CN209787552U - Component carrier structure - Google Patents
Component carrier structure Download PDFInfo
- Publication number
- CN209787552U CN209787552U CN201920266557.8U CN201920266557U CN209787552U CN 209787552 U CN209787552 U CN 209787552U CN 201920266557 U CN201920266557 U CN 201920266557U CN 209787552 U CN209787552 U CN 209787552U
- Authority
- CN
- China
- Prior art keywords
- component carrier
- carrier structure
- component
- opening
- stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a part holds carrier structure (1), wherein, this part holds carrier structure (1) and includes: a stack (2) having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and a component (3) embedded in the stack (2). The component carrier structure (1) further comprises at least one opening (4) in the stack (2) configured to suppress warpage of the component carrier structure (1).
Description
Technical Field
The present invention relates to a component carrier structure, and more particularly to a component carrier structure including an opening. The component carrier structure comprises a stack of at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The components are embedded in the stack.
Background
In particular, the present invention relates to a component carrier structure, such as a PCB, having embedded components at a high packing ratio (wafer to package ratio) in a plan view of the component carrier structure. In conventional efforts, if a high packaging ratio is used, warpage, bending or flexing occurs in the component carrier structure.
SUMMERY OF THE UTILITY MODEL
It is an object of the present invention to provide a component carrier structure having a high encapsulation ratio in a plan view of the component carrier structure, wherein the risk of warping, bending or flexing is reduced.
in order to achieve the object defined above, a component carrier structure according to an embodiment of the present invention is provided. The component carrier structure includes: a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and a component embedded in the stack. At least one opening is disposed in the stack and is configured to inhibit warpage of the component carrier structure. Due to the opening, the stack material is more yielding or flexible in the opening, e.g. resistant to thermal expansion. As a result, overall warping, bending or flexing of the component carrier structure may be reduced. The openings may enable stress relief in the stack and/or flexible expansion of the stack.
Hereinafter, other exemplary embodiments of the present invention will be explained.
In an embodiment, the component carrier structure is a plate, an array, a component carrier or a component carrier preform.
In an embodiment, the opening is any one of a slot, an elongated hole, or a series of dots.
In an embodiment, the opening is a through hole, a blind hole or an internal hole.
In an embodiment, the opening is located between the panel parts.
In an embodiment, the openings are located between adjacent components or component carriers.
In an embodiment, the area ratio between the component and the component carrier structure is more than 10% in plan view.
In an embodiment, the stack comprises a low modulus material, which in particular does not directly contact the part, more particularly surrounding the part. The low modulus material may have a hardness of less than 20 GPa. The low modulus material may be a resin sheet, RCC (resin coated copper) or prepreg. The resin sheet may be a resin sheet without glass fibers. RCC is a material comprising resin-coated copper, such as resin-coated copper foil without glass fibers. The prepreg is a pre-impregnated resin with fibers, such as glass fibers. Low modulus materials, in particular low young's modulus materials, may be used for different structures in PCB manufacturing, in particular for PCBs with embedded components (including hybrid solutions from different vendors).
The young's modulus of the low modulus material may be selected by taking into account the thickness difference between the stack and the component.
In an embodiment, the at least one opening is filled with a filling material. The filler material differs from the material of the stack in terms of thermal expansion and/or young's modulus. The at least one opening may be at least partially filled with a filling material, in particular to cover a sidewall and/or a demarcation line of the at least one opening.
In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein for providing mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different ones of the above-mentioned types of component carriers.
in an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure and electrically conductive layer structure, in particular a laminate formed by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier which is able to provide a large mounting surface for other components and which is nevertheless very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.
In an embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier still provides a large basis for mounting components thereon. Further, particularly a bare chip, which is an example of an embedded electronic component, can be conveniently embedded in a thin plate such as a printed circuit board thanks to its small thickness.
In an embodiment, the component carrier is configured as one of the group consisting of a printed circuit board and a substrate (in particular an IC substrate).
In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier which is formed by laminating several electrically conductive layer structures together with several electrically insulating layer structures, for example by applying pressure and/or supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg, such as FR4 material. The individual conductive layer structures can be connected to one another in a desired manner, for example by laser drilling or mechanical drilling to form through-holes through the laminate and by filling the above-mentioned through-holes with a conductive material, in particular copper, to form vias as through-hole connections. In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to accommodate one or more components on one surface or two opposing surfaces of a plate-like printed circuit board. They may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers, such as glass fibers.
In the context of the present application, the term "substrate" may particularly denote a small component carrier having substantially the same size as the components (particularly electronic components) to be mounted thereon. More specifically, a baseplate may be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a Printed Circuit Board (PCB), however with a relatively high density of laterally and/or vertically arranged connections. The transverse connections are, for example, conductive paths, while the vertical connections may be, for example, boreholes. These lateral and/or vertical connectors are arranged within the substrate and may be used to provide electrical, thermal and/or mechanical connection of housed or unclamped components (such as bare wafers), in particular IC chips, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric part of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.
In an embodiment, the at least one electrically insulating layer structure comprises at least one of the group consisting of: resins (such as reinforced or non-reinforced resins, for example epoxy resins or bismaleimide-triazine resins), cyanate esters, polyphenylene derivatives, glass (in particular glass fibers, multiple layers of glass, glassy materials), pre-preg materials (such as FR-4 or FR-5), polyimides, polyamides, Liquid Crystal Polymers (LCP), epoxy based laminates, polytetrafluoroethylene (teflon), ceramics and metal oxides. Reinforcing materials made of glass (multiple layer glass), such as meshes, fibers or spheres, for example, may also be used. While prepreg, and particularly FR4, is generally preferred for rigid PCBs, other materials, particularly epoxy based laminates or photoimageable dielectric materials, may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins, low temperature co-fired ceramics (LTCC) or other low DK materials, very low DK materials or ultra low DK materials may be implemented in the component carrier as an electrically insulating layer structure.
In an embodiment, the at least one electrically conductive layer structure comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium, and tungsten. Although copper is generally preferred, other materials or coated versions thereof are possible, particularly coated with superconducting materials such as graphene.
The at least one component may be selected from the group consisting of: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g. a heat pipe), a light guide element (e.g. a light guide or light guide connector, an electronic component or a combination thereof). For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an opto-coupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), an encryption component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a micro-electro-mechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as the component. Such magnetic elements may be permanent magnetic elements (such as ferromagnetic, antiferromagnetic or ferrimagnetic elements, e.g. ferrite cores), multiferroic elements or may be paramagnetic elements. However, the component may also be a substrate, an interposer or another component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded within it. Furthermore, other components, in particular those generating and emitting electromagnetic radiation and/or being sensitive to electromagnetic radiation propagating from the environment, may also be used as components.
In an embodiment, the component carrier is a laminate type component carrier. In such an embodiment, the component carrier is a composite of a multilayer structure stacked and connected together by applying a compressive force and/or heat.
The substrate or interposer may be comprised of at least one layer of glass, silicon (Si), or a photoimageable or dry-etchable organic material such as an epoxy-based laminate film or a polymer compound such as polyimide, polybenzoxazole or benzocyclobutene.
The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.
Drawings
Fig. 1 shows a plan view of a component carrier structure according to a first embodiment of the invention.
Fig. 2 shows a plan view of a component carrier structure according to a second embodiment of the invention.
Fig. 3 shows a plan view of a component carrier structure according to a third embodiment of the invention.
Fig. 4 shows a cross-sectional view of a component carrier structure according to a fourth embodiment of the invention.
Fig. 5 shows a cross-sectional view of a component carrier structure according to a fifth embodiment of the present invention.
Fig. 6 shows a cross-sectional view of a component carrier structure according to a sixth embodiment of the invention.
Detailed Description
The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference signs.
Fig. 1 shows a plan view of a component carrier structure 1 according to a first embodiment of the invention. The component carrier structure 1 comprises a stack 2 comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, four arrays 3, and two openings 4 in the stack 2 having the shape of slots, which are configured for suppressing warpage of the component carrier structure 1. The openings 4 are arranged between adjacent arrays 3. The openings 4 may be made by mechanical drilling or by a laser cutting method. The openings 4 may have different sizes or densities. The openings 4 can be made or added at different production stages; however, it is preferred to make the opening 4 before assembly.
In each array 3, components or component carriers may be embedded or surface mounted. In or on such a component carrier, components can be embedded or surface-mounted.
In the first embodiment, the component carrier structure 1 is a plate comprising an array 3. Alternatively, the component carrier structure 1 itself may be an array, a component carrier or a component carrier preform.
In the first embodiment, the opening 4 is formed as a groove, an elongated hole, or a notch.
Fig. 2 shows a plan view of a component carrier structure 1 according to a second embodiment of the invention. In the second embodiment, the component carrier arrangement 1 comprises four sets of component carriers 5, wherein each set in turn comprises four component carriers 5. The component carrier 5 may be a PCB. The openings 4 are located between adjacent component carriers 5 in each group. The opening 4 is shaped as a slot.
In general, the openings 4 may be added on different areas of the component carrier structure 1, such as between cards/arrays, on corners, at a central base, etc.
Fig. 3 shows a plan view of a component carrier structure 1 according to a third embodiment of the invention. The embodiment of fig. 3 is similar to the embodiment of fig. 1, except that the openings 4 are each formed by a series of dots 6.
Fig. 4 shows a cross-sectional view of a component carrier structure according to a fourth embodiment of the invention. The opening 4 is formed as a through hole. Reference numeral 3 denotes an embedded component.
Fig. 5 shows a cross-sectional view of a component carrier structure according to a fifth embodiment of the present invention. The opening 4 is formed as a blind hole. Reference numeral 3 denotes an embedded component.
Fig. 6 shows a cross-sectional view of a component carrier structure according to a sixth embodiment of the invention. The opening 4 is formed as an internal hole. Reference numeral 3 denotes an embedded component.
in the above-described embodiment, the opening 4 formed as the through hole, the blind hole, and the inner hole may have an elongated shape vertically extending to the projection plane of fig. 4 to 6.
In the above-described embodiment, the area ratio between the component 3 and the component carrier structure 1 is greater than 10% in a plan view.
The stack 2 comprises a low modulus material. In a preferred embodiment, the low modulus material does not directly contact the part 3. The low modulus material may surround the component 3.
The component carrier structure 1 may be modified in that the opening 4 is filled with a filling material. The filler material may differ from the material of the stack 2 in terms of thermal expansion and/or modulus. The opening 4 may be at least partially filled with a filling material, in particular to cover the sidewalls and/or demarcations of the opening 4. The demarcation line defines an opening 4 in the stack 2.
It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Also elements described in association with different embodiments may be combined.
It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.
The implementation of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, even in the case of fundamentally different embodiments, it is possible to use the solution shown and a plurality of variants according to the principles of the invention.
Claims (13)
1. A component carrier arrangement (1), characterized in that the component carrier arrangement (1) comprises:
a stack (2) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
A component (3) embedded in the stack (2); and
At least one opening (4) in the stack (2) configured to suppress warpage of the component carrier structure (1).
2. The component carrier structure (1) according to claim 1, characterized in that the component carrier structure (1) is a plate, an array, a component carrier or a component carrier preform.
3. The component carrier structure (1) according to any of the preceding claims 1 and 2, wherein the opening (4) is any of a slot, an elongated hole or a series of points (6).
4. The component carrier structure (1) according to any of the preceding claims 1 and 2, wherein the opening (4) is a through hole, a blind hole or an internal hole.
5. The component carrier structure (1) according to any of the preceding claims 1 and 2, wherein the opening (4) is located between panel parts.
6. the component carrier structure (1) according to any of the preceding claims 1 and 2, characterized in that the openings (4) are located between adjacent components (3) or component carriers.
7. The component carrier structure (1) according to any one of the preceding claims 1 and 2, characterized in that the area ratio between the component (3) and the component carrier structure (1) is more than 10% in plan view.
8. The component carrier structure (1) according to any one of the preceding claims 1 and 2, wherein the stack (2) comprises a low modulus material.
9. The component carrier structure (1) according to claim 8, wherein the low modulus material does not directly contact the component (3).
10. The component carrier structure (1) according to claim 9, wherein the low modulus material surrounds the component (3).
11. The component carrier structure (1) according to any one of claims 1 and 2,
The at least one opening (4) is at least partially filled with a filling material.
12. The component carrier structure (1) according to claim 11,
The filler material differs from the material of the stack (2) in terms of thermal expansion and/or young's modulus.
13. The component carrier structure (1) according to claim 11,
The at least one opening (4) is at least partially filled with the filling material to cover a side wall and/or a demarcation line of the at least one opening (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920266557.8U CN209787552U (en) | 2019-03-01 | 2019-03-01 | Component carrier structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920266557.8U CN209787552U (en) | 2019-03-01 | 2019-03-01 | Component carrier structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209787552U true CN209787552U (en) | 2019-12-13 |
Family
ID=68796334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920266557.8U Active CN209787552U (en) | 2019-03-01 | 2019-03-01 | Component carrier structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209787552U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757606A (en) * | 2020-07-09 | 2020-10-09 | 景旺电子科技(龙川)有限公司 | Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material |
| TWI741891B (en) * | 2020-08-28 | 2021-10-01 | 欣興電子股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN114449756A (en) * | 2020-11-06 | 2022-05-06 | 奥特斯科技(重庆)有限公司 | Manipulating component carrier structures during temperature processing to inhibit deformation of the component carrier structures |
-
2019
- 2019-03-01 CN CN201920266557.8U patent/CN209787552U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757606A (en) * | 2020-07-09 | 2020-10-09 | 景旺电子科技(龙川)有限公司 | Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material |
| TWI741891B (en) * | 2020-08-28 | 2021-10-01 | 欣興電子股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN114449756A (en) * | 2020-11-06 | 2022-05-06 | 奥特斯科技(重庆)有限公司 | Manipulating component carrier structures during temperature processing to inhibit deformation of the component carrier structures |
| CN114449756B (en) * | 2020-11-06 | 2024-03-26 | 奥特斯科技(重庆)有限公司 | Manipulating component carrier structure during temperature processing to inhibit deformation of component carrier structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12075561B2 (en) | Embedding component in component carrier by component fixation structure | |
| US11574849B2 (en) | Package with embedded electronic component being encapsulated in a pressureless way | |
| US10595414B2 (en) | Component carrier and manufacturing method | |
| US10897812B2 (en) | Component carrier having a component shielding and method of manufacturing the same | |
| US11264737B2 (en) | Solder-free component carrier connection using an elastic element and method | |
| CN209787552U (en) | Component carrier structure | |
| US11810844B2 (en) | Component carrier and method of manufacturing the same | |
| CN112702840A (en) | Component carrier with embedded components and horizontally elongated vias and method for manufacturing the same | |
| US11882648B2 (en) | Dielectric layer for component carrier with varying material properties | |
| US10939548B2 (en) | Component carrier with improved toughness factor | |
| US11127670B2 (en) | Component carrier with stabilizing structure for interface adhesion | |
| CN209767902U (en) | Component carrier and plate | |
| US11410965B2 (en) | Electronic device with embedded component carrier | |
| CN111640727B (en) | Component carrier comprising dielectric structures having different physical properties | |
| US11219120B2 (en) | Stress relief opening for reducing warpage of component carriers | |
| CN111682003A (en) | Component carrier comprising a component having a vertical through-connection | |
| US11350520B2 (en) | Component carrier and method of manufacturing the same | |
| CN111200899A (en) | Component carrier and method for producing the same | |
| US20240021440A1 (en) | Component Carrier and Method of Manufacturing the Same | |
| US12219701B2 (en) | Component carrier | |
| CN217883966U (en) | Component carrier comprising at least two components | |
| US20230217589A1 (en) | Component Carrier With Asymmetric Build-Up And Methods for Determining a Design of And Manufacturing the Same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |