CN209964057U - Optical fiber comprehensive tester - Google Patents
Optical fiber comprehensive tester Download PDFInfo
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- CN209964057U CN209964057U CN201921212865.9U CN201921212865U CN209964057U CN 209964057 U CN209964057 U CN 209964057U CN 201921212865 U CN201921212865 U CN 201921212865U CN 209964057 U CN209964057 U CN 209964057U
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Abstract
The utility model discloses an optical fiber comprehensive tester, which mainly comprises a core board module, an MCU processing unit, a display module, a control module, a laser circuit, a PIN tube photoelectric conversion circuit, a logic processing unit and an avalanche photoelectric conversion processing unit; the core board module is respectively connected with the MCU processing unit, the logic processing unit, the display module and the control module; the MCU processing unit is connected with the laser circuit, the PIN tube photoelectric conversion circuit and the avalanche photoelectric conversion processing unit in a control mode; the logic processing unit is also connected with the avalanche photoelectric conversion processing unit. Compared with the existing scheme, the scheme of the optical fiber comprehensive tester provided by the embodiment has the advantages of high control precision, richer functions, capability of effectively overcoming the problems existing in the prior art and very strong practicability.
Description
Technical Field
The utility model relates to an optical fiber communication technology, concretely relates to optical fiber link's test equipment.
Background
Optical fiber communication technology is one of the most mainstream communication means in the current communication technology. Optical fiber has a history as a communication medium, and with the popularization and maturity of optical fiber communication, optical fiber communication has become the mainstream of the international communication field, and the popularization rate represents the development level of a country. However, due to the characteristics of the fragile, easy-to-damage and easy-to-break optical fibers, the laying quality of the optical fiber links, the maintenance of the optical fiber links, the emergency repair and the like become the most important follow-up work.
Light transmission in an optical fiber produces two optical phenomena, fresnel reflection and rayleigh scattering. Therefore, these two reflection phenomena are commonly used to measure and analyze the parameter characteristics of the optical fiber link, which is a common optical time domain analyzer in the market.
At present, optical time domain analyzers are in the market with hundreds of flowers, but various technical parameters are different. For example, an optical time domain analyzer used in a high-end place is not only expensive, but also has a single function, and the expensive price makes many general users unacceptable, and due to the single function, the users have to carry out construction with meters with various functions, which increases the burden of constructors. And some multifunctional optical time domain analysis products generally have poor performance indexes and cannot meet the requirements of users.
Therefore, the problem to be solved by the technical personnel is to provide a multifunctional optical time domain analysis product with high performance index.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems of the existing optical time domain analyzer, a new optical time domain analysis scheme is needed.
Therefore, an object of the utility model is to provide an optical fiber integrated tester to overcome prior art function singleness, the poor problem of performance index.
In order to achieve the above object, the utility model provides an optical fiber comprehensive tester, mainly include the core plate module, MCU processing unit, display module, control module, laser instrument circuit, PIN pipe photoelectric conversion circuit, logic processing unit, and avalanche photoelectric conversion processing unit; the core board module is respectively connected with the MCU processing unit, the logic processing unit, the display module and the control module; the MCU processing unit is connected with the laser circuit, the PIN tube photoelectric conversion circuit and the avalanche photoelectric conversion processing unit in a control mode; the logic processing unit is also connected with the avalanche photoelectric conversion processing unit.
Furthermore, the control module is a key or a touch screen.
Further, the tester also comprises a WIFI module, and the WIFI module is connected with the core board module.
Further, the tester still includes the IOT module, the IOT module is connected with nuclear core plate module.
Further, the tester also comprises a GPS module, and the GPS module is connected with the core board module.
Furthermore, the tester also comprises a peripheral interface circuit, and the peripheral interface circuit is connected with the core board module.
Furthermore, the MCU processing unit is matched with the laser circuit, the PIN tube photoelectric conversion circuit, the logic processing unit and the avalanche photoelectric conversion processing unit to form the optical signal processing unit.
Furthermore, the laser circuit is formed by matching a laser, a light source driving circuit and the laser, and the laser and the light source driving circuit are connected with the MCU processing unit and the logic processing unit.
Further, the avalanche photoelectric conversion processing unit comprises an avalanche photoelectric tube, an amplification network unit, a weak signal matching network unit, a differential amplifier and an analog-to-digital conversion circuit; the avalanche phototube, the amplifying network unit, the weak signal matching network unit, the differential amplifier and the analog-to-digital conversion circuit are sequentially connected, and the amplifying network unit and the weak signal matching network unit are connected with the MCU processing unit; the analog-to-digital conversion circuit is connected with the logic processing unit.
Furthermore, the tester also comprises a temperature sensor, and the temperature sensor is connected with the MCU processing unit.
The utility model provides an optic fibre comprehensive tester scheme based on MCU processing unit and the cooperation of nuclear core plate module, guarantees tester scheme stable performance reliability, satisfies each item index requirement and user demand.
The utility model provides an optic fibre integrated tester hardware scheme, when practical application, can load optical power meter detection function as required.
In addition, a 650nm red laser is arranged in the scheme of the comprehensive optical fiber tester to realize short-distance optical cable fault finding.
The optical fiber comprehensive tester scheme can also be accessed to an end face detector through a corresponding peripheral interface so that a user can detect the damage condition of the optical fiber end face conveniently; the WIFI module is also loaded in the tester scheme, so that the data can be conveniently transmitted by a user through networking; the IOT module and the GPS module can be loaded in the scheme of the tester, so that the Internet of things platform can be conveniently accessed, and the instrument is brought into the instrument management and control system.
The touch screen operation can be adopted in the scheme of the tester, so that the operation of the tester is simpler and more humanized.
Drawings
The invention is further described with reference to the following drawings and detailed description.
FIG. 1 is a schematic structural view of an optical fiber comprehensive tester in this example;
FIG. 2 is a block diagram showing the components of the optical fiber integrated tester in this example;
fig. 3 is a schematic composition diagram of the optical signal processing unit in this example.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.
Referring to fig. 1 and 2, there are shown diagrams illustrating principal constituent examples of the optical fiber complex tester given in this example.
As can be seen, the fiber optic integrated tester 100 is mainly formed by the corresponding housing 112 and the functional components disposed therein.
The functional components herein are mainly formed by matching a core board module 101, an MCU processing unit 102, a display module 103, a touch screen module 104, a laser circuit 105, a PIN photoelectric conversion circuit 106, a logic processing unit 107, an avalanche photoelectric conversion processing unit 108, a positioning module 109, a WIFI module 110, an IOT module 111, and a peripheral interface circuit (not shown in the figure).
The core board module 101 and the MCU processing unit 102 cooperate to form a dual-control core, so as to control other functional modules and coordinate their work, thereby implementing the basic functions of the integrated optical fiber tester.
In this example, the core board module 101 is a Cortex A8 core board module, and is connected to the MCU processing unit 102, the display module 103, the touch screen module 104, the WIFI module 110, the IOT module 111, the GPS module 109, the peripheral interface circuit, and the logic processing unit 107; the MCU processing unit 102 is connected to the laser circuit 105 and the PIN photoelectric conversion circuit 106, and the avalanche photoelectric conversion processing unit 108 is connected to the logic processing unit 107 and the MCU processing unit 102, thereby forming a main scheme of the integrated fiber tester 100.
The Cortex A8 core board module 101 used in this example is used to complete man-machine exchange and data processing, and the specific configuration scheme of the Cortex A8 core board module is well known to those skilled in the art and will not be described herein.
Further, the display module 103 in this example is connected to the Cortex A8 core board module for displaying data or results of the operation of the fiber optic integrated tester 100. The display module 103 is preferably a corresponding liquid crystal display module, and the specific implementation and configuration schemes are well known to those skilled in the art and will not be described herein.
The touch screen module 104 in this example is connected to the Cortex A8 core board module for performing corresponding operation control. The specific implementation and configuration thereof are well known to those skilled in the art and will not be described herein.
Alternatively, the touch screen module 104 may be replaced by corresponding control buttons.
WIFI module 110 in this example is connected with this Cortex A8 core board module, and the user of being convenient for networks data transmission. The specific implementation and configuration thereof are well known to those skilled in the art and will not be described herein.
The IOT module 111 and the positioning module 109 in this example are connected to the core board module of the Cortex A8, and are used to enable the integrated optical fiber tester to access the platform of the internet of things, so that the instrument is incorporated into the instrument management and control system. The positioning module 109 here is preferably a corresponding GPS positioning module, or other feasible positioning module. The specific implementation and configuration thereof are well known to those skilled in the art and will not be described herein.
The peripheral interface circuit in this example is connected with this Cortex A8 core board module for realize this optic fibre comprehensive tester and other equipment or functional unit are connected, if can be used for linking to each other with the terminal surface detector, realize sending the data that the terminal surface detector detected to the liquid crystal display and showing. The specific form of the peripheral interface circuit can be determined according to actual requirements, such as various serial peripheral interfaces (such as a USB structure) and the like. Further, the specific implementation and configuration of the peripheral interface circuit are well known to those skilled in the art, and will not be described herein.
In this example, the MCU processing unit 102 is connected to the Cortex A8 core board module 101, and the MCU processing unit 102 controls the laser circuit 105 and the PIN photoelectric conversion circuit 106.
For the MCU processing unit 102 is formed by a corresponding MCU chip, the specific implementation and configuration thereof can be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein.
A 650nm red laser is preferred for laser circuit 105, which is controlled by MCU processing unit 102 for close range cable troubleshooting. The specific implementation and configuration thereof may be determined according to actual needs, which are well known to those skilled in the art and will not be described herein.
The PIN tube photoelectric conversion circuit 106 is used for converting stable communication light into an electric signal and transmitting the electric signal to the MCU processing unit 102 for calculation of an optical power meter.
The specific implementation and configuration of the PIN transistor photoelectric conversion circuit 106 may be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein.
The logic processing unit 107 in this example cooperates with the avalanche photoelectric conversion processing unit 108 for converting fresnel reflection and rayleigh scattering optical signals into electrical signals, followed by data sampling and processing; and Cortex A8 core board module 101 communicates with logic processing unit 107, reads the photoelectrically converted data and displays on the liquid crystal display unit.
The logic processing unit 107 in this example can be implemented by using a corresponding logic processing circuit, and the specific implementation and configuration of the logic processing circuit can be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein.
Referring to fig. 3, the avalanche photoelectric conversion processing unit 108 in this example cooperates with the logic processing unit 107, the MCU processing unit 102, the laser circuit 105, and the PIN photoelectric conversion circuit 106 to form a corresponding photoelectric signal processing unit.
As an example, the avalanche photoelectric conversion processing unit 108 is mainly formed by sequentially connecting an avalanche photoelectric tube 108a, an amplification network unit 108b, a weak signal matching network unit 108c, a differential amplifier 108d, and an analog-to-digital conversion circuit 108e in a matching manner; meanwhile, the amplifying network unit 108b and the weak signal matching network unit 108c are controlled by the MCU processing unit 102.
Among them, the avalanche photodiode 108a preferably uses an avalanche diode as a photo-receiving transistor to improve the sensitivity of measurement.
The present example further matches the dynamically regulated bias voltage for the avalanche photo-transistor 108a to accommodate avalanche diodes of different characteristics.
The amplifying network unit 108b, the weak signal matching network unit 108c and the differential amplifier 108d are sequentially connected and matched to form a corresponding signal processing circuit, wherein the input end of the amplifying network unit 108b is connected with the output end of the avalanche photo-transistor 108a, and the output end of the differential amplifier 108d is connected with the input end of the analog-to-digital conversion circuit 108 e.
The amplifier network unit 108b is preferably formed by a corresponding amplifier network circuit, and the specific implementation and configuration thereof may be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein. The amplifier network unit 108b amplifies the electrical signal generated by the avalanche photodiode 108a and transmits the amplified signal to the weak signal matching network unit 108 c.
The weak signal matching network unit 108c is preferably formed by a corresponding amplifying network circuit, and the specific implementation and forming scheme thereof may be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein. The weak signal matching network unit 108c performs signal matching processing on the signal amplified by the amplifying network unit 108b, and sends the processing result to the differential amplifier 108 d.
In this embodiment, the weak signal matching network unit 108c is arranged, so that the present solution can satisfy different test conditions.
The differential amplifier 108d amplifies the received signal, and sends the processed signal to the analog-to-digital conversion circuit 108 e.
The analog-to-digital conversion circuit 108e in the avalanche photoelectric conversion processing unit 108 has an input terminal connected to the differential amplifier 108d and an output terminal connected to the logic processing unit 107. The analog-to-digital conversion circuit 108e is used for converting the processed analog electrical signal into a digital signal and sending the digital signal to the logic processing unit 107 for data processing. The specific implementation and configuration of the analog-to-digital conversion circuit 108e can be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein.
Further, the laser circuit 105 in this example is mainly formed by connecting and matching a laser and light source driving circuit 105a and a single-mode/multi-mode laser 105 b.
The laser and light source driving circuit 105a is connected with the single-mode/multi-mode laser 105b in a driving mode and is respectively controlled by the logic processing unit 107 and the MCU processing unit 102; the single-mode/multi-mode laser 105b adopts a high-speed single-power-supply driving and independent driving mode, and realizes the purpose of sharing the laser with a light source circuit so as to achieve the purpose of multiple purposes of one device.
And the single/multimode laser 105b is also connected to the MCU processing unit to ensure stable output and operation of the light source.
The laser circuit 105 thus constructed can be used as an optical pulse output in the optical fiber link detection and as a stable light source output in the light source module.
The logic processing unit 107, which is preferably used for processing 800M main frequency, and the analog-to-digital conversion frequency of the analog-to-digital conversion circuit 108e, which is used for processing, is preferably 50M, and the two are used for realizing an effective sampling frequency of 2050M in cooperation with each other, and the specific implementation and configuration thereof can be determined according to actual requirements, which are well known to those skilled in the art and will not be described herein again.
On the basis, the embodiment is further provided with a temperature sensor 112, and the temperature sensor 112 is connected with the MCU processing unit 102 and is used for detecting the temperature of the core component, correspondingly adjusting parameters, and performing early warning processing and temperature protection processing; and Cortex A8 core board module 101 reads temperature processing conditions through MCU processing unit 102.
The optical fiber integrated tester 100 configured based on the above-described configuration will be described below in the following. It should be noted that the following operation scheme is only an example of a possible operation scheme of the optical fiber integrated tester 100 given as the present example, and is only used to explain the present optical fiber integrated tester scheme, and is not used to limit the present optical fiber integrated tester scheme.
The logic processing unit 107 of the optical fiber comprehensive tester 100 receives the command sent by the Cortex A8 core board module 101, and performs corresponding setting and measurement according to the command; the MCU processing unit 102 accepts the command of Cortex A8 core board module 101 to control and configure the amplifying network unit 108b and the weak signal matching network unit 108 c.
Therefore, the MCU processing unit 102 controls the laser circuit 105 to work, the avalanche diode converts the received optical signal into an electrical signal, the avalanche diode converts the optical signal into the electrical signal and then transmits the electrical signal to the amplification network unit to perform appropriate amplification processing on the signal, and transmits the signal to the weak signal matching network unit to perform signal matching processing, and the weak signal matching network unit transmits the processing result to the differential amplifier to perform amplification processing and transmits the processing result to the analog-to-digital conversion circuit; the analog-to-digital conversion circuit converts the processed analog electrical signal into a digital signal, and sends the digital signal to the logic processing unit 107 for data processing.
Compared with the existing scheme, the scheme of the optical fiber comprehensive tester provided by the embodiment has the advantages of high control precision, richer and more convenient functions, small size, convenience in carrying and more systematic management, can effectively overcome the problems in the prior art, and has strong practicability.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The optical fiber comprehensive tester is characterized by comprising a core board module, an MCU processing unit, a display module, a control module, a laser circuit, a PIN tube photoelectric conversion circuit, a logic processing unit and an avalanche photoelectric conversion processing unit; the core board module is respectively connected with the MCU processing unit, the logic processing unit, the display module and the control module; the MCU processing unit is connected with the laser circuit, the PIN tube photoelectric conversion circuit and the avalanche photoelectric conversion processing unit in a control mode; the logic processing unit is also connected with the avalanche photoelectric conversion processing unit.
2. The integrated optical fiber tester according to claim 1, wherein the control module is a key or a touch screen.
3. The integrated fiber optic tester of claim 1, further comprising a WIFI module, the WIFI module being connected to the core board module.
4. The integrated fiber optic tester of claim 1 further comprising an IOT module coupled to the core board module.
5. The integrated optical fiber tester of claim 1, further comprising a GPS module, wherein the GPS module is connected to the core board module.
6. The integrated fiber optic tester of claim 1, further comprising peripheral interface circuitry coupled to the core board module.
7. The integrated optical fiber tester according to claim 1, wherein the MCU processing unit cooperates with the laser circuit, the PIN tube photoelectric conversion circuit, the logic processing unit, and the avalanche photoelectric conversion processing unit to form the optical signal processing unit.
8. The integrated optical fiber tester according to claim 1 or 7, wherein the laser circuit is formed by matching a laser and a light source driving circuit with the laser, and the laser and the light source driving circuit are connected with the MCU processing unit and the logic processing unit.
9. The integrated optical fiber tester according to claim 1 or 7, wherein the avalanche photoelectric conversion processing unit comprises an avalanche photoelectric tube, an amplifying network unit, a weak signal matching network unit, a differential amplifier and an analog-to-digital conversion circuit; the avalanche phototube, the amplifying network unit, the weak signal matching network unit, the differential amplifier and the analog-to-digital conversion circuit are sequentially connected, and the amplifying network unit and the weak signal matching network unit are connected with the MCU processing unit; the analog-to-digital conversion circuit is connected with the logic processing unit.
10. The integrated optical fiber tester according to claim 1 or 7, further comprising a temperature sensor connected to the MCU processing unit.
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CN201921212865.9U CN209964057U (en) | 2019-07-30 | 2019-07-30 | Optical fiber comprehensive tester |
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CN201921212865.9U CN209964057U (en) | 2019-07-30 | 2019-07-30 | Optical fiber comprehensive tester |
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