat conducting layer 13 which are arranged from inside to outside in sequence. It should be noted that, in the present invention, "inner" means a side close to the sealed cavity 4, and "outer" means a side far from the sealed cavity 4.
The emissive layer 11 includes a substrate and radiation-cooling particles dispersed in the substrate. The radiation refrigeration particles have high emissivity in a wave band of 7-14 microns, so that the emission layer 11 can efficiently emit heat of the emission layer in a form of electromagnetic waves of 7-14 microns, the emissivity of the emission layer 11 in the wave band of 7-14 microns is more than 80%, and preferably, the emissivity of the emission layer 11 in the wave band of 7-14 microns is more than 0.9. In some embodiments of the present invention, the,the particle size of the radiation refrigeration particles is 1-15 mu m, and the radiation refrigeration particles can be, but are not limited to SiC and Si3N4、SiO2、TiO2、BaSO4、CaCO3And glass beads. In some embodiments, the emissive layer 11 has a thickness of 1 μm to 30 μm.
It is worth mentioning that "emissivity" as used in the present invention with respect to a material or structure refers to its effectiveness in emitting energy formed in electromagnetic radiation, a perfect black body emitter being defined as having an emissivity of 1, and a perfect non-emitter being defined as having an emissivity of zero. By "high emissivity" as used herein is meant that the material or structure has an emissivity in this range of greater than about 80%.
In some embodiments, the base material of the emission layer 11 is a base material with good light transmittance, the haze of the emission layer 11 is related to the content of the radiation refrigeration particles in the base material, the haze of the emission layer 11 is adjustable within 1% to 90%, and the higher the content of the radiation refrigeration particles in the base material is, the higher the haze of the emission layer 11 is. Increasing the haze of the emissive layer 11 can reduce the specular reflectivity of the radiation-cooled sheet structure, which is beneficial to reducing light pollution.
The heat conduction layer 13 has high heat conductivity coefficient, the heat conduction layer can rapidly transfer the heat of the object 6 to be cooled to the emission layer 11, the radiation refrigeration efficiency is improved, the heat conductivity coefficient of the heat conduction layer 13 is larger than 1W/m ∙ K, preferably, the heat conductivity coefficient of the heat conduction layer 13 is larger than 10W/m ∙ K, and more preferably, the heat conductivity coefficient of the heat conduction layer 13 is larger than 100W/m ∙ K.
In some embodiments, the outer surface of the heat conduction layer 13 has a concave-convex structure, as shown in fig. 2 or 3, the concave-convex structure increases the surface area of the heat conduction layer 13, and when the surface of the object 6 to be cooled has a certain deformability, or the object 6 to be cooled has a concave-convex surface matched with the surface of the heat conduction layer 13, the concave-convex structure on the surface of the heat conduction layer 13 can increase the contact area between the heat conduction layer 13 and the object to be cooled, thereby facilitating the improvement of the heat conduction efficiency. Preferably, the height difference between the concave-convex structure and the surface of the heat-conducting layer is 1 μm to 10 mm.
In some embodiments, a reflective layer 12 is further disposed between the reflective layer 11 and the heat conductive layer 13, as shown in fig. 2 or 3, the reflective layer 12 is used for reflecting solar rays and performing a reflective heat insulation function, and the reflectivity of the reflective layer 12 in visible light and near infrared bands is greater than 85%. The reflective layer 12 may be, but is not limited to, a metallic reflective layer (e.g., Al, Ag), a ceramic reflective layer (e.g., alumina, etc.), a thin film reflective layer, etc. The thickness of the reflective layer 12 is 10nm to 500 nm. Preferably, the reflective layer 12 also has a high thermal conductivity so that heat conduction can be rapidly carried out between the heat conductive layer 13 and the emission layer 11.
The top coat 2 has high transmittance in the 7-14 μm band, so that the top coat 2 does not influence the emitting layer 11 to emit 7-14 μm electromagnetic wave outwards. The material of overcoat 2 can be, but is not limited to, plastic, glass, and the like. In some embodiments, the transmittance of the overcoat 2 in the wavelength band of 7 μm to 14 μm is not less than 85%, and preferably, the transmittance of the overcoat 2 in the wavelength band of 7 μm to 14 μm is not less than 95%.
The sealed cavity 4 formed between the bottom layer 1 and the top layer 2 can prevent air convection from reducing the cooling efficiency of the emitting layer 11, and can also play a role of heat insulation. In some embodiments, the vacuum level of the sealed chamber 4 is less than 10Pa, preferably the vacuum level of the sealed chamber 4 is less than 1Pa, and more preferably the vacuum level of the sealed chamber 4 is less than 0.1 Pa. The distance between bottom 1 and top facing 2 is 1mm ~20cm, and the two distances are big more, and the thermal-insulated effect of sealed chamber 4 is better, but the distance between bottom 1 and the top facing 2 should not too big yet, otherwise prevents that the effect of air convection from can declining. Preferably, the distance between the bottom layer 1 and the top layer 2 is 2 mm-10 cm. More preferably, the distance between the bottom layer 1 and the top layer 2 is 5 mm-5 cm. Further preferably, when the closed space is filled with gas, the distance between the bottom layer 1 and the top layer 2 is 5 mm-10 mm, which can prevent the gas inside the closed space from convection due to temperature difference, and further avoid heat exchange between the bottom layer 1 and the top layer 2 through the gas.
The sealing structure 3 has a low thermal conductivity so that the heat conduction between the top layer 2 to the bottom layer 1 is small and substantially negligible.
In some embodiments, sealing structure 3 is a unitary member, and as shown in fig. 1-6, sealing structure 3 surrounds to form a closed loop that is disposed between base layer 1 and overcoat layer 2. The sealing structure 3 may be made of rubber, teflon, cork, leather, asbestos, etc., and the sealing structure 3 may be connected and sealed with the bottom layer 1 and the cover layer 2 by an adhesive.
It will be understood by those skilled in the art that the sealing structure 3 is not limited to being formed of a single member, but may be formed of a plurality of members, some of which perform a supporting function, others of which perform a sealing function, and others of which perform a heat insulating function.
In some embodiments, as shown in fig. 1, 2 or 3, the edge of the thermally conductive layer 13 extends to the outside of the emissive layer 11 and the reflective layer 12 (when the reflective layer 12 is not included, the edge of the thermally conductive layer 13 extends to the outside of the emissive layer 11), the sealing structure 3 is disposed on the thermally conductive layer 13, and the emissive layer 11 and the reflective layer 12 are on the inside of the sealing structure 3 (when the reflective layer 12 is not included, the emissive layer 11 is on the inside of the sealing structure 3). Since the sealing structure 3 has a low thermal conductivity, it is possible to prevent the cold from being consumed from the peripheral side of the radiation-cooling sheet structure.
The base layer 1 and the top layer 2 may be rigid or flexible. When the bottom layer 1 and the cover layer 2 are both rigid, the radiation refrigeration sheet structure has better self-supporting capability, and is convenient to mount when used for objects with flat surfaces; however, for some objects with uneven or curved surfaces, the radiation-cooling sheet structure has poor surface conformability to other objects, making it difficult for the heat conductive layer 13 to perform its function. When bottom 1 is flexible, radiation refrigeration thin slice structure all has good laminating ability with various surfaces, and the area of contact of heat-conducting layer 13 and the object of waiting to cool down can realize the maximize, therefore its radiation refrigeration effect is better.
It should be noted that the term "flexible" in the present invention also includes elastic.
In some embodiments, the heat conductive layer 13 is a flexible heat conductive material, and the heat conductive layer 13 includes a resin base material and a high heat conductive filler dispersed in the resin base material, the resin base material ensures that the heat conductive layer 13 has a certain flexibility, and the high heat conductive filler improves the heat conductive performance of the heat conductive layer 13. The resin substrate of the heat conductive layer 13 may be, but is not limited to, rubber, high elastic plastic, etc., and the high heat conductive filler may be, but is not limited to, metal nanoparticles, nano zinc oxide, nano boron nitride, carbon nanotubes, nano carbon fibers, graphene, nano layered metal oxide, etc.
In other embodiments, the thermally conductive layer 13 is a flexible graphene composite film. Preferably, the heat conducting layer 13 is made of a carbon nanotube/graphene composite film, and the thermal conductivity of the carbon nanotube/graphene composite film can reach more than 1000W/m ∙ K. In some embodiments, the emission layer 11 is a flexible film, and the substrate of the emission layer 11 may be, but is not limited to, PET, PBT, TPX, PC, PE, PP, PVC, PMMA, PS.
In some embodiments, the reflective layer 12 is plated on the emissive layer 11 or the thermally conductive layer 13, so that when the emissive layer 11 or the thermally conductive layer 13 is flexible, the reflective layer 12 may also deform accordingly.
In other embodiments, the reflective layer 12 is a flexible film having reflective particles distributed within the reflective layer 12 or having a micro-cellular structure formed within the reflective layer 12 that imparts the reflective layer 12 with the ability to reflect sunlight. The reflective layer 12 is connected to the emission layer 11 and the heat conductive layer 13 by an adhesive material.
In some embodiments, overcoat 2 is flexible, and overcoat 2 is made of a resin material that has good optical transmission properties. The thickness of the top coat 2 is 10 μm to 500 μm. Still be provided with bearing structure 5 between bottom 1 and top facing 2, as shown in fig. 3, 4, 5 or 6, bearing structure 5 is located sealed intracavity 4, and bearing structure 5's upper and lower both ends are respectively in the top facing reaches the bottom contacts, and it mainly plays the effect of support top facing 2. The support structure 5 may be in the form of a bar (as shown in fig. 4), a cylinder (as shown in fig. 5), or the like. Preferably, the support structure 5 has a low thermal conductivity, avoiding heat exchange between the bottom layer 1 and the top layer 2.
It is worth mentioning that when the bottom layer 1 is flexible, the top layer 2 can be either rigid or flexible. When the two are flexible, the whole radiation refrigeration thin sheet structure can be well adapted to the appearance of an object to be cooled, and particularly when the curvature or the irregularity of the outer surface of the object to be cooled is higher. When the bottom layer 1 is flexible and the cover layer 2 is rigid, the radiation refrigeration sheet structure is suitable for the condition that the curvature or irregularity of the outer surface of the object to be cooled is low.
The utility model discloses a radiation refrigeration thin slice structure application area is extensive, can regard as plane shape conch wall, curved surface conch wall, long and thin hollow sleeve pipe, plane shape or curved surface shape wall or roof, open and close door or window, soft surface fabric etc. constitute the refrigerated device of internal space, for example air tank, water tank, high temperature heat conduction cable or instrument or equipment or electronic component or device or the refrigeration sleeve pipe or the outer housing shell in place, nice and cool clothing, heat protection tent, or utilize various well-known energy conversion technique and constitute neotype energy device, for example the comdenstion water is prepared the device, cooling heating system etc..
Furthermore, the radiation refrigeration thin slice structure of the utility model can be used for cooling gas, liquid and solid medium.
Further, the utility model discloses a radiation refrigeration thin slice structure can use on object surfaces such as water tank, cable, roof for reduce its temperature. The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.
Claims (12)
1. The utility model provides a radiation refrigeration thin slice structure, includes bottom, finish coat and seal structure, seal structure encircles the setting and is in the bottom with between the finish coat, thereby the bottom the finish coat and form sealed chamber between the seal structure, a serial communication port, the bottom includes emission layer and heat-conducting layer that sets gradually by interior to exterior, the heat-conducting layer is suitable for to set up and treats cooling object surface, the emissivity of emission layer at 7 mu m ~14 mu m wave band is greater than 80%, the coefficient of heat conduction of heat-conducting layer is greater than the emission layer and the coefficient of heat conduction of seal structure.
2. A radiation-cooled sheet structure according to claim 1, wherein a reflective layer is provided between the emissive layer and the thermally conductive layer, the reflective layer having a reflectivity in the visible and near infrared bands of greater than 85%.
3. A radiation cooling sheet structure as claimed in claim 2, wherein the edges of said heat conducting layer extend to the outside of said emitting layer and said reflecting layer, said sealing structure being provided on said heat conducting layer, said emitting layer and said reflecting layer being on the inside of said sealing structure.
4. A radiation-cooling sheet structure according to claim 1, wherein the edges of the heat-conducting layer extend to the outside of the emitter layer, the sealing structure being provided on the heat-conducting layer, the emitter layer being on the inside of the sealing structure.
5. A radiation cooling sheet structure according to claim 1, wherein the outer surface of said heat conducting layer has a relief structure.
6. A radiation refrigerating sheet structure as claimed in claim 5, wherein the difference in height between the relief structure and the surface of the heat conducting layer is 1 μm to 10 mm.
7. A radiation-cooled sheet structure according to claim 1, wherein the vacuum level of the sealed chamber is less than 10 Pa.
8. A radiation-cooled sheet structure according to claim 1, wherein the distance between the base layer and the cover layer is 1mm to 20 cm.
9. The radiation refrigerating sheet structure of claim 1 wherein the emissive layer comprises a substrate and radiation refrigerating particles dispersed in the substrate, the substrate is a transparent resin, and the haze of the emissive layer is adjustable in the range of 1% to 90%.
10. A radiation cooling sheet structure according to any one of claims 1 to 9, wherein said bottom layer is flexible, said heat conducting layer is a flexible heat conducting material, said heat conducting layer comprises a resin matrix and a high heat conducting filler dispersed in said resin matrix, or said heat conducting layer is a graphene composite film.
11. A radiation cooling sheet structure as claimed in claim 10, wherein said cover layer is flexible, a support structure is further provided between said bottom layer and said cover layer, said support structure is located in said sealed cavity, and upper and lower ends of said support structure are in contact with said cover layer and said bottom layer, respectively.
12. A radiation refrigerating sheet structure as claimed in claim 10 wherein said overcoat layer is a flexible transparent resin, and said overcoat layer has a transmittance of not less than 85% in a wavelength band of 7 to 14 μm.
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| CN201920810326.9U CN210345949U (en) | 2019-05-31 | 2019-05-31 | Radiation refrigeration thin slice structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111721032A (en) * | 2020-08-06 | 2020-09-29 | 东南大学 | A closed cooling film radiation coupling structure |
| CN112378114A (en) * | 2020-10-30 | 2021-02-19 | 宁波瑞凌新能源科技有限公司 | Radiation refrigeration structure, preparation method thereof and radiation refrigeration product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11833780B2 (en) | 2020-04-20 | 2023-12-05 | Ningbo Radi-Cool Advanced Energy Technologies Co., Ltd. | Radiative cooling metal plate, preparation method and application thereof |
| CN111721032A (en) * | 2020-08-06 | 2020-09-29 | 东南大学 | A closed cooling film radiation coupling structure |
| CN112378114A (en) * | 2020-10-30 | 2021-02-19 | 宁波瑞凌新能源科技有限公司 | Radiation refrigeration structure, preparation method thereof and radiation refrigeration product |
| CN112378114B (en) * | 2020-10-30 | 2022-04-15 | 宁波瑞凌新能源科技有限公司 | Radiation refrigeration structure, preparation method thereof and radiation refrigeration product |
| CN114151879A (en) * | 2021-12-15 | 2022-03-08 | 西安建筑科技大学 | Portable passive dehumidification system suitable for tent |
| CN116816242A (en) * | 2023-05-25 | 2023-09-29 | 晋中学院 | Color-controllable radiation refrigeration transparent window structure |
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