CN209784267U - Ultrasonic flaw detection equipment and system based on SPI data transparent transmission - Google Patents

Abstract

The utility model provides an ultrasonic flaw detection equipment based on SPI data passes through, it is including the wireless communication module who connects gradually, SPI data passes through pass module and digital logic control module, wireless communication module passes through the first serial communication bus with SPI data and is connected, SPI data passes through pass module and digital logic control module and passes through second serial communication bus and be connected, first serial communication bus is used for passing module transmission data information to SPI data, SPI data passes through the module and converts data information into the second transmission standard by first transmission standard, second serial communication bus is used for passing module and digital logic control module through SPI data and establishes the principal and subordinate relation. The utility model also provides an ultrasonic flaw detection system based on SPI data passes thoroughly, adopts the little, the small digital logic control module of capacity that does not have built-in treater, has both ensured the original data transmission rate of product, can make portable micro-design again.

Description

Ultrasonic flaw detection equipment and system based on SPI data transparent transmission

technical field

The utility model relates to the field of industrial flaw detection, in particular to an ultrasonic flaw detection device and system based on SPI data transparent transmission.

Background technique

With the rapid development of industrial modernization, the importance of industrial ultrasonic flaw detection has been paid more and more attention. Ultrasonic flaw detection is widely used in the detection field of modern industry. In most industrial measurement control applications, data transparent transmission is a very important link in digital signal processing. At the data acquisition end of an ultrasonic flaw detection device, the digital logic control module is generally used to control the ultrasonic probe to generate ultrasonic signals, but the digital logic control The module adopts an expensive chip with a built-in large-capacity and large-volume processor, which makes the circuit structure of the data acquisition terminal more complicated, which is not conducive to the miniaturization design of the ultrasonic testing equipment, and also brings inconvenience to the carrying of the ultrasonic flaw detection device.

Utility model content

In view of this, the purpose of this utility model is to provide an ultrasonic flaw detection device and system based on SPI data transparent transmission, which adopts the communication mode of serial communication, utilizes the wide applicability of serial communication, simple protocol and high data transmission rate The characteristics make the ultrasonic flaw detection equipment based on SPI data transparent transmission improve the data collection efficiency and accuracy in ultrasonic flaw detection, and also make the ultrasonic flaw detection equipment based on SPI data transparent transmission cost-effective and high portability.

In order to solve the above technical problems, on the one hand, the utility model provides an ultrasonic flaw detection device based on SPI data transparent transmission, including a wireless communication module, an SPI data transparent transmission module and a digital logic control module connected in sequence, the wireless communication The module is connected to the SPI data transparent transmission module through the first serial communication bus, the SPI data transparent transmission module is connected to the digital logic control module through the second serial communication bus, and the first serial communication bus is used To send data information to the SPI data transparent transmission module, the SPI data transparent transmission module converts the data information from the first transmission standard to the second transmission standard, and the second serial communication bus is used to transfer the data information to the second transmission standard. The SPI data transparent transmission module establishes a master-slave relationship with the digital logic control module.

As a further improvement of the above technical solution, the SPI data transparent transmission module includes a peripheral circuit, a first serial bus port and a second serial bus port.

As a further improvement of the above technical solution, the SPI data transparent transmission module uses an FT232H chip, the first serial bus port uses a USB port, and the second serial bus port uses an SPI port.

As a further improvement of the above technical solution, the peripheral circuit includes a reset circuit, a crystal oscillator circuit and a power supply circuit, the reset circuit is used to restore the peripheral circuit to the initial state, and the crystal oscillator circuit is used to send the SPI data The transparent transmission module provides a synchronous clock signal, and the power circuit is used to provide driving power to the SPI data transparent transmission module.

As a further improvement of the above technical solution, the SPI data transparent transmission module also includes a data conversion unit and a control unit, and the data conversion unit is used to convert the data information of the first transmission standard and the data of the second transmission standard For mutual conversion between information, the control unit is used to control the transmission of the data information.

As a further improvement of the above technical solution, the wireless communication module adopts the WIFI module of the MT7628 chip, and the WIFI module also includes a first serial bus port and a WIFI antenna for receiving or sending wireless WIFI signals.

As a further improvement of the above technical solution, the digital logic control module includes a second serial bus port and an input and output port of a data signal, and the digital logic control module is used for logically controlling the data signal.

