CN209903638U - A sticky rod tooling for silicon wafer slicer - Google Patents

Abstract

The utility model relates to the technical field of solar grade silicon wafer cutting, and discloses a silicon wafer slicing machine stick sticking tool; the problem that the quality of a product is affected due to the fact that whether the silicon rod slices are processed in place cannot be timely and rapidly detected is effectively solved; the stick sticking tool comprises a steel support, a resin substrate and a silicon rod, wherein a resistance wire is arranged in the resin substrate, the resistance wire is connected with on-off detection equipment with an alarm function in series, and the on-off detection equipment is arranged outside the resin substrate; after the diamond wire cuts the resistance wire in the resin substrate, the on-off detection instrument immediately sends out an alarm prompt when detecting that the resistance wire is cut off, so that the silicon rod slicing is completed; the utility model avoids the quality accident caused by artificial judgment, and improves the accuracy and timeliness; the problem that the quality of the silicon wafer is reduced due to repeated additional cutting because the one-time cutting is not in place caused by factors such as size change of the silicon rod or size change of the guide wheel is avoided.

Description

A sticky rod tooling for silicon wafer slicer

technical field

The utility model relates to the technical field of solar-grade silicon wafer cutting, in particular to a sticking rod tooling for a silicon wafer slicing machine with the function of detecting that the silicon rod is sliced in place.

Background technique

With the development of my country's economy and society, the energy demand is tense and the energy security situation is becoming more and more urgent. It has accelerated the use of solar energy, wind energy and other renewable energy sources to adjust my country's energy structure and promoted the sustainable development of energy. Among them, the use of solar energy is relatively widespread. , in which the slicer is also a non-negligible device in the field of solar energy.

Silicon wafer slicing has always been a key part of the photovoltaic industry, and the slicing technology is constantly developing towards thin lines, high efficiency and cleanliness. Whether it is ordinary steel wire, resin wire or diamond wire, the same cutting form is adopted. The cutting line runs at high speed, and the silicon rod is fed vertically to complete the cutting. The silicon rod is fixed to the resin substrate by gluing, and the resin substrate is then glued to the steel support. During the cutting process, due to the existence of cutting tension, the cutting line will exist. For a certain arc, in order to ensure the complete cutting of the silicon rod, several experiments are carried out in the early stage. Line marks and color difference on the cutting surface will affect product quality and increase the risk of wire breakage. It is impossible to judge whether the cutting is in place through fast and effective detection.

Utility model content

The utility model overcomes the deficiencies of the prior art, and provides a sticking tool for a silicon wafer slicer with the function of detecting the in-position of silicon rods. It effectively solves the problem of affecting product quality caused by not being able to quickly and quickly detect whether the silicon rod slices are processed in place.

The utility model is realized through the following technical solutions.

A sticking rod tooling for a silicon wafer slicing machine, the sticking rod tooling comprises a steel support, a resin substrate and a silicon rod, the resin substrate is bonded on the steel support, and the silicon rod is bonded on the The resin substrate is characterized in that a resistance wire is arranged in the resin substrate, the resistance wire is connected in series with an on-off detection device, and the on-off detection device is arranged outside the resin substrate, The on-off detection device has an alarm structure.

Further preferably, the resistance wire is a copper resistance wire.

Further preferably, the resin substrate is provided with two resistance wires, and the two resistance wires are respectively connected in series with the on-off detection device.

Further preferably, the resistance wire is arranged at a distance of 1-1.5 mm from the surface of the resin substrate.

A method for detecting that a silicon rod is sliced in place, comprising the following steps:

a) Pre-embed a resistance wire inside the resin substrate of the silicon wafer slicing machine, and connect the resistance wire in series with an on-off detection device with an alarm function, and the on-off detection device is arranged on the resin substrate external.

b) Bonding the resin substrate on the steel support of the silicon wafer slicing machine, and then bonding the silicon rod to be cut on the resin substrate.

c) Turn on the silicon wafer slicing machine, so that the diamond wire cuts the silicon rod. When the on-off detection equipment issues an alarm prompt, it means that the silicon rod slicing process is completed, and then the machine is stopped and unloaded.

The resistance wire described in the method for detecting that the silicon rod is sliced in place is a copper resistance wire.

In the method for detecting that the silicon rod is sliced in place, the resin substrate is provided with two resistance wires, and the two resistance wires are respectively connected in series with the on-off detection device.

The resistance wire described in the method for detecting the silicon rod sliced in place is set at a distance of 1-1.5 mm from the surface of the resin substrate.

The utility model provides a method for checking whether the silicon wafer slicing link is processed in place, instead of a quick way of judging whether the processing is in place through human experience and naked eye observation. , the resistance wire will be cut off by the diamond wire, and the on-off detection equipment connected in series with the resistance wire will issue an alarm to confirm that the silicon rod has been completely cut off.

When the diamond wire is cut to the resin substrate, it means that the silicon rod has been processed. When the diamond wire is cut to the resistance wire, since the hardness of the resistance wire is much smaller than that of the diamond wire, the resistance wire will be cut off quickly. When it is detected that the resistance wire is cut, an alarm prompt will be issued immediately. According to the alarm, the manufacturer can determine that the processing of the silicon rod has been completed, and can stop the cutting to avoid the one-time cutting due to the change of the size of the silicon rod or the size of the guide wheel. , resulting in a decrease in the quality of the silicon wafer through repeated cutting.

The beneficial effects of the present invention relative to the prior art are as follows.

By designing a new resin plate method, the utility model realizes the rapid judgment on whether the processing is finished in the later stage of the processing of the silicon rod, avoids the quality accident caused by human judgment, and improves the accuracy and timeliness. Avoid the one-time cutting is not in place due to factors such as changes in the size of the silicon rod or the size of the guide wheel, and the quality of the silicon wafer is reduced by repeated cutting.

Description of drawings

Figure 1 is a schematic structural diagram of the utility model.

FIG. 2 is a partial enlarged view of part A in FIG. 1 .

Among them, 1 is a steel bracket, 2 is a resin substrate, 3 is a silicon rod, 4 is an on-off detection device, and 5 is a copper resistance wire.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail with reference to the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not intended to limit the present invention. The technical solutions of the present utility model will be described in detail below with reference to the embodiments and the accompanying drawings, but the protection scope is not limited by this.

As shown in Figures 1-2, it is a sticking tool for a silicon wafer slicing machine. The sticking tool includes a steel support 1, a resin substrate 2 and a silicon rod 3, and the resin substrate 2 is bonded on the steel support 1. The silicon rod 3 is bonded on the resin substrate 2. The resin substrate 2 has a length of 650 mm, a width of 157 mm and a thickness of 15 mm. At a horizontal position 1.5 mm from the upper surface of the resin substrate 2, two 0.5 mm diameters are embedded in advance. The copper resistance wire 5. The copper resistance wire 5 is connected in series with a 5V on-off detection device 4 with an alarm function, and the on-off detection device 4 is arranged outside the resin substrate 2 .

The on-off detection device 4 is based on the JL series power isolation transmitter, and is composed of a reference voltage setting circuit and an output drive circuit, which is used to isolate and monitor the AC or DC current in the main circuit. The current relay alarm output is A secondary control loop composed of current relays and current transformers; when the main loop current is cut to sections, an alarm prompt will be generated.

Specifically, the method of using this silicon wafer slicing machine sticking rod tool to detect the position of the silicon rod slicing includes the following steps:

The above-mentioned resin substrate 2 with copper resistance wires 5 embedded in it is bonded on the steel support 1 of the silicon wafer slicing machine, and then the silicon rod 3 to be cut is bonded on the resin substrate 2; the silicon wafer slicing machine is turned on, The diamond wire is used to cut the silicon rod 3. When the on-off detection device 4 gives an alarm, it means that the silicon rod slicing process is completed, and then the machine stops for feeding.

In this embodiment, the existing resin substrate is improved and designed, and a resin substrate with internal resistance wires is designed, which makes full use of the hardness of the diamond wire that is greater than that of copper metal, and realizes the change of the resistance value after cutting and realizes the rapid alarm function. It can improve the judgment of processing accuracy, eliminate the situation that cannot be cut at one time due to changes in human experience and equipment parameters or the size of silicon rods, and avoid quality accidents caused by multiple shutdowns of silicon wafers.

The above content is a further detailed description of the present invention in conjunction with the specific preferred embodiments, and it cannot be considered that the specific embodiments of the present invention are limited to this. Under the premise of a utility model, some simple deductions or substitutions can also be made, which should be regarded as belonging to the utility model and the scope of patent protection determined by the submitted claims.

Claims (4)

1. The utility model provides a silicon chip slicer glues excellent frock, glue excellent frock including steel support, resin base plate and silicon rod, the resin base plate bond the steel support on, the silicon rod bond the resin base plate on, its characterized in that, the resin base plate in be provided with the resistance wire, the resistance wire and an on-off check out test set establish ties mutually, on-off check out test set up the outside of resin base plate, on-off check out test set have alarm structure.

2. The silicon wafer slicer stick sticking tool as claimed in claim 1, wherein the resistance wire is a copper resistance wire.

3. The silicon wafer slicer stick sticking tool as claimed in claim 1, wherein two resistance wires are arranged in the resin substrate, and the two resistance wires are respectively connected in series with the on-off detection device.

4. The silicon wafer slicer stick sticking tool as claimed in claim 1, wherein the resistance wire is arranged at a distance of 1-1.5mm from the surface of the resin substrate.

Images