CN209979526U - A device for detecting X-ray properties of semiconductor materials - Google Patents

Abstract

The utility model discloses a device for surveying semiconductor material X ray performance, the device includes camera bellows and electrometer, be equipped with the electromagnetic shield box in the camera bellows, electromagnetic shield box top is equipped with the opening, the opening top is equipped with the X ray light source, be equipped with the PCB board in the electromagnetic shield box, be equipped with first conductive adhesive on the PCB board, the second conductive adhesive, first stitch and second stitch, first conductive adhesive and second conductive adhesive are used for respectively with the upper and lower surface bonding of sample, first conductive adhesive is connected with first stitch electricity, the second conductive adhesive is connected with the second stitch electricity, the high-pressure input connection of first stitch and electrometer, the signal input connection of second stitch and electrometer. The utility model discloses simple structure, convenient operation can realize electrostatic shielding well, reduces external environment to the interference of surveying, greatly reduced the test cost. Meanwhile, all parts are stably connected, and the weak current of the sample can be accurately measured, so that the X-ray performance of the sample is obtained.

Description

A device for detecting X-ray properties of semiconductor materials

technical field

The utility model relates to the technical field of semiconductor material performance detection, in particular to a device for detecting the X-ray performance of semiconductor materials.

Background technique

Semiconductor materials are a class of electronic materials with semiconductor properties (conductivity between conductors and insulators, resistivity in the range of about 1mΩ·cm to 1GΩ·cm) and can be used to make semiconductor devices and integrated circuits. Semiconductor materials can directly absorb radioactive rays, and generate electron-hole pairs through the photoelectric effect, Compton scattering, and electron pair generation. They move in an external electric field to generate the basic electrical signal of the detector. After the signal is collected, the corresponding switching ratio of the material can be obtained, the sensitivity of the material detection can be calculated, and the μτ product of the material can be calculated. However, since radiation detection requires a very low current level, the generated weak current detection is easily disturbed by factors such as the external environment, thus affecting the accuracy of detection.

Utility model content

In view of the deficiencies of the prior art, the purpose of the present invention is to provide a device with a simple structure, which is not disturbed by the external environment, and can accurately detect the X-ray performance of the semiconductor material. It adopts the following technical solutions:

A device for detecting X-ray properties of semiconductor materials, comprising a camera obscura and an electrometer, an electromagnetic shielding box is arranged inside the camera obscura, an opening is arranged above the electromagnetic shielding box, and an X-ray light source is arranged above the opening, The electromagnetic shielding box is provided with a PCB board, and the PCB board is provided with a first conductive glue, a second conductive glue, a first pin and a second pin, and the first conductive glue and the second conductive glue are used for respectively Adhere to the upper and lower surfaces of the sample, the first conductive glue is electrically connected to the first pin, the second conductive glue is electrically connected to the second pin, and the first pin is connected to the high-voltage input port of the electrometer, The second pin is connected to the signal input port of the electrometer.

As a further improvement of the present invention, the first pin or the second pin is also connected to the ground wire input port of the electrometer.

As a further improvement of the present invention, the PCB is plated with a conductive metal layer, the conductive metal layer is in contact with the second conductive glue, and the second pins are electrically connected to the conductive metal layer.

As a further improvement of the present invention, the dark box is further provided with a bearing platform, and the electromagnetic shielding box is arranged on the bearing platform.

As a further improvement of the present invention, the bearing platform is a liftable bearing platform.

As a further improvement of the present invention, the first pin is connected to the high voltage input port of the electrometer through a coaxial cable, and the second pin is connected to the signal input port of the electrometer through a coaxial cable.

As a further improvement of the present invention, the electromagnetic shielding box is provided with a first IC socket, the first pin is connected to the first IC socket, the first IC socket is provided with a first BNC connector, the The first BNC connector is connected to the high-voltage input port of the electrometer through a coaxial cable, the electromagnetic shielding box is provided with a second IC socket, the second pin is connected to the second IC socket, and the second IC socket is on the second IC socket. A second BNC connector is provided, and the second BNC connector is connected to the signal input port of the electrometer through a coaxial cable.

As a further improvement of the present invention, a control panel is also included, the control panel is arranged on the outer wall of the dark box, and the control panel is connected with the X-ray light source.

As a further improvement of the present invention, the electrometer is a high resistance electrometer.

The beneficial effects of the present utility model:

The device for detecting the X-ray performance of the semiconductor material of the utility model has the advantages of simple structure and convenient operation, which can well realize electrostatic shielding, reduce the interference of the external environment on the detection, and greatly reduce the testing cost. At the same time, the connection between the components is stable and the contact is good, and the weak current of the sample can be accurately measured, thereby obtaining the X-ray performance of the sample, and the detection accuracy is high.

The above description is only an overview of the technical solution of the present invention, in order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present invention better. It is obvious and easy to understand, and the preferred embodiments are exemplified below, and the detailed description is as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic structural diagram of an apparatus for detecting X-ray properties of semiconductor materials in an embodiment of the present invention.

Marking description: 10, dark box; 20, electrometer; 21, high voltage input port; 22, signal input port; 23, ground wire input port; 30, X-ray light source; 31, control panel; 40, carrying platform; 50, electromagnetic shielding box; 51, PCB board; 52, first conductive glue; 53, second conductive glue; 54, conductive metal layer; 55, first pin; 56, second pin; 60, sample; 70, computer.

Detailed ways

The present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and implement it, but the examples are not intended to limit the present utility model.

Based on the photoelectric response of the material, electrons and holes are generated in the semiconductor material under the irradiation of X-rays. Under the action of an external electric field, the electrons and holes will be separated. In the electric field loop, electrons and holes can achieve directional migration, thereby generating a current signal.

As shown in FIG. 1 , it is an apparatus for detecting X-ray properties of semiconductor materials in an embodiment of the present invention, and the apparatus includes a camera obscura 10 and an electrometer 20 . In this embodiment, the electrometer 20 is a high resistance electrometer, preferably a KEIFHLEY 6517B high resistance electrometer. The electrometer 20 is provided with a high voltage input port 21 , a signal input port 22 and a ground wire input port 23 .

An electromagnetic shielding box 50 is arranged in the dark box 10, an opening is arranged above the electromagnetic shielding box 50, an X-ray light source 30 is arranged above the opening, a PCB board 51 is arranged in the electromagnetic shielding box 50, and a first conductive glue 52 is arranged on the PCB board 51 , the second conductive glue 53, the first pin 55 and the second pin 56, the first conductive glue 52 and the second conductive glue 53 are used for bonding with the upper and lower surfaces of the sample 60 respectively, the first conductive glue 52 and the first pin 55 For electrical connection, the second conductive glue 53 is connected to the second pin 56 , the first pin 55 is connected to the high voltage input port 21 of the electrometer 20 , and the second pin 56 is connected to the signal input port 22 of the electrometer 20 . Preferably, the X-ray light source 30 is arranged directly above the sample 60 to ensure that the sample 60 can be irradiated to the maximum. Sample 60 is a semiconductor material.

In this embodiment, the device further includes a control panel 31 , the control panel 31 is arranged on the outer wall of the dark box 10 , and the control panel 31 is connected to the X-ray light source 30 . For controlling the X-ray dose rate by adjusting the tube current and tube voltage of the X-ray light source 30 .

In this embodiment, the first pin 55 is connected to the high voltage input port 21 of the electrometer 20 through a coaxial cable, and the second pin 56 is connected to the signal input port 22 of the electrometer 20 through a coaxial cable.

Preferably, the electromagnetic shielding box 50 is provided with a first IC socket, the first pin 55 is connected to the first IC socket, the first IC socket is provided with a first BNC connector, and the first BNC connector is connected to the static electricity through a coaxial cable. The high-voltage input port 21 of the meter 20 is connected, the electromagnetic shielding box 50 is provided with a second IC socket, the second pin 56 is connected with the second IC socket, and the second IC socket is provided with a second BNC connector, the second BNC connector It is connected to the signal input port 22 of the electrometer 20 through a coaxial cable.

In this embodiment, a conductive metal layer 54 is plated on the PCB board 51 , the conductive metal layer 54 is in contact with the second conductive glue 53 , and the second pins 56 are electrically connected to the conductive metal layer 54 . The conductive metal layer 54 makes the connection more stable.

In this embodiment, the first pin 55 or the second pin 56 is also connected to the ground wire input port 23 of the electrometer 20 . For security protection.

In this embodiment, the dark box 10 is further provided with a supporting table 40 , and the electromagnetic shielding box 50 is disposed on the supporting table 50 . Preferably, the supporting platform 40 is a liftable supporting platform. The most suitable irradiance position can be obtained by adjusting the bearing platform 40 .

In this embodiment, the X-ray light source 30 is a continuous X-ray light source or a pulsed X-ray light source.

The high voltage is input to the sample 60 through the high voltage input port 21, and the current signal generated by the sample 60 is collected through the signal input port 22. By connecting the electrometer 20 to the computer 70, the computer 70 can calculate the corresponding on-off ratio of the sample through the current signal, Parameters such as the product of μτ of the sample are calculated to obtain the X-ray properties of the sample.

The device for detecting the X-ray performance of the semiconductor material of the utility model has the advantages of simple structure and convenient operation, which can well realize electrostatic shielding, reduce the interference of the external environment on the detection, and greatly reduce the testing cost. At the same time, the connection between the components is stable and the contact is good, and the weak current of the sample can be accurately measured, thereby obtaining the X-ray performance of the sample, and the detection accuracy is high.

The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present utility model is subject to the claims.

Claims (9)

1. The utility model provides a device for surveying semiconductor material X ray performance, a serial communication port, including camera bellows and electrometer, be equipped with the electromagnetic shield box in the camera bellows, electromagnetic shield box top is equipped with the opening, the opening top is equipped with the X ray light source, be equipped with the PCB board in the electromagnetic shield box, be equipped with first conducting resin, second conducting resin, first stitch and second stitch on the PCB board, first conducting resin and second conducting resin are used for respectively with the upper and lower surface bonding of sample, first conducting resin is connected with first stitch electricity, the second conducting resin is connected with second stitch electricity, first stitch with the high pressure input port of electrometer is connected, the second stitch with the signal input port of electrometer is connected.

2. The apparatus for detecting X-ray properties of a semiconductor material of claim 1 wherein said first pin or said second pin is further connected to a ground input of said electrometer.

3. The apparatus according to claim 1, wherein the PCB board is plated with a conductive metal layer, the conductive metal layer is in contact with the second conductive adhesive, and the second pin is electrically connected to the conductive metal layer.

4. The apparatus according to claim 1, wherein a support is further disposed in the dark box, and the electromagnetic shielding box is disposed on the support.

5. The apparatus according to claim 4, wherein the stage is a liftable stage.

6. The apparatus for detecting the X-ray performance of a semiconductor material of claim 1 wherein the first pin is connected to the high voltage input port of the electrometer by a coaxial cable and the second pin is connected to the signal input port of the electrometer by a coaxial cable.

7. The apparatus for detecting the X-ray performance of a semiconductor material according to claim 6, wherein a first IC socket is disposed in the electromagnetic shielding case, the first pin is connected to the first IC socket, a first BNC connector is disposed on the first IC socket, the first BNC connector is connected to the high voltage input port of the electrometer through a coaxial cable, a second IC socket is disposed in the electromagnetic shielding case, the second pin is connected to the second IC socket, a second BNC connector is disposed on the second IC socket, and the second BNC connector is connected to the signal input port of the electrometer through a coaxial cable.

8. The apparatus according to claim 1, further comprising a control panel disposed on an outer wall of the dark box, wherein the control panel is connected to the X-ray source.

9. The apparatus for detecting X-ray properties of a semiconductor material of claim 1, wherein said electrometer is a high resistance electrometer.

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