As a further improvement of the above technical solution, the digital logic control module is also connected to an ultrasonic probe through the input and output ports, and the ultrasonic probe is used to generate ultrasonic signals and receive reflected ultrasonic signals.

As a further improvement of the above technical solution, the digital logic control module adopts a 10AX016C3U19 chip whose model is U20.

On the other hand, the utility model also provides an ultrasonic flaw detection detection system based on SPI data transparent transmission, including the above-mentioned ultrasonic flaw detection detection equipment based on SPI data transparent transmission and a remote terminal, the remote terminal and the SPI data transparent transmission based The transmitted ultrasonic flaw detection equipment establishes a communication connection through the wireless communication module.

The utility model provides an ultrasonic flaw detection device and system based on SPI data transparent transmission. By adding the SPI data transparent transmission module between the wireless communication module and the digital logic control module, the wireless communication module It is connected with the SPI data transparent transmission module through the first serial communication bus, and the SPI data transparent transmission module is connected with the digital logic control module through the second serial communication bus, which improves the transmission of data information in the said second serial communication bus. The above-mentioned internal transmission rate based on SPI enables the miniaturization design of the digital logic control module, reduces the size of the digital processing logic module, simplifies the circuit design of the flaw detection device, and enables the transparent transmission of the SPI-based data. Advanced ultrasonic flaw detection equipment is easy to carry and improves work efficiency.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following drawings will be briefly introduced in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention. Therefore, it should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained according to these drawings without creative work.

Fig. 1 is the structural block diagram of the ultrasonic flaw detection detection equipment based on SPI data transparent transmission of the present utility model;

Fig. 2 is the structural block diagram of the ultrasonic flaw detection detection system based on SPI data transparent transmission of the present invention;

Fig. 3 is the circuit structure diagram of the wireless communication module of the present utility model;

Fig. 4 is the structural block diagram of the SPI data transparent transmission module of the present utility model;

Fig. 5 is the circuit structure diagram of the SPI data transparent transmission module of the present utility model;

FIG. 6 is a structural schematic diagram of the master-slave relationship between the SPI data transparent transmission module and the digital logic control module of the present invention.

Description of main component symbols:

100-ultrasonic flaw detection equipment based on SPI data transparent transmission; 110-wireless communication module; 120-SPI data transparent transmission module; 130-digital logic control module; 140-first serial communication bus; 150-second serial communication Bus; 160-first serial bus port; 170-second serial bus port; 180-reset circuit; 190-crystal oscillator circuit; 200-power supply circuit; 210-WIFI antenna; 220-input and output port; ; 300-ultrasonic flaw detection system based on SPI data transparent transmission; 400-remote terminal.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Referring to Fig. 1, the utility model provides an ultrasonic flaw detection device 100 based on SPI data transparent transmission, including a wireless communication module 110, an SPI data transparent transmission module 120 and a digital logic control module 130 connected in sequence, the wireless communication module 110 The SPI data transparent transmission module 120 is connected through the first serial communication bus 140, the SPI data transparent transmission module 120 is connected with the digital logic control module 130 through the second serial communication bus 150, and the first serial communication The row communication bus 140 is used to send data information to the SPI data transparent transmission module 120, and the SPI data transparent transmission module 120 converts the data information from a first transmission standard to a second transmission standard, and the second serial The communication bus 150 is used to establish a master-slave relationship between the SPI data transparent transmission module 120 and the digital logic control module 130 .

Referring to Fig. 3, in this embodiment, the wireless communication module 110 is a wireless WIFI module, the SPI data transparent transmission module 120 has circuits and chips with data processing functions, signal conversion and other functions, and the SPI data transparent transmission module 120 is equivalent to a microprocessor, has the characteristics such as volume is small, light in weight and easy modularization, described SPI data transparent transmission module 120 adopts the FT232H chip that model is U24, and described first serial bus port 160 adopts USB port, Described second serial bus port 170 adopts SPI port, and described wireless communication module 110 adopts the WIFI module that model is the MT7628 chip of U29, and described WIFI module also comprises first serial bus port 160 and is used for receiving or sending wireless For the WIFI antenna 210 of the WIFI signal, the second transmission standard adopts the USB (Universal Serial Bus) bus protocol, and the second transmission standard adopts the SPI (Serial Peripheral Interface) bus protocol. The USB standard includes transmission modes of control transmission, block transmission, terminal transmission and synchronous transmission. The control transmission includes the control information required for transmission, which is used for the initial setting of the device and has the characteristics of safe and reliable communication. narrow bandwidth. The block transmission sends data in packets, which can occupy the entire bandwidth of the bus, and the security of the data transmission is guaranteed by the bus. The interrupt transmission is repeated at a certain cycle, and the driver can freely define the cycle length. The isochronous transfer has the method of being able to use a fixed predefined bandwidth, which is the most suitable transfer mode when it is necessary to ensure a continuous data flow, but in case of occasional data loss. The wireless communication module 110 is connected to the SPI data transparent transmission module 120 through the first serial communication bus 140, and adopts at least one of the above four different transmission modes according to actual needs to ensure that the data information is in the The reliability and stability of the transmission between the wireless communication module 110 and the SPI data transparent transmission module 120 .

The wireless communication module 110 can establish a wireless connection with a processing terminal such as a PAD, a notebook computer, etc., and the digital logic control module 130 mainly adopts a field programmable gate array (Universal Serial Bus, FPGA), and the field programmable gate array adopts Logic cell array, the field programmable gate array includes three parts of configurable logic modules, input and output modules and internal wiring, and the field programmable gate array utilizes small look-up tables to realize combinational logic, each of the look-up tables connected to the input terminal of a flip-flop, and the flip-flop drives other logic circuits or drives I/O, thereby constituting a basic logic unit that realizes combinational logic functions and sequential logic functions, and metal wiring is used between the logic units connected to each other or connected to the I/O unit, the digital logic control module 130 is also implemented by loading programming data to the internal static storage unit, and the value stored in the storage unit determines the logic function of the logic unit and each The connection mode between modules or between modules and I/O. The digital logic control module 130 has no built-in processor and has the characteristics of small capacity. The digital logic control module 130 only does simple digital logic control, such as bridging, digital filtering, etc., which can reduce the number of digital logic control modules. The size of 130 also reduces the volume of the ultrasonic flaw detection device 100 based on SPI data transparent transmission.

In addition, the first serial communication bus 140 is a USB bus, the second serial communication bus 150 is an SPI bus, and the main pins of the SPI bus include SCK pins, DI pins, DO pins, chip Select pins CS0, CS1, CS2, SCK is used for one-way output synchronous clock, DI is used for one-way input data, chip select pin CSn (n=0, 1, 2), used to select equipment, four-wire serial port The basic operation elements include: chip selection, chip selection end, bit output, bit input. The selection of the chip selection is defined as the output active level of the chip selection pin CSn (can be defined as high level or low level), and the end of the chip selection is defined as the output of the non-active level of the chip selection pin CSn, and the bit Output is defined as when SCK is low level, DO outputs bit data, SCK outputs high level pulse, the bit input is defined as SCK outputs high level pulse, and bit data is input from DI after the falling edge, and byte output is defined as 8-bit output, byte input is defined as 8-bit input, the data input and output of the 4-wire serial port is in bytes, each byte contains 8 bits, and supports low-order and high-order first. It can be understood that the SPI bus is high-speed. A full-duplex, synchronous communication bus, the SPI bus only occupies four wires on the pins of the chip, which saves the pins of the chip and saves space for the subsequent layout on the circuit board, which simplifies the process to a certain extent The circuit design reduces the design cost of the ultrasonic flaw detection device 100 based on SPI data transparent transmission.

6, it should be noted that the SPI data transparent transmission module 120 is connected with the digital logic control module 130 through the second serial communication bus 150, and the SPI data transparent transmission module 120 is connected with the digital logic control module 130. The control module 130 establishes a master-slave relationship, that is, the SPI data transparent transmission module 120 is a master, the digital logic control module 130 is a slave, and the second serial communication bus 150 is an SPI bus, and the SPI bus includes a clock (SOICLK, SCLK), chip select (CS) host output, slave input (MOSI) host input and slave output (MISO) four signal lines, the device that generates the clock signal is the SPI data transparent transmission module 120, so The data transmitted between the master and the slave is synchronized with the clock generated by the master, the SPI bus supports a higher clock frequency, and the chip select signal from the master is used to select the slave, i.e. low level A valid signal, when pulled high, the slave is disconnected from the SPI and the bus. When multiple slaves are used, the host needs to provide a separate chip selection signal for each of the slaves, and the chip selection signal is always an active low signal. The transfer rate of the SPI bus is 50Mbps, and the transfer rate of the USB bus is 480Mb/s. The SPI data transparent transmission module 120 also includes converting the data information output by the first serial communication bus 140 into the data information output by the second serial communication bus 150, and the data information can be included in the processing terminal such as The test instructions of the notebook computer may also include reflected ultrasonic signals, voltage signals, etc., and establish a master-slave relationship with the digital logic control module 130 through the SPI data transparent transmission module 120, which improves the efficiency of data transmission.

Further, the SPI data transparent transmission module 120 includes peripheral circuits, a first serial bus port 160 and a second serial bus port 170 .

Specifically, the first serial bus port 160 is used to connect the wireless communication module 110, the second serial bus port 170 is used to connect the digital logic control module 130, and the first serial bus port 160 uses a USB port, and the peripheral circuit can be used to convert between analog signals and digital signals, and can also initialize the circuit to ensure the accuracy of input and output of control signals. The second serial bus port 170 adopts an SPI port, and the USB port can be powered on during data transmission, which improves the reliability of data transmission. The SPI port is used to establish a master-slave relationship, which increases the reliability of data transmission. The speed improves the data acquisition efficiency and transmission efficiency of the ultrasonic flaw detection equipment 100 based on SPI data transparent transmission.

Further, the peripheral circuit includes a reset circuit 180, a crystal oscillator circuit 190 and a power supply circuit 200, the reset circuit 180 is used to restore the peripheral circuit to an initial state, and the crystal oscillator circuit 190 is used to send the SPI data The transparent transmission module 120 provides a synchronous clock signal, and the power supply circuit 200 is used to provide driving power to the SPI data transparent transmission module 120 .

Referring to Fig. 4 and Fig. 5, the reset circuit 180 is used to restore the peripheral circuit to the initial state, and the reset mode of the reset circuit 180 includes manual button reset, power-on reset and integral power-on reset. The reset circuit 180 can be composed of capacitors and inductors. It should be noted that, according to the actual situation, the above reset mode can be flexibly selected. The crystal oscillator circuit 190 can be composed of capacitors and quartz wafers to form a quartz crystal oscillator. The crystal oscillator circuit 190 generates an oscillating current in the circuit and sends out a clock signal. It is a crystal that can convert electrical energy and mechanical energy to each other and work in a resonant state. , to provide stable and precise single frequency oscillation. The crystal oscillator circuit 190 improves the accuracy of data acquisition of the ultrasonic flaw detection device 100 based on SPI data transparent transmission, and the power supply circuit 200 improves the power supply connected to the circuit board for the SPI data transparent transmission module 120 Power supply, the power supply circuit 200 can be composed of large capacitors, the SPI data transparent transmission module 120 is processed to reach the rated voltage, such as converting the input voltage 5V into 3.3V, so that the SPI data transparent transmission module 120 is in normal operation state, thereby reducing the power consumption of the ultrasonic flaw detection device 100 based on SPI data transparent transmission.

Further, the SPI data transparent transmission module 120 also includes a data conversion unit and a control unit, and the data conversion unit is used to convert the data information of the first transmission standard to the data information of the second transmission standard Mutual conversion, the control unit is used to control the transmission of the data information.

Taking the weld seam of flaw detection as an example, the data conversion unit can convert the ultrasonic signal fed back by the digital logic control module 130 into a digital signal, which is convenient to store in the storage unit of the SPI data transparent transmission module 120, so that all The peripheral circuit performs amplification, gain, attenuation and other processing on the digital signal to obtain an ultrasonic signal that meets the requirements, so that the ultrasonic signal is clearly displayed on the processing end, so that the tester can intuitively understand the current detection result data. The control unit can realize mutual conversion between the first transmission standard and the second transmission standard, and the control unit mainly includes an encoding unit and a decoding unit. It can be understood that each network has its own information exchange mode, When two networks or hardware need to communicate with each other, if they do not recognize each other’s communication methods, they cannot communicate with each other. The control unit is used for protocol conversion to play a role in the ultrasonic flaw detection equipment 100 based on SPI data transparent transmission. The role of real-time communication within the establishment.

In this embodiment, when a signal is transmitted from the wireless communication module 110 to the digital logic control module 130, the SPI data transparent transmission module 120 converts the data information of the first transmission standard into the second Transmit standard data information, that is, convert the information of the USB port standard into the information of the SPI port; when the signal is transmitted from the digital logic control module 130 to the wireless communication module 110, the SPI data transparent transmission module 120 transmits the The data information of the second transmission standard is converted into the data information of the first transmission standard, that is, the data information of the SPI port standard is converted into the information of the USB port standard.

Further, the digital logic control module 130 includes a second serial bus port 170 and a data signal input and output port 220, and the digital logic control module 130 is used for logically controlling the data signal.

Described digital logic control module 130 adopts the 10AX016C3U19 chip that model is U20, and described digital logic control module 130 comprises the input and output port 220 of SPI port and data signal, and the logical control of described digital logic control module 130 can be the generation of signal, Establish connection with other devices and filter functions, etc.

Further, the digital logic control module 130 is also connected to the ultrasonic probe 230 through the input and output port 220, and the ultrasonic probe 230 is used for generating ultrasonic signals and receiving reflected ultrasonic signals.

In this embodiment, the digital logic control module 130 is connected to the ultrasonic probe 230 through the input and output port 220, so that the ultrasonic flaw detection device 100 based on SPI data transparent transmission and the ultrasonic probe 230 are combined to form an ultrasonic flaw detection At the data acquisition end of the equipment, the digital logic control module 130 can control the ultrasonic probe 230 to generate ultrasonic signals. The ultrasonic probe 230 is a transducer that uses the piezoelectric effect of materials to convert electrical energy and acoustic energy. The main component of the probe 230 is a single crystal or polycrystalline sheet with piezoelectric effect, which can realize mutual conversion between electric energy and acoustic energy.

In this embodiment, the input/output port 220 of the digital logic control module 130 controls generation, and after processing (logic control, bridging and digital filtering, etc.) by the digital logic control module 130, the processed The ultrasonic signal is sent from the second serial bus port 170 to the SPI data transparent transmission module 120 through the second serial communication bus 150, and the SPI data transparent transmission module 120 passes through the second serial bus port 170 receives the ultrasonic signal after described processing and converts the ultrasonic signal after described processing into the data information of USB transmission standard by SPI transmission standard, then passes through the first serial bus port 160 of described SPI data transparent transmission module 120 to The wireless communication module 110 sends the data information, and the wireless communication module 110 modulates the data information on the radio frequency carrier signal and sends it out through the radio frequency carrier signal, and transmits it to other receiving devices (such as computers, notebook computers, PAD, etc.) for analysis and processing, so that the position and size of the weld of the workpiece can be determined.

The utility model also provides an ultrasonic flaw detection detection system 300 based on SPI data transparent transmission, including the above-mentioned ultrasonic flaw detection detection device 100 based on SPI data transparent transmission and a remote terminal 400, the remote terminal 400 and the SPI data transparent transmission based The transmitted ultrasonic flaw detection equipment 100 establishes a communication connection through the wireless communication module 110 .

Referring to FIG. 2 , specifically, the ultrasonic flaw detection system 300 based on SPI data transparent transmission includes the ultrasonic flaw detection detection device 100 based on SPI data transparent transmission, the ultrasonic probe 230 and the remote terminal 400. It can be understood that, The ultrasonic probe 230 and the ultrasonic flaw detection equipment 100 based on SPI data transparent transmission may constitute the ultrasonic detection end of the SPI data transparent transmission-based ultrasonic flaw detection detection system 300, and the remote end may be the SPI data-based The processing end of the transparent ultrasonic flaw detection system 300, the remote end 400 may include a WIFI module, a touch screen, a processor and a memory, and the remote end 400 may send a test command to the ultrasonic detection end through the WIFI module, The wireless communication module 110 receives the test command, since the digital logic control module 130 in the ultrasonic testing device 100 based on SPI data transparent transmission has no built-in processing unit, the SPI data transparent transmission module 120 has a data processing function The chips and peripheral circuits can micro-design the ultrasonic flaw detection equipment 100 based on SPI data transparent transmission to a certain extent, and can also be designed as a portable ultrasonic detection terminal with data scanning and data acquisition functions, which effectively expands the The scope of detection is improved, and the working efficiency of the ultrasonic flaw detection equipment 100 based on SPI data transparent transmission is also improved.

In a specific application, taking the detection of the weld seam of a workpiece as an example, the tester places the ultrasonic flaw detection device 100 based on SPI data transparent transmission at the weld seam of the workpiece, and adjusts the connection between the remote terminal 400 and the The communication connection of the ultrasonic flaw detection equipment 100 through SPI data transparent transmission, the tester presses the button of the test instruction on the touch screen of the remote terminal 400, the wireless communication module 110 receives the test instruction, and after processing The obtained data information is sent by the first serial bus port 160 to the SPI data transparent transmission module 120 through the first serial communication bus 140, and the SPI data transparent transmission module 120 transmits the first The data information of a transmission standard is converted into the data information of the second transmission standard and sent to the digital logic control module 130 through the second serial communication bus 150, and the digital logic control module 130 controls according to the data information The ultrasonic probe 230 generates a corresponding ultrasonic signal, the workpiece reflects the ultrasonic signal to the ultrasonic probe 230, the ultrasonic probe 230 feeds back the ultrasonic signal to the digital logic control module 130, and the ultrasonic The signal processing is the same as the ultrasonic processing process in the SPI data transparent transmission-based ultrasonic flaw detection equipment 100 , and will not be repeated here.

The utility model provides an ultrasonic flaw detection device and system based on SPI data transparent transmission. By adding the SPI data transparent transmission module 120 between the wireless communication module 110 and the digital logic control module 130, the The wireless communication module 110 is connected with the SPI data transparent transmission module 120 through the first serial communication bus 140, and the SPI data transparent transmission module 120 and the digital logic control module 130 are connected through the second serial communication bus 150 connection, which improves the transmission rate of data information inside the ultrasonic flaw detection equipment 100 based on SPI data transparent transmission, enables the miniaturization of the digital logic control module 130, and reduces the size of the digital logic control module 130 , making the circuit design of the flaw detection and testing equipment 100 based on SPI data transparent transmission more simple, reducing the cost of the simplified design of the ultrasonic flaw detection and testing equipment 100 based on SPI data transparent transmission, and also improving the The working efficiency of the transparent ultrasonic flaw detection system 300.

The above is only a preferred embodiment of the present utility model, but the scope of protection of the present utility model is not limited thereto, and any person familiar with the technical field can easily think of it within the technical scope disclosed by the utility model Changes or replacements should fall within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be based on the protection scope of the claims.

Claims (10)

1. The utility model provides an ultrasonic flaw detection equipment based on SPI data passes through which characterized in that: the wireless communication module is connected with the SPI data transparent transmission module through a first serial communication bus, the SPI data transparent transmission module is connected with the digital logic control module through a second serial communication bus, the first serial communication bus is used for sending data information to the SPI data transparent transmission module, the SPI data transparent transmission module converts the data information from a first transmission standard into a second transmission standard, and the second serial communication bus is used for establishing a master-slave relationship between the SPI data transparent transmission module and the digital logic control module.

2. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the SPI data transparent transmission module comprises a peripheral circuit, a first serial bus port and a second serial bus port.

3. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 2, characterized in that: the SPI data transparent transmission module adopts an FT232H chip, the first serial bus port adopts a USB port, and the second serial bus port adopts an SPI port.

4. the ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 2, characterized in that: the peripheral circuit comprises a reset circuit, a crystal oscillator circuit and a power supply circuit, wherein the reset circuit is used for restoring the peripheral circuit to an initial state, the crystal oscillator circuit is used for providing synchronous clock signals for the SPI data transparent transmission module, and the power supply circuit is used for providing driving power for the SPI data transparent transmission module.

5. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 3, characterized in that: the SPI data transparent transmission module further comprises a data conversion unit and a control unit, wherein the data conversion unit is used for mutual conversion between the data information of the first transmission standard and the data information of the second transmission standard, and the control unit is used for controlling the transmission of the data information.

6. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the wireless communication module adopts a WIFI module of an MT7628 chip, and the WIFI module further comprises a first serial bus port and a WIFI antenna for receiving or sending wireless WIFI signals.

7. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the digital logic control module comprises a second serial bus port and an input/output port of a data signal, and is used for carrying out logic control on the data signal.

8. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 7, characterized in that: the digital logic control module is also connected with an ultrasonic probe through the input/output port, and the ultrasonic probe is used for generating ultrasonic signals and receiving the reflected ultrasonic signals.

9. The ultrasonic flaw detection equipment based on the SPI data transparent transmission according to claim 1, characterized in that: the digital logic control module adopts a 10AX016C3U19 chip with the model number of U20.

10. The utility model provides an ultrasonic flaw detection system based on SPI data passes through, its characterized in that includes: the SPI data transmission-based ultrasonic flaw detection device of any one of claims 1-9 and a remote end, wherein the remote end is in communication connection with the SPI data transmission-based ultrasonic flaw detection device through the wireless communication module.