CN210225867U - Multi-layer circuit board of miniaturized KU wave band tuner - Google Patents

Abstract

The utility model relates to a multilayer circuit board of miniaturized KU wave band tuner, including P piece, high frequency circuit board, low frequency circuit board, the multilayer pressfitting forms. The utility model discloses to assemble multiple panel set and form an organic whole, can lay wire simultaneously, reduce substantially the area of circuit board, provide the basis for realizing miniaturized KU wave band tuner.

Description

Multi-layer circuit board of miniaturized KU wave band tuner

[ technical field ] A method for producing a semiconductor device

The utility model relates to a satellite television receiving technology, concretely relates to multilayer circuit board of miniaturized KU wave band tuner.

[ background of the invention ]

The circuit device of the prior KU band tuner comprises a polarization probe, an RF amplifying circuit, a band-pass filter circuit, a phase-locked loop PLL circuit, an IF output circuit and a part of independent setting circuits. Many circuits are integrated on a circuit board.

The circuit board on the tuner is a single-layer double-sided board, which is commonly used as a ROGERS board (high frequency ceramic board), an LNB33 board, and an FR4 board (glass fiber epoxy resin board), and the board 10 is coated with copper 20 on both sides, and the cross section is shown in fig. 1. In a high frequency head circuit, the RF amplifying circuit is made of a Rogers board or an LNB33 board, and the IF output circuit is made of an FR4 board, so that circuit boards of a plurality of boards are often combined and spliced on the same product. The combined circuit board formed by splicing can lead to more complicated process flow of products, the products are large in whole, finished products are high in height, and how to realize product miniaturization is a technical problem which is urgently needed to be solved by technical personnel in the field.

Therefore, in order to solve the above technical problems, it is necessary to provide a miniaturized KU-band tuner multilayer circuit board to overcome the above-mentioned drawbacks of the prior art.

[ Utility model ] content

In order to solve the above problem, an object of the utility model is to provide a multilayer circuit board of miniaturized KU wave band tuner will assemble multiple panel set and form integratively, can lay wire simultaneously, reduces substantially the area of circuit board, provides the basis for realizing miniaturized KU wave band tuner.

In order to achieve the above purpose, the utility model mainly adopts the following technical scheme:

a multi-layer circuit board of a miniaturized KU-band tuner comprises a P piece, a high-frequency circuit board and a low-frequency circuit board which are laminated in a multi-layer mode.

The thickness of the P piece is 0.08-0.12 mm.

The high-frequency circuit board comprises a first base material layer which adopts a Rogers plate or an LNB33 plate, and copper-clad layers respectively coated on the upper surface and the lower surface of the first base material layer.

The copper-clad layer covering the upper surface of the first base material layer is a top layer circuit layer, and the copper-clad layer covering the lower surface of the first base material layer and bonded with the P sheet is a first intermediate circuit.

The thickness of the first substrate layer is 500-520um, and the thickness of the copper-clad layer is 17.5 um.

The low-frequency circuit board comprises a second base material layer adopting an FR4 board, and copper-clad layers respectively covering the upper surface and the lower surface of the second base material layer.

The copper-clad layer which is covered on the upper surface of the second base material layer and is bonded with the P sheet is a second intermediate circuit layer, and the copper-clad layer which is covered on the lower surface of the second base material layer is a bottom circuit layer.

The thickness of the second substrate layer is 160-170um, and the thickness of the copper-clad layer is 17.5 um.

The multilayer board comprises a first wire hole for copper-clad perforation of the top circuit layer and the first middle circuit, a second wire hole for copper-clad perforation of the top circuit layer and the second middle circuit layer, a third wire hole for copper-clad perforation of the top circuit layer and the bottom circuit layer, and a fourth wire hole for copper-clad perforation of the first middle circuit layer and the bottom circuit layer.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses dielectric property than single panel in current trade is more stable and can satisfy multilayer circuit board and integrated circuit design's requirement, for the miniaturization of product upgrading and digital integration establish solid basis, catered to low-cost, high-quality market demand simultaneously, popularize and apply at this field for the first time.

[ description of the drawings ]

FIG. 1 is a schematic view of a single layer plate of the prior art;

FIG. 2 is a schematic view of a preferred embodiment of the present invention;

fig. 3 is a schematic diagram of the present invention showing the layers in a preferred embodiment.

[ detailed description ] embodiments

Referring to the accompanying drawings of fig. 2-3, the present invention is a multi-layer circuit board of a miniaturized KU-band tuner, which mainly includes a P-plate 1, a high-frequency circuit board 2, and a low-frequency circuit board 3.

The P sheet 1 is an isolation layer, the thickness is generally in the range of 0.08-0.12mm, usually 0.1mm, the material can be PP resin material, and the probiotic S1000B is selected in this embodiment. The P sheet 1 is used for isolating signals, preventing signal interference of an upper plate and a lower plate, and playing a role in adhering an upper circuit board and a lower circuit board.

Above the P-plate 1 is a high-frequency circuit board 2, and the high-frequency circuit board 2 is a top circuit layer 21, a first base material layer 22, and a first intermediate circuit layer 23 in this order from top to bottom. The top circuit layer 21 is mainly made of copper foil and used for routing, grounding and the like. The first substrate layer 22 can be a regers board (high frequency ceramic board) or a bio-LNB 33 board which can meet the requirement of high frequency band, and the first intermediate circuit layer 23 is also made of copper foil, contacts with the P sheet 1, and is used for grounding and routing. The thickness of the first substrate layer 22 is 500-520um, and the thickness of the top circuit layer 21 and the first middle circuit 23 is 17.5 um.

Below the P-plate 1 is a low-frequency circuit board 3, which is composed of a second intermediate circuit layer 31, a second base material layer 32, and a bottom circuit layer 33 in this order from top to bottom. The second middle circuit layer 31 and the bottom circuit layer 33 are also made of copper foil and are used for grounding and routing. The second base material layer 32 is a substrate of FR4 board (glass fiber epoxy resin board), and this layer does not go through the signal line of high frequency band, so there is no need for a board that can meet the requirement of high frequency band, and FR4 board can be used.

Wherein the thickness of the second substrate layer 32 is 160-170um, and the thickness of the two intermediate circuit layers 31 and the bottom circuit layer 33 is 17.5 um.

For the performance of producing that makes can reach the requirement, the utility model discloses in all put the circuit through KU wave band radio frequency signal on the top layer circuit layer 21 of high frequency circuit board 2, low frequency circuit board 3 only crosses DC circuit and ground connection. And the top layer circuit layer 21 and the first middle circuit layer 23 contacting with the P sheet 1 are connected by a copper-clad via hole to form a first wire hole 41. The top layer circuit layer 21 and the second intermediate circuit layer 31 in contact with the P piece are connected by a copper-clad via hole to form a second line hole 42. The top wiring layer 21 and the bottom wiring layer 33 are connected by copper-clad vias, forming three wire holes 43. The first intermediate wiring layer 23 and the bottom wiring layer 33 in contact with the P sheet 1 are connected with copper-clad vias. The four string holes 44 are formed. This connection allows better product signal interference and better performance.

The utility model discloses the circuit board characteristics lie in, with the integrated monoblock panel of panel lamination of different materials, both accorded with the high frequency requirement, can adopt low-cost panel again, and do not have any influence to the product characteristic. The original parallel splicing structures of different plates are converted into the laminated structures, so that the line connection mode between different plates is simplified, the area of the circuit board can be greatly reduced, and the miniaturization of products is facilitated, and the circuit board is widely applied and popularized.

The above embodiments are merely preferred embodiments of the present disclosure, which are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present disclosure, should be included in the scope of the present disclosure.

Claims (9)

1. The utility model provides a multilayer circuit board of miniaturized KU wave band tuner which characterized in that: comprises a P piece, a high-frequency circuit board, a low-frequency circuit board and a plurality of layers which are pressed together.

2. A multi-layer circuit board for a miniaturized KU-band tuner as claimed in claim 1, wherein: the thickness of the P piece is 0.08-0.12 mm.

3. A multi-layer circuit board for a miniaturized KU-band tuner as claimed in claim 1, wherein: the high-frequency circuit board comprises a first base material layer which adopts a Rogers plate or an LNB33 plate, and copper-clad layers respectively coated on the upper surface and the lower surface of the first base material layer.

4. A multi-layer circuit board for a miniaturized KU-band tuner as claimed in claim 3, wherein: the copper-clad layer covering the upper surface of the first base material layer is a top layer circuit layer, and the copper-clad layer covering the lower surface of the first base material layer and bonded with the P sheet is a first intermediate circuit.

5. A multi-layer circuit board for a miniaturized KU-band tuner as claimed in claim 3, wherein: the thickness of the first substrate layer is 500-520um, and the thickness of the copper-clad layer is 17.5 um.

6. A multi-layer circuit board for a miniaturized KU-band tuner as claimed in claim 1, wherein: the low-frequency circuit board comprises a second base material layer adopting an FR4 board, and copper-clad layers respectively covering the upper surface and the lower surface of the second base material layer.

7. The multi-layer circuit board of a miniaturized KU-band tuner as claimed in claim 6, wherein: the copper-clad layer which is covered on the upper surface of the second base material layer and is bonded with the P sheet is a second intermediate circuit layer, and the copper-clad layer which is covered on the lower surface of the second base material layer is a bottom circuit layer.

8. The multi-layer circuit board of a miniaturized KU-band tuner as claimed in claim 6, wherein: the thickness of the second substrate layer is 160-170um, and the thickness of the copper-clad layer is 17.5 um.

9. A multi-layer circuit board for a miniaturized KU-band tuner as claimed in claim 1, wherein: the multilayer board comprises a first wire hole for copper-clad perforation of the top circuit layer and the first middle circuit, a second wire hole for copper-clad perforation of the top circuit layer and the second middle circuit layer, a third wire hole for copper-clad perforation of the top circuit layer and the bottom circuit layer, and a fourth wire hole for copper-clad perforation of the first middle circuit layer and the bottom circuit layer.

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