CN209897101U - Mobile phone motherboard that crushing resistance is good - Google Patents
Mobile phone motherboard that crushing resistance is good Download PDFInfo
- Publication number
- CN209897101U CN209897101U CN201921253556.6U CN201921253556U CN209897101U CN 209897101 U CN209897101 U CN 209897101U CN 201921253556 U CN201921253556 U CN 201921253556U CN 209897101 U CN209897101 U CN 209897101U
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- China
- Prior art keywords
- mobile phone
- phone motherboard
- motherboard
- mainboard
- shock pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a mobile phone motherboard that crushing resistance is good, including mobile phone motherboard and anti-magnetic interference packing ring, mobile phone motherboard one side top and bottom all veneer are connected with horizontal shock pad, and mobile phone motherboard one side both ends all veneer are connected with upright shock pad, horizontal shock pad all has the swell with upright shock pad on, mobile phone motherboard top both ends all veneer are connected with top edge buffer block, and mobile phone motherboard bottom both ends all veneer are connected with bottom edge buffer block, mobile phone motherboard one side central point puts the veneer and is connected with rubber shock attenuation strip piece, and rubber shock attenuation strip piece both ends all install anti-magnetic interference packing ring through fastening screw, mobile phone motherboard opposite side passes through fastening screw installation fin. The utility model discloses mobile phone motherboard that crushing resistance is good, reasonable in design, simple structure is fit for being extensively promoted and used.
Description
Technical Field
The utility model relates to a mobile phone motherboard technical field, in particular to mobile phone motherboard that crushing resistance is good.
Background
Along with the rapid development of electronic communication technology, the mobile phone has become an indispensable communication tool for people's life, and the more the intelligent machine has, the more complicated the circuit structure of its corresponding mainboard also, corresponding mainboard is also the more fragile, wherein lead to the mainboard to go wrong easily and be receive external force extrusion and break, cause the mobile phone to damage and can not continue to use. Therefore, the mobile phone mainboard with good pressure resistance is provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a mobile phone motherboard that crushing resistance is good, through set up horizontal shock pad and the upright shock pad that has the swell in mobile phone motherboard one side, and set up top edge buffer block and bottom edge buffer block respectively at mobile phone motherboard top both ends and bottom both ends, and put at mobile phone motherboard one side central point and set up rubber shock-absorbing strip piece, thereby can play effective cushioning effect, and then can high-efficiently cushion mobile phone motherboard from the top both ends, the influence that bottom both ends falling pressure or side extrusion pressure caused to it, reduce the mobile phone motherboard because of the possibility of pressure rupture damage, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a mobile phone motherboard that crushing resistance is good, includes mobile phone motherboard and anti-magnetic interference packing ring, mobile phone motherboard one side top and the equal veneer in bottom are connected with horizontal shock pad, and the equal veneer in mobile phone motherboard one side both ends is connected with upright shock pad, horizontal shock pad all has the swell with upright shock pad on, mobile phone motherboard top both ends all veneer are connected with top edge buffer block, and mobile phone motherboard bottom both ends all veneer are connected with bottom edge buffer block, mobile phone motherboard one side central point puts the veneer and is connected with rubber shock bar piece, and rubber shock bar piece both ends all install anti-magnetic interference packing ring through fastening screw, mobile phone motherboard opposite side passes through fastening screw installation fin.
Furthermore, the outer surface of the mobile phone mainboard is provided with a waterproof layer, the outer surface of the waterproof layer is coated with an anti-static polyurethane coating, and the waterproof layer is made of a vacuum nano coating material.
Furthermore, mainboard mounting holes are formed in the mobile phone mainboard, and two or more groups of mainboard mounting holes are specifically arranged.
Furthermore, horizontal shock pad and upright shock pad are the silica gel material and make, and the fin is made for stainless steel material.
Furthermore, the bottom of the mobile phone mainboard is provided with a charging interface.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses mobile phone motherboard that crushing resistance is good, through horizontal shock pad and the upright shock pad that has the swell in mobile phone motherboard one side setting, and set up top edge buffer block and bottom edge buffer block respectively at mobile phone motherboard top both ends and bottom both ends, and put at mobile phone motherboard one side central point and set up rubber shock-absorbing strip piece, thereby can play effective cushioning effect, and then can high-efficient buffering mobile phone motherboard from the top both ends, the influence that bottom both ends pressure of falling or side extrusion pressure caused to it, reduce the possibility that mobile phone motherboard damages because of the pressure rupture.
2. The waterproof layer is arranged on the outer surface of the mobile phone mainboard, so that the waterproof performance of the mobile phone mainboard can be effectively enhanced, and the phenomenon that water enters the mobile phone mainboard to cause damage to electronic parts is avoided; through preventing static polyurethane coating at waterproof layer surface coating to can effectively strengthen mobile phone motherboard antistatic properties, reduce the accumulation of static voltage, avoid producing and discharge and destroy the mobile phone motherboard, lead to electronic component to damage on the mobile phone motherboard, cause the loss.
3. Through setting up the anti-magnetic interference packing ring to can obstruct the magnetic interference that other magnetic object brought for the mobile phone motherboard, guarantee the normal use of cell-phone.
Drawings
Fig. 1 is the utility model relates to a mobile phone motherboard's that crushing resistance is good overall structure schematic diagram.
Fig. 2 is the utility model relates to a mobile phone motherboard's that crushing resistance is good looks sideways at schematic structure.
Fig. 3 is the utility model relates to a mobile phone motherboard surface material layer profile structure sketch map of mobile phone motherboard that crushing resistance is good.
In the figure: 1. a mobile phone mainboard; 2. a main board mounting hole; 3. a transverse shock pad; 4. a rubber shock-absorbing bar block; 5. an anti-magnetic interference washer; 6. erecting a shock pad; 7. bulging; 8. a top edge buffer block; 9. a heat sink; 10. an antistatic polyurethane coating; 11. a waterproof layer; 12. a charging interface; 13. a bottom edge buffer block.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, a mobile phone motherboard that crushing resistance is good, includes mobile phone motherboard 1 and anti-magnetic interference packing ring 5, 1 one side top of mobile phone motherboard and bottom all veneer connection have horizontal shock pad 3, and 1 one side both ends of mobile phone motherboard all veneer connection have upright shock pad 6, all have the swell 7 on horizontal shock pad 3 and the upright shock pad 6, 1 top both ends of mobile phone motherboard all veneer connection have top edge buffer block 8, and 1 bottom both ends of mobile phone motherboard all veneer connection have bottom edge buffer block 13, 1 one side central point of mobile phone motherboard puts the veneer connection and has rubber shock strip piece 4, and rubber shock strip piece 4 both ends all install anti-magnetic interference packing ring 5 through fastening screw, 1 opposite side of mobile phone motherboard installs fin 9 through fastening screw.
The mobile phone comprises a mobile phone main board 1 and is characterized in that a waterproof layer 11 is arranged on the outer surface of the mobile phone main board 1, an anti-static polyurethane coating 10 is coated on the outer surface of the waterproof layer 11, and the waterproof layer 11 is made of a vacuum nano coating material.
In this embodiment, as shown in fig. 3, the waterproof layer 11 is disposed on the outer surface of the mobile phone motherboard 1, so that the waterproof performance of the mobile phone motherboard 1 can be effectively enhanced, and the damage of electronic parts caused by the entry of water into the mobile phone motherboard 1 is avoided; through coating antistatic polyurethane coating 10 at waterproof layer 11 surface to can effectively strengthen mobile phone motherboard 1 antistatic performance, reduce the accumulation of static voltage, avoid producing discharge and destroy mobile phone motherboard 1, lead to the electronic component damage on the mobile phone motherboard 1.
The mobile phone motherboard 1 is provided with motherboard mounting holes 2, and the motherboard mounting holes 2 are specifically provided with two or more groups.
In this embodiment, as shown in fig. 1, the main board mounting hole 2 may facilitate the mounting of the mobile phone main board 1 in the mobile phone by using a fastening screw.
The horizontal damping pad 3 and the vertical damping pad 6 are made of silica gel materials, and the radiating fins 9 are made of stainless steel materials.
In this embodiment, as shown in fig. 1, the horizontal shock absorbing pad 3 and the vertical shock absorbing pad 6 made of a silica gel material can effectively buffer the extrusion of the external pressure on the mobile phone motherboard 1, so as to reduce the damage of the mobile phone motherboard 1 caused by the extrusion of the external pressure; the radiating fins 9 made of stainless steel material can enhance the radiating effect of the mobile phone motherboard 1, and avoid damage to the mobile phone motherboard 1 caused by overheating of the mobile phone during long-time operation.
The bottom of the mobile phone mainboard 1 is provided with a charging interface 12.
In this embodiment, as shown in fig. 1 and 2, the charging interface 12 can facilitate insertion of an external charging wire, so as to complete charging operation of a battery electrically connected to the mobile phone motherboard 1.
It should be noted that the utility model is a mobile phone motherboard with good pressure resistance, when in use, the lateral shock-absorbing pad 3 and the vertical shock-absorbing pad 6 with the bulge 7 are arranged on one side of the mobile phone motherboard 1, the top edge buffer block 8 and the bottom edge buffer block 13 are respectively arranged on the top end and the bottom end of the mobile phone motherboard 1, and a rubber shock-absorbing bar 4 arranged at the center of one side of the mobile phone mainboard 1, thereby playing an effective buffering role, thereby effectively buffering the influence of the falling pressure or the side extrusion pressure of the mobile phone mainboard 1 from the two ends of the top and the two ends of the bottom, reducing the possibility of the damage of the mobile phone mainboard 1 due to the pressure fracture, in the use process of the mobile phone, the waterproof layer 11 is arranged on the outer surface of the mobile phone mainboard 1, so that the waterproof performance of the mobile phone mainboard 1 can be effectively enhanced, and the phenomenon that water enters the mobile phone mainboard 1 to cause damage to electronic parts is avoided; the anti-static polyurethane coating 10 is coated on the outer surface of the waterproof layer 1, so that the anti-static performance of the mobile phone mainboard 1 can be effectively enhanced, the accumulation of static voltage is reduced, and the damage of electronic parts on the mobile phone mainboard 1 and loss caused by discharge damage to the mobile phone mainboard 1 are avoided; the anti-magnetic interference gasket 5 can block magnetic interference brought to the mobile phone mainboard 1 by other magnetic objects, and normal use of the mobile phone is ensured.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a mobile phone motherboard that crushing resistance is good, includes mobile phone motherboard (1) and anti-magnetic interference packing ring (5), its characterized in that: cell-phone mainboard (1) one side top and the equal veneer in bottom are connected with horizontal shock pad (3), and cell-phone mainboard (1) one side both ends are all glued and are connected with upright shock pad (6), horizontal shock pad (3) and upright all have on shock pad (6) swell (7), cell-phone mainboard (1) top both ends are all glued and are connected with top edge buffer block (8), and cell-phone mainboard (1) bottom both ends are all glued and are connected with bottom edge buffer block (13), cell-phone mainboard (1) one side central point puts the veneer and is connected with rubber shock attenuation strip piece (4), and rubber shock strip piece (4) both ends all install anti magnetic interference packing ring (5) through fastening screw, cell-phone mainboard (1) opposite side passes through fastening screw installation fin (9).
2. The mobile phone motherboard with good crush resistance of claim 1, wherein: the mobile phone is characterized in that a waterproof layer (11) is arranged on the outer surface of the mobile phone main board (1), an anti-static polyurethane coating (10) is coated on the outer surface of the waterproof layer (11), and the waterproof layer (11) is made of a vacuum nano coating material.
3. The mobile phone motherboard with good crush resistance of claim 1, wherein: the mobile phone mainboard (1) is provided with mainboard mounting holes (2), and the mainboard mounting holes (2) are specifically provided with two or more groups.
4. The mobile phone motherboard with good crush resistance of claim 1, wherein: horizontal shock pad (3) and upright shock pad (6) are the silica gel material and make, and fin (9) are made for stainless steel material.
5. The mobile phone motherboard with good crush resistance of claim 1, wherein: the bottom of the mobile phone main board (1) is provided with a charging interface (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921253556.6U CN209897101U (en) | 2019-08-05 | 2019-08-05 | Mobile phone motherboard that crushing resistance is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921253556.6U CN209897101U (en) | 2019-08-05 | 2019-08-05 | Mobile phone motherboard that crushing resistance is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209897101U true CN209897101U (en) | 2020-01-03 |
Family
ID=69002104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921253556.6U Expired - Fee Related CN209897101U (en) | 2019-08-05 | 2019-08-05 | Mobile phone motherboard that crushing resistance is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209897101U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290249A (en) * | 2019-08-05 | 2019-09-27 | 江苏天隆富信息技术有限公司 | A kind of cell phone mainboard that crushing resistance is good |
-
2019
- 2019-08-05 CN CN201921253556.6U patent/CN209897101U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290249A (en) * | 2019-08-05 | 2019-09-27 | 江苏天隆富信息技术有限公司 | A kind of cell phone mainboard that crushing resistance is good |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 224000 Yandu District Yanlong Street Intelligent Terminal Pioneer Park, Yancheng City, Jiangsu Province, Phase II, 3 (D) Patentee after: Jiangsu Shangxin Electronic Technology Co.,Ltd. Address before: 224000 Yandu District Yanlong Street Intelligent Terminal Pioneer Park, Yancheng City, Jiangsu Province, Phase II, 3 (D) Patentee before: JIANGSU TIANLONGFU INFORMATION TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 Termination date: 20210805 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |