CN209850697U - Circulating liquid supply device for polishing liquid in ring polishing - Google Patents
Circulating liquid supply device for polishing liquid in ring polishing Download PDFInfo
- Publication number
- CN209850697U CN209850697U CN201920220986.1U CN201920220986U CN209850697U CN 209850697 U CN209850697 U CN 209850697U CN 201920220986 U CN201920220986 U CN 201920220986U CN 209850697 U CN209850697 U CN 209850697U
- Authority
- CN
- China
- Prior art keywords
- polishing
- liquid supply
- liquid
- ring
- supply device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a circular liquid supply device for polishing liquid in ring polishing, which comprises a liquid supply device; the liquid supply pipeline is in switchable communication or cutoff with the liquid supply device and is fixed on a multi-station bridge frame of the ring polishing machine; the nozzles are arranged on the liquid supply pipeline at preset intervals and are in switching communication or cutoff with the liquid supply pipeline; the preset distance refers to the position of a nozzle correspondingly arranged according to the position of the optical element on the ring polishing machine; the recycling bin is connected to the bottom of the polishing disk of the ring polishing machine; the recovery pump is communicated with the recovery barrel through a pipeline and is in convertible communication or cutoff with the liquid supply device; and the control cabinet, the liquid supply device, the spray nozzle and the recovery pump are all electrically connected with the control cabinet. The technical problem that deformation is caused by different heat dissipation speeds of the surface of an element due to uneven distribution of polishing solution caused by single-point supply of the polishing solution is solved, so that an uneven temperature field in the element and deformation caused by the uneven temperature field are improved, and the processing precision is improved; meanwhile, the polishing solution is recycled, so that the processing cost can be reduced.
Description
Technical Field
The utility model relates to an optical machining technical field, more specifically the circulation that relates to polishing solution during ring is thrown supplies liquid device that says so.
Background
Ring polishing (ring polishing for short) is one of the key technologies for processing large-caliber planar optical elements. The ring polishing machine tool usually adopts large-size and high-thermal-stability natural granite to make a polishing disk base plate, and an annular asphalt glue layer is cast on the surface of the base plate to serve as the polishing disk. The surface of the ring belt of the asphalt polishing disk is sequentially provided with a correcting disk and a workpiece disk, wherein the correcting disk is used for correcting and controlling the shape error of the polishing disk, and the workpiece disk is used for holding a component. When in processing, the polishing disk, the correcting disk and the workpiece disk rotate around the anticlockwise direction at a constant speed, and the optical elements in the workpiece disk generate material removal under the action of the asphalt polishing disk and polishing particles carried by the asphalt polishing disk so as to form an optical surface.
During polishing, the element and the polishing disk undergo relative motion, and the friction therebetween generates heat, which enters the inside of the element from the polishing surface of the element and is radiated from the respective surfaces of the element, thereby forming a non-uniform temperature field inside the element and causing deformation of the element. Therefore, in the polishing process, uniform supply and temperature control of the polishing solution are key requirements of process control, so that the heat convection speed between the element and the polishing solution is increased, and the temperature distribution uniformity in the element and element deformation caused by the temperature distribution uniformity are improved. The existing polishing solution supply mode is generally single-point supply, the distribution uniformity of the polishing solution on the surface of the polishing disc is poor, the temperature control of the polishing solution is not facilitated, and the deformation of an element caused by heat generated by friction of the element is caused; meanwhile, the polishing solution is directly discarded after being used, and cannot be recycled, so that the polishing solution is wasted.
Therefore, how to provide a uniform and circular supply device for polishing solution in ring polishing is a problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a circulation of polishing solution supplies liquid device in ring is thrown has solved in the ring is thrown that polishing solution can not cyclic utilization, evenly supplies with, leads to the component deformation that the heat that the component surface produced because of the friction can't in time take away and arouse, has reduced the technical problem of component machining precision.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the cyclic liquid supply device of polishing solution in ring polishing is carried on a ring polishing machine and comprises:
the liquid supply device is used for storing and supplying polishing liquid and is arranged outside the ring polishing machine;
the liquid supply pipeline is in switchable communication or cutoff with the liquid supply device and is fixed on a multi-station bridge frame of the ring polishing machine; the supply line may include a trunk pipe and a plurality of branch pipes;
the nozzles comprise a plurality of nozzles, are arranged on the liquid supply pipeline according to a preset interval and are in switching communication or cutoff with the liquid supply pipeline; the preset distance refers to the position of a nozzle correspondingly arranged according to the position of the optical element on the ring polishing machine; the nozzles may be provided on the branch pipes;
the recycling bin is connected to the bottom of the polishing disc of the ring polishing machine; the polishing solution is used for recovering the polishing solution flowing down from the polishing disk;
the recovery pump is communicated with the recovery barrel through a pipeline and is in switchable communication or cutoff with the liquid supply device;
and the control cabinet, the liquid supply device, the spray nozzle and the recovery pump are all electrically connected with the control cabinet.
According to the technical scheme, compared with the prior art, the utility model discloses a circulation liquid supply device of polishing solution in the ring throwing, because it carries on the ring throwing machine, switch board control liquid supply ware carries the polishing solution to the nozzle through the liquid supply pipeline, the switch board is according to operating mode demand control nozzle injection polishing solution to polishing dish surface, take away thermal polishing solution and flow down to the recycling bin in from the polishing dish, the recovery pump liquid of controller control and recycling bin intercommunication to the liquid supply ware, the polishing solution circulates again to the liquid supply pipeline in, the cyclic utilization of polishing solution has been realized, and then guaranteed the continuous supply of polishing solution; meanwhile, the plurality of nozzles communicated with or cut off from the liquid supply pipeline are arranged, the plurality of nozzles are controlled by the controller to spray according to corresponding working conditions, and the plurality of spraying points are multiple, so that the technical problems that in the prior art, polishing liquid is supplied at a single point, so that the polishing liquid is not uniformly distributed, the heat dissipation speed of the surface of an element is different, and the deformation is caused are solved, the non-uniform temperature field in the element and the deformation caused by the non-uniform temperature field are improved, and the processing precision is improved; meanwhile, the polishing solution is recycled, so that the processing cost can be reduced.
Preferably, the liquid supply device comprises a liquid storage barrel and a liquid supply pump; the liquid supply pump is fixed on the liquid storage barrel and communicated with the interior of the liquid storage barrel; and the outlet of the liquid supply pump is in switchable communication or cutoff with the liquid supply pipeline, and the liquid supply pump is electrically connected with the control cabinet. Wherein the liquid feed pump is preferably located the stock solution bucket top, more optimizes to whole pipeline overall arrangement.
Preferably, the liquid storage barrel is a constant-temperature liquid storage barrel; a heat exchange pipeline is arranged in the heat exchanger, and a temperature controller for controlling the temperature of the heat exchange pipeline is arranged outside the heat exchanger; the temperature controller is electrically connected with the control cabinet. In the prior art, after the element is processed and the lower disc is kept at a constant temperature, the non-uniform temperature field is converted into the uniform temperature field, and the deformation of the element is recovered, so that the surface shape of the processed element is greatly deteriorated. The utility model discloses an improve the inside temperature distribution homogeneity of component, increased polishing solution thermostatic control on the basis that the circulation that has adopted the polishing solution supplied liquid, improved the heat convection speed of component and polishing solution to improve the temperature distribution homogeneity of component and the component deformation that arouses, further improve the machining precision of component.
Preferably, install level sensor and temperature sensor in the stock solution bucket, level sensor and temperature sensor all with switch board electric connection. By adopting the scheme, the controller is favorable for collecting the liquid level and temperature information of the polishing liquid in the liquid storage barrel at any time, and when the liquid level is lower than a set value, the controller controls the recovery pump to supply liquid to the liquid storage barrel to keep the liquid supply. Therefore, the utilization rate of the polishing solution is increased, and the polishing solution which is recycled needs to be checked, replenished or replaced regularly. When the temperature is lower than or higher than the set temperature of the temperature controller, the control cabinet controls the temperature controller to heat or cool the polishing solution and maintain the set temperature of the polishing solution.
Preferably, the bottom of the liquid storage barrel is provided with a stirrer, and the stirrer is electrically connected with the control cabinet; by adopting the scheme, the stirrer is controlled by the control cabinet to stir the polishing solution, so that the polishing solution is prevented from depositing and reducing the use performance.
Preferably, each nozzle is provided with a flow regulating switch which is electrically connected with the control cabinet; by adopting the scheme, quantitative injection can be performed according to the working condition requirement, and the uniformity of polishing solution supply is ensured.
Preferably, the top of the recycling bin is provided with a recycling groove communicated with the recycling bin, and the recycling groove is arranged at the bottom of the polishing disk and is used for containing used polishing solution; wherein have the filter core on the play liquid hole of recycling bin, the effect of adopting this scheme is that the polishing solution that flows down on the polishing dish firstly gets into the accumulator, then flows into the recycling bin in, filters through the filter core that the recycling bin liquid outlet department set up, prevents that impurity from getting into the confession liquid pipeline in, has guaranteed the normal use of polishing solution.
Preferably, the circular liquid supply device for polishing liquid in ring polishing further comprises a cleaning partition plate, the cleaning partition plate is connected to the side wall of the polishing disk, rotates together with the polishing disk, and can clean the polishing liquid in the recovery tank; adopt the effect of this scheme for clean polishing solution to the recycling bin in from the accumulator, clean the baffle and rotate together with the polishing dish for the recovery rate of polishing solution.
Preferably, a liquid level probe is arranged in the recycling bin and is electrically connected with the control cabinet; by adopting the scheme, the control cabinet can collect liquid level information in the recovery barrel, and the liquid level information is converged with the liquid storage barrel to control the liquid supply pump and the recovery pump to work; if the liquid levels of the two polishing solutions are low, the control cabinet prompts information of checking, maintaining or supplying the polishing solutions.
The utility model provides a liquid supply method of polishing solution's circulation liquid supply device in ring is thrown, including following step:
s1, mounting a circulating liquid supply device of polishing liquid in ring polishing on a ring polishing machine;
s2, opening the ring polishing machine and the control cabinet; the control cabinet controls the liquid supply device to supply polishing liquid to the nozzle through the liquid supply pipeline, and the nozzle supplies the polishing liquid to the surface of the polishing disc according to the instruction of the control cabinet;
and S4, enabling the sprayed polishing solution to flow into the periphery of the polishing disc and be recovered by a recovery barrel, and pumping the polishing solution in the recovery barrel back to a liquid supply device by a recovery pump for recycling.
The utility model provides an among the liquid supply method of liquid supply equipment, the switch board control liquid feeder is through liquid supply pipeline to nozzle with the polishing solution, the switch board is according to operating mode demand control nozzle jet polishing solution to polishing dish surface and enter between polishing dish and the component, take away thermal polishing solution from polishing dish flow down to the recycling bin in, the recovery pump liquid of controller control and recycling bin intercommunication is to the liquid feeder, the polishing solution circulates again to the liquid supply pipeline in, the cyclic utilization of polishing solution has been realized, and then the continuous supply of polishing solution has been guaranteed, prevent the waste of polishing solution, use cost has been reduced; meanwhile, the plurality of nozzles communicated with or cut off from the liquid supply pipeline are arranged, the plurality of nozzles are controlled by the controller to spray according to corresponding working conditions, and the plurality of spraying points are multiple, so that the technical problems that in the prior art, polishing liquid is supplied at a single point, so that the polishing liquid is not uniformly distributed, the heat dissipation speed of the surface of an element is different, and the deformation is caused are solved, the non-uniform temperature field in the element and the deformation caused by the non-uniform temperature field are improved, and the processing precision is improved; meanwhile, the polishing solution is recycled, so that the processing cost can be reduced.
The method comprises the following specific steps: the device is arranged on a ring polishing machine, polishing solution is contained in a liquid storage barrel, and the control temperature of a temperature controller is set; starting the ring polishing machine and the control cabinet, starting the ring polishing machine and all parts of the device to run, controlling the on-off state of the temperature controller by the control cabinet according to the measured polishing liquid temperature, and controlling the liquid supply pump and the recovery pump to work according to the liquid level information of the liquid storage barrel and the recovery barrel; the polishing liquid in the liquid storage barrel is divided into a plurality of paths of liquid flows through a liquid supply pipeline by a liquid supply pump and is supplied to the surface of the polishing disc through a plurality of nozzles, and the flow of each nozzle is controlled by a flow regulating switch; polishing solution on the surface of the polishing disc flows into the polishing solution recovery tank from the side face of the polishing disc, the cleaning partition plate moves along with the polishing disc so as to discharge the polishing solution in the recovery tank into the recovery barrel, and the polishing solution in the recovery barrel is recovered into the liquid storage barrel under the action of the recovery pump, so that circulating liquid supply and temperature control of the polishing solution are formed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic structural view of a circular liquid supply device of polishing liquid in ring polishing carried on a ring polishing machine according to the present invention;
FIG. 2 is a top view of the circular liquid supply device for polishing liquid in ring polishing of the present invention mounted on a ring polishing machine;
fig. 3 is a partial cross-sectional view of an embodiment of a recycling tank and a cleaning partition plate of a circular liquid supply device for polishing liquid in ring polishing provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the utility model discloses liquid device is supplied in circulation of polishing solution in the ring is thrown has solved the ring and has thrown that polishing solution can't last, evenly supply with, leads to the component deformation that the heat that the component surface produced because of the friction can't in time take away and arouse, has reduced the technical problem of the qualification rate of polishing back component.
Referring to fig. 1-2, the present invention provides a circular liquid supply device for polishing liquid in ring polishing, which is carried on a ring polishing machine, comprising:
the liquid supply device 1 is used for storing and supplying polishing liquid and is arranged outside the ring polishing machine;
the liquid supply pipeline 2 is in switchable communication or cutoff with the liquid supply device 1 and is fixed on a multi-station bridge of the ring polishing machine;
the nozzles 3 are arranged on the liquid supply pipeline 2 at preset intervals and are in switching communication or cutoff with the liquid supply pipeline 2; the preset distance refers to the position of the nozzle 3 correspondingly arranged according to the position of the optical element on the ring polishing machine;
the recycling bin 4 is connected to the bottom of a polishing disc 9 of the ring polishing machine; for recovering the polishing liquid flowing down from the polishing disk 9;
the recovery pump 5 is communicated with the recovery barrel 4 through a pipeline, and is in convertible communication or cutoff with the liquid supply device 1;
and the control cabinet 6, the liquid supply device 1, the spray nozzle 3 and the recovery pump 5 are all electrically connected with the control cabinet 6.
The utility model discloses a circulation liquid supply device of polishing solution in ring throwing, because it is carried on the ring throwing machine, switch board 6 control liquid supply ware 1 is through liquid supply pipeline 2 to nozzle 3 with the polishing solution, switch board 6 is according to operating mode demand control nozzle 3 jet polishing solution to between polishing dish 9 and the component, take away thermal polishing solution and flow down to recycling bin 4 from polishing dish 9, the recovery pump 5 pump liquid that the controller control communicates with recycling bin 4 is to liquid supply ware 1, the polishing solution circulates again to liquid supply pipeline 2, the cyclic utilization of polishing solution has been realized, and then guaranteed the continuous supply of polishing solution; meanwhile, the plurality of nozzles 3 communicated with or cut off from the liquid supply pipeline 2 are arranged, the plurality of nozzles 3 are controlled by the controller to spray according to corresponding working conditions, and the plurality of spraying points are multiple, so that the technical problems that in the prior art, polishing liquid is supplied at a single point, so that the polishing liquid is not uniformly distributed, the heat dissipation speed of the surface of an element is different, and the deformation is caused are solved, the non-uniform temperature field in the element and the deformation caused by the non-uniform temperature field are improved, and the processing precision is improved; meanwhile, the polishing solution is recycled, so that the processing cost can be reduced.
In one embodiment of the present invention, the liquid supply device 1 includes a liquid storage barrel 11 and a liquid supply pump 12; the liquid supply pump 12 is fixed on the liquid storage barrel 11 and communicated with the interior of the liquid storage barrel; and the outlet of the liquid supply pump 12 is in switching communication or cutoff with the liquid supply pipeline 2, and the liquid supply pump 12 is electrically connected with the control cabinet 6. Wherein the liquid supply pump 12 is preferably positioned at the top of the liquid storage barrel 11, and the overall pipeline layout is more optimized.
Advantageously, the liquid storage barrel 11 is a constant temperature liquid storage barrel; a heat exchange pipeline is arranged in the heat exchanger, and a temperature controller 111 for controlling the temperature of the heat exchange pipeline is arranged outside the heat exchanger; the temperature controller 111 is electrically connected with the control cabinet 6. In the prior art, after the element is processed and the lower disc is kept at a constant temperature, the non-uniform temperature field is converted into the uniform temperature field, and the deformation of the element is recovered, so that the surface shape of the processed element is greatly deteriorated. The utility model discloses an improve the inside temperature distribution homogeneity of component, increased polishing solution thermostatic control on the basis that the circulation that has adopted the polishing solution supplied liquid, improved the heat convection speed of component and polishing solution to improve the temperature distribution homogeneity of component and the component deformation that arouses, further improve the machining precision of component.
More advantageously, install level sensor and temperature sensor in the liquid storage bucket 11, level sensor and temperature sensor all with switch board 6 electric connection, are favorable to the polishing solution liquid level and the temperature information in the controller constantly gathering liquid storage bucket 11 from this, and when the liquid level was less than the setting value, the controller control recycle pump 5 supplied liquid to liquid storage bucket 11, keeps supplying the use of liquid. Therefore, the utilization rate of the polishing solution is increased, and the polishing solution which is recycled needs to be checked, replenished or replaced regularly. When the temperature is lower than or higher than the set temperature of the temperature controller 111, the control cabinet 6 controls the temperature controller 111 to heat or cool the polishing solution, and the set temperature of the polishing solution is maintained.
In another embodiment of the utility model, a stirrer is arranged at the bottom of the liquid storage barrel 11 and is electrically connected with the control cabinet 6; by adopting the scheme, the stirrer is controlled by the control cabinet 6 to stir the polishing solution, so that the deposition of the polishing solution is prevented, and the use performance is reduced.
In other embodiments of the present invention, each nozzle 3 is provided with a flow regulating switch, and the flow regulating switch is electrically connected to the control cabinet 6; by adopting the scheme, quantitative injection is facilitated according to the working condition requirement, and the uniformity of heat dissipation of elements is ensured.
In other embodiments of the present invention, referring to fig. 3, the top of the recycling bin 4 has a recycling tank 7 connected thereto, and the recycling tank 7 is disposed at the bottom of the polishing tray 9 for containing the used polishing solution; wherein have the filter core on the play liquid hole of recycling bin 4, the effect of adopting this scheme is that the polishing solution that flows down on polishing disc 9 at first gets into accumulator 7 first, then flows into recycling bin 4, and the filter core that the play liquid mouth department of recycling bin 4 set up filters, prevents during impurity gets into liquid supply pipeline 2, has guaranteed the normal use of polishing solution. The recovery tank 4 may be fixed together with the polishing platter 9 or provided separately.
More advantageously, the device for circularly supplying polishing solution in ring polishing further comprises a cleaning partition plate 8, wherein the cleaning partition plate 8 is connected to the side wall of the polishing disk 9, rotates together with the polishing disk 9 and can rotate in the recovery tank 7; the polishing solution recovery device has the advantages that the polishing solution is cleaned into the recovery barrel 4 from the recovery tank 7, the cleaning partition plate 8 and the polishing disc 9 rotate together, and the polishing solution recovery speed is increased.
Wherein, a liquid level probe is arranged in the recycling bin 4 and is electrically connected with the control cabinet 6; by adopting the scheme, the control cabinet 6 can collect liquid level information in the recovery barrel 4, collect the liquid level information of the liquid storage barrel 11 and control the liquid supply pump 12 and the recovery pump 5 to work; if the liquid levels of the two polishing solutions are low, the control cabinet 6 prompts information of inspection, maintenance or polishing solution supply.
The utility model provides a liquid supply method of polishing solution's circulation liquid supply device in ring is thrown, including following step:
s1, mounting a circulating liquid supply device of polishing liquid in ring polishing on a ring polishing machine;
s2, opening the ring polishing machine and the control cabinet; the control cabinet controls the liquid supply device to supply polishing liquid to the nozzle through the liquid supply pipeline, and the nozzle sprays the polishing liquid to the surface of the polishing disc according to the instruction of the control cabinet;
and S4, enabling the sprayed polishing solution to flow into the periphery of the polishing disc and be recovered by a recovery barrel, and pumping the polishing solution in the recovery barrel back to a liquid supply device by a recovery pump for recycling.
The utility model discloses in the liquid supply method of the liquid supply device, the control cabinet controls the liquid supply device to spray polishing liquid through the liquid supply pipeline to the nozzle, the control cabinet controls the nozzle to spray polishing liquid to between the polishing disk and the element according to the working condition requirement, the polishing liquid taking away heat flows down to the recycling bin from the polishing disk, the controller controls the recycling pump liquid communicated with the recycling bin to the liquid supply device, the polishing liquid circulates to the liquid supply pipeline again, the cyclic utilization of the polishing liquid is realized, and the continuous supply of the polishing liquid is further ensured; meanwhile, the plurality of nozzles communicated with or cut off from the liquid supply pipeline are arranged, the plurality of nozzles are controlled by the controller to spray according to corresponding working conditions, and the plurality of spraying points are multiple, so that the technical problems that in the prior art, polishing liquid is supplied at a single point, so that the polishing liquid is not uniformly distributed, the heat dissipation speed of the surface of an element is different, and the deformation is caused are solved, the non-uniform temperature field in the element and the deformation caused by the non-uniform temperature field are improved, and the processing precision is improved; meanwhile, the polishing solution is recycled, so that the processing cost can be reduced.
The method comprises the following specific steps: the device is arranged on a ring polishing machine, polishing solution is contained in a liquid storage barrel, and the control temperature of a temperature controller is set; starting the ring polishing machine and the control cabinet, starting the ring polishing machine and all parts of the device to run, controlling the on-off state of the temperature controller by the control cabinet according to the measured polishing liquid temperature, and controlling the liquid supply pump and the recovery pump to work according to the liquid level information of the liquid storage barrel and the recovery barrel; the polishing liquid in the liquid storage barrel is divided into a plurality of paths of liquid flows through a liquid supply pipeline by a liquid supply pump and is supplied to the surface of the polishing disc through a plurality of nozzles, and the flow of each nozzle is controlled by a flow regulating switch; polishing solution on the surface of the polishing disc flows into the polishing solution recovery tank from the side face of the polishing disc, the cleaning partition plate moves along with the polishing disc so as to discharge the polishing solution in the recovery tank into the recovery barrel, and the polishing solution in the recovery barrel is recovered into the liquid storage barrel under the action of the recovery pump, so that circulating liquid supply and temperature control of the polishing solution are formed.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The circulation liquid supply device of polishing solution in ring polishing is carried on a ring polishing machine, and is characterized by comprising:
the liquid supply device (1) is used for storing and supplying polishing liquid and is arranged outside the ring polishing machine;
the liquid supply pipeline (2) is in switchable communication or cutoff with the liquid supply device (1) and is fixed on a multi-station bridge of the ring polishing machine;
the nozzles (3) comprise a plurality of nozzles, are arranged on the liquid supply pipeline (2) at preset intervals and are in switchable communication or cutoff with the liquid supply pipeline (2);
the recycling bin (4), the recycling bin (4) is connected to the bottom of a polishing disk of the ring polishing machine;
the recovery pump (5) is communicated with the recovery barrel (4) through a pipeline and is in switching communication or cutoff with the liquid supply device (1);
and the control cabinet (6), the liquid supply device (1), the spray nozzle (3) and the recovery pump (5) are electrically connected with the control cabinet (6).
2. The device for circularly supplying polishing solution in ring polishing according to claim 1, wherein the liquid supply device (1) comprises a liquid storage barrel (11) and a liquid supply pump (12); the liquid supply pump (12) is fixed on the liquid storage barrel (11) and is communicated with the interior of the liquid storage barrel; and the outlet of the liquid supply pump (12) is in switchable communication or cutoff with the liquid supply pipeline (2), and the liquid supply pump (12) is electrically connected with the control cabinet (6).
3. The device for circularly supplying polishing solution in ring polishing according to claim 2, wherein the liquid storage barrel (11) is a constant-temperature liquid storage barrel; a heat exchange pipeline is arranged in the heat exchanger, and a temperature controller (111) for controlling the temperature of the heat exchange pipeline is arranged outside the heat exchanger; the temperature controller (111) is electrically connected with the control cabinet (6).
4. The device for circularly supplying polishing solution in ring polishing according to claim 3, wherein a liquid level sensor and a temperature sensor are installed in the liquid storage barrel (11), and both the liquid level sensor and the temperature sensor are electrically connected with the control cabinet (6).
5. The device for circularly supplying polishing solution in ring polishing according to claim 3, wherein a stirrer is installed at the bottom of the liquid storage barrel (11), and the stirrer is electrically connected with the control cabinet (6).
6. The device for cyclically supplying polishing solution in ring polishing according to claim 1, wherein each nozzle (3) is provided with a flow regulating switch, and the flow regulating switch is electrically connected with the control cabinet (6).
7. The device for supplying the polishing solution in the ring polishing of claim 1, wherein the top of the recovery barrel (4) is provided with an annular recovery groove (7) communicated with the top, and the recovery groove (7) is fixed around the polishing disk.
8. The device for supplying polishing solution in ring polishing according to claim 7, further comprising a cleaning partition plate (8), wherein the cleaning partition plate (8) is connected to the side wall of the polishing disk and rotates together with the polishing disk, and can clean the polishing solution in the recovery tank (7).
9. The circular liquid supply device of polishing liquid in ring polishing according to claim 8, characterized in that a liquid level probe is arranged in the recycling tank (4), and the liquid level probe is electrically connected with the control cabinet (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920220986.1U CN209850697U (en) | 2019-02-21 | 2019-02-21 | Circulating liquid supply device for polishing liquid in ring polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920220986.1U CN209850697U (en) | 2019-02-21 | 2019-02-21 | Circulating liquid supply device for polishing liquid in ring polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209850697U true CN209850697U (en) | 2019-12-27 |
Family
ID=68931845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920220986.1U Active CN209850697U (en) | 2019-02-21 | 2019-02-21 | Circulating liquid supply device for polishing liquid in ring polishing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209850697U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759957A (en) * | 2019-02-21 | 2019-05-17 | 中国工程物理研究院激光聚变研究中心 | The circulating feeding liquid device and feed liquid method of polishing fluid in ring throwing |
| CN112157561A (en) * | 2020-08-14 | 2021-01-01 | 大连理工大学 | Polishing machine with disk surface in-place measurement and trimming functions |
-
2019
- 2019-02-21 CN CN201920220986.1U patent/CN209850697U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759957A (en) * | 2019-02-21 | 2019-05-17 | 中国工程物理研究院激光聚变研究中心 | The circulating feeding liquid device and feed liquid method of polishing fluid in ring throwing |
| CN112157561A (en) * | 2020-08-14 | 2021-01-01 | 大连理工大学 | Polishing machine with disk surface in-place measurement and trimming functions |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209850697U (en) | Circulating liquid supply device for polishing liquid in ring polishing | |
| CN109759957A (en) | The circulating feeding liquid device and feed liquid method of polishing fluid in ring throwing | |
| US5904827A (en) | Plating cell with rotary wiper and megasonic transducer | |
| US10373852B2 (en) | Substrate processing apparatus and method with processing unit selection based on usage rate and usage time | |
| JP6664492B2 (en) | Pickling apparatus and pickling method | |
| CN108748743A (en) | A kind of crystal holder heat sink and polysilicon chip preparation process | |
| GB1591587A (en) | Preparation of the outlet surface of spinnerets | |
| CN211437167U (en) | Cleaning liquid supply device | |
| CN118768715B (en) | Fixtures for Additive Manufacturing | |
| TW202340545A (en) | Electroplating equipment | |
| CN103353253B (en) | Cooling tower group and water distribution device thereof | |
| CN210967147U (en) | Milling machine with internal circulation cooling system | |
| CN210232505U (en) | Full-aperture polishing immersion type element processing device and polishing machine | |
| CN203044403U (en) | Full-automatic pass-type ultrasonic cleaner | |
| CN218855041U (en) | Solar cell production equipment, dust removal assembly and air knife | |
| CN118664520A (en) | Polishing machine and liquid circulation device thereof | |
| CN110153839B (en) | Full-caliber polishing immersed element processing device, processing method and polishing machine | |
| CN215089221U (en) | Liquid supply device and cleaning machine | |
| JP2023551684A (en) | Resource management system and additive manufacturing facility equipped with it | |
| CN211515344U (en) | Battery case cleaning line | |
| CN210616985U (en) | Automatic circulating spraying silicon wafer cutting machine | |
| CN221501290U (en) | Electroplating clamp and equipment | |
| CN210701562U (en) | Online automatic quick belt cleaning device of reation kettle | |
| CN219873716U (en) | Battery pack thermal management device and battery pack | |
| CN219723437U (en) | Powder spraying and coating heating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |