CN209911606U - Lens coupling system - Google Patents
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Abstract
本实用新型涉及光学器件安装领域,公开了一种透镜耦合系统,包括:抓取机构用于抓取料盘中的透镜;空间位移机构与抓取机构相连,用于带动透镜移动以与点胶机构接触进行点胶以及移动点胶后的透镜与芯片贴合;固化机构设置在芯片的上方,用于对透镜和芯片之间的胶水进行固化;定位子系统包括第一图像检测机构,第一图像检测机构设置在料盘的上方,用于获得料盘中透镜的位置信息。本实用新型提供的一种透镜耦合系统,可自动完成透镜与芯片耦合,且设置第一图像检测机构可获得料盘上透镜的精确位置信息,从而使得抓取机构能够顺利准确的抓取透镜,该系统自动化程度较高,可减少劳动强度,且可对透镜进行定位,提高效率和精确度。
The utility model relates to the field of optical device installation, and discloses a lens coupling system, comprising: a grasping mechanism for grasping a lens in a material tray; a spatial displacement mechanism is connected with the grasping mechanism, and is used for driving the lens to move so as to be used for dispensing glue The mechanism is contacted for dispensing and the lens after moving the dispensing is attached to the chip; the curing mechanism is arranged above the chip to cure the glue between the lens and the chip; the positioning subsystem includes a first image detection mechanism, a first The image detection mechanism is arranged above the tray, and is used to obtain the position information of the lens in the tray. The lens coupling system provided by the utility model can automatically complete the coupling between the lens and the chip, and the precise position information of the lens on the material tray can be obtained by setting the first image detection mechanism, so that the grasping mechanism can grasp the lens smoothly and accurately. The system has a high degree of automation, which can reduce labor intensity, and can position the lens to improve efficiency and accuracy.
Description
技术领域technical field
本实用新型涉及光学器件安装领域,特别是涉及一种透镜耦合系统。The utility model relates to the field of optical device installation, in particular to a lens coupling system.
背景技术Background technique
半导体激光器是以半导体材料为工作物质的具有光反馈功能的P-N结二极管,其与固体激光器和气体激光器相比,具有结构紧凑、可靠性高高效稳定等优点,已经被广泛应用于机械加工、材料处理、武器制造和激光显示等行业。半导体激光器具有特殊的发光特性,其输出的激光一般不能直接在实际中应用,必须经过整形、变换和准直。因此自半导体激光器诞生开始,就产生了半导体激光器的耦合问题。所谓的耦合过程主要是对准中心光强较强的部分,以及压缩准直其他部分的光线,以得到功率更集中、质量更好的激光输出。Semiconductor lasers are P-N junction diodes with optical feedback function that use semiconductor materials as working materials. Compared with solid-state lasers and gas lasers, they have the advantages of compact structure, high reliability, high efficiency and stability, and have been widely used in machining, materials, etc. Processing, weapons manufacturing and laser display industries. Semiconductor lasers have special luminous characteristics, and the output lasers generally cannot be directly applied in practice, but must be shaped, transformed and collimated. Therefore, since the birth of semiconductor lasers, the coupling problem of semiconductor lasers has arisen. The so-called coupling process is mainly to align the part with strong light intensity in the center, and to compress and collimate the light of other parts, so as to obtain the laser output with more concentrated power and better quality.
耦合过程通常采用透镜来调整光束的特性,即需要将透镜贴合在半导体激光器的发光芯片上,通过透镜对半导体激光器所发的光进行汇聚和准直。由于透镜的几何尺寸很小,因此对透镜的耦合定位具有较高的难度。In the coupling process, a lens is usually used to adjust the characteristics of the light beam, that is, the lens needs to be attached to the light-emitting chip of the semiconductor laser, and the light emitted by the semiconductor laser is collected and collimated through the lens. Due to the small geometric size of the lens, the coupling positioning of the lens is difficult.
现有透镜耦合大多需要人工将透镜贴合在芯片上,效率和准确率较低,且劳动强度较大。Most of the existing lens coupling needs to manually attach the lens to the chip, which has low efficiency and accuracy, and high labor intensity.
实用新型内容Utility model content
(一)要解决的技术问题(1) Technical problems to be solved
本实用新型的目的是提供一种透镜耦合系统,用于解决或部分解决现有透镜耦合大多需要人工将透镜贴合在芯片上,效率和准确率较低,且劳动强度较大的问题。The purpose of the utility model is to provide a lens coupling system, which is used to solve or partially solve the problems that most of the existing lens couplings need to manually attach the lens to the chip, the efficiency and accuracy are low, and the labor intensity is high.
(二)技术方案(2) Technical solutions
为了解决上述技术问题,本实用新型提供一种透镜耦合系统,包括:抓取机构、空间位移机构、点胶机构、固化机构和定位子系统;所述抓取机构用于抓取料盘中的透镜;所述空间位移机构与所述抓取机构相连,用于带动所述透镜移动以与所述点胶机构接触进行点胶以及移动点胶后的透镜与芯片贴合;所述固化机构设置在所述芯片的上方,用于对透镜和芯片之间的胶水进行固化;所述定位子系统包括第一图像检测机构,所述第一图像检测机构设置在所述料盘的上方,用于获得料盘中透镜的位置信息。In order to solve the above technical problems, the utility model provides a lens coupling system, which includes: a grasping mechanism, a spatial displacement mechanism, a glue dispensing mechanism, a curing mechanism and a positioning subsystem; the grasping mechanism is used for grasping the lens; the spatial displacement mechanism is connected with the grabbing mechanism, and is used for driving the lens to move to contact the dispensing mechanism for dispensing and moving the dispensing lens and the chip to fit; the curing mechanism is set Above the chip, it is used for curing the glue between the lens and the chip; the positioning subsystem includes a first image detection mechanism, and the first image detection mechanism is arranged above the material tray and is used for Obtain position information for the lens in the tray.
在上述方案的基础上,所述空间位移机构包括X轴滑台和Y轴滑台中的至少一个以及Z轴滑台;以及X轴角位移平台、Y轴角位移平台和Z轴角位移平台中的至少一个。On the basis of the above solution, the spatial displacement mechanism includes at least one of the X-axis sliding table and the Y-axis sliding table and the Z-axis sliding table; and the X-axis angular displacement platform, the Y-axis angular displacement platform and the Z-axis angular displacement platform at least one of.
在上述方案的基础上,在所述抓取机构和所述空间位移机构之间设置摆动气缸,所述空间位移机构与所述摆动气缸的壳体相连,所述摆动气缸的输出轴与所述抓取机构相连。On the basis of the above solution, a swinging cylinder is arranged between the grabbing mechanism and the spatial displacement mechanism, the spatial displacement mechanism is connected to the housing of the swinging cylinder, and the output shaft of the swinging cylinder is connected to the The gripping mechanism is connected.
在上述方案的基础上,还包括:限位块和安装座;所述限位块设置在所述摆动气缸和所述抓取机构之间,所述限位块的一侧与所述摆动气缸的壳体相连,所述抓取机构与所述安装座固定连接,所述安装座在所述限位块的另一侧与所述摆动气缸的输出轴相连;所述安装座与所述限位块相接的一侧连接设置定位销,所述限位块的另一侧设置有定位槽,所述定位销插入所述定位槽中。On the basis of the above solution, it also includes: a limit block and a mounting seat; the limit block is arranged between the swing cylinder and the grab mechanism, and one side of the limit block is connected to the swing cylinder The housing is connected to the housing, the grabbing mechanism is fixedly connected to the mounting seat, and the mounting seat is connected to the output shaft of the swing cylinder on the other side of the limiting block; the mounting seat is connected to the limiting block. A positioning pin is connected to one side where the position blocks are connected, the other side of the limit block is provided with a positioning groove, and the positioning pin is inserted into the positioning groove.
在上述方案的基础上,所述抓取机构包括上夹头、下夹头和驱动机构;所述上夹头和所述下夹头的一端分别与所述驱动机构相连,所述上夹头和所述下夹头的另一端分别竖直连接夹爪,所述夹爪朝下设置且所述上夹头的夹爪和所述下夹头的夹爪相对式设置,所述驱动机构用于带动所述上夹头的夹爪和所述下夹头的夹爪相向或者相背移动。On the basis of the above solution, the grasping mechanism includes an upper chuck, a lower chuck and a driving mechanism; one end of the upper chuck and the lower chuck are respectively connected with the driving mechanism, and the upper chuck is connected to the driving mechanism. and the other end of the lower collet are respectively vertically connected to the clamping jaws, the clamping jaws are arranged downward, and the clamping jaws of the upper clamping head and the clamping jaws of the lower clamping head are arranged oppositely, and the driving mechanism uses To drive the jaws of the upper chuck and the jaws of the lower chuck to move toward or away from each other.
在上述方案的基础上,所述点胶机构包括胶针组件和胶杯;所述胶针组件设置在所述胶杯的上方,所述胶杯开口朝上,所述胶针组件通过插入胶杯内部以获得胶水;所述胶针组件包括两个平行设置的胶针,两个胶针的底端处于同一水平面,两个胶针之间的距离小于所述胶杯的杯筒的截面宽度。On the basis of the above solution, the glue dispensing mechanism includes a glue needle assembly and a glue cup; the glue needle assembly is arranged above the glue cup, the opening of the glue cup is upward, and the glue needle assembly is inserted into the glue inside the cup to obtain glue; the glue needle assembly includes two glue needles arranged in parallel, the bottom ends of the two glue needles are in the same horizontal plane, and the distance between the two glue needles is smaller than the cross-sectional width of the cup barrel of the glue cup .
在上述方案的基础上,所述点胶机构还包括:胶杯座、水平设置的第一气缸和竖直设置的第二气缸;所述第一气缸与所述胶针组件相连,用于推动所述胶针组件水平移动;所述胶杯设置在胶杯座上,所述第二气缸与所述胶杯座相连,所述第二气缸用于推动所述胶杯上下移动以使得所述胶针组件插入胶杯内部。On the basis of the above solution, the glue dispensing mechanism further comprises: a glue cup seat, a first air cylinder arranged horizontally and a second air cylinder arranged vertically; the first air cylinder is connected with the glue needle assembly and is used for pushing The glue needle assembly moves horizontally; the glue cup is arranged on the glue cup seat, the second air cylinder is connected with the glue cup seat, and the second air cylinder is used to push the glue cup to move up and down so that the The glue needle assembly is inserted into the glue cup.
在上述方案的基础上,所述胶杯座上设置有滑槽,所述滑槽沿与所述第一气缸的移动方向相垂直的水平方向设置,所述胶杯的杯底与所述滑槽滑动连接。On the basis of the above solution, the plastic cup holder is provided with a chute, the chute is arranged in a horizontal direction perpendicular to the moving direction of the first air cylinder, and the bottom of the plastic cup is connected to the sliding groove. Slot sliding connection.
在上述方案的基础上,所述固化机构包括:若干个UV灯头;若干个UV灯头相互间具有夹角且出光端汇聚设置,若干个UV灯头所发出的光束相交于一点;所述UV灯头远离出光端的第二端与连接板相连,所述连接板用于所述UV灯头的固定。On the basis of the above scheme, the curing mechanism includes: a plurality of UV lamp heads; a plurality of UV lamp heads have an included angle with each other and the light-emitting ends are arranged to converge, and the light beams emitted by the several UV lamp heads intersect at one point; the UV lamp heads are far away from each other. The second end of the light-emitting end is connected with a connecting plate, and the connecting plate is used for fixing the UV lamp head.
在上述方案的基础上,若干个UV灯头连接的连接板相连为一体形成安装板,所述安装板为弯折结构,所述安装板背离所述UV灯头的一侧连接散热片,若干个所述散热片间隔设置且相互平行。On the basis of the above solution, the connecting plates connected by several UV lamp heads are connected together to form a mounting plate, the mounting plate is a bending structure, and the side of the mounting plate facing away from the UV lamp head is connected to the heat sink, and several The heat sinks are arranged at intervals and are parallel to each other.
在上述方案的基础上,所述料盘上设有至少一个透镜放置槽,所述透镜放置槽的底部的中间开设有第一通孔,所述透镜放置槽的底部在所述透镜的至少一个端部处开设有第二通孔;在所述料盘的下方设置第一光源,所述第一光源朝向所述料盘设置;所述料盘放置在第一样品台上,所述第一样品台与所述第一通孔和第二通孔对应位置处设有第三通孔;所述第一样品台的底部设置有第一调整机构,所述第一调整机构包括X轴和Y轴移动平台。On the basis of the above solution, the material tray is provided with at least one lens placement slot, a first through hole is opened in the middle of the bottom of the lens placement slot, and the bottom of the lens placement slot is at least one of the lenses. A second through hole is opened at the end; a first light source is arranged below the material tray, and the first light source is arranged toward the material tray; the material tray is placed on the first sample stage, and the first light source is placed on the first sample stage. A sample stage is provided with a third through hole at a position corresponding to the first through hole and the second through hole; the bottom of the first sample stage is provided with a first adjustment mechanism, and the first adjustment mechanism includes X Axis and Y axis to move the platform.
在上述方案的基础上,所述定位子系统还包括:第二图像检测机构和第三图像检测机构;所述第二图像检测机构设置在所述芯片的上方、用于从上方采集芯片和透镜的图像,所述第二图像检测机构上设置有朝向芯片的第二光源;所述第三图像检测机构设置在所述芯片的一侧、用于从侧面采集芯片和透镜的图像,所述芯片的另一侧设置有第三光源;所述第二图像检测机构和所述第三图像检测机构用于对透镜与芯片的贴合过程进行定位;所述第一图像检测机构、第二图像检测机构和第三图像检测机构分别与所述空间位移机构电连接;所述第一图像检测机构、第二图像检测机构和第三图像检测机构分别包括工业相机。On the basis of the above solution, the positioning subsystem further includes: a second image detection mechanism and a third image detection mechanism; the second image detection mechanism is arranged above the chip and is used to collect the chip and the lens from above The second image detection mechanism is provided with a second light source facing the chip; the third image detection mechanism is provided on one side of the chip and is used to collect images of the chip and the lens from the side. A third light source is provided on the other side of the lens; the second image detection mechanism and the third image detection mechanism are used to position the lens and the chip in the bonding process; the first image detection mechanism, the second image detection mechanism The mechanism and the third image detection mechanism are respectively electrically connected with the spatial displacement mechanism; the first image detection mechanism, the second image detection mechanism and the third image detection mechanism respectively comprise industrial cameras.
在上述方案的基础上,所述芯片放置在底座上;所述底座沿长度方向设置有与多个芯片一一对应的台阶面;所述芯片竖直设置在所述台阶面的一端;所述底座放置在第二样品台上,所述第二样品台的底部设置有第二调整机构;所述第二调整机构包括沿所述底座长度方向的水平移动平台和竖直移动平台。On the basis of the above solution, the chip is placed on the base; the base is provided with a step surface corresponding to a plurality of chips one-to-one along the length direction; the chip is vertically arranged at one end of the step surface; the The base is placed on the second sample stage, and the bottom of the second sample stage is provided with a second adjustment mechanism; the second adjustment mechanism includes a horizontal moving platform and a vertical moving platform along the length direction of the base.
在上述方案的基础上,所述定位子系统还包括:光斑检测机构,所述光斑检测机构包括相对设置于所述芯片的两侧的探针和探头,所述探针用于接触所述芯片以使所述芯片通电发出光束;所述探头用于检测所述光束形成的光斑;所述探头与所述空间位移机构电连接,所述空间位移机构根据所述光斑的状态调节所述透镜的位姿。On the basis of the above solution, the positioning subsystem further includes: a light spot detection mechanism, the light spot detection mechanism includes probes and probes disposed opposite to both sides of the chip, the probes are used to contact the chip so that the chip is energized to emit a light beam; the probe is used to detect the light spot formed by the light beam; the probe is electrically connected with the spatial displacement mechanism, and the spatial displacement mechanism adjusts the position of the lens according to the state of the light spot. pose.
(三)有益效果(3) Beneficial effects
本实用新型提供的一种透镜耦合系统,可自动完成透镜与芯片耦合过程的各个工艺,且设置第一图像检测机构可通过采集料盘的图像获得料盘上透镜的精确位置信息,从而使得抓取机构能够顺利准确的抓取透镜,该系统自动化程度较高,可减少劳动强度,且可对透镜进行定位,提高效率和精确度。The lens coupling system provided by the utility model can automatically complete the various processes of the coupling process of the lens and the chip, and the first image detection mechanism is provided to obtain the precise position information of the lens on the tray by collecting the image of the tray, so that the grasping The pick-up mechanism can grasp the lens smoothly and accurately, the system has a high degree of automation, can reduce labor intensity, and can position the lens to improve efficiency and accuracy.
附图说明Description of drawings
图1为本实用新型实施例的一种透镜耦合系统的第一示意图;1 is a first schematic diagram of a lens coupling system according to an embodiment of the present invention;
图2为本实用新型实施例的一种透镜耦合系统的第二示意图;2 is a second schematic diagram of a lens coupling system according to an embodiment of the present invention;
图3为本实用新型实施例中空间位移机构的示意图;3 is a schematic diagram of a spatial displacement mechanism in an embodiment of the present invention;
图4为本实用新型实施例中安装座的示意图;4 is a schematic diagram of a mounting seat in an embodiment of the present invention;
图5为本实用新型实施例中限位块的示意图;5 is a schematic diagram of a limit block in an embodiment of the present invention;
图6为本实用新型实施例中抓取机构的示意图;6 is a schematic diagram of a grabbing mechanism in an embodiment of the present invention;
图7为本实用新型实施例中点胶机构的第一示意图;Fig. 7 is the first schematic diagram of the dispensing mechanism in the embodiment of the present utility model;
图8为本实用新型实施例中点胶机构的第二示意图;8 is a second schematic diagram of the dispensing mechanism in the embodiment of the present invention;
图9为本实用新型实施例中胶杯与胶杯座的连接示意图;9 is a schematic diagram of the connection between the plastic cup and the plastic cup holder in the embodiment of the present utility model;
图10为本实用新型实施例中压片的示意图;Fig. 10 is the schematic diagram of tablet pressing in the embodiment of the utility model;
图11为本实用新型实施例中固化机构的示意图;11 is a schematic diagram of a curing mechanism in an embodiment of the present invention;
图12为本实用新型实施例中料盘的示意图;Fig. 12 is the schematic diagram of the material tray in the embodiment of the utility model;
图13为本实用新型实施例中透镜放置槽和透镜的相对位置关系示意图;13 is a schematic diagram of the relative positional relationship between the lens placement groove and the lens in the embodiment of the present utility model;
图14是本实用新型实施例中的夹头的调节过程示意图;14 is a schematic diagram of the adjustment process of the chuck in the embodiment of the present invention;
图15是本实用新型实施例中的第二图像检测机构获取的目标透镜和芯片耦合的调节过程示意图;15 is a schematic diagram of the adjustment process of the coupling between the target lens and the chip obtained by the second image detection mechanism in the embodiment of the present invention;
图16是本实用新型实施例中的第三图像检测机构获取的目标透镜和芯片耦合的调节过程示意图。FIG. 16 is a schematic diagram of the adjustment process of the coupling between the target lens and the chip obtained by the third image detection mechanism in the embodiment of the present invention.
附图标记说明:Description of reference numbers:
1—点胶机构; 101—胶针组件; 102—胶杯;1—dispensing mechanism; 101—plastic needle assembly; 102—plastic cup;
103—胶杯座; 104—第一气缸; 105—第二气缸;103—plastic cup holder; 104—first cylinder; 105—second cylinder;
106—压片; 1021—杯筒; 1022—杯底;106—tablet; 1021—cup tube; 1022—cup bottom;
1031—滑槽; 2—固化机构; 201—UV灯头;1031—chute; 2—curing mechanism; 201—UV lamp head;
202—光束; 203—散热片; 204—第一侧边;202—beam; 203—radiator; 204—first side;
205—第二侧边; 206—电源线; 207—固定板;205—the second side; 206—the power cord; 207—the fixing plate;
31—抓取机构; 32—空间位移机构; 33—摆动气缸;31—Grab mechanism; 32—Space displacement mechanism; 33—Swing cylinder;
34—限位块; 35—安装座; 36—定位销;34—Limiting block; 35—Mounting seat; 36—Locating pin;
311—上夹头; 312—下夹头; 313—夹爪;311—upper chuck; 312—lower chuck; 313—claw;
314—开槽; 315—气爪气缸; 316—气爪;314—Slotting; 315—Air Claw Cylinder; 316—Air Claw;
321—X轴滑台; 322—Z轴滑台; 323—Y轴角位移平台;321—X-axis slide table; 322—Z-axis slide table; 323—Y-axis angular displacement platform;
341—定位槽; 3131—夹头第一位置; 325—Z轴角位移平台;341—positioning slot; 3131—the first position of the chuck; 325—Z-axis angular displacement platform;
342—开口; 3132—夹头第二位置; 324—X轴角位移平台;342—opening; 3132—second position of chuck; 324—X-axis angular displacement platform;
51—透镜放置槽; 3134—夹头第四位置; 4—第一图像检测机构;51—lens placement slot; 3134—fourth position of chuck; 4—first image detection mechanism;
5—料盘; 3133—夹头第三位置; 52—第一通孔;5—the material tray; 3133—the third position of the chuck; 52—the first through hole;
53—第二通孔; 54—T形槽; 6—第一样品台;53—the second through hole; 54—the T-shaped groove; 6—the first sample stage;
7—第一调整机构; 10—底座; 8—第二图像检测机构;7—the first adjustment mechanism; 10—the base; 8—the second image detection mechanism;
11—第二样品台; 12—第二调整机构; 9—第三图像检测机构;11—the second sample stage; 12—the second adjustment mechanism; 9—the third image detection mechanism;
13—探针; 14—探头; 15—同步带组;13—Probe; 14—Probe; 15—Timing belt group;
16—机架; 17—支撑台; 18—三维调节架;16—frame; 17—support table; 18—three-dimensional adjustment frame;
19—目标透镜; 20—夹取位置; 1901—透镜第一位置;19—target lens; 20—clamping position; 1901—lens first position;
22—芯片安装位; 21—目标芯片; 1902—透镜第二位置;22—chip mounting position; 21—target chip; 1902—second lens position;
1903—透镜第三位置; 1904—透镜第四位置。1903—the third position of the lens; 1904—the fourth position of the lens.
具体实施方式Detailed ways
下面结合附图和实施例,对本实用新型的具体实施方式作进一步详细描述。以下实例用于说明本实用新型,但不用来限制本实用新型的范围。The specific embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
在本实用新型的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本实用新型中的具体含义。In the description of the present invention, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a connectable connection. Detachable connection, or integral connection; may be mechanical connection or electrical connection; may be direct connection, or indirect connection through an intermediate medium, or internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.
根据本实用新型实施例提供一种透镜耦合系统,参考图1和图2,该系统包括:抓取机构31、空间位移机构32、点胶机构1、固化机构2和定位子系统。抓取机构31用于抓取料盘5中的透镜。空间位移机构32与抓取机构31相连、用于带动透镜移动以与点胶机构1接触进行点胶以及移动点胶后的透镜与芯片贴合。According to an embodiment of the present invention, a lens coupling system is provided. Referring to FIG. 1 and FIG. 2 , the system includes: a grasping
固化机构2设置在芯片的上方、用于对透镜和芯片之间的胶水进行固化。定位子系统包括第一图像检测机构4,第一图像检测机构4设置在料盘5的上方、用于获得料盘5中透镜的位置信息。The curing mechanism 2 is arranged above the chip, and is used for curing the glue between the lens and the chip. The positioning subsystem includes a first image detection mechanism 4 . The first image detection mechanism 4 is arranged above the
本实施例提供的一种透镜耦合系统,空间位移机构32可带动抓取机构31进行空间移动。抓取机构31为主要与透镜接触对透镜进行抓取固定的部件。透镜初始放置在料盘5上。首先,空间位移机构32带动抓取机构31移动,抓取机构31将透镜从料盘5上抓起。In the lens coupling system provided in this embodiment, the spatial displacement mechanism 32 can drive the grabbing
然后空间位移机构32带动抓取机构31和透镜移动,至点胶机构1处对透镜进行点胶。然后空间位移机构32带动抓取机构31和透镜移动至芯片放置位置处,将透镜贴合在芯片上。透镜通过胶水与芯片贴合为一体。在透镜贴合上芯片后,设置在芯片上方的固化机构2对胶水进行固化,以实现透镜和芯片的牢固贴合。Then, the space displacement mechanism 32 drives the
设置第一图像检测机构4在料盘5的上方可通过采集料盘5的图像,进而根据图像获得料盘5中透镜的精确位置信息。进而根据该位置信息控制空间位移机构32移动,使得抓取机构31可顺利准确抓取透镜。By arranging the first image detection mechanism 4 above the
本实施例提供的一种透镜耦合系统,可自动完成透镜与芯片耦合过程的各个工艺,且设置第一图像检测机构4可通过采集料盘5的图像获得料盘5上透镜的精确位置信息,从而使得抓取机构31能够顺利准确的抓取透镜,该系统自动化程度较高,可减少劳动强度,且可对透镜进行定位,提高精确度。The lens coupling system provided in this embodiment can automatically complete each process of the lens and chip coupling process, and the first image detection mechanism 4 is provided to obtain the precise position information of the lens on the
在上述实施例的基础上,进一步地,参考图3,空间位移机构32包括X轴滑台321和Y轴滑台中的至少一个以及Z轴滑台322;以及X轴角位移平台324、Y轴角位移平台323和Z轴角位移平台325中的至少一个。On the basis of the above embodiment, further, referring to FIG. 3 , the spatial displacement mechanism 32 includes at least one of the X-axis sliding table 321 and the Y-axis sliding table and the Z-axis sliding table 322; and the X-axis
X轴滑台321、Y轴滑台和Z轴滑台322可实现抓取机构31的空间直线移动。空间位移机构32可包括三个方向的直线电动滑台,也可只设置竖直方向与一个水平方向的直线电动滑台。滑台的个数可根据具体夹取透镜、点胶以及贴合的过程中抓取机构31所需要移动的位置进行设置,对此不做限定。The X-axis sliding table 321 , the Y-axis sliding table and the Z-axis sliding table 322 can realize the spatial linear movement of the grabbing
以设置三个方向的直线电动滑台为例,即空间位移机构32包括X轴滑台321、Y轴滑台和Z轴滑台322。空间位移机构32可设置在一固定的支撑台17上,设置在料盘5的一侧。X轴滑台321、Y轴滑台和Z轴滑台322的连接结构为:X轴滑台321可固定设置,可与支撑台17固定连接。Y轴滑台与X轴滑台321的滑块相连,X轴滑台321可带动Y轴滑台沿X轴方向进行直线移动;Taking the linear electric sliding table set in three directions as an example, that is, the spatial displacement mechanism 32 includes an X-axis sliding table 321 , a Y-axis sliding table and a Z-axis sliding table 322 . The space displacement mechanism 32 can be arranged on a fixed support table 17 and arranged on one side of the
Z轴滑台322可与Y轴滑台的滑块相连,Y轴滑台可带动Z轴滑台322沿Y轴方向做直线移动。同时Z轴滑台322与Y轴滑台一体可在X轴滑台321的带动下沿X轴方向做直线移动。The Z-axis sliding table 322 can be connected with the slider of the Y-axis sliding table, and the Y-axis sliding table can drive the Z-axis sliding table 322 to move linearly along the Y-axis direction. At the same time, the Z-axis sliding table 322 and the Y-axis sliding table are integrated and can move linearly along the X-axis direction under the driving of the X-axis sliding table 321 .
可设置抓取机构31与Z轴滑台322的滑块相连。抓取机构31在Z轴滑台322的带动下可沿Z轴方向做直线移动。从而空间位移机构32可实现抓取机构31进行三个方向的直线移动。The grabbing
设置滑台,还可便于对抓取机构31的位移进行精确定位。通过滑台可将抓取机构31移动至预设位置处,便于对透镜进行移动。通过滑台使得抓取机构31可沿着预设轨迹移动至所需位置处,便于对透镜进行夹取、点胶和贴合放置。The provision of the sliding table can also facilitate precise positioning of the displacement of the grabbing
因为在对器件夹取过程中,例如在透镜贴合到芯片工艺中对透镜夹取时,因为透镜大多为人工放置在料盘5中。人工放置不能保证每个透镜均毫无偏差的放置在预设位置处。不可避免的透镜与预设位置间为存在一些角度的偏差。Because in the process of clamping the device, for example, in the process of attaching the lens to the chip, the lens is mostly placed in the
因此设置角位移平台,用于带动抓取机构31进行角度偏转移动,以适应透镜的角度偏差,保证能够顺利的夹取透镜。可设置能够实现绕三个方向分别旋转的三个方向角位移平台,也可设置两个方向的角位移平台,也可设置一个方向的角位移平台。Therefore, an angular displacement platform is provided to drive the grabbing
角位移平台的个数可根据具体需要设置,对此不做限定。进一步地,以设置三个方向的角位移平台为例,即同时设置X轴角位移平台324、Y轴角位移平台323和Z轴角位移平台325。X轴角位移平台324即能够提供绕X轴方向旋转运动的平台。The number of angular displacement platforms can be set according to specific needs, which is not limited. Further, take the setting of angular displacement platforms in three directions as an example, that is, the X-axis
X轴角位移平台324、Y轴角位移平台323和Z轴角位移平台325的连接结构为:X轴角位移平台324可与Z轴滑台322的滑块连接;Y轴角位移平台323可与X轴角位移平台324的转动块连接;Z轴角位移平台325与Y轴角位移平台323的转动块连接;驱动机构可与Z轴角位移平台325的转动块连接。The connection structure of the X-axis
抓取机构31可在角位移平台的带动下实现绕三个方向的旋转移动,从而可适应透镜角度的偏转,保证能够顺利夹取透镜。进一步地,X轴滑台321、Y轴滑台和Z轴滑台322均包括位移传感器。X轴角位移平台324、Y轴角位移平台323和Z轴角位移平台325均包括角度传感器。便于对空间位移机构32的移动进行控制调节。The grasping
在上述实施例的基础上,进一步地,参考图3,在抓取机构31和空间位移机构32之间设置摆动气缸33。空间位移机构32与摆动气缸33的壳体相连,摆动气缸33的输出轴与抓取机构31相连。On the basis of the above-mentioned embodiment, further, referring to FIG. 3 , a swinging cylinder 33 is arranged between the grabbing
摆动气缸33为能够提供绕输出轴转动运动的气缸。设置摆动气缸33,可在抓取机构31抓取透镜之后,转动抓取机构31和透镜,使得透镜的底面朝向不同方向,便于适应不同方向的芯片,实现顺利的将透镜贴合在芯片上。The swing cylinder 33 is a cylinder capable of providing rotational movement around the output shaft. The oscillating cylinder 33 is provided to rotate the grabbing
在上述实施例的基础上,进一步地,参考图3,一种透镜耦合系统还包括:限位块34和安装座35。限位块34设置在摆动气缸33和抓取机构31之间。限位块34的一侧与摆动气缸33的壳体相连。抓取机构31与安装座35固定连接。安装座35在限位块34的另一侧与摆动气缸33的输出轴相连。安装座35与限位块34相接的一侧连接设置定位销36。限位块34的另一侧设置有定位槽341。定位销36插入定位槽341中。On the basis of the above-mentioned embodiment, further referring to FIG. 3 , a lens coupling system further includes: a limiting
限位块34用于限定摆动气缸33带动抓取机构31摆动的角度。摆动气缸33位于限位块34的一侧,抓取机构31位于限位块34的另一侧。限位块34与摆动气缸33的壳体相连,限位块34不随摆动气缸33输出轴的转动而转动。抓取机构31是与摆动气缸33的输出轴一体转动的。The
在摆动气缸33带动抓取机构31一体转动时,限位块34可通过阻挡抓取机构31的转动,进而实现控制抓取机构31的摆动角度。设置摆动气缸33主要是为了适应透镜贴合时芯片的位置,可根据实际芯片位置的需要来具体设置限位块34,使得在限位块34的限制下,抓取机构31与透镜转动的角度满足贴合需要。When the swinging cylinder 33 drives the grabbing
参考图4,设置安装座35可便于对抓取机构31进行固定,以及便于抓取机构31与摆动气缸33相连。安装座35和抓取机构31一体在摆动气缸33的带动下转动。参考图5,限位块34可呈块状结构。限位块34的中间部位可设置开口342,便于摆动气缸33的输出轴通过该开口342穿过限位块34与安装座35相连。限位块34在边缘位置处可与摆动气缸33的壳体固定连接。Referring to FIG. 4 , setting the mounting
限位块34的另一侧,即背离摆动气缸33的一侧与安装座35相接。在安装座35与限位块34相接的一侧固定连接设置定位销36,定位销36可为轴状结构,也可为块状结构,为凸出于安装座35表面的结构即可。在摆动气缸33的带动下,定位销36与安装座35一体进行转动。The other side of the limiting
在限位块34的另一侧设置定位槽341。定位槽341可沿定位销36的转动方向进行设置。使得定位销36在定位槽341中能够顺利进行转动。而定位槽341的槽边则可阻挡定位销36的转动,从而对抓取机构31的转动进行限定。定位槽341的开槽角度,即允许定位销36转动的角度可根据需要透镜转动的位置进行设置,不做限定。A
进一步地,在透镜贴合芯片的工艺过程中,一般透镜平放在水平面上,而芯片是竖直放置的。在抓取机构31抓起透镜时,透镜的底面朝下。在将透镜贴合在芯片上时,需要将透镜的底面朝向芯片,即将透镜的底面竖直放置。Further, in the process of attaching the lens to the chip, the lens is generally placed on a horizontal plane, while the chip is placed vertically. When the grasping
此时,可设置定位槽341的开槽角度为90°,即定位槽341两侧槽边的夹角为90°。定位销36初始位于定位槽341的一侧。使得摆动气缸33带动抓取机构31转动时,定位槽341可限定抓取机构31和透镜转动90°。使得透镜的底面转动为竖直状态,便于与芯片贴合。At this time, the slotting angle of the
进一步地,限位块34也可为其他结构来实现限定抓取机构31的转动角度。例如,可在抓取机构31的转动路径上设置限位块34,通过限位块34阻挡抓取机构31的转动来实现控制转动角度。限位块34的具体结构不做限定。Further, the limiting
在上述实施例的基础上,进一步地,参考图6,抓取机构31包括上夹头311、下夹头312和驱动机构。上夹头311和下夹头312的一端分别与驱动机构相连。上夹头311和下夹头312的另一端分别竖直连接夹爪313。夹爪313朝下设置且上夹头311的夹爪313和下夹头312的夹爪313相对式设置。驱动机构用于带动上夹头311的夹爪313和下夹头312的夹爪313相向或者相背移动。On the basis of the above-mentioned embodiment, further, referring to FIG. 6 , the grasping
上夹头311和下夹头312可分别呈板状或杆状,具体形状不限。上夹头311一端与驱动机构相连,另一端向下竖直连接夹爪313,使得上夹头311和夹爪313整体呈L形。同样,下夹头312一端与驱动机构相连,另一端向下竖直连接夹爪313,使得下夹头312和夹爪313整体呈L形。The
上夹头311位于下夹头312的上方,可与下夹头312上下平行设置。上夹头311与下夹头312之间可接触,也可存在间隙。上夹头311的夹爪313与下夹头312的夹爪313均竖直设置,且相互平行。驱动机构可带动上夹头311和/或下夹头312移动,进而使得两个夹爪313之间的距离发生变化。将待夹取器件即透镜置于两个夹爪313之间,两个夹爪313相向移动可对器件进行夹紧;两个夹爪313相背移动,可松开器件。The
进一步地,两个夹爪313的底面应平齐;即位于同一水平面。便于对放置在水平面上的器件进行夹紧,以保证顺利夹取器件。Further, the bottom surfaces of the two clamping
驱动机构包括:气爪气缸315;气爪气缸315包括两个相互平行的气爪316,两个气爪316分别与上夹头311和下夹头312的一端一一对应连接。The driving mechanism includes: an
气爪气缸315的两个气爪316,一个与上夹头311的一端相连,另一个与下夹头312的一端相连。气爪气缸315可带动两个气爪316相向或相背移动,进而可带动上夹头311和下夹头312相向或相背移动,满足夹取需要。One of the two
进一步地,驱动机构也可设置为其他机构,具体不做限定。例如,驱动机构还可为滑轨和电机;可设置上夹头311和下夹头312中的一个与滑轨固定连接,另一个与滑轨滑动连接。与滑轨滑动连接的夹头与电机相连,电机可带动该夹头沿滑轨移动。从而通过电机可调整该夹头与另一个夹头之间的距离,以进行夹取。电机可采用气缸或皮带机等,具体不做限定。Further, the driving mechanism can also be set to other mechanisms, which is not specifically limited. For example, the driving mechanism can also be a slide rail and a motor; one of the
夹爪313中间部位设置有开口朝下的开槽314。夹爪313是与透镜接触的部件。在夹取透镜时,两个夹爪313位于透镜的两侧。在每个夹爪313上设置开槽314,可使得在透镜任一侧的夹爪313与透镜的两个部位接触。The middle part of the clamping
不仅可保证夹爪313夹持透镜的牢固稳定性,且夹爪313中间部位设置开槽314,夹爪313与透镜的中间部位不接触,可防止夹爪313对透镜的中间部位造成损坏而影响正常使用。Not only can the
在上述实施例的基础上,进一步地,参考图7和图8,点胶机构1包括胶针组件101和胶杯102。胶针组件101设置在胶杯102的上方,胶杯102开口朝上,内部容纳有胶水。胶针组件101通过插入胶杯102内部以获得胶水。胶针组件101包括两个平行间隔设置的胶针。两个胶针的底端处于同一水平面。两个胶针之间的距离小于胶杯102的杯筒1021的截面宽度。On the basis of the above embodiment, further referring to FIGS. 7 and 8 , the glue dispensing mechanism 1 includes a
胶针组件101通过插入胶杯102内部的胶水中来蘸取胶水,使得胶水附着在胶针组件101的底端。抓取机构31可抓取透镜等待点胶器件与胶针组件101的底端接触,实现在透镜上涂设胶水。The
胶针组件101可为简单的轴状或针状结构,使得该点胶系统结构简单,便于制造。该点胶系统操作简单,且设置胶针组件101通过蘸取获得胶水,相比现有的胶筒结构,可便于控制每次涂设的胶水量,有利于均匀涂设。The
两个胶针可同时插入胶杯102中蘸取胶水。在对待点胶器件进行涂设胶水时,两个有间隔的胶针可同时对待点胶器件例如透镜的两端进行涂设胶水,有利于提高点胶效率。The two glue needles can be inserted into the
进一步地,可控制胶针每次插入胶杯102中的深度以及时间,来控制胶针每次蘸取的胶水量。控制胶针蘸取胶水后悬空停留的时间来控制在透镜上涂设胶水的均匀性。Further, the depth and time of each insertion of the glue needle into the
进一步地,胶针组件101中两个胶针之间的距离可略小于待点胶器件的长度。这样,两个胶针可与待点胶器件的两端同时接触进行点胶。两个胶针之间的距离也可略大于待点胶器件的长度。这样,待点胶器件可在两个胶针之间移动,带点胶器件的两端应与胶针底部的胶水接触实现点胶。Further, the distance between the two glue needles in the
因为透镜为较精确器件,一般尺寸较小。在两个胶针之间的距离略大于透镜的长度时,只要透镜的两端能够与胶水接触到,就能在透镜的两端涂设上胶水,即能满足透镜的涂胶需求。Because the lens is a more precise device, it is generally smaller in size. When the distance between the two glue needles is slightly larger than the length of the lens, as long as the two ends of the lens can be in contact with the glue, the glue can be applied to the two ends of the lens, which can meet the needs of the lens for gluing.
在上述实施例的基础上,进一步地,点胶机构1还包括:胶杯座103、水平设置的第一气缸104和竖直设置的第二气缸105。第一气缸104与胶针组件101相连,用于推动胶针组件101水平移动。胶杯102设置在胶杯座103上。第二气缸105与胶杯座103相连。第二气缸105用于推动胶杯102上下移动以使得胶针组件101插入胶杯102内部。On the basis of the above embodiment, the glue dispensing mechanism 1 further includes: a
可设置固定安装的机架16用于固定第一气缸104和第二气缸105。第一气缸104的移动方向为水平方向。两个胶针可同时与一连接板相连,通过该连接板与第一气缸104相连。第一气缸104可带动胶针组件101沿水平方向来回移动,便于将胶针组件101输送到方便点胶的位置处,以及便于调整胶针组件101的位置使其位于胶杯102上方。A fixedly mounted
第二气缸105的移动方向为竖直方向。胶针组件101位于胶杯102的上方,第二气缸105带动胶杯102上升,使得胶针插入胶杯102中蘸取胶水;第二气缸105带动胶杯102下降,使得胶针离开胶杯102,便于向待点胶器件进行涂设胶水。The moving direction of the
气缸通过活塞的伸缩可提供直线运动。气缸不同的设置方向,可提供不同方向的直线运动。The cylinder provides linear motion through the expansion and contraction of the piston. Different setting directions of the cylinder can provide linear motion in different directions.
第一气缸104和第二气缸105也可设置为其他结构,例如,可设置为导轨滑块结构。即设置一导轨,滑块与该导轨滑动连接,通过电机的驱动可驱动滑块沿导轨进行直线移动。也可设置为丝杠螺母结构等,具体不做限定。The
进一步地,可设置第一气缸104与三维调节架18相连。可设置三维调节架18与机架16相连,第一气缸104与三维调节架18相连,胶针组件101与第一气缸104相连。可对胶针组件101的初始位置进行调整,便于更好的适应待点胶器件的位置。Further, the
进一步地,第一气缸104和第二气缸105上可设置微调旋钮,用于调节气缸的行程。Further, fine adjustment knobs may be provided on the
在上述实施例的基础上,进一步地,参考图9,胶杯座103上设置有滑槽1031。滑槽1031沿与第一气缸104的移动方向相垂直的水平方向设置。胶杯102的杯底1022与滑槽1031滑动连接。胶杯102的杯底1022插入所述滑槽1031中。胶杯102的杯底1022与滑槽1031滑动连接,使得胶杯102可沿滑槽1031进行移动以调整胶杯102的位置。On the basis of the above-mentioned embodiment, further, referring to FIG. 9 , the
通过设置胶杯102与胶杯座103滑动连接,且滑动方向与胶针组件101的移动方向相垂直。可通过对胶杯102或者胶针组件101位置的调整,使得胶杯102位于胶针组件101的正下方,便于能够顺利蘸取胶水。The
在上述实施例的基础上,进一步地,胶杯102的杯底1022的截面面积大于胶杯102的杯筒1021的截面面积。胶杯102的杯底1022与胶杯座103通过连接件可拆卸连接。连接件用于在胶杯102调整好位置之后,将胶杯102与胶杯座103连接起来对胶杯102进行固定。设置胶杯102的杯底1022截面大于杯筒1021的截面,可便于设置连接件实现胶杯102的固定。On the basis of the above embodiment, further, the cross-sectional area of the
在上述实施例的基础上,进一步地,参考图10,连接件包括压片106。压片106呈U形。压片106的两侧壁分别覆盖在胶杯102的杯筒1021两侧的杯底1022上。压片106与胶杯座103通过螺栓连接。On the basis of the above-mentioned embodiment, further, referring to FIG. 10 , the connecting piece includes a
U形压片106的开口端可插在胶杯102的杯筒1021两侧,使得压片106的两侧壁压在胶杯102的杯底1022上。而压片106的另一端可与胶杯座103通过螺栓进行连接固定。通过压片106的压力对胶杯102进行固定。The open ends of the U-shaped
在上述实施例的基础上,进一步地,连接件包括夹紧机构。夹紧机构用于将胶杯102的杯底1022与胶杯座103夹紧固定。连接件也可设置为夹紧机构,即在胶杯102的位置调整好之后,将胶杯102与胶杯座103夹紧实现胶杯102的固定。On the basis of the above embodiment, further, the connecting piece includes a clamping mechanism. The clamping mechanism is used to clamp and fix the
夹紧机构可为夹持件,例如夹具,将胶杯102的杯底1022与胶杯座103夹紧。夹紧机构也可为Z型件。在胶杯102的两侧,各通过Z型件将胶杯102的杯底1022与胶杯座103连接起来。在胶杯102的任一侧,设置两个Z型件,一个在胶杯座103的上方,一个在下方。通过两个Z型件的固定连接,进而对胶杯102的杯底1022进行夹紧固定。The clamping mechanism may be a clamping member, such as a clamp, for clamping the
胶杯102也可通过其他结构与胶杯座103可调节固定连接,具体不做限定。The
在上述实施例的基础上,进一步地,参考图11,固化机构2包括:若干个UV灯头201。若干个UV灯头201相互间具有夹角且出光端汇聚设置。若干个UV灯头201所发出的光束202相交于一点。UV灯头201远离出光端的第二端与连接板相连。连接板用于UV灯头201的固定。On the basis of the above embodiment, further referring to FIG. 11 , the curing mechanism 2 includes: a plurality of UV lamp heads 201 . The plurality of UV lamp heads 201 have an included angle with each other, and the light-emitting ends are arranged in a convergent manner. The light beams 202 emitted by several UV lamp heads 201 intersect at one point. The second end of the
本实施例提供的一种固化机构2,将若干个UV灯头201呈一定夹角汇聚设置,使得若干个UV灯头201的多束光斑汇聚,从而可增大UV光线的强度,将待固化器件放置在光斑汇聚处,可改善照射效果,提高固化效率。In a curing mechanism 2 provided in this embodiment, a plurality of UV lamp heads 201 are converged and arranged at a certain angle, so that the multiple light spots of the plurality of UV lamp heads 201 are converged, so that the intensity of the UV light can be increased, and the device to be cured can be placed on the At the convergence of the light spot, the irradiation effect can be improved and the curing efficiency can be improved.
UV灯头201即可发出UV紫外光的灯具。优选的,UV灯头201为光线从一端射出的灯具。可通过连接板将UV灯头201固定在合适的位置处以及形成合适的角度。The
进一步地,UV灯头201可通过连接板与胶杯座103固定连接。芯片可设置在胶杯座103的下方,便于UV灯头201的光线照射到芯片上。UV灯头201也可通过机架16进行固定,以能将光束202汇聚点照射到芯片上为目的。Further, the
在上述实施例的基础上,进一步地,若干个UV灯头201连接的连接板相连为一体形成安装板。安装板为弯折结构。安装板背离所述UV灯头201的一侧连接散热片203。若干个散热片203间隔设置且相互平行。On the basis of the above embodiment, further, a plurality of connecting plates connected to the UV lamp heads 201 are connected together to form a mounting plate. The mounting plate is a bent structure. The side of the mounting plate facing away from the
即若干个UV灯头201同时与一个安装板连接固定。安装板为弯折结构。可便于UV灯头201相互呈一定夹角设置。将若干个UV灯头201集成设置在一个安装板上,使固化机构2设计成一体,结构紧凑,可方便安装调试。设置散热片203可加速UV灯头201工作过程中热量的散发,保证UV灯头201长期高效的工作。散热片203可与连接板垂直设置。That is, several UV lamp heads 201 are connected and fixed to one mounting plate at the same time. The mounting plate is a bent structure. It is convenient for the UV lamp heads 201 to be arranged at a certain angle with each other. Several UV lamp heads 201 are integrated on a mounting plate, so that the curing mechanism 2 is designed as a whole, and the structure is compact, which can be easily installed and debugged. Disposing the
进一步地,安装板呈L形。L形的安装板具有两个侧边。安装板的第一侧边204为弯折结构且与散热片203连接。安装板的第二侧边205与胶杯座103或机架16固定连接。安装板的第二侧边205可与胶杯座103或机架16通过螺栓可拆卸固定连接。Further, the mounting plate is L-shaped. The L-shaped mounting plate has two sides. The
进一步地,安装板的第二侧边205上设置固定板207。固定板207与第二侧边205之间存在距离。UV灯头201的电源线206在固定板207的一侧或两侧通过固定板207固定。Further, a fixing
固定板207可平行于第二侧边205设置。且固定板207可与第二侧边205可拆卸固定连接。安装板上在散热片203之间的间隙处可设置有通孔。UV灯头201的电源线206穿过通孔到达安装板设置散热片203的一侧。The fixing
电源线206可布置在固定板207与第二侧边205之间,也可布置在固定板207背离第二侧边205的一侧,也可布置在固定板207的两侧。电源线206可通过固定板207进行固定。例如,可通过卡箍等将电源线206固定在固定板207上。The
设置第二侧边205不仅便于对固化机构2整体进行安装固定,也便于对UV灯头201的电源线206进行固定。将UV灯头201的电源线206通过固定板207固定,可使若干个UV灯头201的电源线206有序放置,便于连接电源,且增加整个固化机构2的集成度,便于安装和使用。The provision of the
进一步地,固定板207与安装板的第二侧边205可通过螺栓连接,可在固定板207与安装板的第二侧边205之间、固定板207的两端设置垫片,以使得固定板207与安装板的第二侧边205之间存在距离。安装板也可直接通过该螺栓与胶杯座103或机架16进行固定连接。安装板也可在其他部位与胶杯座103或机架16连接,固定板207与安装板也可通过其他方式连接以形成间距,具体不做限定。Further, the fixing
在上述实施例的基础上,进一步地,UV灯头201与连接板转动连接。连接板上设置安装座,UV灯头201与安装座铰接连接或销接连接。设置UV灯头201在安装板上可转动,可便于调整每个UV灯头201的角度,便于调整整个固化机构2汇聚的光斑的位置,提高整个固化机构2使用的灵活性和适用性。On the basis of the above embodiment, further, the
该固化机构2,适用于大功率激光器FAC透镜耦合封装设备,即在激光器透镜耦合过程中,透镜和激光器芯片之间设置有紫外胶水,该固化机构2可用于对透镜和激光器芯片之间的紫外胶水进行固化处理。The curing mechanism 2 is suitable for high-power laser FAC lens coupling and packaging equipment, that is, in the process of laser lens coupling, ultraviolet glue is arranged between the lens and the laser chip, and the curing mechanism 2 can be used for UV glue between the lens and the laser chip. The glue is cured.
在上述实施例的基础上,进一步地,参考图12,料盘5上设有至少一个透镜放置槽51。透镜放置槽51的底部的中间开设有第一通孔52。透镜放置槽51的底部在透镜的至少一个端部处开设有第二通孔53。On the basis of the above embodiment, further referring to FIG. 12 , at least one
在料盘5的下方设置第一光源,第一光源朝向料盘5设置。料盘5放置在第一样品台6上。第一样品台6与第一通孔52和第二通孔53对应位置处设有第三通孔。第一样品台6的底部设置有第一调整机构7,第一调整机构7包括X轴和Y轴移动平台。A first light source is disposed below the
透镜放置槽51的数量可以为一个,也可以为多个,本实施例中以多个为例进行说明。多个透镜放置槽51呈纵横阵列式排布。第一通孔52为长条形,位于透镜放置槽51的中间部位,使得透镜的中间部位的两侧边与该第一通孔52的位置相对应。即从料盘5底部,透过该第一通孔52可看到透镜中间部位的两侧边。The number of the
第二通孔53的数量为一个,形状为圆形,且设置于透镜放置槽51的一端。透镜放置槽51的另一端设置一个T形槽54。放置透镜时,透镜的一端位于第二通孔53上,透镜的另一端位于T形槽54上。即从料盘5底部,通过第二通孔53可看到透镜的一端。T形槽54并不贯穿料盘5设置,用于对透镜的另一端进行支撑。T形槽54的宽度可与透镜的宽度相适应,便于对透镜放置时进行初步定位。The number of the second through
除了上述情况外,第二通孔53的数量也可以为两个,且对称地设置于透镜放置槽51的两端。In addition to the above situation, the number of the second through
第一光源从料盘5的底部朝向料盘5发光,第一光源可以与料盘5间隔一定的距离,也可以直接设置在料盘5的底部。本实施例中的第一光源设置在第一样品台6的下方,可通过固定在支撑台17上的基座进行固定。第一光源所发出的光,可穿过样品台的第三通孔以及料盘5上的第一通孔52和第二通孔53照向透镜。The first light source emits light from the bottom of the
第一光源在料盘5的下方,只有在第一通孔52和第二通孔53处才能穿过料盘5,使得第一图像检测机构4所采集的料盘5图像中,第一通孔52处和第二通孔53处与透镜放置槽51的其他部位颜色有明显区别。便于识别第一通孔52处和第二通孔53处透镜的部位。通过第一通孔52可识别出透镜的两侧边,可用来判断透镜与预设参考线可为透镜放置槽51的中心线之间的角度。通过第二通孔53可判断出透镜的端部,根据透镜的已知长度参数可确定透镜的两个端部,进而可判断出透镜的位置信息。The first light source is below the
第一调整机构7可为能提供沿X轴直线移动以及Y轴直线移动的相关结构。可为滑台结构,也可为电机、丝杠和螺母座结构,具体不做限定,以能提供直线移动为目的。第一调整机构7可带动第一样品台6移动,便于放置料盘5以及移动料盘5至合适的初始位置处。The first adjustment mechanism 7 may be a related structure capable of providing linear movement along the X axis and linear movement along the Y axis. It can be a sliding table structure or a motor, a lead screw and a nut seat structure, which is not limited in detail, in order to provide linear movement. The first adjustment mechanism 7 can drive the first sample stage 6 to move, which is convenient for placing the
在上述实施例的基础上,进一步地,定位子系统还包括:第二图像检测机构8和第三图像检测机构9。第二图像检测机构8设置在芯片的上方、用于从上方采集芯片和透镜的图像。第二图像检测机构8上设置有朝向芯片的第二光源。第三图像检测机构9设置在芯片的一侧、用于从侧面采集芯片和透镜的图像。芯片的另一侧设置有第三光源。第三光源朝向第三图像检测机构9设置。第二图像检测机构8和第三图像检测机构9用于对透镜与芯片的贴合过程进行定位。On the basis of the above embodiment, the positioning subsystem further includes: a second image detection mechanism 8 and a third image detection mechanism 9 . The second image detection mechanism 8 is disposed above the chip, and is used to collect images of the chip and the lens from above. The second image detection mechanism 8 is provided with a second light source facing the chip. The third image detection mechanism 9 is arranged on one side of the chip, and is used to collect images of the chip and the lens from the side. The other side of the chip is provided with a third light source. The third light source is disposed toward the third image detection mechanism 9 . The second image detection mechanism 8 and the third image detection mechanism 9 are used to position the lens and the chip during the bonding process.
在透镜点胶之后,空间位移机构32可先根据芯片的初始位置信息将透镜移动至芯片上方。第二图像检测机构8与第二光源配合,可从芯片上方采集透镜和芯片的图像。通过该图像可分析出透镜与芯片之间的水平间距以及从俯视角度透镜相对与芯片的偏移角度。After the lens is glued, the space displacement mechanism 32 can first move the lens above the chip according to the initial position information of the chip. The second image detection mechanism 8 cooperates with the second light source, and can collect images of the lens and the chip from above the chip. Through this image, the horizontal distance between the lens and the chip and the offset angle of the lens relative to the chip from a top view can be analyzed.
第三图像检测机构9与第三光源配合,可在侧边采集芯片和透镜的图像。通过该图像可分析出透镜与芯片之间竖直间距以及从测试角度透镜相对与芯片的偏移角度。The third image detection mechanism 9 cooperates with the third light source, and can collect images of the chip and the lens at the side. Through this image, the vertical distance between the lens and the chip and the offset angle of the lens relative to the chip from the test angle can be analyzed.
第一图像检测机构4、第二图像检测机构8和第三图像检测机构9分别与空间位移机构32电连接。空间位移机构32根据第一图像检测机构4、第二图像检测机构8和第三图像检测机构9所判断出的位置信息进行移动,以实现顺利夹取透镜以及将透镜贴合在芯片上。The first image detection mechanism 4 , the second image detection mechanism 8 and the third image detection mechanism 9 are respectively electrically connected to the spatial displacement mechanism 32 . The spatial displacement mechanism 32 moves according to the position information determined by the first image detection mechanism 4 , the second image detection mechanism 8 and the third image detection mechanism 9 , so as to smoothly clamp the lens and attach the lens to the chip.
第一图像检测机构4、第二图像检测机构8和第三图像检测机构9分别包括工业相机。例如CCD相机或者CMOS相机。利用工业相机可以将所采集的光信号转变成电信号,然后再通过信号线传输给空间位移机构32。工业相机数据接口可以采用以太网接口、USB接口或者其他的信号接口。The first image detection mechanism 4 , the second image detection mechanism 8 and the third image detection mechanism 9 respectively include industrial cameras. For example, a CCD camera or a CMOS camera. The collected optical signal can be converted into an electrical signal by using an industrial camera, and then transmitted to the spatial displacement mechanism 32 through a signal line. The industrial camera data interface can use an Ethernet interface, a USB interface or other signal interfaces.
进一步地,第一图像检测机构4、第二图像检测机构8可分别通过机架16进行固定。机架16可固定设置在支撑台17上。第三图像检测机构9可通过固定在支撑台17上的支撑座进行固定。Further, the first image detection mechanism 4 and the second image detection mechanism 8 can be respectively fixed by the
进一步地,第一图像检测机构4、第二图像检测机构8和第三图像检测机构9还可分别连接三维调节架。三维调节架固定在机架16或支撑座上,可便于对图像检测机构的初始位置进行调节,提高使用灵活性和适用性。例如,在进行夹取作业之前,利用三维调节架调节镜头与料盘5之间的距离,使得透镜可以获得较好的成像质量。在夹取作业过程中,无需再调节该距离。Further, the first image detection mechanism 4 , the second image detection mechanism 8 and the third image detection mechanism 9 can be respectively connected to the three-dimensional adjustment frame. The three-dimensional adjustment frame is fixed on the
在上述实施例的基础上,进一步地,芯片放置在底座10上。底座10沿长度方向设置有与多个芯片一一对应的台阶面。芯片竖直设置在台阶面的一端。底座10放置在第二样品台11上。第二样品台11的底部设置有第二调整机构12;第二调整机构12包括沿底座10长度方向的水平移动平台和竖直移动平台。On the basis of the above embodiment, further, the chip is placed on the base 10 . The base 10 is provided with step surfaces corresponding to the plurality of chips one-to-one along the length direction. The chip is vertically arranged at one end of the stepped surface. The base 10 is placed on the second sample stage 11 . The bottom of the second sample stage 11 is provided with a second adjustment mechanism 12 ; the second adjustment mechanism 12 includes a horizontal moving platform and a vertical moving platform along the length direction of the base 10 .
底座10用于固定芯片。底座10的上表面呈台阶状,在每个台阶面的一端竖直放置芯片。抓取机构31从料盘5上抓取透镜时,透镜的底面是朝下的。因为芯片竖直设置,因此需要摆动气缸33带动抓取机构31和透镜旋转90°,使得透镜的底面设置为竖直态,便于贴合在芯片上。The base 10 is used to fix the chip. The upper surface of the base 10 is stepped, and chips are placed vertically at one end of each stepped surface. When the grabbing
设置第二调整机构12,既便于对底座10和芯片的初始位置进行调整,使其位于便于贴合透镜的位置处。且在一个芯片贴合完成后,通过第二调整机构12可将下一个芯片移动至贴合工位处,便于连续自动的对多个芯片进行贴合。The provision of the second adjustment mechanism 12 is convenient for adjusting the initial positions of the base 10 and the chip, so that they are located at a position that is convenient for attaching the lens. And after the bonding of one chip is completed, the next chip can be moved to the bonding station through the second adjustment mechanism 12, so as to facilitate continuous and automatic bonding of multiple chips.
在上述实施例的基础上,进一步地,定位子系统还包括:光斑检测机构。光斑检测机构包括相对设置于芯片的两侧的探针13和探头14。探针13用于接触芯片以使芯片通电发出光束。探头14用于检测光束形成的光斑。探头14与空间位移机构32电连接。空间位移机构32根据光斑的状态调节透镜的位置。On the basis of the above embodiment, further, the positioning subsystem further includes: a light spot detection mechanism. The light spot detection mechanism includes probes 13 and probes 14 that are oppositely disposed on both sides of the chip. The probe 13 is used to contact the chip to energize the chip to emit light beams. The probe 14 is used to detect the spot formed by the light beam. The probe 14 is electrically connected to the spatial displacement mechanism 32 . The spatial displacement mechanism 32 adjusts the position of the lens according to the state of the light spot.
在透镜贴合过程中,首先空间位移机构32根据第二图像检测机构8和第三图像检测机构9所判断的位置信息进行移动,使透镜逐渐朝向芯片移动。在透镜与芯片距离较近时,空间位移机构32暂停移动。通过光斑检测机构对透镜的位置进行精确更进一步地定位。该距离可为预设距离。During the lens bonding process, first, the spatial displacement mechanism 32 moves according to the position information determined by the second image detection mechanism 8 and the third image detection mechanism 9 , so that the lens is gradually moved toward the chip. When the distance between the lens and the chip is relatively close, the movement of the space displacement mechanism 32 is suspended. The position of the lens is precisely and further positioned by the spot detection mechanism. The distance may be a preset distance.
此时,透镜已经较为接近芯片。光斑检测机构通过检测透镜对芯片的聚光效果来判断透镜是否达到了最合适的耦合位置处。透镜位于芯片和探头14之间。探针13为通电状态。当探针13接触芯片时,芯片会发出光束。芯片朝向探头14设置,光束经透镜后被探头14接收形成光斑。At this point, the lens is relatively close to the chip. The spot detection mechanism judges whether the lens has reached the most suitable coupling position by detecting the light-converging effect of the lens on the chip. The lens is located between the chip and the probe 14 . The probe 13 is energized. When the probe 13 contacts the chip, the chip emits a light beam. The chip is disposed toward the probe 14, and the light beam is received by the probe 14 after passing through the lens to form a light spot.
可设置透镜处于耦合位置处的预设光斑形状,将实际光斑与预设光斑进行比较,来不断的微调透镜的位置。直至实际光斑与预设光斑一致,形状和大小均相同,则说明透镜已达到耦合位置处,此时,通过空间位移机构32将透镜在耦合位置处与芯片贴合。The preset spot shape of the lens at the coupling position can be set, and the actual spot is compared with the preset spot to continuously fine-tune the position of the lens. Until the actual light spot is consistent with the preset light spot with the same shape and size, it means that the lens has reached the coupling position. At this time, the lens is attached to the chip at the coupling position by the spatial displacement mechanism 32 .
进一步地,在探头14和底座10之间可设置同步带组15等移动机构,便于调整探头14与底座10之间的距离,提高灵活性和适用性。探头14也可连接三维调节架,便于调整初始位置。Further, a moving mechanism such as a timing belt group 15 can be arranged between the probe 14 and the base 10 to facilitate adjustment of the distance between the probe 14 and the base 10 and improve flexibility and applicability. The probe 14 can also be connected to a three-dimensional adjustment frame, which is convenient for adjusting the initial position.
在上述实施例的基础上,进一步地,一种透镜耦合方法,利用上述任一实施例中的透镜耦合系统,包括:通过第一图像检测机构4获得料盘5上目标透镜19的位置信息;移动抓取机构31至目标透镜19的上方,然后抓取机构31抓取目标透镜19;移动抓取机构31带动目标透镜19至预设点胶位置处;按照预设路径移动抓取机构31与点胶机构1接触进行点胶;通过第二图像检测机构8和第三图像检测机构9获得底座10上目标芯片21的位置;移动抓取机构31带动目标透镜19至预耦合位置处;根据光斑检测机构检测到的目标芯片21所发出光束形成的光斑,调整目标透镜19的位姿,直至耦合位置处;移动抓取机构31将目标透镜19与目标芯片21贴合起来;固化机构2对目标透镜19上的胶水进行固化预设时间后,抓取机构31松开目标透镜19,完成贴合。On the basis of the above embodiment, further, a lens coupling method, using the lens coupling system in any of the above embodiments, includes: obtaining the position information of the
在点胶之后、通过第二图像检测机构8和第三图像检测机构9获得底座10上目标芯片21的位置之前,摆动气缸33可带动夹头和目标透镜19转动90°,使得目标透镜19的底部朝向芯片。After the glue is dispensed and before the position of the
在上述实施例的基础上,进一步地,图13中的a图为第一图像检测机构拍摄到的透镜和透镜放置槽的图像,图13中的b图为第一图像检测机构经过计算处理后得到的透镜和透镜放置槽的图像。通过第一图像检测机构4获得料盘5上目标透镜19的位置具体包括:利用第一通孔52透射光线,获取目标透镜19的侧边的图像,计算目标透镜19的侧边与预设参考线之间的角度值,得到目标透镜19倾角α;利用第二通孔53透射光线,获取目标透镜19的端面的图像,得到目标透镜19的端面的位置信息,根据目标透镜19的长度H计算出目标透镜19的另一端面的位置信息。On the basis of the above-mentioned embodiment, further, picture a in FIG. 13 is the image of the lens and the lens placement groove captured by the first image detection mechanism, and picture b in FIG. 13 is after the calculation processing of the first image detection mechanism The resulting image of the lens and lens placement slot. Obtaining the position of the
具体的,本实施例中的预设参考线为透镜放置槽51的右边线。更进一步地,根据透镜的两端的位置信息以及透镜倾角α可以得到透镜在透镜放置槽51内的放置图像。根据夹头的大小,使得上夹头311和下夹头312的夹爪313上开槽314的中心线与透镜的中心线重合或者存在一定范围的偏移,进而可以计算出夹头的最终的夹取位置20。上夹头311和下夹头312统称为夹头。Specifically, the preset reference line in this embodiment is the right line of the
更进一步地,如图14所示,空间位移机构32调节夹头的位置至夹取位置20这一步骤,包括以下分步骤:Further, as shown in FIG. 14 , the step of adjusting the position of the chuck head to the
将夹头由初始位置移动至透镜的上方,夹头与透镜的高度差为预设高度。具体地,可以设定为1-3mm。Move the chuck from the initial position to the top of the lens, and the height difference between the chuck and the lens is a preset height. Specifically, it can be set to 1-3mm.
利用第一图像检测机构4获取夹头的位置,根据透镜倾角α转动夹头,使夹头的夹取面平行于透镜的侧面;Use the first image detection mechanism 4 to obtain the position of the collet, and rotate the collet according to the lens inclination angle α, so that the clamping surface of the collet is parallel to the side surface of the lens;
计算夹头的夹取面与透镜的侧面之间的距离,得到平移距离L。具体地,该平移距离L沿Y轴的分量为L1,以及沿X轴的分量为L2,可以通过空间位移机构32和/或第一调整机构7进行调整。Calculate the distance between the clamping surface of the collet and the side surface of the lens to obtain the translation distance L. Specifically, the component of the translation distance L along the Y axis is L 1 and the component along the X axis is L 2 , which can be adjusted by the spatial displacement mechanism 32 and/or the first adjustment mechanism 7 .
根据平移距离L和预设高度移动夹头至夹取位置20。Move the collet to the
具体地,如图14所示,将夹头的调整过程分为四个阶段:初始状态时,夹头位于夹头第一位置3131,此时夹头的夹取面平行于透镜放置槽51的右边线,因此夹头的夹取面与透镜之间的夹角等于透镜倾角α。将夹头转动透镜倾角α,使得夹头位于夹头第二位置3132,夹头的夹取面平行于透镜的侧面。再通过空间位移机构32或第一调整机构7在Y轴方向移动L1,使得夹头位于夹头第三位置3133,夹头的中心线与透镜的中心线重合。然后,通过空间位移机构32或第一调整机构7在X轴方向移动L2,使得夹头位于夹头第四位置3134,夹头的夹取面位于夹取位置20的上方。接着,通过Z轴滑台322向下移动预设高度,使得夹头位于夹取位置20。最后,接着打开气缸,使得上夹头311和下夹头312靠拢,进行夹取作业。Specifically, as shown in FIG. 14 , the adjustment process of the collet is divided into four stages: in the initial state, the collet is located at the first position 3131 of the collet, and the clamping surface of the collet is parallel to the position of the
进一步地,在利用第一图像检测机构4获取透镜的位置之后,第一图像检测机构4将透镜的位置信息传递给空间位移机构32之前,还包括以下步骤:获取透镜位置偏差预设值;计算透镜的位置与标准透镜位置之间的偏差值;比较偏差值与透镜位置偏差预设值之间的大小;若偏差值大于透镜位置偏差预设值,则停止夹取作业,并发出提示信息,以提示工作人员重新放置透镜;若偏差值小于或者等于透镜位置偏差预设值,则利用第一图像检测机构4将透镜的位置信息传递给空间位移机构32,继续执行后续作业。Further, after the first image detection mechanism 4 is used to obtain the position of the lens, and before the first image detection mechanism 4 transmits the position information of the lens to the spatial displacement mechanism 32, the following steps are further included: obtaining a preset value of lens position deviation; calculating The deviation value between the lens position and the standard lens position; compare the deviation value and the lens position deviation preset value; if the deviation value is greater than the lens position deviation preset value, the clamping operation will be stopped and a prompt message will be issued. To prompt the staff to reposition the lens; if the deviation value is less than or equal to the preset lens position deviation value, the first image detection mechanism 4 is used to transmit the position information of the lens to the spatial displacement mechanism 32, and the subsequent operation is continued.
通过以上实施例可以看出,本实用新型实施例提供的透镜耦合系统及方法,通过夹头替代人工来夹取透镜,降低了夹取过程的随机性,使得夹持力更加稳定。同时,通过第一图像检测机构4替代人眼来做测量和判断,并将透镜的位置信息传递给空间位移机构32,空间位移机构32再根据测量所得的透镜的位置来调节夹头的位置,提高了夹取过程的精确度,避免了对透镜工作面的污染。空间位移机构32和第一图像检测机构4相辅相成,可以实现透镜夹取过程的自动化、连续化操作,提高了夹取过程的效率,节省了人力和时间,也为后续透镜的安装提供了位置参考。It can be seen from the above embodiments that the lens coupling system and method provided by the embodiments of the present invention use a chuck instead of manually to clamp the lens, which reduces the randomness of the clamping process and makes the clamping force more stable. At the same time, the first image detection mechanism 4 replaces the human eye for measurement and judgment, and transmits the position information of the lens to the spatial displacement mechanism 32, and the spatial displacement mechanism 32 adjusts the position of the chuck according to the position of the lens obtained by measurement, The precision of the clamping process is improved, and the contamination of the working surface of the lens is avoided. The spatial displacement mechanism 32 and the first image detection mechanism 4 complement each other, which can realize the automatic and continuous operation of the lens clamping process, improve the efficiency of the clamping process, save manpower and time, and also provide a position reference for the subsequent lens installation. .
根据光斑检测机构检测到的目标芯片21所发出光束形成的光斑,调整目标透镜19的位姿具体包括:若判断光斑与预设光斑在位置和/或大小上不同,利用抓取机构31调整目标透镜19的位置;若判断光斑与预设光斑在形状上不同,利用抓取机构31调整目标透镜19的倾斜角度;直到光斑检测机构检测到的光斑与预设光斑相同时,将目标透镜19贴合到目标芯片21上。According to the light spot formed by the light beam emitted by the
如果探头14获取的光斑与预设光斑在大小、位置和形状三个方面均存在差异,可以同时调整目标透镜19的倾斜角度和位置来使得实际光斑与预设光斑相同。If the spot obtained by the probe 14 differs from the preset spot in size, position and shape, the tilt angle and position of the
本实用新型实施例给出了实际光斑和预设光斑的调整方法,在实际光斑与预设光斑在大小和位置上不同时,需要调整目标透镜19的位置,在实际光斑与预设光斑在形状上不同时,需要调整目标透镜19的倾斜角,在实际使用过程中,可以根据实际光斑的实际情况来调整目标透镜19的位姿,而不是盲目的调整,从而提高调整效率。The embodiment of the present utility model provides an adjustment method for the actual light spot and the preset light spot. When the actual light spot and the preset light spot are different in size and position, the position of the
下面通过结合具体的耦合定位过程来进一步的说明。The following is further described by combining the specific coupling positioning process.
首先,将多个芯片安装于底座10上对应的芯片安装位22中。底座10的台阶面的数量和尺寸根据具体的需要来设计。First, a plurality of chips are mounted in the corresponding
然后,利用第二调整机构12将待耦合的芯片移动至第二图像检测机构8和第三图像检测机构9的观测区域,再利用空间位移机构32将夹持有透镜的夹头也移动至相应的观测区域,使透镜和芯片能被同时拍摄至一个画面中。其中料盘5中可以放置多个透镜,每次耦合之前夹头均移动至料盘5处夹取一个透镜。Then, use the second adjustment mechanism 12 to move the chip to be coupled to the observation area of the second image detection mechanism 8 and the third image detection mechanism 9, and then use the space displacement mechanism 32 to move the chuck holding the lens to the corresponding position. The observation area is large, so that the lens and the chip can be photographed into one picture at the same time. A plurality of lenses can be placed in the
接着,利用第二图像检测机构8和第三图像检测机构9同时获取透镜和待耦合的芯片的相对位置,并通过图像处理单元得到透镜与芯片之间的距离和角度关系。如图15所示,第二图像检测机构8获取到透镜与芯片之间的夹角为β,透镜与芯片之间的距离为L3。如图16所示,第三图像检测机构9获取到透镜与芯片之间的夹角为δ,透镜与芯片之间的距离为L4。第二图像检测机构8和第三图像检测机构9将上述相对位置信息传递给空间位移机构32,空间位移机构32根据相对位置信息(即距离和角度)计算出待耦合位置。Next, use the second image detection mechanism 8 and the third image detection mechanism 9 to simultaneously obtain the relative positions of the lens and the chip to be coupled, and obtain the distance and angle relationship between the lens and the chip through the image processing unit. As shown in FIG. 15 , the angle between the lens and the chip obtained by the second image detection mechanism 8 is β, and the distance between the lens and the chip is L 3 . As shown in FIG. 16 , the angle between the lens and the chip obtained by the third image detection mechanism 9 is δ, and the distance between the lens and the chip is L 4 . The second image detection mechanism 8 and the third image detection mechanism 9 transmit the relative position information to the spatial displacement mechanism 32, and the spatial displacement mechanism 32 calculates the to-be-coupled position according to the relative position information (ie, distance and angle).
接着,利用空间位移机构32调节夹头的位置至耦合位置,此时需要调节透镜与芯片在Y方向上平行。通过空间位移机构32调整夹头的角度,使透镜从透镜第一位置1901变换至透镜第二位置1902,同时平移透镜,使透镜与芯片在X轴方向的距离为第一预设距离,此时透镜处于透镜第三位置1903。再通过空间位移机构32调整夹头的角度,使透镜从透镜第三位置1903变换至透镜第四位置1904,同时平移透镜,使透镜与芯片在Z轴方向的距离为第二预设距离,此时透镜处于待耦合位置。Next, use the space displacement mechanism 32 to adjust the position of the chuck to the coupling position, and at this time, it is necessary to adjust the lens to be parallel to the chip in the Y direction. The angle of the collet is adjusted by the space displacement mechanism 32, so that the lens is transformed from the
接着,利用探针13给目标芯片21通电,目标芯片21发出光束,调整透镜的位姿直至探头14检测到光束形成的光斑。调整透镜的位置,以调节光斑的宽度、位置和形状。再判断光斑是否合格,若合格,则进入下一步;若不合格,则跳转再重新调节透镜的位置。Next, the
光斑合格时,夹头夹持着目标透镜19与目标芯片21贴合起来。固化机构2对透镜和芯片进行固化一定时间之后,夹头松开透镜,完成一个透镜的贴合。然后夹头重新移动至料盘5上方,夹取下一个透镜与芯片进行贴合。When the light spot is qualified, the chuck clamps the
通过以上实施例可以看出,本实用新型实施例提供的透镜耦合系统及方法,通过在底座10上放置多个芯片以形成激光器阵列,同时,利用第二调整机构12将待耦合的芯片移动至观测区域,利用空间位移机构32将夹持有透镜的夹头也移动至观测区域,再通过定位子系统对待耦合的芯片和透镜的相对位置做测量和判断,并将该相对位置信息传递给空间位移机构32,空间位移机构32再根据测量所得的相对位置信息来调节夹头的位置,进而调节透镜至待耦合的芯片的耦合区域,然后释放透镜,即完成了透镜与当前的待耦合的芯片之间的耦合。随后利用相同的方式对其他的待耦合的芯片依次进行透镜耦合,直至全部芯片均为耦合状态。该透镜耦合系统通过空间位移机构32、第二调整机构12和定位子系统相互配合,完成了对多个芯片依次进行透镜耦合定位的自动化、连续化操作,提高了耦合过程的精度和效率,节省了人力和时间,为高功率半导体激光器的批量生产提供了参考。It can be seen from the above embodiments that the lens coupling system and method provided by the embodiments of the present invention form a laser array by placing a plurality of chips on the base 10, and at the same time, the second adjusting mechanism 12 is used to move the chips to be coupled to In the observation area, the chuck holding the lens is also moved to the observation area by the spatial displacement mechanism 32, and then the relative position of the chip to be coupled and the lens is measured and judged by the positioning subsystem, and the relative position information is transmitted to the space. The displacement mechanism 32, the spatial displacement mechanism 32 adjusts the position of the chuck according to the relative position information obtained by measurement, and then adjusts the coupling area of the lens to the chip to be coupled, and then releases the lens, that is, the lens and the current chip to be coupled are completed. coupling between. Then, in the same way, the other chips to be coupled are sequentially lens-coupled until all the chips are in the coupled state. The lens coupling system cooperates with each other through the spatial displacement mechanism 32, the second adjustment mechanism 12 and the positioning subsystem, and completes the automatic and continuous operation of lens coupling and positioning for multiple chips in sequence, which improves the accuracy and efficiency of the coupling process and saves money. It saves manpower and time, and provides a reference for the mass production of high-power semiconductor lasers.
进一步地,该透镜耦合系统还包括控制单元(图中未示出),控制单元可以设置在集中控制台内,第一调整机构7、第二调整机构12、空间位移机构32、第一气缸104、第二气缸105、气爪气缸315和定位子系统均电连接于控制台,控制台采用集中控制模式,将底座10、料盘5、胶针组件101、夹头、芯片和透镜的当前位置信号集中收集,再将实际的位置信号与预设的位置信号进行对比分析,计算得到各部件的控制参数,并发送给对应的机构。Further, the lens coupling system also includes a control unit (not shown in the figure), the control unit can be set in the centralized console, the first adjustment mechanism 7 , the second adjustment mechanism 12 , the space displacement mechanism 32 , the
进一步地,第一图像检测机构4可单一采集料盘5的图像,判断出料盘5上透镜与第一图像检测机构4间的位置关系,然后根据初始位置关系,获得夹头与料盘5上透镜的位置关系。第一图像检测机构4也可采集夹头和料盘5上透镜处于同一画面时的图像,从而在图像上获得夹头和透镜之间的位置关系。Further, the first image detection mechanism 4 can collect the image of the feeding
在上述实施例的基础上,进一步地,一种透镜耦合系统及方法中具体点胶过程为:首先通过三维调节架18调节胶针组件101的初始位置,使得胶针组件101能够满足对透镜进行点胶的位置需要。然后通过胶杯102在滑槽1031中移动调整胶杯102的位置,使得胶杯102位于胶针的正下方。On the basis of the above embodiment, further, a specific glue dispensing process in a lens coupling system and method is as follows: firstly, the initial position of the
第二气缸105带动胶杯102上升预设距离,使得胶针组件101的两胶针均插入胶杯102内部的胶水预设深度处,停留预设时间之后,第二气缸105带动胶杯102下降,使得胶杯102离开胶针组件101。然后第一气缸104带动胶针组件101移动至便于涂胶的位置处。The
可停留预设时间使得附着在胶针底部的胶水形成预设形状。然后空间位移机构32带动夹头和透镜可先移动至与胶针组件101的位置对应处,即较靠近的地方,可为根据各部件初始位置确定的预设位置。然后空间位移机构32带动透镜沿预设路径进行移动与胶针组件101底部的胶水进行接触点胶,可沿矩形轨迹进行移动。在需要的时候,可通过角位移平台对透镜进行转动,便于对不同侧面进行点胶。It can stay for a preset time to make the glue attached to the bottom of the glue needle form a preset shape. Then the space displacement mechanism 32 drives the collet and the lens to move to a position corresponding to the position of the
该透镜耦合系统能够自动实现对透镜进行涂设胶水,且结构简单,便于操作,点胶效率较高且涂设均匀性较好。该透镜耦合系统及方法可自动进行透镜与激光器芯片的耦合贴合,且设置定位子系统,相比人工进行贴合,可大大提高贴合的效率和准确率,且减少劳动强度,节约人工成本。The lens coupling system can automatically apply glue to the lens, has a simple structure, is easy to operate, has higher glue dispensing efficiency and better coating uniformity. The lens coupling system and method can automatically carry out the coupling and bonding of the lens and the laser chip, and set up a positioning subsystem. Compared with manual bonding, the bonding efficiency and accuracy can be greatly improved, labor intensity is reduced, and labor costs are saved .
以上所述仅为本实用新型的较佳实施例而已,并不用以限制本实用新型,凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the within the scope of protection of the present invention.
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CN110045465B (en) * | 2019-04-10 | 2024-02-06 | 中南大学 | Lens coupling system and method |
CN114934941A (en) * | 2022-04-28 | 2022-08-23 | 江西联坤智能科技有限公司 | Automatic assembling equipment and method for light engine |
CN114934941B (en) * | 2022-04-28 | 2024-07-19 | 江西联坤智能科技有限公司 | Automatic light engine assembling equipment and assembling method thereof |
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